Intel is beginning to put out the first details of its next high-end desktop (HEDT) processors, internally. Codenamed "Broadwell-E," the company's next Core i7 HEDT chips will be built in the existing LGA2011v3 package, and will be compatible with existing motherboards based on Intel's X99 Express chipset (with BIOS updates). Much like "Ivy Bridge-E" was to "Sandy Bridge-E," these chips will introduce only incremental updates, and nothing major, in terms of architecture.

To begin with, Core i7 "Broadwell-E" will be built in the 14 nanometer silicon fab process, and will feature 6 to 8 cores based on the "Broadwell" micro-architecture. These cores will be cushioned with up to 20 MB of L3 cache. The chip is pin-compatible to "Haswell-E," and so its I/O will be identical, featuring a quad-channel DDR4 integrated memory controller. One difference is that Intel may can the 28-lane PCIe approach with the entry-level part; or at least it doesn't find mention on the slide. If it's true, all parts based on this silicon, will feature 40-lane PCIe interfaces. The TDP of these chips will be rated at 140W. Intel is expected to launch the Core i7 "Broadwell-E" in 2016.

SK Hynix Inc. announced that it has developed the world's highest density 16 GB (Gigabytes) of NVDIMM (Non Volatile DIMM) based on 4 Gb (Gigabit) DDR4 using its advanced 20 nm class technology.

This NVDIMM is able to send DRAM data to NAND Flash whose density is two times bigger than the DRAM in a unanticipated power loss by combining DRAM, NAND Flash and the module controller in a single module. Therefore, it is feasible to save and restore data safely as well as performing on the same level with general DDR4 modules. This new product works at 2133 Mbps and with a 64-bit I/O it processes up to 17 GB of data per second running at 1.2V.

Samsung Electronics announced that it is mass producing the industry's most advanced 8-gigabit (Gb) DDR4 memory and 32-gigabyte (GB) module, both of which will be manufactured based on a new 20-nanometer (nm) process technology, for use in enterprise servers.

"Our new 20 nm 8 Gb DDR4 DRAM more than meets the high performance, high density and energy efficiency needs that are driving the proliferation of next-generation enterprise servers," said Jeeho Baek, Vice President of Memory Marketing at Samsung Electronics. "By expanding the production of our 20 nm DRAM line-ups, we will provide premium, high-density DRAM products, while handling increasing demand from customers in the global premium enterprise market."

Among other reasons like support for DDR4 memory modules and being invulnerable to water, the ability to break new records constantly is why ASRock's OC Series motherboards are awesome for overclocking. A couple of weeks ago, Nick Shih overclocked an Intel Core i7 5960X (Haswell-E) on ASRock X99 OC Formula to 6620.73 MHz, and now the skilled overclocker John Lam has set another new record by running Intel Extreme Tuning Utility (XTU) on the same winning combination to achieve a mind exploding 2950 marks! Moreover, overclocker 8 Pack also broke two more new records on an ASRock's Z97 OC Formula and GeForce GTX 980 - 3DMark06 57742 marks and 3DMark05 75123 marks!

SMART Modular Technologies, Inc., a global leader in specialty memory solutions, today announced that it has expanded its lineup of Enterprise Memory products to include DDR4 modules. SMART has attained an exceptional reliability level of sub-two hundred DPPM with its DDR3 RDIMM Enterprise Memory and is achieving similar levels with DDR4 during its internal development process for these enterprise grade modules.

This superior DPPM rate is accomplished utilizing a SMART proprietary Ultra-Reliability Test (URT) burn-in process. Early life failures and weak modules are eliminated through SMART's URT lab where every enterprise grade module undergoes a rigorous triple-stress process entailing hours of burn-in at high speed operation while running custom software at 99% DRAM utilization.

