We posted their press release here, but have now managed to get a few more infos for you. The unit will only ship in silver, comes with a 3.5" SATA hard drive and sports multiple USB connectors in the back along with a network jack. It has the same foot print as an AppleTV, but is slightly taller, while the casing seems to be made of aluminum. Besides that, we snapped an image of an external hard drive with an LCD screen. While this may not be anything out of the ordinary, the technology used in the display allows it to function just like eInk. It does not require any power to change the state of the screen, so that you will always know how much free space is available, even when it is not connected.

MSI, a leading manufacturer of computer components and systems, has unveiled three new concept products at the Consumer Electronics Show (CES) that the company believes will redefine the way consumers will interact with digital information in their homes.:

1. 3D All-in-One PC - Continuing to lead the industry in All-in-One product features, MSI has developed the world's first 3D All-in-One PC. Wearing comfortable wireless 3D glasses, users can have the ultimate life-like gaming experience and 3D HD movie experience from the comfort of home with system's stunning 24-inch display.

EVGA showed of its almost-ready dual LGA-1366 high-end workstation motherboard at the ongoing CES event. The motherboard pictured sports a component cooling covering all its vital areas except for one of the CPUs' VRM areas, it gives a fair idea about what the final product could look like. The board itself was detailed earlier.

The chipset cooler design borrows heavily from single-slot graphics cards. A monolithic baseplate covers the northbridge Intel 5500(?), ICH10-class southbridge, and the two NVIDIA BR-03 bridge chips. The heatsink becomes taller over one of the CPU sockets' VRM area. Air is drawn in from the round intake, and pushed out near the expansion slots. the gaps between the expansion slots will do their part in directing the hot air away.

MSI is ready with two new custom-design graphics cards based on the ATI Radeon HD 5800 graphics processors: the R5870 Lightning and R5850 Cyclone. The R5870 Lightning, as expected features a Twin-Frozr II dual-fan VGA cooler designed by MSI on a custom-designed PCB which makes some high-grade components, specifically in the card's VRM area (12-phase PWM, dual 8-pin PCI-E power input), to make it fare better at overclocking. Other notable features include v-check points and 1 GB of GDDR5 memory across the GPU's 256-bit wide memory interface. Connectivity cluster resembles that of the AMD reference design, retaining Eyefinity technology support. The R5850 Cyclone, on the other hand, uses the familiar Cyclone GPU cooler MSI used in the past on some Radeon HD 4800 series graphics cards. MSI designed its own PCB here too, but with a few smart cost-cuttings, although the quality of the components used isn't affected. The two will be out in this quarter.

One of ASUS' premier offers for this year's Consumer Electronics Show (CES) event is a new high-end socket LGA-1366 motherboard, the Republic of Gamers (ROG) Rampage III Extreme. The board succeeds the Rampage II Extreme which launched over an year ago along with Intel's then new Core i7 series processors. The new model based on the Intel X58 Express + ICH10R chipset, comes with four well spaced out PCI-Express 2.0 x16 slots, a new set of overclocking enhancements such as the ROG connect which lets you control the motherboard's overclocking from any Bluetooth and Java enabled mobile phone, SATA 6 Gb/s and USB 3.0 connectivity using ASUS' innovative PCI-Express 2.0 bridge implementation, and a more powerful CPU VRM to keep the board stable with bleeding-edge settings.

The board features an enhanced CPU VRM which is now powered by two 8-pin ATX connectors apart from two 4-pin Molex connectors. Some of these could be redundant and needed only for electrical stability. The CPU and memory power circuitry makes use of super-ML capacitors for cleaner power delivery. Voltage readouts are located next to the DIMM slots for accessibility. The motherboard makes use of slimmer component heatsinks that look to be made of the ceramic composite which the TUF Sabertooth P55 motherboard uses.

