MSI is readying a trio of Gaming "M" Series socket LGA1151 motherboards with DDR4 memory slots. It's important to note that the "M" does not denote micro-ATX, as it used to, in previous generations. It's inserted before the model number, letting you know that it's an MSI Gaming product, and not by one of its competitors, which imitated its nomenclature, with its Z97 motherboards. The lineup includes the Z170A Gaming M5, the Z170A Gaming M7, and the Z170A Gaming M9 ACK.

The Z170A Gaming M5 offers all the features you need to build a slick gaming PC build, with up to two high-end graphics cards. It offers a 10-phase CPU VRM, an all-PCIe gen 3.0 expansion area, ten SATA ports (including two SATA-Express 16 Gb/s), two M.2 slots (both 32 Gb/s), and AudioBoost III audio, with Killer E2205 GbE. The Z170A Gaming M7 takes things a notch up, with a 14-phase CPU VRM, a "Game Boost" rotary knob that steps up CPU and memory clocks in 11 preset steps, and better onboard audio. The Z170A Gaming M9 ACK leads the pack, with a back-plate, liquid-cooling preparation for the VRM heatsink, and Killer ACK WLAN. All three feature USB 3.1 with both type-A and type-C ports.

Mushkin introduced the ECO2, a DDR3L-1600 MHz (PC3L-12800) memory module. Available in 4 GB and 8 GB densities, and coming in single-module, dual-channel, and quad-channel kits, the module ticks at 800 MHz (1600 MHz DDR3-effective), with timings of 9-9-9-24 CR1, and module voltage of 1.35V. DDR3L could play an important role in the transition of mainstream memory standard from DDR3 to DDR4, with the upcoming Intel Core "Skylake" processors, which feature integrated memory controllers that natively support DDR3L-1600 and DDR4-2400 (or DDR4-2666 as some reports suggest). Expect mainstream pricing for these modules.

MSI, world leading in motherboard technology, announces the most powerful X99 gaming solution, the X99A GODLIKE GAMING motherboard. Featuring Killer DoubleShot-X3 Pro, Turbo M.2 connectivity, 2X Faster USB 3.1 Type-A and Type-C and a whole new gaming oriented LED feature, MYSTIC LIGHT, the X99A GODLIKE GAMING is the most powerful motherboard to serve you in battle.

The X99A GODLIKE GAMING is world's first RGB LED motherboard, supporting more than 2000 colors and many style presets such as breathing, flashing and waving. Make your build look on fire or cold as ice. You are in control. Simply select any of the colors from the palette to suit the systems' design. Just change it to another one using the easy to use Mystic Light APP available on PC, phone and tablet, and make your PC look & feel brand new! With 2048 different colors and 7 different LED modes, the Mystic Light provides infinite possibilities for gamers to personalize their gaming rig.

Intel is expected to debut its 6th generation Core "Skylake" desktop processor family at Gamescom 2015, which will be held in Cologne, Germany, between 5th and 9th August. PC enthusiasts should look forward to two parts in particular, the Core i7-6700K, and the Core i5-6600K. The two quad-core chips will be built in the LGA1151 package, compatible with upcoming motherboards based on Intel's 100-series chipset. Motherboards based on the Intel Z170 Express chipset will allow CPU overclocking. The integrated memory controller of "Skylake" CPUs support both DDR3 and DDR4 memory standards, and should prove to be a transition point between the two.

Following the i7-6700K and i5-6600K with Z170 chipset motherboards, at Gamescom; Intel will launch other parts in the 6th gen. Core processor family between late-August and early-September. Those launches will include i7-6700/6700T, Core i5-6600, 6500, 6400, 6600T, 6500T and 6400T, and H170 and B150 chipsets. Then in late-September, the company will launch the entry-level H110 chipset.

EVGA is giving finishing touches to the X99 Micro2, is latest socket LGA2011v3 motherboard, in the micro-ATX form-factor. The board is characterized by support for two USB 3.1 ports, including a type-C port. Most of the feature-set from the original X99 Micro, is carried over. This includes a 10-phase CPU VRM, three PCI-Express 3.0 x16 slots (full-time x16/x16/x8), a 32 Gb/s M.2 slot, with NVMe BIOS support, making up its expansion area. The board supports up to 64 GB of quad-channel DDR4 memory. Storage connectivity on the X99 Micro2 includes ten SATA 6 Gb/s ports, apart from the 32 Gb/s M.2 slot. Other modern connectivity includes two USB 3.1 ports (at least one of which is type-C), six USB 3.0 ports (four on the rear panel, two by header), 8-channel HD audio with ground-layer isolation, and a headphones amp; and gigabit Ethernet. EVGA didn't announce pricing or availability.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, is honored to announce that its XPG Z2 DDR4 computer memory breaks new record again! It's able to clock up to 4222MHz when used with an air-cooled msi X99A XPOWER AC motherboard. This creates a new overclocking world record for production line DDR4 computer memory.

