Avicena, a privately held company headquartered in Sunnyvale, CA, is demonstrating its LightBundle multi-Tbps chip-to-chip interconnect technology at the European Conference for Optical Communications (ECOC) 2023 in Glasgow, Scotland (https://www.ecocexhibition.com/). Avicena's microLED-based LightBundle architecture breaks new ground by unlocking the performance of processors, memory and sensors, removing key bandwidth and proximity constraints while simultaneously offering class leading energy efficiency.

"As generative AI continues to evolve, the role of high bandwidth-density, low-power and low latency interconnects between xPUs and HBM modules cannot be overstated", says Chris Pfistner, VP Sales & Marketing of Avicena. "Avicena's innovative LightBundle interconnects have the potential to fundamentally change the way processors connect to each other and to memory because their inherent parallelism is well-matched to the internal wide and slow bus architecture within ICs. With a roadmap to multi-terabit per second capacity and sub-pJ/bit efficiency these interconnects are poised to enable the next era of AI innovation, paving the way for even more capable models and a wide range of AI applications that will shape the future."

SK hynix announced on September 22 that it showcased its latest memory technologies and products at Intel Innovation 2023 held September 19-20 in the western U.S. city of San Jose, California. Hosted by Intel since 2019, Intel Innovation is an annual IT exhibition which brings together the technology company's customers and partners to share the latest developments in the industry. At this year's event held at the San Jose McEnery Convention Center, SK hynix showcased its advanced semiconductor memory products which are essential in the generative AI era under the slogan "Pioneer Tomorrow With the Best."

Products that garnered the most interest were HBM3, which supports the high-speed performance of AI accelerators, and DDR5 RDIMM, a DRAM module for servers with 1bnm process technology. As one of SK hynix's core technologies, HBM3 has established the company as a trailblazer in AI memory. SK hynix plans to further strengthen its position in the market by mass-producing HBM3E (Extended) from 2024. Meanwhile, DDR5 RDIMM with 1bnm, or the 5th generation of the 10 nm process technology, also offers outstanding performance. In addition to supporting unprecedented transfer speeds of more than 6,400 megabits per second (Mbps), this low-power product helps customers simultaneously reduce costs and improve ESG performance.

AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

To address customers' growing needs, Intel expanded its Intel Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG) offerings to handle the increased demand for customized workloads, including enhanced AI capabilities, and to provide lower total cost of ownership (TCO) and more complete solutions. These new products and technologies will be the focus of Intel's FPGA Technology Day (IFTD) on Sept. 18, where hardware engineers, software developers and system architects can interact with Intel and partner experts.

FPGAs play an important role in Intel's portfolio by offering flexible and customizable platform capabilities for demanding applications and workloads. Intel FPGAs solve customer challenges from cloud to edge with AI capabilities across silicon, IP and software. Intel's latest announcements illustrate how the company's increased investment in its FPGA portfolio is unfolding. So far in 2023, Intel has released 11 of 15 expected new products - more new product introductions than ever in Intel's FPGA business. As disclosed in its second quarter 2023 earnings call, Intel reported that its PSG business unit delivered 35% revenue growth year-over-year, marking the third consecutive quarter of record revenue.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

Lightelligence, the global leader in photonic computing and connectivity systems, today announced Photowave, the first optical communications hardware designed for PCIe and Compute Express Link (CXL) connectivity, unleashing next-generation workload efficiency.

Photowave, an Optical Networking (oNET) transceiver leveraging the significant latency and energy efficiency of photonics technology, empowers data center managers to scale resources within or across server racks. The first public demonstration of Photowave will be at Flash Memory Summit today through Thursday, August 10, in Santa Clara, Calif.

Micron Technology, Inc. (Nasdaq: MU), today announced sample availability of the Micron CZ120 memory expansion modules to customers and partners. The Micron CZ120 modules come in 128 GB and 256 GB capacities in the E3.S 2T form factor, which uses PCIe Gen 5 x8 interface. Additionally, the CZ120 modules are capable of running up to 36 GB/s memory read/write bandwidth and augment standard server systems when incremental memory capacity and bandwidth is required. The CZ120 modules use Compute Express Link (CXL) standards and fully support the CXL 2.0 Type 3 standard. By leveraging a unique dual-channel memory architecture and Micron's high-volume production DRAM process, the Micron CZ120 delivers higher module capacity and increased bandwidth. Workloads that benefit from more memory capacity include AI training and inference models, SaaS applications, in-memory databases, high-performance computing and general-purpose compute workloads that run on a hypervisor on premise or in the cloud.

