MSI's third-generation "GAMING" series motherboards are almost ready, and the company displayed two of them at Computex. The first is a mid-range socket LGA1151 motherboard, the MSI Z170A-G45 Gaming, and the X99A-GODLIKE Gaming (we kid you not). It looks like MSI is doing away with the "Gaming 3/5/7/9" nomenclature in the wake of GIGABYTE copying it. The Z170A-G41 Gaming offers a decent feature-set for gaming PC builds with up to two graphics cards. This includes an 10-phase CPU VRM, four DDR4 DIMM slots (dual-channel DDR4), three PCI-Express 3.0 x16 slots, two M.2 slots (32 Gb/s and 10 Gb/s); SATA-Express 16 Gb/s, six SATA 6 Gb/s, Killer E2205 networking, and 8-channel HD audio with ground-layer isolation and audio-grade capacitors.

The X99A-GODLIKE Gaming is a different beast. Topping off the company's LGA2011v3 lineup, this board offers top of the line components. It begins with a 12-phase VRM that draws power from a combination of 24-pin ATX, 8-pin EPS, and 4-pin ATX power connectors; five PCI-Express 3.0 x16 slots with support for 4-way SLI/CrossFire, 32 Gb/s M.2 slot, and an EMI shield that covers a large part of the front PCB area (a la ASUS TUF), and gaming-centric connectivity that includes two gigabit interfaces, 8-channel audio with onboard 600Ω headphones amp, 802.11 ac Killer ACK Double-Shot WLAN, and USB 3.1 type-C ports.

Here's the first picture of ASUS X99M-WS, an upcoming workstation-grade socket LGA2011v3 motherboard based on the Intel X99 Express chipset, which the company claims will be the "most powerful" motherboard of its kind in this form-factor. The board draws power from 24-pin ATX, and two 8-pin EPS power connectors, with an optional 6-pin PCIe power input to stabilize power to add-on cards. The socket is wired to four DDR4 DIMM slots, supporting up to 128 GB of quad-channel DDR4 memory; and two PCI-Express 3.0 x16 connectors.

Other expansion slots include one PCI-Express 2.0 x16 (electrical x4) and a PCI-Express 2.0 x1. Storage connectivity includes eight SATA 6 Gb/s, and a 32 Gb/s M.2 slot. Other connectivity includes two USB 3.1 ports, six USB 3.0 ports, two gigabit Ethernet interfaces (Intel-made controllers); 802.11 ac WLAN, Bluetooth 4.0, 8-channel HD audio with a 115 dBA SNR CODEC, ground-layer isolation, and audio-grade capacitors. The board supports certain 1P Intel Xeon models in addition to Core i7 ones.

GIGABYTE showed off its entry-level ATX motherboard based on Intel Z170 chipset, the Z170-HD3. This socket LGA1151 board, ready for 6th generation Core "Skylake" processors, offers a basic feature-set for single graphics card gaming PC builds. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the CPU with a 7-phase VRM. The CPU socket is wired to four DDR4 DIMM slots, supporting dual-channel DDR4 memory.

Expansion slots on the Z170-HD3 include one PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical x4, wired to the PCH), and two each of PCI-Express 2.0 x1 and legacy PCI. Storage connectivity includes 32 Gb/s M.2 (PCI-Express 3.0 x4 physical layer), two SATA-Express 16 Gb/s, and six SATA 6 Gb/s. Display outputs include one each of D-Sub, dual-link DVI, and HDMI 2.0. Six USB 3.0 ports, gigabit Ethernet (Realtek controller), and 8-channel HD audio with audio-grade capacitors and ground-layer isolation make for the rest of its modern connectivity.

Patriot, a leading manufacturer of computer memory, USB/flash memory, SSDs, and mobile accessories, today extended their Viper 4 series of DDR4 memory to include new 64GB and 128GB quad kits designed for the latest Intel X99 DDR4 platform and Haswell-E processor.

