Intel's 9th generation re-branding of its "Skylake-X Refresh" HEDT processors could have a rather short lifespan in the company's product-stack of just three quarters. Intel is planning to launch its next HEDT platform, codenamed "Glacier Falls," which succeeds the current "Basin Falls Refresh." "Glacier Falls" could launch around late-Q2/early-Q3, with unveils slated for Computex 2019 (June). These details are part of a slide leak from an internal presentation from motherboard manufacturer GIGABYTE.

The slide revealing "Glacier Falls" also mentions two new mainstream-desktop platform chipsets, the B365 Express and the H310C Express. There is no information on what sets these apart from the current B360 and H310, respectively. We predict their entry is necessitated by stronger CPU VRM requirements to support 9th generation Core 6-core and 8-core processor SKUs that are known to pull up to 140 Watts of power (unrelated to TDP, which is calculated on the basis of nominal clock speed and not Turbo Boost). There's also a faint possibility of Intel giving the B365 CPU overclocking support to compete with the value proposition of AMD's B450.

Intel could very soon fork its high-end desktop platform into two, with the introduction of the new Z399 socket LGA2066 chipset later this quarter; and the fabled X599 chipset powering LGA3647 processors. The move is probably triggered by AMD's introduction of new 24-core and 32-core Ryzen Threadripper processors that wipe out competitiveness of its existing "Basin Falls" X299 platform. The X599 could essentially be a C629 with the addition of some client-segment features (and the subtraction of some enterprise-segment ones), whereas the Z399 is a whole different beast.

With the introduction X599 and LGA3647, Intel could restore competitiveness at the >$1,500 market segment with new 24-core, 26-core, and 28-core "Skylake-X" XCC (extended/extreme core count) processors; whereas the introduction of Z399 could be necessitated with a that of a new 22-core chip for the LGA2066 socket, from which Intel can carve out new 20-core and 22-core SKUs. Existing Skylake-X LCC and HCC chips could be forwards-compatible with Z399, and X299 motherboards could still be eligible for supporting new 20-core and 22-core processors via BIOS updates. The Z399 could introduce a handful of new client-segment features Intel is introducing with the Z390.

Intel is allegedly killing off the "Extreme Edition" brand extension it has been using to denote its flagship client-segment products, such as processors and NUCs. This, according to industry observer François Piednoël. This could also mean the retirement of related elements such as the iconic Intel Skull, and the black and silver packaging. What Intel is replacing this moniker with, remains a mystery.

Intel currently assigns the "Extreme" extension to only one client-segment product, the Core i9-7980XE. With the advent of the 28-core client-segment processor on a new motherboard platform, Intel could find itself tough to justify the extension on the "Basin Falls" (LGA2066) platform. The company is planning to launch new 20-core and 22-core LGA2066 processors, besides its 28-core processor on the new platform. The Extreme extension is also used on the company's "Skull Canyon" NUC.

Intel is readying a refresh to its "Basin Falls" HEDT platform (LGA2066 client high-end desktop), with a new 22-core silicon. This part is neither Skylake HCC (20 tiles, up to 18 cores) nor Skylake XCC (30 tiles, up to 28 cores), but a new die with four more tiles than the Skylake HCC silicon, all of which are cores. The new silicon could let Intel design 20-core and 22-core SKUs for the X299 Express chipset, and is seen as a direct response to AMD's 24-core Ryzen Threadripper II processor, which was recently shown beating the 18-core i9-7980X in tech demos. The 32-core Threadripper II could face competition from the 28-core HEDT processor Intel is readying for Q4-2018, but that processor won't be compatible with LGA2066.

In related news, the company is giving finishing touches to a new 8-core "Coffee Lake" die for the mainstream-desktop platform (LGA1151 socket, 300-series chipset). This die features 8 cores, and likely 16 MB of shared L3 cache, while retaining the iGPU and uncore components from the existing Coffee Lake-S die. The chip could retain the classic "Ring Bus" design. The new 8-core mainstream-desktop SKUs, and at least two new high-end desktop SKUs (20-core and 22-core), could be launched in September 2018. The "Basin Falls" refresh, coupled with the new LGA3647 "Purley" derivative for the 28-core monstrosity, will be all Intel has to face AMD this year, with the company's next HEDT silicon, "Cascade Lake-X" being reportedly delayed to the second half of 2019, probably due to foundry problems.

GIGABYTE today announced its latest motherboard based on Intel's 'Basin Falls' architecture and targeted at workstation use cases. With this new architecture, GIGABYTE brings Intel's Skylake architecture to the SOHO segment with a new offering: the 'Basin Falls' single-socket platform for workstations. This new build offers a wealth of I/O options, including multiple PCIe lanes to support graphics, storage and USB options, as well as direct SATA and USB ports.

GIGABYTE's new Xeon 'Skylake-W'-based motherboard utilizes the full complement of 48x PCIe lanes direct from the CPU to support up to 4 x GPU dual-slot cards or multiple x8 and x16 add-on cards. In addition, GIGABYTE's engineers have designed densely-packed SATA and USB options, based on direct and PCIe connections from the chipset, leading to a massively flexible workstation board.

Intel announced that its first CPU micro-architecture built on its upcoming 10 nanometer silicon fab process, the 9th generation Core "Cannon Lake," is on track. In a tweet on the official company account, Intel also announced that its second micro-architecture on the new 10 nm process, codenamed "Ice Lake," is taped out.

In the wake of a competitive CPU lineup by AMD, Intel is frantically upgrading its product lineup, beginning with the new "Basin Falls" HEDT platform early-Summer 2017, followed by its 14 nm "Coffee Lake" 8th generation Core series late-Summer. "Coffee Lake" sees the first six-core SKUs to Intel's mainstream desktop lineup, which has until now, been restricted to dual-core and quad-core parts.

Recent reports mentioned Intel's moves to bring forward the launch of their Basin Falls HEDT platform, which succeeds their X99 platform. Intel is doing this in hopes to hold the blue flag against AMD's upcoming X399 Ryzen-based HEDT platform (there's seemingly a war in numbers here), pitting 4, 6, 8, 10, and 12-core CPUs against AMD's expected 12-core and 16-core processors.

As such, it's only natural motherboard makers would also have to expedite their work on X299-based motherboards, and it would seem that MSI has done just that, simultaneously advancing their marketing campaign. A teaser image from the company showcases an as-of-yet unreleased motherboard (not just any motherboard, but the "Best. Motherboard. Ever") which boasts of a trio of M.2 slots (with MSI's M.2 Shield thermal solution), and four PCIe x16 slots. Are you still counting the number of PCI lanes needed to drive all these slots? Well, it just so happens Intel's Basin Falls is expected to deliver up to 44 PCIe 3.0 lanes, so those should be enough to at least make this ridiculous amount of slots worthwhile... For some use cases. There's also an additional power-supply connector on top of the first PCIe slot, which should increase power delivery for these. It's almost open season on these HEDT platforms, kind sirs.