"Micron is advancing the adoption of CXL memory with this CZ120 sampling milestone to key customers," commented Siva Makineni, vice president of the Micron Advanced Memory Systems Group. "We have been developing and testing our CZ120 memory expansion modules utilizing both Intel and AMD platforms capable of supporting the CXL standard. Our product innovation coupled with our collaborative efforts with the CXL ecosystem will enable faster acceptance of this new standard, as we work collectively to meet the ever-growing demands of data centers and their memory-intensive workloads."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

As COMPUTEX once again opens its door, MSI, the world leader in gaming, content creation, business & productivity, and AIoT solutions, is all geared up to dominate the show floor with a full slate of new lineup and its Best Choice Award honorees. "We are thrilled to be back at COMPUTEX," said Sam Chern, MSI Vice President of Marketing. "We expect to see users' tech experiences reinvented and MSI is at the forefront. Our COMPUTEX 2023 lineup showcases the ultimate fusion of breakthrough technology and everlasting aesthetics that surpasses all limits and indulges global users with the best possible experience like never before."

This year, MSI themes its booth around The Leap to Singularity, envisioning a future in which the technological singularity brings forth superintelligence to improve human lives. Among the highlights on display will be the Raider GE78 HX Smart Touchpad, Stealth 16 and Creator Z17 laptops powered by up to 13th Gen Intel Core i9 processors and NVIDIA GeForce RTX 40 Series graphics, making them powerhouses for gamers and creators alike.

With more countries creating initiatives to develop homegrown processors capable of powering powerful supercomputing facilities, India has just presented its development milestone with Aum HPC. Thanks to information from the report by The Next Platform, we learn that India has developed a processor for powering its exascale high-performance computing (HPC) system. Called Aum HPC, the CPU was developed by the National Supercomputing Mission of the Indian government, which funded the Indian Institute of Science, the Department of Science and Technology, the Ministry of Electronics and Information Technology, and C-DAC to design and manufacture the Aum HPC processors and create strong, strong technology independence.

The Aum HPC is based on Armv8.4 CPU ISA and represents a chiplet processor. Each compute chiplet features 48 Arm Zeus Cores based on Neoverse V1 IP, so with two chiplets, the processor has 96 cores in total. Each core gets 1 MB of level two cache and 1 MB of system cache, for 96 MB L2 cache and 96 MB system cache in total. For memory, the processor uses 16-channel 32-bit DDR5-5200 with a bandwidth of 332.8 GB/s. To expand on that, HBM memory is present, and there is 64 GB of HBM3 with four controllers capable of achieving a bandwidth of 2.87 TB/s. As far as connectivity, the Aum HPC processor has 64 PCIe Gen 5 Lanes with CXL enabled. It is manufactured on a 5 nm node from TSMC. With a 3.0 GHz typical and 3.5+ GHz turbo frequency, the Aum HPC processor is rated for a TDP of 300 Watts. It is capable of producing 4.6+ TeraFLOPS per socket. Below are illustrations and tables comparing Aum HPC to Fujitsy A64FX, another Arm HPC-focused design.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its development of the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.

Building on its development of the industry's first CXL 1.1-based CXL DRAM in May of 2022, Samsung's introduction of the 128 GB CXL DRAM based on CXL 2.0 is expected to accelerate commercialization of next-generation memory solutions. The new CXL DRAM supports PCle 5.0 interface (x8 lanes) and provides bandwidth of up to 35 GB per second.

Today, thanks to Yuuki_Ans on the Chinese Bilibili forum, we have more information about the upcoming "Avenue City" platform that powers Granite Rapids and Sierra Forest. Intel's forthcoming Granite Rapids and Sierra Forest Xeon processors will diverge the Xeon family into two offerings: one optimized for performance/core equipped with P-cores and the other for power/core equipped with E-cores. The reference platform Intel designs and shares with OEMs internally is a 16.7" x 20" board with 20 PCB layers, made as a dual-socket solution. Featuring two massive LGA-7529 sockets, the reference design shows the basic layout for a server powered by these new Xeons.