KINGMAX, a leading memory brand, showcased its DDR4 memory module during COMPUTEX Taipei, held in June 2014. After a period of integration, KINGMAX now officially announces its DDR4 application solution has entered mass production. In response to market trends, four types of memory clock speeds have been launched: 1866/2133/2400/3200MHz, with speeds that meet 14.9GB/s to 25.6GB/s requirements, and have exceptionally high transmission efficiency. With the setting of memory standards for the next-generation DDR4 RAM by JEDEC, many companies have taken a wait-and-see approach for the right opportunity. With the launch of Intel's Haswell-E processor platform, which supports DDR4, it is believed that computer products with DDR4 will gradually appear in the market, triggering a rapid increase in a spectacular rise in usage of DDR4 in 2015.

Virtium, the embedded industry's trusted supplier of highly reliable infrastructure SSDs and industrial memory modules, today expanded its embedded infrastructure market support with two new DDR4 VLP UDIMM and VLP RDIMM memory module form factors.

Virtium was one of the first to offer DDR4 memory modules, and the company's latest modules give embedded-industrial OEMs increased performance, lower power and higher bandwidth advantages thanks to the latest evolution in DRAM technology. Offering power savings of up to 40% and as much as twice the bandwidth compared to previous-generation DDR3 modules, Virtium's DDR4 modules are ideal solutions for server blades, networking and telecom applications.

The transition between DDR2 and DDR3 system memory types was slower than the one between DDR and DDR2. DDR3 made its mainstream debut with Intel's X38 and P35 Express platforms, at a time when the memory controller was still within the domain of a motherboard chipset, at least in Intel's case. The P35 supported both DDR2 and DDR3 memory types, and motherboard manufacturers made high-end products based on each of the two memory types, with some even supporting both.

Higher module prices posed a real, and higher latencies, posed a less real set of drawbacks to the initial adoption of DDR3. Those, coupled with the limited system bus bandwidth, to take advantage of DDR3. DDR3 only really took off with Nehalem, Intel's first processor with an integrated memory controller (IMC). An IMC, again in Intel's case, meant that the CPU came with memory I/O pins, and could only support one memory type - DDR3. Since then, DDR3 proliferated to the mainstream. Will the story repeat itself during the transition between DDR3 and the new DDR4 memory introduced alongside Intel's Core i7 "Haswell-E" HEDT platform? Not exactly.

G.SKILL International Co., Ltd., the leading extreme performance memory manufacturer and designer, is excited to feature two extremely high end DDR4 memory at 3333MHz 32GB (4GBx8) and 3200MHz 32GB (8GBx4) during Intel Developer Forum 2014 (IDF 2014). Driven by the newest Intel i7-5960X CPU on the newest ASUS Rampage V Extreme X99 and X99-Deluxe motherboards, the Ripjaws 4 series DDR4 3333MHz 4GBx8 and 3200MHz 8GBx4 memory demonstrates the highest DDR4 speed available in 4GB and 8GB modules, respectively.

"It's very exciting to show the world what we can do with the new DDR4 memory standard for the latest Intel X99 platform. There is no doubt that breaking the 3000MHz memory barrier with ease is the next big thing in desktop performance, effectively doubling bandwidth throughput compared to the previous DDR3 memory standard," says Frank Hung, Product Marketing at G.SKILL.

ASUS' entry-level socket LGA2011-v3 motherboard, the X99-A, began selling. Although announced along with ASUS' mainline flagship, the X99-Deluxe, the X99-A, along with mid-range X99-Pro, weren't available immediately, as the company decided to go in with three flagship LGA2011-v3 products, the ROG Rampage V Extreme and X99-WS being the other two. The X99-A appears to be based on a slightly watered down version of a PCB it shares with the X99-Pro; different from that of the X99-Deluxe. It's targeted at high-end gaming PC and mid-range content-creation builds.

To begin with, the X99-A is built in the standard ATX form-factor. It draws power from a combination of 24-pin ATX and 8-pin EPS connectors. An 8-phase VRM conditions power for the CPU, with a 2+2 phase VRM for the eight DDR4 DIMM slots flanking the CPU socket on either sides. The CPU socket is wired to three PCI-Express 3.0 x16 slots (x16/x16/NC or x16/x8/x8 on i7-5960X and i7-5930K; and x16/NC/NC or x8/x8/NC or x8/x4/x4 on i7-5820K), and a 32 Gb/s M.2 slot, which features a PCI-Express 3.0 x4 physical layer. Other expansion slots include one PCI-Express 2.0 x16 (electrical x4), and two PCI-Express 2.0 x1. The board supports 3-way NVIDIA SLI and AMD CrossFireX.

