Here are the first pictures of ASRock X99 OC Formula, the Nick Shih-designed socket LGA2011-3 motherboard for professional overclockers. Designed for CPU and memory overclocking, apart from running up to four graphics cards in multi-GPU configs, the board can supply a claimed "1300W" of maximum CPU power, using its 12-phase CPU VRM. Memory is care of a 4-phase VRM. The board draws power from a combination of 24-pin ATX, 8-pin EPS, 4-pin ATX, and 4-pin Molex power connectors, to stabilize the various power domains.

The LGA2011-3 socket is wired to eight DDR4 DIMM slots, which can support up to 64 GB of quad-channel DDR4 memory. The board features BIOS options that can let you crank DRAM frequencies over 4000 MHz. Expansion slots include four PCI-Express 3.0 x16 (x16/x8/x16/x8), an mPCIe 2.0 x1 (for WLAN cards), and one PCI-Express 2.0 x16 (physical x4). Storage connectivity includes two M.2 slots, from which one is an "Ultra M.2" slot, which is wired to the CPU, and features physical-layer PCI-Express 3.0 x4; and ten SATA 6 Gb/s ports. The board offers ten USB 3.0 ports (six on the rear panel, four by headers). 8-channel HD audio with audio-grade capacitors and ground-layer isolation; two gigabit Ethernet interfaces, at least one of which is Intel-made, make for the rest of it.

Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

Intel will price its next-generation Core i7 "Haswell-E" HEDT processors along expected lines. The lineup will begin with the Core i7-5820K, priced at US $389 - just $50 more than a Core i7-4790K. There are some major trade-offs you need to consider when choosing between the two. The i7-5820K is a six-core chip, but its motherboard and newer, costlier DDR4 memory, will jack up your overall platform costs. The i7-4790K lets you buy a motherboard as cheap as $120, and memory that's as cheap as it gets. It's now confirmed that the i7-5820K features 6 cores, 12 threads enabled by HyperThreading, a quad-channel DDR4 memory interface, and 15 MB of L3 cache, but a narrower 28-lane PCI-Express 3.0 root complex. The chip features TurboBoost frequency of 3.60 GHz.

To use the platform to its fullest, you'd need to part with at least US $583 for a processor. That's what will get you the Core i7-5930K. Also a six-core chip, the i7-5930K features a wider 40-lane PCI-Express 3.0 root complex, letting you set up 3-way and 4-way high-end multi-GPU setups with sufficient bus width for each of the cards running in tandem. The chip features 6 cores, 12 threads, a quad-channel DDR4 IMC, 15 MB of L3 cache, and TurboBoost frequencies of up to 3.70 GHz. Leading the pack is the Core i7-5960X, Intel's first eight-core high-end client CPU. It's priced at a wallet-scorching $999. For close to a grand, you get 8 cores, 16 threads enabled with HyperThreading, a massive 20 MB of L3 cache, a quad-channel DDR4 IMC, and 40 PCI-Express 3.0 lanes. To keep the eight cores within Intel's desired 140W thermal envelope, the company had to go easy on the clocks. It offers TurboBoost frequencies of up to 3.50 GHz. All three chips feature unlocked base-clock multipliers.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-4 Low Power Double Data Rate 4 (LPDDR4). Designed to significantly boost memory speed and efficiency for mobile computing devices such as smartphones, tablets, and ultra-thin notebooks, LPDDR4 will eventually operate at an I/O rate of 4266 MT/s, twice that of LPDDR3.

The new interface promises to have an enormous impact on the performance and capabilities of next-generation portable electronics. "LPDDR4 represents a dramatic performance increase," said Mian Quddus, Chairman, JEDEC Board of Directors. "It is intended to meet the power, bandwidth, packaging, cost and compatibility requirements of the world's most advanced mobile systems." Developed by JEDEC's JC-42.6 Subcommittee for Low Power Memories, the JESD209-4 LPDDR4 standard can be downloaded from the JEDEC website for free by clicking here.

G.SKILL International Co., Ltd., the leading high performance memory designer and manufacturer, reveals the long awaited next generation Ripjaws 4 series DDR4 memory kits! Featuring all new redesigned heatspreaders in three different colors, high performance frequencies, high capacity, DDR4 quad-channel ready, and ultra low voltages, the Ripjaws 4 series is all the benefits of DDR4 rolled into one sleek package.