In cooperation with motherboard manufacturers, ADATA strives to achieve the best performance in DDR4 memory compliant with the Intel X99 architecture. The XPG Z2 DDR4 memory breaks the record with extremely high clock frequency of 4222MHz, impressing both gamers and standard CPU clock users alike with outstanding sustained performance, cooling and stability.

In addition to its flagship GeForce GTX 980 Ti graphics card, Colorful unveiled its most premium socket LGA1151 motherboard, the Z170 Ymir-G. This board offers a massive 18-phase CPU VRM with provision for liquid cooling, four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4-3400 memory, three each of PCI-Express 3.0 x16 and PCI-Express 3.0 x1 slots, making up the expansion area. Storage connectivity includes two SATA-Express 16 Gb/s, one M.2 32 Gb/s (under a detachable portion of the metal shroud, two USB 3.1, six USB 3.0 ports; two gigabit Ethernet connections, and a premium 8-channel HD audio solution.

ASRock is seeking to strike a cost-features sweet-spot around the $130-150 mark with the new Z170 Extreme4 motherboard. ASRock didn't finalize the board's heatsink design, but showed it off at Computex. This ATX form-factor, socket LGA1151 motherboard based on Intel's Z170 Express chipset, features four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4-3400 MHz memory. A 10-phase VRM powers the CPU. The board draws power from a combination of 24-pin ATX and 8-pin EPS connectors; and with this generation, is appears that ASRock has finally got the onboard electrical distribution right; with the board lacking any additional power inputs.

Expansion slots include two PCI-Express 3.0 x16 (x16/NC or x8/x8), one PCI-Express x16 (electrical x4) wired to the PCH, and three PCIe 3.0 x1 slots. Much like the beefier Z170 Extreme7, this board offers three SATA-Express 16 Gb/s ports, but just one M.2 (32 Gb/s) slot; and six SATA 6 Gb/s ports. All other essentials for this generation are covered, with two USB 3.1 ports (one each of Type-C and Type-A), and eight USB 3.0 (four on the rear panel, four by headers); 115 dBA SNR onboard audio with a headphones amp and ground-layer isolation; and a single gigabit Ethernet interface (Intel controller).

Here's one of the first pictures of ASRock's flagship socket LGA1151 motherboards from its mainline Z170 Extreme series, the Z170 Extreme7. This board offers an exhaustive feature set, and should appeal to gamers and overclockers alike. The board draws power from a combination of 24-pin ATX, 8-pin EPS, with no other auxiliary inputs. The LGA1151 socket is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4-3200 MHz memory; and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4); the fourth PCIe x16 slot is electrical x4, wired to the PCH. There's also an mPCIe slot; which will seat a WLAN+Bluetooth card on the /ac variant of this board.

The Z170 Extreme7 is the first motherboard to feature three M.2 slots, all three of which are PCIe gen 3.0 x4 (32 Gb/s). Other storage options include three SATA-Express 16 Gb/s, and ten SATA 6 Gb/s ports. The board features two USB 3.1 ports, one each of Type-C and Type-A; and eight USB 3.0 ports, four on the rear panel, four by headers. Display outputs include one each of dual-link DVI, HDMI 2.0 and DisplayPort 1.2. The onboard audio is an ASRock designed Purity Sound III solution, which combines a Realtek ALC1150 CODEC with ground-layer isolation, a headphones amp, and audio-grade capacitors. Other features include dual-BIOS (manual switching), and a high-quality plastic sheath running along its I/O area.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, displays the highest frequency DDR4 3800MHz kit and the largest DDR4 128GB kit running at a full 3000 MHz CL14.

After the announcement of the DDR4 3666MHz kit in May 2015, G.SKILL continued pushing DDR4 speed to new heights. At Computex this year, G.SKILL demos the ultimate DDR4 3800MHz 16GB(4x4GB) kit on two live demo systems with GIGABYTE GA-X99-SOC-Champion and ASRock Fatal1ty X99M Killer motherboards.