Capable of powering Granite Rapids / Sierra Forest-AP processors of up to 500 Watts, the platform also accommodates next-generation I/O. Featuring 24 DDR5 DIMMs with support for 12-channel memory, with memory speeds of up to 6400 MT/s. The PCIe selection includes six PCIe Gen 5 x16 links supporting CXL cache coherent protocol and 6x24 UPI links. Additionally, we have another piece of information that Granite Rapids will come with up to 128 cores and 256 threads in both regular and HBM-powered Xeon Max flavoring. You can see storage and reference platform configuration details on the slides below.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

AMD today announced the appointment of five technical leaders to the role of AMD Corporate Fellow. These appointments recognize each leader's significant impact on semiconductor innovation across various areas, from graphics architecture to advanced packaging. "David, Nathan, Suresh, Ben and Ralph - whose engineering contributions have already left an indelible mark on our industry - represent the best of our innovation culture," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "Their appointments to Corporate Fellow will enable AMD to innovate in new dimensions as we work to deliver the most significant breakthroughs in high-performance computing in the decade ahead."

Appointment to AMD Corporate Fellow is an honor bestowed on the most accomplished AMD innovators. AMD Corporate Fellows are appointed after a rigorous review process that assesses not only specific technical contributions to the company, but also involvement in the industry, mentoring of others and improving the long-term strategic position of the company. Currently, only 13 engineers at AMD hold the title of Corporate Fellow.

AIC Inc., (from now on referred to as"AIC"), a leading provider in enterprise storage and server solutions, today unveiled its new server systems powered by 4th Gen Intel Xeon Scalable processors (formerly codenamed Sapphire Rapids). The new server platforms are designed to accelerate performance across the most in-demand workloads that businesses rely on including enterprise, storage, AI and HPC.

The newly launched AIC servers, SB102-HK, SB201-HK and HP202-KT, are designed to offer superior processing performance and energy efficiency by leveraging the innovative features of 4th Gen Intel Xeon Scalable processors. With built-in accelerators, the 4th Gen Intel Xeon Scalable processors optimize the utilization of CPU core resources and feature enhanced memory bandwidth with DDR5, advanced I/O with PCIe Gen 5 and Compute Express Link (CXL) 2.0/1.1, and the ability to accelerate PyTorch real-time inference performance by up to 10x using Intel Advanced Matrix Extensions (Intel AMX) compared to the previous generation. The new AIC servers are empowered by advanced security technologies from 4th Gen Intel Xeon Scalable processors, allowing them to protect data and unlock new opportunities for business collaborations.

Inspur Information, a leading IT infrastructure solutions provider, announced that its G7 server platform fully supports 4th Gen Intel Xeon Scalable Processors. The 16 servers making up the brand-new lineup are industry-leading in terms of performance, openness, intelligent operation & maintenance, and sustainability. Compared with the previous generation of Intel-based products, these servers have 61% higher performance and up to 30% higher computing performance per unit of power consumption. The server platform is designed to be deployed in general-purpose computing, critical computing, AI, and other application scenarios.

Inspur Information's brand-new G7 platform was designed with green technology, open-source solutions, security, and intelligence as priorities. It is an industry-leading example of system design, energy efficiency, and operation & maintenance management. G7 servers support diversified computing, with the most comprehensive product lineup in the industry. With a focus on green energy, this product line supports cold plate and immersion cooling schemes, and has unique cooling designs such as T-shaped radiator and advance heat detection with intelligent regulation, which all work together to reduce energy consumption by up to 30%. The new series also supports cloud operation and maintenance for intelligent fault diagnosis with an accuracy rate up to 95%.

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel Xeon Scalable processor - the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM's well-established cyber security product line. NSA 7160 is equipped with the latest Intel technologies, featuring eight PCIe Gen5 extension slots for LAN modules, built-in accelerators, CXL1.1 and supports installation of RunBMC module & full-height full-length (FHFL) card.

NEXCOM's NSA 7160 is intended for network security and 5G network applications, with cutting-edge features like multi-core computing performance, high memory capacity, high-speed I/O interface, and improved Intel QuickAssist Technology (Intel QAT) hardware acceleration for both enterprise and telecommunication applications. By leveraging 4th Gen Intel Xeon Scalable processors, NSA 7160 accelerates performance across the fastest-growing workloads and delivers value across multiple applications.