With a standard of 2133MHz, DDR4 is the next generation definition of performance. Also available in 2400MHz, 2666MHz, 2800MHz, 3000MHz, and 3200MHz, the starting lineup is continuing where DDR3 left off. With capacities starting at 16GB (4GBx4), 32GB (8GBx4 / 4GBx8) and 64GB (8GBx8), your new X99 platform will have more memory space to do what you need it to do. That's not all! Ripjaws 4 also has an ultra low voltage rating of 1.2V for kits under 2800MHz and 1.35V for 3000/3200MHz.

Today ASRock decided to show off yet another (last week it revealed the X99X Killer, X99M Killer and X99 WS) motherboard based on the Intel X99 chipset, the X99 Extreme6. This board, like the X99 WS, has a black and blue color theme and it features support for Haswell-E processors, eight DDR4 memory slots (for up to 128 GB of RAM), ten SATA 6.0 Gbps ports and one Ultra (PCIe 3.0 x4) M.2 connector, plus three PCI-Express x16 slots allowing SLI or CrossFire multi-GPU setups.

ASRock's creation also has 7.1 channel Purity Sound 2 audio, dual Gigabit Ethernet (includes one Intel NIC), two USB 2.0 and six USB 3.0 ports on the back panel plus another connector on the PCB near the DDR4 slots, one eSATA connector, and a debug LED. The X99 Extreme6 is expected to be officially launched next week.

It turns out that our older report suggesting that the most affordable of Intel's new Core i7 "Haswell-E" HEDT processors will feature a slimmer PCI-Express root complex, even if it gives you 6 cores at a [hopefully] sub-$400 price-point, holds true, after all. Intel's wacky approach to its latest HEDT processor lineup was confirmed by leaked manuals of Gigabyte's socket LGA2011-3 motherboards, based on the Intel X99 Express chipset. The manual confirms that while Intel's $500-$750 Core i7-5930K and >$1,000 Core i7-4960X offer bigger 40-lane PCI-Express Gen 3.0 root complexes; the Core i7-5820K features a narrower 28-lane one. This means that multi-GPU configurations on systems running the chip won't be too different from those on LGA1150 "Haswell" platforms.

On motherboards with, say, three PCI-Express 3.0 x16 slots, the i7-5930K and i7-5960X will let you run two slots at full x16 bandwidth, and a third slot at x8. On systems with the i7-5820K, the second slot won't go beyond x8, and the third one will cap out at x4. On boards with four slots, one of them will run out of bandwidth. The trade-off for this narrower PCI-Express interface is the fact that you're getting six "Haswell" cores, twelve logical CPUs enabled with HyperThreading, about 12 MB of L3 cache, and a quad-channel DDR4 memory interface, at a price-point not too far off from the Core i7-4790K. So for enthusiasts with no more than two high-end graphics cards, the i7-5820K could provide an attractive gateway option to Intel's new HEDT platform. You can find the leaked manuals in this thread.

Wanna build a Haswell-E HEDT build on the "cheap?" Then this could make it to your list. ADATA is ready with its no-frills Premier line of DDR4 memory modules, which are sold in single-module packs of 4 GB and 8 GB. The modules stick to JEDEC specifications of DDR4-2133 MHz (PC4-17000), with CAS latencies of 15T, and voltage of 1.2 Volt. The modules use DRAM chips made by SK Hynix. Inclusive of all taxes, the 4 GB module is priced at the equivalent of $75 USD in Japan; and the 8 GB module goes for the equivalent of $150.

Here's the first picture of G.Skill's gaming-grade RipJaws 4 DDR4 memory modules. Featuring a slightly new heatspreader design, albeit the same flashy colour options as its DDR3 predecessors, RipJaws 4 will initially ship in quad-channel kits of 16 GB (4x 4GB) and 32 GB (4x 8GB); in time for Intel's Core i7 "Haswell-E" HEDT platform. G.Skill's range will begin at DDR4-2133, going all the way up to DDR4-3000. The ones above DDR4-2133 will ship with XMP 2.0 profiles that let you run the advertised speeds with a simple setting in the UEFI setup program. UK retailer Overclockers UK has it up for pre-order at this page.

Intel is expected to launch its next flagship Core i7 HEDT (high-end desktop) processors, codenamed "Haswell-E" along with compatible motherboards based on the company's X99 Express chipset, on the 29th of August, 2014. The platform will introduce DDR4 system memory to the consumer space. On that day, Intel's new processors, compatible motherboards, and DDR4 memory modules should be ready to buy off the shelf.