Crucial, a leading global brand of memory and storage upgrades, has expanded its DDR4 memory portfolio with LRDIMM and VLP RDIMM modules. Designed to enable next-generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 load reduced DIMMs (LRDIMMs) and very low profile registered DIMMS (VLP RDIMMs) are available for immediate purchase through select global channel partners.

By utilising a memory buffer chip that helps reduce the electrical load presented to the memory bus, Crucial DDR4 LRDIMMs allow for more DIMMs per channel and are up to 50 percent more energy efficient and deliver up to 50 percent more memory bandwidth than DDR3 LRDIMMs. Furthermore, by using less voltage and standby current, Crucial DDR4 LRDIMMs transmit power in a more efficient manner to the CPU, allowing for additional power savings and lower total cost of ownership.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Crucial Ballistix Sport DDR4 memory and Crucial DDR4 desktop memory. Designed to enhance high-performance gaming and computing environments, the new Ballistix Sport DDR4 modules deliver introductory speeds of 2400 MT/s, while Crucial DDR4 desktop memory speeds start at 2133 MT/s and are expected to increase as DDR4 technology matures.

Optimized for the latest Intel X99 platforms, the new modules have increased bandwidth over mainstream DDR3 memory and are up to 40 percent more energy efficient. In addition, select Ballistix Sport DDR4 modules are plug and play, featuring XMP 2.0 profiles for easy configuration as well as an integrated heat spreader and black PCB.

Japanese memory maker Century Micro announced its entry-level DDR4 ECC registered memory modules. Compatible with Intel Xeon E5-2600 v3 and Core i7-5000 HEDT processors, the modules come in density of 8 GB (model: CD8G-D4RE2133L82), making up single-module and four-module (32 GB) kits. The CD8G-D4RE2133L82 complies with JEDEC specifications, and runs at DDR4-2133 MHz speeds, with a module voltage of 1.2V, and timings of 15-15-15. The module features an 8-layer PCB, and appears to use DRAM chips made by SK Hynix. The modules will start selling in a couple of weeks from now.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, is pleased to announce its full line of DDR4 extreme performance memory modules already support Intel Haswell-EP series processors. All ADATA DDR4 memory modules will be on display in Booth #379 at the Intel Developer Forum (IDF 2014). ADATA's DDR4 memory supports server, consumer workstation and gaming PC applications. ADATA's lightning-fast DDR4 products deliver superior scalability, power-saving capability, and ultimate reliability for consumer, enterprise and industrial applications across the globe.

Intel Haswell-EP Compatible: Power for Big Data and Cloud
All of ADATA's DDR4 DRAM memory solutions are Intel Haswell-EP compatible to leverage the best in performance, scalability, power efficiency, and reliability. Further benefits such as accessibility and serviceability offer top-to-bottom transparency that factors significantly with the Internet of Things (IoT). ADATA's DDR4 DRAM memory solutions range from 4-16 GB to meet the high-volume demands of Big Data and Cloud applications.

GIGABYTE Technology, a leading creator of high performance server hardware, is happy to introduce today its new lineup of motherboards based on the new Intel C612 chipset. Supporting the brand new Intel Xeon processor E5-2600/1600 V3 product families (former codename Haswell-EP) and the also brand new DDR4 server memory, this new lineup initially consists of one workstation motherboard and six server motherboards.

On Intel's previous server platforms, by design the maximum supported memory frequency has always been automatically downgraded the more DIMMs were being added on a server motherboard. As this trade-off between performance and capacity represents a dilemma to many memory-hungry server applications, GIGABYTE offers a unique solution. All our motherboards based on the LGA 2011-3 socket support by default a maximum frequency of 2133 MHz in any memory configuration.

