MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

Qualcomm Snapdragon 8cx Gen 3 is a high performance Arm SoC designed to compete with Apple M3, with Windows 11 thin and light notebooks and Chromebooks being its main target devices. Microsoft pins a lot of hope in chips such as the Snapdragon 8cx series as they offer comparable performance and battery life to the current crop of M3 MacBooks. A lot of water has flown under the bridge since Windows RT, and the latest crop of Windows 11 for Arm has a much wider PC application support base thanks to official translation layers by Microsoft. CPUID has an Arm64 version of the popular CPU-Z utility, which correctly detects all the specs of the Snapdragon 8cx, but more importantly, has a Bench tab that can test the single- and multithreaded performance of the CPU.

A Chinese tech enthusiast wasted no time in putting the Snapdragon 8cx through this CPU-Z internal benchmark, and found surprisingly good performance numbers. The single-threaded bench, which loads one of chip's four Arm Cortex-X1C P-cores, registers a score of 543.7 points. This is roughly comparable to that of the AMD "Zen 2" or Intel "Comet Lake" x86-64 core. The multithreaded test, which saturates all four P-cores, and all four Cortex-A78C E-cores, springs up 3479.7 points, which again compares to entry/mainstream x86-64 processors from AMD or Intel. Not impressed? How about the fact that the Snapdragon 8cx Gen 3 is a 7 W chip that idles under 2 W for the most part, and can make do with passive cooling, posting scores comparable to 35 W x86 chips that need active cooling?

The rumors of Nintendo's next-generation Switch handheld gaming console have been piling up ever since the competition in the handheld console market got more intense. Since the release of the original Switch, Valve has released Steam Deck, ASUS made ROG Ally, and others are also exploring the market. However, the next-generation Nintendo Switch 2 is closer and closer, as we have information about the chipset that will power this device. Thanks to Kepler_L2 on Twitter/X, we have the codenames of the upcoming processors. The first generation Switch came with NVIDIA's Tegra X1 SoC built on a 20 nm node. However, later on, NVIDIA supplied Nintendo with a Tegra X1+ SoC made on a 16 nm node. There were no performance increases recorded, just improved power efficiency. Both of them used four Cortex-A57 and four Cortex-A53 cores with GM20B Maxwell GPUs.

For the Nintendo Switch 2, NVIDIA is said to utilize a customized variant of NVIDIA Jetson Orin SoC for automotive applications. The reference Orin SoC carries a codename T234, while this alleged adaptation has a T239 codename; the version is most likely optimized for power efficiency. The reference Orin design is a considerable uplift compared to the Tegra X1, as it boasts 12 Cortex-A78AE cores and LPDDR5 memory, along with Ampere GPU microarchitecture. Built on Samsung's 8 nm node, the efficiency would likely yield better battery life and position the second-generation Switch well among the now extended handheld gaming console market. However, including Ampere architecture would also bring technologies like DLSS, which would benefit the low-power SoC.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Ahead of CES 2023, MediaTek today announced the latest chipset in the Genio platform for IoT devices, the octa-core Genio 700 designed for smart home, smart retail, and industrial IoT products. The new chipset will be featured as part of a demo at MediaTek's booth at CES 2023. With a focus on power efficiency, the MediaTek Genio 700 is a N6 (6 nm) IoT chipset that boasts two ARM A78 cores running at 2.2 GHz and six ARM A55 cores at 2.0 GHz while providing 4.0 TOPs AI accelerator. It comes with support for FHD 60p + 4K 60p display, as well as an ISP for better images.

"When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding," said Richard Lu, Vice President of MediaTek IoT Business Unit. "With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers."

MediaTek today announced the Dimensity 8200, the company's newest chipset for premium 5G smartphones. Smartphones powered by the Dimensity 8200 will offer flagship level experiences - including connectivity, gaming, multimedia, displays and imaging - at a more accessible price point. Built on the 4 nm-class process, the new chipset delivers unparalleled power efficiency. It also integrates an octa-core CPU with four Arm Cortex-A78 cores operating at up to 3.1 GHz, along with a powerful Mali-G610 graphics engine, for better performance across applications.