Intel's Core i7 "Haswell-E" processor lineup will include three parts, two six-core, and one eight-core. Leading the pack will be the Core i7-5960X, featuring eight cores based on the "Haswell" micro-architecture, with HyperThreading enabling 16 logical CPUs; a staggering 20 MB of shared L3 cache, and 3.00 GHz clock speed. It will command a four-figure price. Next up, is the Core i7-5930K, featuring six cores, HyperThreading enabling 12 logical CPUs, 15 MB of shared L3 cache, and 3.50 GHz clocks. This chip will be priced anywhere between $500 and $750. The most affordable chip will be the Core i7-4820K, which will be a six-core chip. Its other specs are unclear. It is expected to be priced between $350 and $450.

Corsair, a leader in high-performance PC hardware, today announced the availability of Corsair Vengeance LPX and Dominator Platinum lines of high-speed DDR4 computer memory. This new generation of memory ushers in a new age of ultrafast computing with optimizations such as increased DRAM bandwidth, higher bus frequencies, lower power usage, and higher reliability.

Corsair Vengeance LPX and Dominator Platinum DDR4 memory kits are validated with motherboard partners (ASUS, ASRock, EVGA, Gigabyte, and MSI) and use the new XMP 2.0 profile to deliver easy, reliable overclocking performance with the upcoming next-generation Intel X99 platforms and Intel Core i7 processors (codenamed Haswell-E). The Vengeance LPX and Dominator Platinum memory kits are supplied with a limited lifetime warranty.

Overclockers UK were the first e-tailer to list the brand new DDR4 memory with the Crucial Ballistix range and now have expanded their portfolio to include Corsair's high performance memory now bringing it to the largest range of DDR4 in the UK. The memory is ready to order with already a few modules in stock ready to buy.

Overclockers UK are well known to hit the market first with new technology. As X99 chipsets are just around the corner, we see the advancement in memory technology to DDR4. Overclockers UK were the first in the UK to list Crucials Ballistix DDR4 memory range with full specs and product details. Since then, Overclockers UK have expanded their DDR4 memory range to include Corsairs high-performance modules even including the well established Corsair Platinum range. Prepared like a coiled spring ready for X99, Overclockers UK will be ready with all the components customers need to upgrade to the latest technology, hosting a full range of motherboards, memory and even fully built X99 systems. With the addition of Corsairs DDR4 range, Overclockers UK now boasts the largest range to offer.

Taiwanese company ASRock has this week provided a few press images of its soon-to-be-released X99X Killer motherboard. Based on Intel's X99 chipset, the board offers support for Haswell-E (LGA2011) processors and features eight DDR4 memory slots (for up to 128 GB of RAM), three PCI-Express x16 slots (allowing SLI or CrossFire setups), ten SATA 6.0 Gbps ports, plus one Ultra (PCIe x4-powered) M2 connector.

ASRock's creation also has 7.1-channel Purity Sound 2 audio, dual Gigabit Ethernet (one Intel NIC and one Killer E2200 NIC), two Fatal1ty and six 'regular' USB 3.0 mouse ports, one eSATA connector, plus a debug LED. The X99X Killer is set to become available after August 29th.

Adding to the world's most comprehensive line of workstation solutions, Dell today announced new mainstream and performance tower and rack workstations, the Dell Precision Tower 5810, Tower 7810, Tower 7910, and Rack 7910, designed to address the critical requirements of customers in compute-intensive fields such as engineering, manufacturing, and media and entertainment.

Updated with Intel's latest Xeon processors, DDR4 memory, next-generation graphics technology from NVIDIA and AMD, and doubling the amount of memory from the previous generation, these powerful, scalable systems are optimized and independent software vendor (ISV) certified to run the most demanding applications. In addition, Dell is releasing a new version of the Dell Precision Optimizer v2.0, which automatically configures workstation settings to maximize application performance.

Lenovo today, at SIGGRAPH 2014 in Vancouver, British Columbia, announced the launch of the ThinkStation P Series, unveiling its vision for the ultimate in desktop workstation performance, reliability and usability. Rebuilt from the ground up, the Lenovo ThinkStation P900, P700 and P500 workstations join the entry-level ThinkStation P300, announced in May 2014, as the most powerful professional-grade desktop workstations available. Now, professionals in engineering, architecture, media and entertainment, oil & gas, medical & science, finance and other industries can arm themselves with workstation technology selected and configured to meet their needs for enhanced productivity and limitless innovation.