ECS unveiled two socket LGA1151 motherboards based on the Z170 Express chipset, under its L337 line of gamer-centric products - the ATX Z170-Claymore, and the micro-ATX Z170-Blade (pictured in that order). The two pictured below are pre-launch versions, the company didn't finalize their heatsink design or color-scheme. The Z170-Claymore features a 12-phase CPU VRM, four DDR4 DIMM slots, and five PCI-Express x16 slots. Of these, three are wired to the CPU (x16/NC/NC or x8/x8/NC or x8/x4/x4); and two are gen 2.0 x4, wired to the Z170 PCH. Storage connectivity includes six SATA 6 Gb/s, one SATA-Express 16 Gb/s, one M.2, two USB 3.1, six USB 3.0, Realtek-made gigabit Ethernet and HD audio, and 2-way SLI support. The Z170-Blade, on the other hand, is a micro-ATX board with a 9-phase CPU VRM, two PCI-Express 3.0 x16 slots (x16/NC or x8/x8), one PCIe 2.0 x1, six SATA 6 Gb/s ports, an M.2 slot; 6-channel HD audio, and gigabit Ethernet, making up the modern connectivity. Two USB 3.1 and six USB 3.0 ports make for the rest of it.

In addition to the Hi-Fi B150Z5, BIOSTAR unveiled the micro-ATX Hi-Fi H170Z3. Based on the H170 Express chipset, which has the same feature-set as the Z170, minus CPU overclocking and multi-GPU; the Hi-Fi H170Z3 offers a 7-phase CPU VRM, two each of DDR3 and DDR4 memory slots (you can use any one type at a given time), supporting up to 16 GB of dual-DDR3-1600 and up to 32 GB of dual-DDR4-2133; a single PCI-Express 3.0 x16 and PCIe 2.0 x1; two legacy PCI slots; and storage options that include SATA-Express, two SATA 6 Gb/s, and M.2 (10 Gb/s). An 8-channel Hi-Fi onboard audio, gigabit Ethernet, and six USB 3.0 ports, make for the rest of its modern connectivity.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, showcases the brand new Trident Z series of DDR4 memory designed for PC enthusiasts.

With numerous overclocking records under its belt, G.SKILL TridentX series is known as the most powerful overclocking memory series in the PC enthusiast community. The new Trident Z series comes with high quality aluminum heatspreaders and a customized bar in various colors, providing PC builders the options to match their own system's color scheme, while maintaining efficient heat dissipation.

Team Group showed off three new premium DDR4 memory lines at Computex. It begins with the iconic Team Xtreem brand. The company launched the Xtreem LE (18th Anniversary Limited Edition), a double-height module made with binned DRAM chips, and rigorous QA, that results in DDR4-3400 at 16-16-16-36, with 1.35V DRAM voltage. The module PCB is green, but is topped off with a thick black aluminium heatsink, with a soft-gold beam running along its top.

Next up, is the most imaginatively named of the lot, the Team Gaming OC. These blood-red modules feature a 2-layer aluminium heatsink cooling the DRAM chips. Though the heatsink isn't as tall as the one on the Team Xtreem LE, it is decked with red or green LEDs. These modules offer DDR4-3000 with 16-16-16-36, at 1.35V. Last of the three, is the new Team Dark 128 GB memory kit, made up of eight 16 GB modules. These modules do DDR4-2666 at 15-17-17-35, with 1.2V DRAM voltage.

Crucial, a leading global brand of memory and storage upgrades, today announced Crucial Ballistix DDR4 16GB performance memory. Ideal for gamers and enthusiasts who deal with content creation, virtual machines, RAM drives, and memory-intensive applications, the new Ballistix modules leverage Micron's new 8Gb DDR4 component technology to offer up the highest density DDR4 memory to date.

Until now, only expensive server systems have been able to reach these memory densities, but with Ballistix DDR4 16GB modules, users can achieve greater densities on high-end desktop systems like the latest Intel X99 platforms. Available across Sport LT, Tactical, and Elite product lines, each module includes Intel XMP 2.0 profiles for easy setup and support.

Crucial, a leading global brand of memory and storage upgrades, is now sampling Crucial DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.

Higher density modules, when combined with the next DDR4 speed increase of 2400MT/s, create greater channel bandwidth and channel density, as well as increased energy efficiency. Ultimately, these benefits provide more value per gigabit than current 4Gb-based offerings. Taken together, the increase in density, bandwidth, and value deliver a lower total cost of ownership for users.