To enhance gaming performance, the chipset takes advantage of MediaTek's HyperEngine 6.0 gaming technologies so users can enjoy smooth high framerate gameplay without suffering connection drops, FPS jitter, or gameplay hiccups. MediaTek's Intelligent Display Sync 2.0 technology intelligently adjusts the display refresh rate according to the game frame rate detected, which helps provide smoother viewing experiences.

With the announcement of the NVIDIA Jetson AGX Orin developer kit, AAEON is excited to utilize the many benefits that such a powerful system-on-module (SOM) can bring to its own product lines. With the same form factor and pin compatibility as the NVIDIA Jetson AGX Xavier, but with an improvement from 32 TOPS to 275 TOPS, the NVIDIA Jetson AGX Orin is set to make it easier than ever to develop faster, more sophisticated AI applications.

AAEON is therefore pleased to announce two upcoming products available in Q4 which will feature the Jetson AGX Orin 32 GB and Jetson AGX Orin 64 GB as their respective processor modules: the BOXER-8260AI and BOXER-8261 AI@Edge Embedded BOX PCs. Both products will feature the NVIDIA JetPack 5.0 SDK to support the full Jetson software stack to help in the development of AI applications in areas such as high-end autonomous machinery. With two NVIDIA deep learning accelerators (NVDLA), along with a 32 GB 256-bit system memory, the BOXER-8260AI will provide the perfect device for vision-based AI applications. Moreover, its expansive I/O options include 12 RJ-45 slots for PoE, along with DB-9 slots for CANbus and six DIO.

MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology - connectivity, displays, gaming, multimedia and imaging features - to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek's powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the ultra-efficient TSMC 5 nm production process with an octa-core CPU. The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85 GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75 GHz.

"You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market," said CH Chen, Deputy General Manager of MediaTek's Wireless Communications Business Unit. Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek's HyperEngine 5.0 gaming technologies for exceptional power-efficiency that extends play time, and best-in-class frame rates - 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.

MediaTek today announced its new Kompanio 1380 chip, which offers a new level of performance and best-in-class features for premium Chromebooks such as the new Acer Chromebook Spin 513. The Kompanio 1380 delivers incredible portable computing experiences with superb battery life, all in a compact form factor for slim and lightweight devices. "Kompanio 1380 continues MediaTek's legacy as the No. 1 chipmaker for Arm-based Chromebooks, elevating premium Chromebook experiences with next-level performance and extra-long battery life," said PC Tseng, general manager of Intelligent Multimedia Business Unit at MediaTek. "This chip stands out with its outstanding processing performance, best-in-class multimedia and AI features, and smooth cloud gaming capabilities, all integrated into an ultra-efficient 6 nm chip."

"Chromebook users have come to expect more from their Chromebooks, increasingly they are looking for their devices to strike a perfect balance of performance, weight and power efficiency," said John Solomon, VP of Chrome OS at Google. "The Kompanio 1380 is an integral part of delivering a great experience for users whether they're working from home, enjoying media on the go, or anything in between. We're excited to see its versatility come to life on the Acer Chromebook Spin 513, the first product to launch with this chip."

NVIDIA today introduced NVIDIA Jetson AGX Orin, the world's smallest, most powerful and energy-efficient AI supercomputer for robotics, autonomous machines, medical devices and other forms of embedded computing at the edge. Built on the NVIDIA Ampere architecture, Jetson AGX Orin provides 6x the processing power and maintains form factor and pin compatibility with its predecessor, Jetson AGX Xavier. It delivers 200 trillion operations per second, similar to that of a GPU-enabled server but in a size that fits in the palm of your hand.