Patriot's latest addition to their Viper 4 DDR4 line of extreme performance memory built for the most demanding environments will include a 64GB (4 x 16GB) and a 128GB (8 X 16GB) kits for the ultimate PC build. Testing in at 14-16-16-31 the Viper 4 64GB and 128GB will start at 2400MHz 1.2V with higher speeds to be announced at a later date. Designed for the PC enthusiast builder or content creator the latest capacity of Viper 4 DDR4 will take any build to the ultimate level of speed.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is proud to announce that its Ripjaws 4 DDR4 memory has achieved the fastest air-cooling frequency record at DDR4 4062MHz on the ASRock X99M Killer/3.1 motherboard.

G.SKILL has been dedicated to unleash the maximum performance of DDR4 memory since its launch in August 2014. Working closely with ASRock, G.SKILL DDR4 memory is capable of reaching a new height of DDR4 memory frequency at a whopping 4062MHz! It is the fastest DDR4 frequency ever seen with both CPU and memory under standard air-cooling.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, will unveil its extreme performance XPG line: new SSDs (Solid State Drives) and DDR4 memory module solutions, the new Apple series of products, Type-C mobile accessories and ruggedized products. Come witness history at ADATA's "Aspire, Empower, Transform" theme on show June 2-6 at COMPUTEX TAIPEI 2015, Taipei World Trade Center, in Nangang Exhibition Hall 1F Booth #J0806.

ADATA will flaunt its extreme performance XPG line of products, including the winner of the Taiwan Excellence Gold Award, the XPG Z1 DDR4 Gaming DRAM. Never satisfied with staying in one place, ADATA's newest XPG Z2 is now set to break another world record at 4034 MHz in the DDR4 gaming memory class. ADATA will also show the latest SX930 gaming SSDs featuring SLC cache technology and premier MLC flash that boost overall speed and stability. To give visitors an extremely fast and playful gaming experience, ADATA will hold a Special Force 2 Challenge game in its XPG display zone and will give away SSD and DRAM prizes every day.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has announced that its JC-45 Committee has approved the first standards for support of "hybrid" DDR4 memory modules which are defined as modules that plug into standard dual in-line memory module (DIMM) sockets and appear like a DDR4 SDRAM to the system controller, yet contain non-volatile (NV) memories such as NAND Flash on the module. These hybrid module families are referred to as Non-Volatile DIMMs, or NVDIMMs, and they may share the memory channel with other standard DDR4 DIMMs. Publication is expected later this year.

"The introduction of hybrid memory modules into system platform architectures adds new levels of functionality to the computer memory hierarchy," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "Non-volatile memory may be used for data persistence, mass storage, and the door is now opened for innovative new applications using the high speed of the DRAM channel. NAND Flash is the first non-volatile memory to be incorporated into the channel; however, the industry is poised for other memory types to be included as well. The framework established by JEDEC is flexible enough to allow for a variety of memories to be included under the 'hybrid' umbrella."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, is honored to announce that its XPG Z2 DDR4 3400 computer memory is able to clock up to 4034MHz when used with an air-cooled msi X99A XPOWER AC motherboard. This creates a new overclocking world record for production line DDR4 computer memory.

In cooperation with motherboard manufacturers, ADATA strives to achieve the best performance in DDR4 memory compliant with the Intel X99 architecture. The XPG Z2 DDR4 3400 breaks the record with extremely high clock frequency of 4034MHz, impressing both gamers and standard CPU clock users alike with outstanding sustained performance, cooling and stability.

Intel's future enterprise computing business, post-2017, could see a unification of its 2-socket (2S), 4-socket (4S), and >8-socket (8S+) platforms unify into one, codenamed "Purley." The platform will consist of multiple SKUs, but a common socket type (Socket-P), and a new interconnect technology replacing InfiniBand, which will wire the sockets and core-logic across multiple server blades, together. Called Omni-Path Interconnect, the tech appears to be fiber-optic at the physical layer, with extremely thin cables, and bandwidths could start at 100 Gbps, for the first generation. The controller driving it will be codenamed "Storm Lake." The inter-socket communication will be care of a newer 10.4 GT/s UPI interconnect, each socket will feature three such UPI channels. The platform will support up to eight sockets per blade, with more sockets across neighboring blades over Omni-Path.