Hong Kong-based KLEVV, which came out of nowhere in 2014 as a premium PC memory vendor, and established itself as a brand to look out for, launched its flagship DDR4 memory module for the year, the CRAS "Creative Evolution" series. This full-height unbuffered DDR4 module is characterized by a tall anodized aluminium heatsink with aluminium protrusions that add to its surface area of dissipation, and a brushed aluminium strip, with either red or white LED lighting.

KLEVV CRAS comes in module densities of 4 GB and 8 GB, in variants of DDR4-2133 (15-15-15 @1.2V), DDR4-2666 (XMP 2.0, 15-15-15 @1.2V); DDR4-2800 (XMP 2.0, 16-16-16 @1.2V), and DDR4-3000 (XMP 2.0, 16-18-18 @1.35V). It will be initially sold in quad-channel kits of 16 GB (4 x 4 GB), and 32 GB (4 x 8 GB); dual-channel kits of 8 GB (2 x 4 GB) and 16 GB (2 x 8 GB) will soon follow.

ASRock is designing multiple Fatal1ty Killer branded socket LGA1151 motherboards, which it plans to differentiate using a new naming scheme - K3, K4, and K6. The company showed off some of its latest such boards at Computex. The series is led by the Z170 Gaming K6, followed by the Z170 Gaming K4, H170 Performance, and the Z170-e ITX. All four feature the familiar red+black color scheme, and Fatal1ty branding.

The Z170 Gaming K6 leads the pack with a strong 13-phase VRM, 3-way multi-GPU support, dual-channel DDR4-3000 support, dual SATA-Express 16 Gb/s, Ultra M.2 (32 Gb/s), Killer E2200 NIC, and high-end 115 dBA SNR audio. The Z170 Gaming K4 and H170 Performance share a common PCB design, offering all essentials from this platform, and are intended for gaming PC builds with single graphics cards; the Z170 ITX offers a decent feature-set despite its space constraints, including mSATA, Ultra M.2 (32 Gb/s), SATA-Express 16 Gb/s, and USB 3.1 ports. ASRock did not finalize heatsink design.

MSI's third-generation "GAMING" series motherboards are almost ready, and the company displayed two of them at Computex. The first is a mid-range socket LGA1151 motherboard, the MSI Z170A-G45 Gaming, and the X99A-GODLIKE Gaming (we kid you not). It looks like MSI is doing away with the "Gaming 3/5/7/9" nomenclature in the wake of GIGABYTE copying it. The Z170A-G41 Gaming offers a decent feature-set for gaming PC builds with up to two graphics cards. This includes an 10-phase CPU VRM, four DDR4 DIMM slots (dual-channel DDR4), three PCI-Express 3.0 x16 slots, two M.2 slots (32 Gb/s and 10 Gb/s); SATA-Express 16 Gb/s, six SATA 6 Gb/s, Killer E2205 networking, and 8-channel HD audio with ground-layer isolation and audio-grade capacitors.

The X99A-GODLIKE Gaming is a different beast. Topping off the company's LGA2011v3 lineup, this board offers top of the line components. It begins with a 12-phase VRM that draws power from a combination of 24-pin ATX, 8-pin EPS, and 4-pin ATX power connectors; five PCI-Express 3.0 x16 slots with support for 4-way SLI/CrossFire, 32 Gb/s M.2 slot, and an EMI shield that covers a large part of the front PCB area (a la ASUS TUF), and gaming-centric connectivity that includes two gigabit interfaces, 8-channel audio with onboard 600Ω headphones amp, 802.11 ac Killer ACK Double-Shot WLAN, and USB 3.1 type-C ports.

Here's the first picture of ASUS X99M-WS, an upcoming workstation-grade socket LGA2011v3 motherboard based on the Intel X99 Express chipset, which the company claims will be the "most powerful" motherboard of its kind in this form-factor. The board draws power from 24-pin ATX, and two 8-pin EPS power connectors, with an optional 6-pin PCIe power input to stabilize power to add-on cards. The socket is wired to four DDR4 DIMM slots, supporting up to 128 GB of quad-channel DDR4 memory; and two PCI-Express 3.0 x16 connectors.

Other expansion slots include one PCI-Express 2.0 x16 (electrical x4) and a PCI-Express 2.0 x1. Storage connectivity includes eight SATA 6 Gb/s, and a 32 Gb/s M.2 slot. Other connectivity includes two USB 3.1 ports, six USB 3.0 ports, two gigabit Ethernet interfaces (Intel-made controllers); 802.11 ac WLAN, Bluetooth 4.0, 8-channel HD audio with a 115 dBA SNR CODEC, ground-layer isolation, and audio-grade capacitors. The board supports certain 1P Intel Xeon models in addition to Core i7 ones.