Samsung Electronics Co., Ltd., a worldwide leader in digital consumer electronics and information technology, announced today it will display a prototype of its new slim external DVD writer, the SE-S084D optical disk drive (ODD) at the Treasure Island Hotel in a private product display room during CES 2010. Featuring a more compact footprint and lighter weight than competitive offerings, the new DVD writer also delivers high-performance with a USB power source to eliminate electrical outlet requirements.

"Because netbooks are designed for ultra mobility, they aren't typically equipped with optical disc drives, which can potentially make booting from a CD or playing a DVD movie a problem," said John Suh, director of OMS sales and marketing, Samsung Semiconductor, Inc. "But with the lightweight, portable SE-S084D Optical Disc Drive, you have the perfect on-the-go, stand-alone. And thanks to its USB BUS power source, you can write at maximum speed with no outlet in sight."

MSI G-Series and C-Series of laptop computers have reached a new apex in their evolution. The first NBs equipped with Intel's new generation Calpella platform to be shown at CES 2010, both series come with Intel's most advanced family of New Core processors and Microsoft's Windows 7 operating system. They also come with cinema-class screens coupled with top-end Surround Sound for maximum audiovisual enjoyment.

CoolIT Systems, leaders in advanced liquid cooling technology announced today 4 new products set to revolutionize the computer cooling industry yet again. Following the huge success of the CoolIT Domino that hit the market by storm in 2009, CoolIT have wowed visitors at this year's Consumer Electronics Show, Las Vegas, Nevada with even more innovative, affordable and leading-performance advanced liquid cooling products.

"Liquid cooling is the future" remarked Geoff Lyon, CEO, CoolIT Systems. "The advantages of CoolIT's liquid solutions far outweigh any air-based or competitive liquid cooling product, and at CES this year, we're here to prove that".

CoolIT ECO A.L.C
First up is the CoolIT ECO A.L.C CPU cooler which breaks a world record for the ultimate price/performance cooling benchmark.

AMD today introduced its lineup of next-generation DirectX 11-capable ATI Mobility Radeon Premium graphics, including ATI Mobility Radeon HD 5870 graphics, the highest performance graphics for notebooks in the world.1 The entire family of DirectX 11-capable graphics consists of ATI Mobility Radeon HD 5800, ATI Mobility Radeon HD 5700, ATI Mobility Radeon HD 5600 and ATI Mobility Radeon HD 5400 series graphics. This top-to-bottom family of Direct 11-capable notebook graphics introduces compelling new features including ATI Eyefinity multi-display technology, bringing powerful visual gaming and computing innovation to the notebook PC. Notebooks featuring the new graphics technology are previewed at the 2010 Consumer Electronics Show (CES) in the VISION Experience Center, located in the Grand Lobby (GL-8 and GL-10) of the Las Vegas Convention Center.

"Six months ago AMD claimed the title of undisputed technology leader in desktop graphics, and now we also offer powerful mobile graphics processors for notebooks to go with our market leadership in that segment," said Rick Bergman, senior vice president and general manager, Products Group, AMD. "Once again, AMD changes the game both in terms of performance and experience. AMD innovations now give notebook users full DirectX 11 support, eye-opening ATI Eyefinity technology, superb HD multimedia capabilities, and ATI Stream technology designed to help optimize Windows 7 notebook performance."

LaCie demonstrates a new network storage server based on the Microsoft Windows Home Server platform. The product will be shown for the first time at the CES. This server leverages the success of LaCie's award winning 5big Network, which features five user-replaceable drives, Gigabit Ethernet, and data protection support for data integrity. The technology demonstration shows that by combining Microsoft and LaCie technologies on a single platform, small business users can enjoy a seamless interface to automatically back up computers to a single server. The server secures their backup both locally and remotely by automatically copying their critical data to the cloud, using LaCie's Wuala technology.

"LaCie's network server offers an exciting design and provides plenty of storage options with terabytes of capacity and the ability to back up data from local computers and to cloud-based services," said Leslie McGuire, Director of Windows Server Marketing at Microsoft. "We're pleased to have LaCie join us as a Windows Home Server partner."

OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high-reliability memory and flash-based storage as an alternative to hard disk drives, plans to unveil an array of next-generation solid state drives (SSDs) along with other premium hardware at the 2010 International Consumer Electronics Show to be held January 7-10, 2010, in Las Vegas, Nevada. With its finger on the pulse of emerging and booming markets, OCZ's impending line of SSDs is designed to optimize entire businesses as well as the computing experiences of everyday consumers.

"For this year's Consumer Electronics Show, OCZ continues to build on its lineup of SSD solutions designed for enterprise-class applications," commented Ryan Petersen, CEO of OCZ Technology Group. "We are uniquely positioned as the leading developer of SSDs, which we believe will ultimately replace traditional hard drives. In addition to our robust lineup of 2.5-inch solid state drives, we will be launching new drives at CES with interfaces that include SAS and PCI-E. These interfaces make it easier than ever for enterprise clients to replace expensive-to-maintain, traditional storage media with a higher-performing and more reliable solution."

The recently surfaced high-end dual socket LGA-1366 motherboard is pictured in full, without its cooling assembly. The picture reveals quite a bit about EVGA's new monstrosity. To begin with, the motherboard is neither ATX, nor EATX in the truest sense. Like the recently announced X58 Classified 4-way SLI which was based on the "XL-ATX" form-factor, this motherboard seems to be 13.58 inches (344.93 mm) long, and about as wide as EATX (330 mm, 13 inches), or maybe a little more.

Each LGA-1366 socket is wired to six DDR3 DIMM slots for triple-channel memory, and is powered by an 8-phase digital-PWM circuit. Each socket further has a 3-phase power circuit for its DIMM slots. The CPU VRM for each socket takes input from an 8-pin ATX, and what appears to be a 6-pin +12V (PCI-E?) connector. The motherboard further takes power from a 6-pin PCI-E power connector apart from the usual 24-pin ATX power connector. Some of these inputs may be redundant and needed only for additional electrical stability to support competitive overclocking.

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today unveiled the VIA VL810 SuperSpeed Hub Controller, the industry's first integrated single chip solution that supports the higher transfer rates of the new USB 3.0 specification.

USB 3.0 (also known as SuperSpeed USB) allows for a maximum data transfer rate of up to 5Gbps, or ten times the throughput available to USB 2.0 based devices. Other enhancements provide for improved interaction between device and host controller, including important advancements in power management.

EVGA is keeping up its streak of releasing high-end motherboards for processors based on the new Intel Nehalem architecture, with a new dual-socket monstrosity. Slated for CES 2010, not much about this high-end workstation motherboard has been revealed beyond the picture below. From the looks of it, probably EVGA is making a high-end, overclocker-friendly dual LGA-1366 motherboard based on the Intel 5500 "Tylersburg" chipset with the usual ICH10R southbridge. Existing LGA-1366 processors that support dual-socket operation which includes Xeon 5500 series may work on it. Probably, a future high-end Intel Core family CPU is released that is capable of dual-socket setups, too. The picture reveals two LGA-1366 sockets, each powered by an 8-phase digital PWM circuit. Each socket is wired to six DDR3 DIMM slots supporting triple-channel memory for that socket. More this CES.

Thermaltake seems to have finished development of its new high-end CPU cooler, the Thermaltake Frio. Designs of this cooler surfaced as early as in June this year, originally slating it for Computex 2009. After some development delay, it has finally taken shape with the disctinct black+red color scheme the company's Level 10 case comes with. The design consists of a CPU contact block from which five seemingly 8 mm heatpipes arise, conveying heat to a dense aluminum fin array which has largely rectangular fins. The array is cooled a 120 mm fan. There is provision to install one on either sides, that rotates at speeds between 1200 - 2500 rpm. The cooler supports all current CPU sockets, including LGA-1366, LGA-1156, LGA-775, AM3/AM2+. The cooler is now slated for CES 2010.