"Purley" will feature a new platform core-logic, in the form of the "Lewisburg" PCH. It will feature the new DMI3 chipset-bus, which is PCI-Express 3.0 x4 at the physical layer. This chipset will support up to four 10 GbE interfaces. On the processor front, will be as processors based on the "Skylake" micro-architecture. Intel will carve out several silicons based on "Skylake," the biggest one will feature 28 physical CPU cores, with HyperThreading enabling 56 logical CPUs, and for the first time, a six-channel (384-bit wide) DDR4 integrated memory controller, with support for DDR4-2666. On the flip side, this IMC only supports one DIMM per channel (DPC). The 3DPC support from previous platforms is gone. These chips will be built on the 14 nm silicon fab process, and their TDP will range between 45W and 165W, depending on the number of cores and clock speeds.

GIGABYTE Technology, a leading creator of high performance server and workstation hardware, is happy to present today the MW70-3S0, its latest dual socket workstation motherboard based on the Intel C612 chipset. It joins the single socket MW50-SV0 to complement GIGABYTE's line of 2011-3 socket based workstation motherboards, and offers workstation builders a high end product featuring the latest technologies and the most reliable components. The MW70-3S0 has been designed with flexibility in mind, through large memory, storage and PCI-Express platforms that will satisfy the most demanding performance requirements of professional workstation users.

G.SKILL International Enterprises Co., Ltd., the world's leading manufacturer of extreme performance memory, proudly announces yet another extreme speed DDR4 memory kit to the market at a blistering 3666 MHz with only 1.35V. This first-of-its-kind top speed memory kit features a 16GB (4GBx4) capacity and premium class Samsung 4Gb IC chips.

Validated on the Gigabyte X99 SOC Champion motherboard, the Ripjaws 4 series DDR4-3666 MHz memory kit takes the high end desktop X99 chipset platform to new heights in the exciting preparation for the upcoming DDR4 platform.

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced that it has created the world's fastest DDR4 128GB memory kit running at an astounding 3000MHz. The kit consists of eight 16GB HyperX Predator modules (16GB x 8) motherboard in an eight module, quad-channel configuration along with an MSI X99 MPOWER motherboard in an eight module, quad-channel configuration along with an Intel Core i7 5820K processor.

During Computex en Taipei,HyperX will unleash a high-performance system featuring the upcoming 16GB modules powered by the recently released HyperX Predator M.2 PCIe SSD. The live demo will take place during the HyperX Roadshow Experience from June 4-7, 2015, at the ATT 4 FUN center, in Taipei. More details will be forthcoming about availability and pricing for HyperX Predator 16GB DDR4 modules and kits.

Intel Corporation today announced the Intel Xeon processor E7-8800/4800 v3 product families, delivering accelerated business insight through real-time analytics and enhanced performance and reliability for mission-critical computing.

Real-time business intelligence is a top priority for companies across the full spectrum of industries, from healthcare to retail to telecommunications, among others. The need to rapidly extract actionable insight from large volumes of data is driving demand for new technologies for in-memory computing and big data analytics. Considering the current and future demand for in-memory computing, Gartner believes that revenue in this market will exceed $9.5 billion by year-end 2018, and at least 50 percent of large organizations will adopt in-memory computing to enable digital business strategies.

Here is the first picture of Colorful's premium socket LGA1151 motherboard, the iGame-Z170. The company plans to carve out at lease three unique SKUs out of this PCB (second picture below), the iGame-Z170 being the base model. As its name suggests, the board is based on Intel's upcoming Z170 Express chipset, and is designed for 6th generation Core "Skylake" processors. Some variants of this board, such as the iGame-Z170U, will feature DDR4 DIMM slots (up to 64 GB), while others will feature DDR3 (up to 32 GB).