"After a period of intensive research, development and testing, we're excited to introduce our next generation workstations to the market, as we truly believe this is the best designed workstation ever," said Victor Rios, vice president and general manager, Workstation, Lenovo. "We built on the advancements delivered in our 30 Series workstations and engineered the P Series with new levels of innovation based on extensive customer feedback. The result for users is optimum performance, outstanding reliability and unparalleled usability that is unlike anything they have experienced."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the first DDR4 overclocking memory of XPG series - XPG Z1, which supports the latest Intel Haswell-E platform for ultimate performance. With the benefits of DDR4, the XPG Z1 is not only a powerful weapon for gaming, also an important component for overclocking.

Performance Boosts with Great Power Efficiency
DDR4 outperforms DDR3 with improved performance and lower power consumption. The operating voltage has decreased from 1.5V to 1.2V, which is a 20% reduction of power, and keeps the system at a low temperature for stable operation. With speeds of up to 2800 MHz, timings of CL 17-17-17 and transfer bandwidth reaching 22 GB/s, the XPG Z1 provides improved efficiency of data transfer than ever. It only requires 1.2V to achieve high clock frequency of 2800 MHz for overclockers. In addition, the SPD (Serial Presence Detect) of XPG Z1 allows direct application without changing settings in the BIOS, facilitating usage and system stability.

AgigA Tech, Inc., a subsidiary of Cypress Semiconductor Corp. and a leading provider of high-speed, high-density, and battery-free nonvolatile memory solutions, today announced that it is now sampling the industry's first DDR4 Nonvolatile DIMM (NVDIMM) to key OEMs and development partners. The AGIGARAM DDR4 NVDIMM has been designed to operate in the standard DIMM sockets of next-generation, Intel-based server platforms, providing a significant boost to I/O performance in a host of applications, including storage and database acceleration. AgigA Tech will show its new AGIGARAM DDR4 NVDIMM here at the Flash Memory Summit in the Storage Network Industry Association's (SNIA) booth number 808.

DDR4 is the latest evolution in DRAM technology, building upon previous generations with improved reliability, speed and power. With current data rates reaching 2,400 MT/s, DDR4 increases performance up to 50% over DDR3, while delivering a 20% reduction in operating voltage. With DDR4's additional power-saving features, total overall power savings versus DDR3 can be as much as 40%. The AGIGARAM DDR4 NVDIMM builds upon the success of the DDR3 NVDIMM products currently shipping to top-tier OEMs.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the Premier DDR4 2133 Unbuffered DIMM memory, which supports the latest Intel Haswell-E platform for extreme performance. Thanks to the benefits of DDR4 and rigorous production of ADATA, the DDR4 2133 U-DIMM memory module is the best upgrade solution for PC DIY users.

Faster Data Transfer, Higher Power Efficiency
With speeds of up to 2133 MHz and a transfer bandwidth reaching 17 GB/s, the Premier DDR4 2133 Unbuffered DIMM provides greater efficiency of data transfer than previous generations of DRAM. Compared to DDR3, DDR4 memory features faster clock frequencies and lower power consumption. Running at just 1.2 volts, the new DDR4 2133 Unbuffered DIMM can save 20% of the power making it an environmentally friendly component. In desktop PCs, the advantages of DDR4 will lead to lower costs and improved overall performance.

AMD's desktop processor and APU platforms are not expected to see any major changes till 2016, according to a BitsnChips report. The delay is attributed to a number of factors, including DDR4 memory proliferation (i.e. for DDR4 memory to get affordable enough for target consumers of APUs), and AMD's so-called "project Fast-Forward," which aims to place high-bandwidth memory next to the APU die, for the AMD's increasingly powerful integrated graphics solutions to overcome memory bottlenecks.

The company's upcoming "Carrizo" APU is targeted at low-TDP devices such as ultra-slim notebooks and tablets; and is the first chip to integrate AMD's next-generation "Excavator" CPU micro-architecture. "Carrizo" chips continue to use DDR3 system memory, and therefore it's possible that AMD may design a socket FM2+ chip based on "Excavator," probably leveraging newer silicon fab processes. But otherwise, socket FM2+ is here to stay.

SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today that it has begun shipments in sample quantities of DDR4 memory modules. These samples are for qualification in next generation server, storage and networking applications which are expected to launch later in 2014 through 2015.

Currently, SMART's lineup of available DDR4-2133 1.2V modules includes VLP (Very Low Profile) and standard height RDIMMs up to 16 GB, and ECC SO-DIMMs up to 8 GB. These modules include improved capacity and performance scalability, improved power efficiency, and enhanced system reliability, which are all benefits driving the transition to DDR4.