Intel Corporation today introduced the Intel Xeon processor E5-2600/1600 v3 product families to address the requirements of diverse workloads and the rapidly evolving needs of data centers. The new processor families include numerous enhancements that provide performance increases of up to 3x over the previous generation, world-class energy efficiency and enhanced security. To facilitate the explosive demand for software defined infrastructure (SDI), the processors expose key metrics, through telemetry, which enable the infrastructure to deliver services with the best performance, resilience and optimized total cost of ownership.

The processors will be used in servers, workstations, storage and networking infrastructure to power a broad set of workloads such as data analytics, high-performance computing, telecommunications and cloud-based services, as well as back-end processing for the Internet of Things.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD229-2 Wide I/O 2. Wide I/O 2 offers a significant speed increase over Wide I/O, while retaining Wide I/O's vertically stacked through silicon via (TSV) architecture and optimized packaging. Combined, these characteristics position Wide I/O 2 to deliver the ever-increasing speed, capacity, and power efficiency demanded by mobile devices such as smartphones, tablets and handheld gaming consoles. JESD229-2 may be downloaded free of charge from the JEDEC website here.

Wide I/O 2 provides four times the memory bandwidth (up to 68GBps) of the previous version of the standard, but at lower power consumption (better bandwidth/Watt) with the change to 1.1V supply voltage. From a packaging standpoint, the Wide I/O 2 die is optimized to stack on top of a system on chip (SOC) to minimize power consumption and footprint.

G.SKILL International Co., Ltd., the leading high performance memory designer and manufacturer, is releasing the world's fastest DDR4 memory kit at a breath-taking and neck-breaking 3333MHz!!! With a total capacity of 16GB (4GBx4), the system can take full advantage of quad channel mode and crank up the bandwidth speed to new heights. Not to mention the CAS timings are maintained at a nice CL16-16-16-36, and fully validated on the newest ASUS Rampage V Extreme X99 motherboard.

In addition to the extremely high end DDR4 3333 MHz memory kit, Ripjaws 4 series memory kits are also now available in 3300 MHz 16GB (4GBx4) and 3200MHz 16GB (4GBx4). These high end models are available in sleek black and slated to be available September 5th, on Newegg.com. For all other countries and regions, these high end Ripjaws 4 will be available very soon. The 4x 4GB quad-channel DDR4-3333 kit is available now, at US $699.99.

Mushkin Enhanced MFG, a leading designer and manufacturer of high-performance computer innovations and solutions, today announced that it has officially launched its lineup of unbuffered DDR4 "Essentials" modules. This milestone places Mushkin at the development forefront for the next generation of memory products, which will be nearly twice as fast as today's highest speed DDR3 memory modules. Mushkin's DDR4 Essentials UDIMMs will be available in limited quantities mid-September, with full production volumes available in Q4.

"Mushkin is proud to usher in our fourth generation of double data rate memory modules," said Brian Flood, Mushkin's Director of Product Development. "With our vast experience in DDR technology from the previous three generations, our Essentials DDR4 UDIMMs continue our tradition of providing reliable, high performance, JEDEC-compliant system memory solutions."

Intel's latest X99 platform released Aug. 29, 2014, which marked a milestone where personal computer has officially entered DDR4 high-speed calculating era. As the leading brand of professional memory products, Team Group Inc. has launched DDR4 memory- Elite/Elite+ and Team Server DDR4 targeting mainstream market and server applications respectively.

Following Team Group's tradition of producing high-quality and efficient merchandises, brand-new Team DDR4 memory for desktop and server has adapted 100 percent original particles and passed strict requirements by Team Group, featuring high stability and durability. With complete lifetime warranty (damages from mishandling the product is not covered), it offers customers an excellent high-speed platform experience.

Oregon-based custom PC builder Falcon Northwest has also adopted Intel's new high-end desktop line and is making it available on three of its systems, the Mach V, the Talon and the FragBox. The X99-powered configurations feature the 8-core Core i7-5960X or the 6-core i7-5930K or i7-5820K, liquid cooling for the CPU, up to 64 GB of DDR4 memory, up to six storage drives, and up to three graphics cards set up in SLI or CrossFireX.