The board offers a pretty decent feature-set, including a 14-phase CPU VRM, two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated) wired to the CPU, a third PCI-Express x4 slot wired to the PCH, three other PCI-Express x1 slots; storage connectivity that includes six SATA 6 Gb/s, one SATA-Express, and one M.2 10 Gb/s; two USB 3.1 ports, six USB 3.0 ports, gigabit Ethernet, and a modern onboard audio solution with ground-layer isolation, and audio-grade capacitors. The iGame-Z170 series will launch some time in Q3, 2015. The three will likely be exhibited at Computex 2015, this June.

Major pre-built desktop manufacturers began listing products driven by 5th generation Core "Broadwell" processors, which are having a brief stint at the markets before being replaced by 6th generation Core "Skylake" processors in Q3-2015. The 5th Generation Core family is led by two parts, the Core i5-5675C, and the Core i7-5775C, both of which come with unlocked base-clock multipliers, are based on Intel's new 14 nanometer silicon fab process, and built in the LGA1150 package, compatible with existing Intel 9-series chipset based motherboards, with BIOS updates.

The Core i5-5675C and i7-5775C aren't exactly successors of the i5-4690K and i7-4790K. The i7-5775C is placed in a product tier Intel calls "P1+," while the i5-5675C is placed in one called "MS2+." The two aren't exactly in the same plane as P1K (eg: i7-4790K) or MS2K (eg: i5-4690K), respectively, and don't qualify as P1 (eg: i7-4790 non-K) or MS2 (eg: i5-4690 non-K). The two still feature unlocked multipliers. This places them somewhere between P1K/MS2K and P1/MS2. Both the i5-5675C and i7-5775C are quad-core chips, and physically feature just 6 MB of L3 cache. The i7-5775C has access to all 6 MB of it, while the i5-5675K features just 4 MB.

They've done it! After building the first LGA2011v3 motherboard in the mini-ITX form-factor, letting you cram up to 8 "Haswell" cores into a lunchbox-sized PC, albeit having to make do with just dual-channel memory; ASRock developed the first mini-ITX motherboard with not just LGA2011v3, but also its full quad-channel memory interface, called the EPC612D4I. There's just one rider, which shouldn't really be a dealbreaker - this is a server-grade motherboard, and is bound to be expensive.

The EPC612D4I achieves its quad-channel memory chops by using smaller DDR4 SO-DIMM slots instead of standard-sized DIMM slots. Availability of aftermarket DDR4 SO-DIMM memory is close to non-existent, but that could change with 6th Generation Core processor notebooks hitting the shelves by Holiday 2015. As an enterprise board, it also supports Xeon E5-1600 V3 and E5-2600 V3 processors.

Trying to squeeze revenues from the high-end desktop (HEDT) market to its last drop by saturating it with as many catchy-named models as possible, GIGABYTE launched the X99-SLI socket LGA2011v3 motherboard. This board will likely be priced between $199 and $249, and will compete against the likes of ASUS X99-A and MSI X99S Gaming 7, enabling it to make the most out of the crucial pre-Summer sales season. Built in the standard ATX form-factor, the X99-SLI offers a feature-set that's nearly identical to the company's X99-UD4. It's not a rebrand, because the PCB is different between the two. The X99-SLI could end up being cheaper.

The X99-SLI draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, with an optional 4-pin Molex input to stabilize multiple graphics cards that rely on the PCI-Express slot for power. Power to the CPU is conditioned by a 6-phase VRM. The CPU is wired to eight DDR4 DIMM slots, four on either sides, and four PCI-Express 3.0 x16 slots (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8 on i7-5930K and i7-5960X; x16/NC/x4 or x8/x8/x4 on i7-5820K), supporting 4-way SLI and CrossFireX. The board supports DDR4-3333 MHz with overclocking.

In what is a confirmation that AMD has killed socket AM3+ and its 3-chip platform, a leaked slide that's part of a larger press-deck addressing investors, tells us that the company is planning to launch a high-performance desktop processor targeting enthusiasts, based on its next-generation "Zen" architecture, in 2016. Our older articles detail the Zen CPU core design, and the way in which AMD will build multi-core CPUs with it. This processor will be codenamed "Summit Ridge," and will be a CPU, and not an APU as previously reported. In AMD-speak, what sets a CPU apart from an APU is its lack of integrated graphics.