GIGABYTE showed off its entry-level ATX motherboard based on Intel Z170 chipset, the Z170-HD3. This socket LGA1151 board, ready for 6th generation Core "Skylake" processors, offers a basic feature-set for single graphics card gaming PC builds. The board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the CPU with a 7-phase VRM. The CPU socket is wired to four DDR4 DIMM slots, supporting dual-channel DDR4 memory.

Expansion slots on the Z170-HD3 include one PCI-Express 3.0 x16, a PCI-Express 2.0 x16 (electrical x4, wired to the PCH), and two each of PCI-Express 2.0 x1 and legacy PCI. Storage connectivity includes 32 Gb/s M.2 (PCI-Express 3.0 x4 physical layer), two SATA-Express 16 Gb/s, and six SATA 6 Gb/s. Display outputs include one each of D-Sub, dual-link DVI, and HDMI 2.0. Six USB 3.0 ports, gigabit Ethernet (Realtek controller), and 8-channel HD audio with audio-grade capacitors and ground-layer isolation make for the rest of its modern connectivity.

Patriot, a leading manufacturer of computer memory, USB/flash memory, SSDs, and mobile accessories, today extended their Viper 4 series of DDR4 memory to include new 64GB and 128GB quad kits designed for the latest Intel X99 DDR4 platform and Haswell-E processor.

Patriot's latest addition to their Viper 4 DDR4 line of extreme performance memory built for the most demanding environments will include a 64GB (4 x 16GB) and a 128GB (8 X 16GB) kits for the ultimate PC build. Testing in at 14-16-16-31 the Viper 4 64GB and 128GB will start at 2400MHz 1.2V with higher speeds to be announced at a later date. Designed for the PC enthusiast builder or content creator the latest capacity of Viper 4 DDR4 will take any build to the ultimate level of speed.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and solid state storage, is proud to announce that its Ripjaws 4 DDR4 memory has achieved the fastest air-cooling frequency record at DDR4 4062MHz on the ASRock X99M Killer/3.1 motherboard.

G.SKILL has been dedicated to unleash the maximum performance of DDR4 memory since its launch in August 2014. Working closely with ASRock, G.SKILL DDR4 memory is capable of reaching a new height of DDR4 memory frequency at a whopping 4062MHz! It is the fastest DDR4 frequency ever seen with both CPU and memory under standard air-cooling.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, will unveil its extreme performance XPG line: new SSDs (Solid State Drives) and DDR4 memory module solutions, the new Apple series of products, Type-C mobile accessories and ruggedized products. Come witness history at ADATA's "Aspire, Empower, Transform" theme on show June 2-6 at COMPUTEX TAIPEI 2015, Taipei World Trade Center, in Nangang Exhibition Hall 1F Booth #J0806.

ADATA will flaunt its extreme performance XPG line of products, including the winner of the Taiwan Excellence Gold Award, the XPG Z1 DDR4 Gaming DRAM. Never satisfied with staying in one place, ADATA's newest XPG Z2 is now set to break another world record at 4034 MHz in the DDR4 gaming memory class. ADATA will also show the latest SX930 gaming SSDs featuring SLC cache technology and premier MLC flash that boost overall speed and stability. To give visitors an extremely fast and playful gaming experience, ADATA will hold a Special Force 2 Challenge game in its XPG display zone and will give away SSD and DRAM prizes every day.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, has announced that its JC-45 Committee has approved the first standards for support of "hybrid" DDR4 memory modules which are defined as modules that plug into standard dual in-line memory module (DIMM) sockets and appear like a DDR4 SDRAM to the system controller, yet contain non-volatile (NV) memories such as NAND Flash on the module. These hybrid module families are referred to as Non-Volatile DIMMs, or NVDIMMs, and they may share the memory channel with other standard DDR4 DIMMs. Publication is expected later this year.

"The introduction of hybrid memory modules into system platform architectures adds new levels of functionality to the computer memory hierarchy," said Mian Quddus, Chairman of JEDEC's JC-45 Committee for Dynamic Random Access Memory (DRAM) Modules. He added, "Non-volatile memory may be used for data persistence, mass storage, and the door is now opened for innovative new applications using the high speed of the DRAM channel. NAND Flash is the first non-volatile memory to be incorporated into the channel; however, the industry is poised for other memory types to be included as well. The framework established by JEDEC is flexible enough to allow for a variety of memories to be included under the 'hybrid' umbrella."