The new Jetson computer accelerates the full NVIDIA AI software stack, allowing developers to deploy the largest, most complex models needed to solve edge AI and robotics challenges in natural language understanding, 3D perception, multisensor fusion and more. "As robotics and embedded computing transform manufacturing, healthcare, retail, transportation, smart cities and other essential sectors of the economy, the demand for processing continues to surge," said Deepu Talla, vice president and general manager of embedded and edge computing at NVIDIA. "Jetson AGX Orin addresses this need, enabling the 850,000 Jetson developers and over 6,000 companies building commercial products on it to create and deploy autonomous machines and edge AI applications that once seemed impossible."

MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.

Designed for powerful 5G smartphones, the Dimensity 920 balances performance, power and cost to provide an incredible mobile experience. Built using the 6nm high-performance manufacturing node, it supports intelligent displays and hardware-based 4K HDR video capture, while also offering a 9% boost in gaming performance compared to its predecessor, the Dimensity 900.

MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience. "Dimensity 900 brings a suite of connectivity, display and 4K HDR visual enhancements to high-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios," said Dr. JC Hsu, Corporate VP and GM of MediaTek's Wireless Communications Business Unit. "The chipset's support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity."

The Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and support for bandwidth up to 120 MHz. The chipset is equipped with an 8-core central processing unit (CPU) consisting of two Arm Cortex-A78 processors with a clock speed of up to 2.4 GHz and six Arm Cortex-A55 cores operating at up to 2.00 GHz. Dimensity 900 supports flagship LPDDR5 memory and UFS 3.1 storage, and can adapt to a 120 Hz screen refresh rate, bringing excellent performance improvements and a seamless experience to 5G mobile devices.

MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6 nm Dimensity 1200 and 1100 chipsets to MediaTek's 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier," said JC Hsu, Corporate Vice President and General Manager of MediaTek's Wireless Communications Business Unit. "Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements."

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the Exynos 2100 through its first virtual event, Exynos On 2021. The new mobile processor is the company's first premium 5G-integrated mobile processor built on the most advanced 5-nanometer (nm) extreme ultra-violet (EUV) process node.

The chip's computation and graphic processing performance have been improved and refined to surpass the power user's performance expectations. As Samsung's first 5G-integrated flagship mobile processor, the Exynos 2100 is built on an advanced 5 nm EUV process technology that allows up to 20-percent lower power consumption or 10-percent higher overall performance than the 7 nm predecessor. For further enhancement, the chip offers improved cache memory utilization and a stronger scheduler. The octa-core CPU comes in an improved tri-cluster structure made up of a single powerful Arm Cortex -X1 core that runs at up to 2.9 GHz, three high-performing Cortex-A78 cores and four power-efficient Cortex-A55 cores delivering more than 30-percent enhancement in multi-core performance than the predecessor.

In the past few years, the Windows-on-Arm (WoA) market has gotten some momentum has with companies trying to develop their WoA PCs, primarily laptops. One example of that is Microsoft. The company has launched a Surface notebook powered by a custom chip from Snapdragon, called Surface Pro X. This device is being powered by the Snapdragon SQ2 processor. However, what seemed to be missing for a while was the lack of support from the Arm itself for this type of market. That is what the company decided to change and make a brand new processor IP dedicated to "on-the-go" devices as they call it, translating into laptops.

The Cortex-A78C is a new design direction which Arm thinks is a good way for laptops, to get some more serious work done. Unlike the regular Cortex-A78 which is a heterogeneous design of big and little cores (Arm's famous big.LITTLE architecture), the new Cortex-A78C revision aims to change that. The "C" version of the processor is actually a homogeneous structure made up of all the big cores. Where you would typically use four big and four little cores for a design, Arm has decided to go all big with this design. For multithreaded purposes, this is the right decision to boost performance. The level three (L3) cache has seen a boost as well, translating to 8 MB of L3$ found on the die. We are eagerly awaiting to see the first designs based on this configuration and see how it performs.