AMD "Summit Ridge" will be an 8-core CPU built on the 14 nanometer silicon fab process. It will feature eight "Zen" cores, with 512 KB of L2 cache per core, 16 MB of L3 cache, with 8 MB shared between two sets of four cores, each; a dual-channel integrated memory controller that likely supports both DDR3 and DDR4 memory types; and an integrated PCI-Express gen 3.0 root complex, with a total of 22 lanes. We can deduce this from the fact that "Summit Ridge" will be built in the same upcoming socket FM3 package, which the company's "Bristol Ridge" Zen-based APU will be built on. "Summit Ridge" will hence be more competitive with Intel's 6th generation Core "Skylake" processors, such as the i7-6700K and i5-6600K, than the company's "Broadwell-E" HEDT platform.

Intel's next major CPU architecture, codenamed "Skylake," could be classified as the company's 6th generation Core processor family. It will succeed the brief stint Core "Broadwell" will have at the market, with no major chips for PC enthusiasts to look forward to. The Core i7-6700K appears to be the flagship product based on the Skylake-D silicon, succeeding the i7-4770K and i7-4790K. The Core i5-6600K will succeed the i5-4670K and i5-4690K.

The i7-6700K is a quad-core chip, with HyperThreading enabling 8 logical CPUs. Its nominal clock will be 4.00 GHz, with a rather shallow 4.20 GHz Turbo Boost frequency. It will feature an 8 MB L3 cache, and an integrated memory controller that supports both DDR4 and DDR3 memory types. This makes Skylake a transition point for the mainstream PC market to gradually upgrade to DDR4. You'll have some motherboards with DDR3 memory slots, some with DDR4 slots, and some with both kinds of slots. The resulting large uncore component, and perhaps a bigger integrated GPU, will result in quad-core Skylake parts having TDP rated as high as 95W, higher than current Haswell quad-core parts, with their 88W TDP.

Some of the first CPUs and APUs based on AMD's next-generation "Zen" micro-architecture could be quad-core. "Zen" will be AMD's first monolithic core design after a stint with multi-core modules, with its "Bulldozer" architecture. Our older article details what sets Zen apart from its predecessor. As expected, in a multi-core chip, Zen cores share no hardware resources with each other, than a last-level cache (L3 cache), much like Intel's current CPU architecture.

There's just one area where Zen will differ from Haswell. With Haswell, Intel has shown that it can clump any number of cores on a chip, and make them share a proportionately large L3 cache. Haswell-E features 8 cores sharing a 20 MB cache. The Haswell-EX features 18 cores sharing 45 MB of cache. With Zen, however, the scale up stops at 4 cores sharing 8 MB of L3 cache. A set of four cores makes up what AMD calls a "quad-core unit." To be absolutely clear, this is not a module, the cores share no hardware components with each other, besides the L3 cache.

As a quick follow up to our older report on AMD's upcoming "Zen" CPU core micro-architecture being a reversion to the monolithic core design, and a departure from its "Bulldozer" multicore module design which isn't exactly flying off the shelves, a leaked company slide provides us the first glimpse into the core design. Zen looks a lot like "Stars," the core design AMD launched with its Phenom series, except it has a lot more muscle, and one could see significant IPC improvements over the current architecture.

To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.

G.SKILL International Enterprises Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is thrilled to announce the world's first DDR4 128GB(16GBx8) 2800MHz CL16-16-16 -36 1.35V memory kit based on the newest 16GB capacity DDR4 consumer-class memory modules. These high capacity memory modules are manufactured with new 8Gb ICs produced on the latest 20nm fabrication process, which takes performance to a whole new level, by Samsung Electronics.

While 16GB capacity have been available for server memory in the past, support and design for such large capacity memory modules are now paving its way to consumer memory modules, suitable for workstation level workloads where high capacity memory is vital. These new G.SKILL Ripjaws 4 series high capacity memory kits are capable of running in quad-channel at a grand total of 128GB, and have already been validated on the latest ASUS X99 Rampage V Extreme motherboard with Intel Haswell-E processors. A stress-testing screenshot of the newly released memory kit with 16GB DDR4 modules can be found below.