The 2010 International Consumer Electronics Show (CES) officially kicks off on January 7 in Las Vegas! MSI's formidable achievements in R&D and design will be out in force. In addition to ultra-thin and stylish designs, the much talked about and yet to be released 2010 iF Product Design Award winning netbook, the Wind U160, will be unveiled at CES.

Embodying MSI's flawless and exquisite craftsmanship, the Wind U Series notebooks have not only won countless awards, they've also repeatedly achieved success in the market, with over one million in worldwide sales to date. MSI continues to innovate and uphold its concept of insisting on the best by infusing these concepts into the impressive MSI Wind U Series. Many of these high-quality, exquisite notebook models will be on display at CES, including the Wind12 U200, the U230, the all-new U135, and the iF Product Design Award winning ultra-thin and stylish U160 netbook. With a beautiful and stylish appearance, the U160 features MSI's distinctive Chiclet keyboard, Color Film Print Technology, an artistic and ultra-thin fuselage, and all new software upgrades. In addition its hardware has also been fully upgraded. Featuring the latest generation Intel ATOM N450 processor and Windows 7 OS, the all new elite product series is sure to once again capture international attention and capitalize on market opportunities.

DisplayLink, the company behind USB-based display controllers has disclosed plans to release a display chip during the upcoming CES event next month, that runs on USB 3.0 SuperSpeed interface. The new chip will make use of the increased bandwidth (up to 4.8 Gbps vs. 480 Mbps of USB 2.0), to transmit higher-resolution videos. The current USB 2.0 based DisplayLink chips are able to transmit display of 3D games at 60 fps and HD video at 26~27 fps. The new USB 3.0 based chip will be able to do the same faster, without any flickering, said Dennis Crespo, executive vice-president of marketing and business development at DisplayLink. The DisplayLink technology involves using the system's graphics hardware to drive multiple display-heads, by transmitting display across USB.

Cooler Master is giving one of its best-selling PC cases, the CM 690 a facelift with the CM 690 II Advanced. The new model builds on the CM 690's design and stying, including the perforated metal front bezel with chrome lines. There are a few more gradients here and there to add to its rugged look. It seems to have slate/black colored rear panel, including interiors of the same color (from the looks of it). There is room for several 80/90/120/140 fans as usual. Cooler Master will detail this case further during its unveiling at the upcoming CES event. It also has a teaser site, though for now it doesn't show much more than a countdown.

Following Intel's launch of the new socket LGA-1156 platform with quad-core Intel Core i5, Core i7 "Lynnfield", and the P55 Express chipset to drive the platform, Intel is preparing to drop another chalk in Q1 2010, with dual-core socket LGA-1156 processors that use the Core i3 and Core i5 brand identifiers. A feature unique to these processors is the integration of a graphics controller into the processor package. On the platform side, core-logic must support the Intel Flexible Display technology, which handles connectivity for that graphics controller. The chipset which will drive this would be Intel's upcoming H57 Express chipset, codenamed "Eagle Lake".

Motherboards based on the H57 chipset typically feature display connectors such as DVI, D-Sub, or HDMI. While intended to cover the mainstream segment, H57 can also be used to drive high-grade motherboards, as is shown by ASUS with its newest motherboard based on the chipset - the P7PH57D-V EVO. The ATX motherboard resembles the P7P55D Deluxe in many design aspects. It supports all the high-end features its cousin does, including support for SATA 6 Gb/s and USB 3.0 along with full-bandwidth PCI-Express 2.0 interfaces for the controllers.

Intel's Atom processor platform will get its successor in the next-generation "Pine Trail" platform sooner than expected, what Intel refers to as a 'fast transition to the next-generation platform'. The company plans to detail the new platform for netbooks and nettops on the 21st of December, 2009, by means of a press release. Launches of products based on the new Atom N450 will start as early as by 4th January, 2010, in time for the CES 2010 event.