ADATA Technology Co., Ltd., is honorably invited by Intel as a strategic partner to the Grantley New Platform Workshop. During the 4 day event taking place on June 24th & 25th in Hillsboro, Oregon and July 9th & 10th in Hudson, Massachusetts, ADATA will proudly demonstrate the latest DDR4 server DIMMs, DDR3 LR-DIMMs, and complete product line of 2.5" SSDs and PCIe SSDs. One of the primary showcases will be server grade DDR4 R-DIMMs supporting the latest Intel Xeon processor E5-2600 v3 series with the features of up to 16 GB density, 1.2V low power consumption, and maximized 2133 MHz high speed transmission. ADATA's DDR4 product line includes DDR4 RDIMMs, VLP R-DIMMs, LR-DIMMs, and ECC SO-DIMMs.

In-memory computing stores data on memory chips rather than hard drives removes any performance bottleneck caused by traditional storage. ADATA DDR3 LR-DIMMs 64GB and R-DIMMs 32GB (with Invensas DFD technology) support In-memory computing with high capacity and outstanding performance. In Intel New Platform Workshop, ADATA will demonstrate DDR3 LR-DIMMs, which deliver up to 64GB capacity for Intel Xeon processor E5 V2 family-based servers, and increase total memory capacity by up to 1.5 TB to fulfill In-Memory Computing application.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Core i7 "Haswell-E" HEDT (high-end desktop) processors, along with compatible motherboards based on the Intel X99 Express chipset, are expected to launch on September 14, 2014, according to a leaked Intel supply chain document scored by VR-Zone. The Core i7 "Haswell-E" series succeeds current Core i7 "Ivy Bridge-E," and its compatible X79 Express chipset. The new chips will be built in the new LGA2011-3 package (incompatible with current LGA2011), and will be the first client desktop platform to support the new DDR4 system memory standard. The series will include three parts, the six-core Core i7-5820K and i7-4930K; and the eight-core i7-5960X. The three are detailed in our older article, here.

Micron Technology, Inc., (Nasdaq:MU) today congratulates Daniel Skinner, Director, Mobile DRAM Architecture, on receiving the prestigious JEDEC Award of Excellence in recognition of his leadership as chairman of the LPDDR3 and LPDDR4 Task Groups. The Award of Excellence is the most prestigious award bestowed by the Association, and it recognizes an individual's sustained service to JEDEC and the standards community. Mr. Skinner is only the 10th individual to have been awarded this honor.

"Dan was instrumental in driving the development of LPDDR3 in a timely manner to meet the needs of the mobile industry," said JEDEC president John Kelly. "His continued leadership within JEDEC around LPDDR4 has been essential as he led the task group to identify next-generation mobile apps and develop a standard around the needed requirements to make those apps a reality."

Intel's presentation for Italian technology conference 3D Revolution 2014 was leaked to the web, revealing the company's most up-to-date desktop CPU roadmap, which looks deep into 2015. It reveals a wealth of new information. To begin with the HEDT (high-end desktop) segment, Intel plans to drag Core i7 "Ivy Bridge-E" through Q3-2014, and launch its succeeding Core i7 "Haswell-E" processor close to Q4-2014, or late into Q3, which would pin its launch some time in September 2014. "Haswell-E" is built in the new socket LGA2011-3 package, and is supported exclusively by Intel X99 Express chipset. It also heralds DDR4 memory to the consumer space. "Haswell-E" will have its reign till late-Q3 2015, when Intel plans to launch Core i7 "Broadwell-E," which is built in the same package, and supported by the same X99 platform, but based on a swanky new 14 nm silicon.

Things get interesting with the company's mainline desktop processors. Intel recently launched its "Haswell" Refresh silicon, and is bound to launch their unlocked variants, codenamed "Devil's Canyon," on the 25th of June. Built in the LGA1150 package, "Haswell" Refresh runs on both 8-series and 9-series chipset. Intel's 9-series chipset was originally designed to launch alongside the company's first processors built on the 14 nm silicon fab process, codenamed "Broadwell," which is an optical shrink of "Haswell," with a few minor tweaks and speed bumps, just as "Ivy Bridge" was to "Sandy Bridge." Intel's "Broadwell" chips are now expected to debut in Q1-2015, probably along the sidelines of the 2015 International CES. These chips will be supported by existing LGA1150 motherboards, some with BIOS updates.