Today, Lenovo unveiled 25 new ThinkSystem and ThinkAgile server and hyperconverged solutions powered by Intel's 4th Generation Xeon Scalable Processors as part of its recently announced Infrastructure Solutions V3 portfolio. Designed to help accelerate global IT modernization for organizations of all sizes, the integrated solutions deliver advanced performance, efficiency and management capabilities specifically optimized for complex workloads, including mission-critical, AI, HPC and containerized applications.

"In today's competitive business climate, modern infrastructure solutions that generate faster insights and more efficiently enable complex workloads from the edge to the cloud are critical across every major industry," said Kamran Amini, Vice President and General Manager of Server & Storage, Lenovo Infrastructure Solutions Group. "With the performance and management improvements of the Intel-based ThinkSystem V3 portfolio, customers can reduce their IT footprint by up to three times to achieve greater ROI and more easily transform their infrastructure with one seamless platform designed for today's AI, virtualization, multi-cloud and sustainable computing demands."

Intel today marked one of the most important product launches in company history with the unveiling of 4th Gen Intel Xeon Scalable processors (code-named Sapphire Rapids), the Intel Xeon CPU Max Series (code-named Sapphire Rapids HBM) and the Intel Data Center GPU Max Series (code-named Ponte Vecchio), delivering for its customers a leap in data center performance, efficiency, security and new capabilities for AI, the cloud, the network and edge, and the world's most powerful supercomputers.

Working alongside its customers and partners with 4th Gen Xeon, Intel is delivering differentiated solutions and systems at scale to tackle their biggest computing challenges. Intel's unique approach to providing purpose-built, workload-first acceleration and highly optimized software tuned for specific workloads enables the company to deliver the right performance at the right power for optimal overall total cost of ownership. Additionally, as Intel's most sustainable data center processors, 4th Gen Xeon processors deliver customers a range of features for managing power and performance, making the optimal use of CPU resources to help achieve their sustainability goals.

Giga Computing is an industry leader in high-performance servers and workstations, today announced the next-generation of GIGABYTE servers and server motherboards for the new 4th Gen Intel Xeon Scalable processor to achieve efficient performance gains with built-in accelerators. The new processors have the most built-in accelerators of any processor on the market to help maximize performance efficiency for emerging workloads; and do so while boosting virtualization and AI performance. Generational improvements make this platform ideal for AI, cloud computing, advanced analytics, HPC, networking, and storage applications. For these markets, Giga Computing has announced fourteen new series that constitute seventy-eight configurations for customers to choose from. And all these new GIGABYTE products support the full portfolio of 4th Gen Intel Xeon Scalable processors, including those with high bandwidth memory (HBM) in the Intel Xeon Max Series.

Montage Technology, a leading data processing and interconnect IC design company, announced today that its PCIe 5.0/CXL 2.0 Retimer has successfully achieved mass production. This chip is a key upgrade based on Montage's PCIe 4.0 Retimer, providing a stable and reliable PCIe 5.0 and CXL 2.0 interconnect solution with high bandwidth and low latency for the cloud and high-performance computing market.

Montage's PCIe 5.0/CXL 2.0 Retimer employs advanced signal conditioning technologies to improve signal integrity and increase the effective transmission distance of high-speed signals. Compliant with relevant PCI-SIG and CXL specifications, the chip meets mainstream package requirements, supports transfer rate up to 32 GT/s, and takes the lead in supporting ultra-low transmission latency of less than 5 ns. The chip supports various complex system topologies such as SRIS and Retimer cascading, offering an ideal solution to address the PCIe/CXL signal integrity challenges in next-generation servers, enterprise storage, and AI acceleration systems. The PCIe 5.0/CXL 2.0 Retimer has passed extensive interoperability testing with a variety of compute, storage and networking products, such as CPU, PCIe switches, SSDs, GPUs and NICs, thus laying a solid foundation for the large-scale deployment of cloud computing and data centers.

SK hynix Inc. announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan. 5th through Jan. 8th. The products, introduced under the theme of the "Green Digital Solution," as part of the SK Group's "Carbon-Free Future" campaign, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt and performance. The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe interface.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings its upcoming server platforms powered by 4th Gen Intel Xeon Scalable processors optimized for HPC and storage markets at SC22 on November 14-17, Booth#2000 in the Kay Bailey Hutchison Convention Center Dallas.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue driving the changes in the HPC landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in chip technology coupled with the rise in cloud computing has brought high levels of compute power within reach for smaller organizations. HPC now is affordable and accessible to a new generation of users."

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.