AMD's upcoming "Zen" architecture will see a major change in the way the company designs its CPU cores. It will be a departure from the "module" core design introduced with "Bulldozer," in which two cores with shared resources constitute the indivisible unit of a multi-core processor. A "Zen" core will have dedicated resources in a way things used to be before "Bulldozer," and only the last-level cache (L3 cache), will be shared between cores. "Zen" will also implement SMT, much in the same way as Intel processors do, with HyperThreading Technology.

The first implementation of "Zen" will be an insanely powerful APU (on paper anyway), featuring 16 physical "Zen" CPU cores, 32 logical CPUs enabled with SMT, 512 KB dedicated L2 cache per core, and 32 MB of shared L3 cache. The CPU's ISA instruction set will see a spring-cleaning, with the removal of underused instruction-sets, and the introduction of new ones. Other features on this APU are equally surprising - a quad-channel DDR4 integrated memory controller, a separate HBM (high-bandwidth memory) controller dedicated to the integrated graphics, with up to 512 GB/s bandwidth, and an integrated graphics core featuring "Greenland-class" stream processors. Given that AMD is able to build 7-billion transistor GPUs on existing 28 nm processes, building an APU with these chops doesn't sound far-fetched. The company could still have to rely on a newer fab.

ASRock unveiled its latest socket LGA2011v3 motherboard for Core i7 "Haswell-E" processors, the X99M-Killer USB 3.1. Characterized by its micro-ATX form-factor and two 10 Gb/s USB 3.1 ports, the board offers a pretty tight feature-set. To begin with, the board draws power from 24-pin ATX, 8-pin EPS, and an optional 4-pin Molex. A 12-phase VRM conditions it for the CPU, which is wired to four DDR4 DIMM slots, supporting quad-channel memory. Expansion slots include two PCI-Express 3.0 x16 wired to the CPU, and one PCI-Express 2.0 x16 (electrical x4), wired to the PCH.

Storage connectivity on the X99M-Killer USB 3.1 include ten SATA 6 Gb/s, from which two turn into SATA-Express 10 Gb/s, an eSATA 6 Gb/s, and one Ultra M.2 (PCI-Express 3.0 x4 physical-layer). Modern connectivity includes ASRock's Purity Sound 2 onboard audio solution, featuring a 115 dBA SNR CODEC, audio-grade capacitors, a headphones amplifier, and ground-layer isolation on the PCB; two gigabit Ethernet interfaces, one driven by a Killer E2205, and another by Intel i218-V controller; two USB 3.1 ports (type-A connectors), six USB 3.0 (four on the rear panel, two by header), and a pair of low-latency, power-stabilized USB 2.0 ports, meant for gaming mice or keyboards. Also featured is dual-BIOS, with manual switching between two physical EEPROMs. ASRock didn't announce pricing or availability.

Corsair, a worldwide leader in high-performance PC components, today announced the availability of the Dominator Platinum Series DDR4 3400MHz 16GB memory kits which debuted at CES in January. The new kits are performance tuned to run air-cooled at an incredible 3400MHz and beyond on the Gigabyte X99-SOC Champion motherboard. The memory and motherboard duo together create one of the highest performance enthusiast PC platforms currently available.

The fastest DDR4 memory available from Corsair, the Dominator Platinum 3400MHz 16GB (4x4GB, 16-18-18-36) memory kits have a striking industrial with an orange anodized heat spreader that matches the color scheme on Gigabyte SOC motherboards. Like all Dominator Platinum memory modules, the new kits have patented DHX technology for cooler operation, user-swappable colored "light pipes" for customizable downwash lighting, and Corsair Link compatibility for real-time temperature monitoring. Dominator Platinum memory is built with hand-screened ICs, undergoes rigorous performance testing, and incorporates state-of-the-art cooling for reliable performance in demanding environments.