At the center of the Pine Trail platform is the "Pineview" processor. Unlike its predecessor, Pineview integrates a DDR2 memory controller, graphics processor, and a video decoding processor by Broadcom into a single package. The new processor will support the x86-64 instruction set, indicating that netbooks and nettops could use over 4 GB of memory very soon. The processor also comes with higher performance, and a brand new chipset. Sources reveal the following three initial models to X-bit labs:

• Intel Atom N450: single-core with Hyper-Threading support, 1.66GHz, 512KB cache, x86-64, BGA437 package, $63 price-point;
• Intel Atom D510: dual-core with Hyper-Threading support, 1.66GHz, 1MB cache, x86-64, BGA437 package, $63 price-point;
• Intel Atom D410: single-core with Hyper-Threading support, 1.66GHz, 512KB cache, x86-64, BGA437 package, $43 price-point.

Antec is preparing the airy, new Lanboy Air ATX case. The new case will be one of Antec's star attractions at CES 2010, where it will be launched. The sporty design looks to be massively modular, from the looks of it, users could completely dismantle it. Several shards look to be connected to each other, which make for the case's various panels. Each of these has a steel mesh for high airflow. These, in combination with the black, grey and a dash of yellow, give it a subjectively industrial look.

The case sports three 5.25" drive bays, two 120 mm fans which protrude, and the the front connectors, on the front panel. The area of the side panel covering the drive bays holds another two to three 120 mm fans, two more right over the expansion slot area. The top, again, is perforated, with room for two 120 mm exhausts apart from the usual one on the rear panel. The LanBoy Air awaits launch at CES 2010, which will be held in the coming January. It is expected to be priced at around 200 EUR.

ASUS, a leading producer of home theater PC (HTPC) solutions, today added a new member to its HDAV family: the ASUS Xonar HDAV1.3 Slim sound card. The CES-award winning Xonar HDAV1.3 Series of audio cards has been credited for revolutionizing the world of HTPC by offering the world's first and only solution to bitstream true Blu-ray audio on the PC platform, and this new offering is no different.

ASUS chose last month's CES event to announce its flagship gaming notebook, the W90. Usual high-end specifications aside, the most distinct component used in it is the ATI Mobility Radeon HD 4870 X2, AMD's flagship mobile graphics platform, which is on the brink of snatching the performance crown away from NVIDIA for the platform. A North American sales representative for ASUS tells GPU Café that the W90 will be available from February 23, which perhaps makes it the launch-date for the Mobility HD 4870 X2. It is also noted that the Mobility HD 4670 will be out around the same time, while Mobility HD 4850 will arrive a week or two later.

XtremeSystems forum member Kinc posted some early performance numbers relating to the Mobility HD 4870 X2, featured on the ASUS W90 with an Intel Core 2 Quad T9400, which effortlessly overclocked to 4 GHz on the notebook's stock cooling system. The Mobility HD 4870 X2 carried clock speeds of 600/900 MHz (core/memory). The notebook used Intel's X38 core-logic. At the said parameters, it was put through 3DMark 06. The notebook secured a score of 20,284 3DMarks at default setting. When released, the Mobility Radeon HD 4870 X2 will replace NVIDIA GeForce 9800M GTX SLI as the fastest mGPU solution, replicating a similar feat by its desktop cousin.

CoolIT is showing off a few very interesting concepts and implementation of their cooling technology. The first is a PC which is completely cooled by such a system. The prototype is hand made but features high-end components in a unique formfactor. To control all aspects of the system there is a special PCB, to which you may connect multiple fans among other things. Then there is the notebook cooling prototype. It actually pushes cooled air into the notebooks air vents, to be exausted by the internal cooling fan.

One device, which I forgot to take a picture off, is their Domino ALC CPU cooler. It is a pre-filled and ready to go liquid cooling solution. But fear not, we will have a review of the system shortly.

EVGA is also showing off a few very interesting items. The first being a remote thin client. This unit gives you the ability to access a PC from an outside location, while the machine itself remains in a secure location. All the data is transmitted through a network connection. This includes the display information over DVI. The thin client can drive two DVI based displays, USB and audio. Read on for information on the X58 Classified board.