The Haswell-E-based Mach V, Talon and FragBox start at $3,021, $2,330 and $2,313, respectively.

G.SKILL International Co. Ltd., the leading high performance memory designer and manufacturer, is proud to announce breaking the DDR4 memory speed record at 4004 MHz extreme frequency.

G.SKILL never stops pushing the computing performance to the limits. Over the past few months, G.SKILL has been dedicated to develop the fastest DDR4 memory and test the performance boundary on the latest Intel X99 platform. All the hard work has finally paid off. G.SKILL Ripjaws 4 Series DDR4 memory broke the DDR4 4 GHz barrier under LN2 extreme cooling, using the ASUS ROG X99 Rampage V Extreme Motherboard and Intel Core i7-5930K CPU.

This incredible score has been validated by CPU-Z.

ASUS today announced X99-Deluxe, X99-Pro and X99-A, three new ATX motherboards based on the Intel X99 chipset and packed with exclusive technologies, including OC Socket and 5-Way Optimization, to ensure ultimate performance from the latest LGA 2011-v3 Intel Core i7 processors.

X99-Deluxe is the flagship model, with a bundled ASUS Hyper M.2 x4 expansion card for ultra-fast 32 Gbit/s transfer speeds; onboard 3x3 (3T3R) 802.11ac for ultra-fast Wi-Fi speeds of up to 1,300 Mbit/s; and an ASUS Fan Extension Card for flexible additional cooling. With a cool, streamlined outlook that includes a broad, striking-white shield, X99-Deluxe and X99-Pro also deliver the futuristic style and strong performance demanded by PC enthusiasts.

Corsair, a worldwide leader in high-performance PC components and ASUS a worldwide leader in motherboards, today announced the availability of the Corsair Dominator Platinum DDR4 memory kits in 3300 MHz, 3200 MHz and 3000 MHz speeds - the world's fastest production memory kits. Corsair developed the new high-speed DDR4 memory in close collaboration with ASUS, tuning and validating the memory timings to take advantage of the optimized DRAM layout and UEFI firmware of ASUS's new X99 motherboards. The new Dominator DDR4 memory kits, when paired with the ASUS X99 Deluxe and Rampage V Extreme motherboards, creates some of the fastest, most stable enthusiast PC platforms available for the new Intel Core i7 processors (codenamed Haswell-E).

"Our rigorous validation with ASUS has enabled us to make Dominator Platinum 3300 MHz the fastest desktop DDR4 memory available at launch," said Thi La, Chief Operating Officer at Corsair. "Our OC team and engineers are excited to see such performance headroom the new Intel platform and are looking forward to releasing even faster kits in the near future."

HyperX, a division of Kingston Technology Company, Inc., the independent world leader in memory products, today announced it will demo next-generation HyperX Predator DDR4 Memory during PAX Prime 2014 in Seattle, Washington, beginning today through September 1, 2014. HyperX Predator DDR4 kits will ship in September. HyperX Predator DDR4 memory is specifically designed for the next generation Intel X99 chipset and the Haswell-E processor. The combination of high frequency, low voltage and aggressive CAS latencies in the HyperX DDR4 memory kits provide users with one of the fastest solutions on the market. HyperX Predator DDR4 memory will be available in 16GB kits of four starting at 1.2V, and frequencies from 2133MHz to 3000MHz.

"With the industry launch of DDR4 memory, the HyperX team is excited to have our Predator DDR4 memory ready for the next generation of PC enthusiasts who continually want the absolute best performance possible from their system," said Edward Baily, business manager, HyperX. "Gamers can also turn to HyperX for all of their peripheral hardware needs from the comfortable and great sounding Cloud headset to the speedy and accurate Skyn mouse pad. As HyperX continues to support the world of gaming and eSports, we hope the community sees us a trusted leader in the gaming hardware industry."