SMART Modular Technologies, Inc., a leading designer, manufacturer and supplier of specialty memory and storage solutions, including memory modules, flash memory cards and other memory and solid state storage products, has announced today that it has begun shipments in sample quantities of DDR4 memory modules. These samples are for qualification in next generation server, storage and networking applications which are expected to launch later in 2014 through 2015.

Currently, SMART's lineup of available DDR4-2133 1.2V modules includes VLP (Very Low Profile) and standard height RDIMMs up to 16 GB, and ECC SO-DIMMs up to 8 GB. These modules include improved capacity and performance scalability, improved power efficiency, and enhanced system reliability, which are all benefits driving the transition to DDR4.

ADATA Technology Co., Ltd., is honorably invited by Intel as a strategic partner to the Grantley New Platform Workshop. During the 4 day event taking place on June 24th & 25th in Hillsboro, Oregon and July 9th & 10th in Hudson, Massachusetts, ADATA will proudly demonstrate the latest DDR4 server DIMMs, DDR3 LR-DIMMs, and complete product line of 2.5" SSDs and PCIe SSDs. One of the primary showcases will be server grade DDR4 R-DIMMs supporting the latest Intel Xeon processor E5-2600 v3 series with the features of up to 16 GB density, 1.2V low power consumption, and maximized 2133 MHz high speed transmission. ADATA's DDR4 product line includes DDR4 RDIMMs, VLP R-DIMMs, LR-DIMMs, and ECC SO-DIMMs.

In-memory computing stores data on memory chips rather than hard drives removes any performance bottleneck caused by traditional storage. ADATA DDR3 LR-DIMMs 64GB and R-DIMMs 32GB (with Invensas DFD technology) support In-memory computing with high capacity and outstanding performance. In Intel New Platform Workshop, ADATA will demonstrate DDR3 LR-DIMMs, which deliver up to 64GB capacity for Intel Xeon processor E5 V2 family-based servers, and increase total memory capacity by up to 1.5 TB to fulfill In-Memory Computing application.

Micron Technology, Inc. (Nasdaq:MU), one of the world's leading providers of advanced semiconductor solutions, today announced an ongoing collaboration with Intel to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.

"The ecosystem is changing and the importance of scalable on-package memory and memory bandwidth is now coming to light," said Chirag Dekate, Research Manager at IDC. "Memory is at the heart of the solution space which will benefit both big compute and big data. This announcement is a clear validation of how Micron is advancing the role and impact of memory on systems and the value that 3D memory can deliver."

Intel Core i7 "Haswell-E" HEDT (high-end desktop) processors, along with compatible motherboards based on the Intel X99 Express chipset, are expected to launch on September 14, 2014, according to a leaked Intel supply chain document scored by VR-Zone. The Core i7 "Haswell-E" series succeeds current Core i7 "Ivy Bridge-E," and its compatible X79 Express chipset. The new chips will be built in the new LGA2011-3 package (incompatible with current LGA2011), and will be the first client desktop platform to support the new DDR4 system memory standard. The series will include three parts, the six-core Core i7-5820K and i7-4930K; and the eight-core i7-5960X. The three are detailed in our older article, here.

Micron Technology, Inc., (Nasdaq:MU) today congratulates Daniel Skinner, Director, Mobile DRAM Architecture, on receiving the prestigious JEDEC Award of Excellence in recognition of his leadership as chairman of the LPDDR3 and LPDDR4 Task Groups. The Award of Excellence is the most prestigious award bestowed by the Association, and it recognizes an individual's sustained service to JEDEC and the standards community. Mr. Skinner is only the 10th individual to have been awarded this honor.

"Dan was instrumental in driving the development of LPDDR3 in a timely manner to meet the needs of the mobile industry," said JEDEC president John Kelly. "His continued leadership within JEDEC around LPDDR4 has been essential as he led the task group to identify next-generation mobile apps and develop a standard around the needed requirements to make those apps a reality."

Intel's presentation for Italian technology conference 3D Revolution 2014 was leaked to the web, revealing the company's most up-to-date desktop CPU roadmap, which looks deep into 2015. It reveals a wealth of new information. To begin with the HEDT (high-end desktop) segment, Intel plans to drag Core i7 "Ivy Bridge-E" through Q3-2014, and launch its succeeding Core i7 "Haswell-E" processor close to Q4-2014, or late into Q3, which would pin its launch some time in September 2014. "Haswell-E" is built in the new socket LGA2011-3 package, and is supported exclusively by Intel X99 Express chipset. It also heralds DDR4 memory to the consumer space. "Haswell-E" will have its reign till late-Q3 2015, when Intel plans to launch Core i7 "Broadwell-E," which is built in the same package, and supported by the same X99 platform, but based on a swanky new 14 nm silicon.

Things get interesting with the company's mainline desktop processors. Intel recently launched its "Haswell" Refresh silicon, and is bound to launch their unlocked variants, codenamed "Devil's Canyon," on the 25th of June. Built in the LGA1150 package, "Haswell" Refresh runs on both 8-series and 9-series chipset. Intel's 9-series chipset was originally designed to launch alongside the company's first processors built on the 14 nm silicon fab process, codenamed "Broadwell," which is an optical shrink of "Haswell," with a few minor tweaks and speed bumps, just as "Ivy Bridge" was to "Sandy Bridge." Intel's "Broadwell" chips are now expected to debut in Q1-2015, probably along the sidelines of the 2015 International CES. These chips will be supported by existing LGA1150 motherboards, some with BIOS updates.

Here are the first pictures of a Crucial Ballistix Elite DDR4 memory module up close. Launched earlier this week, the Ballistix Elite DDR4 will be Crucial's first enthusiast module to address the emerging market created by Intel's Haswell-E HEDT platform. It will come in various speeds upwards of 2133 MHz (DDR), and densities of 4 GB, 8 GB, and 16 GB, and will be available as single-module, dual-channel, and quad-channel kits. The underlying DRAM chips are homebrew, from Micron's mega DRAM/NAND-flash plant in Boise, Idaho, US. The chips are cooled by a simple and effective aluminium heat-spreader.

Corsair's Dominator line of enthusiast memory module finally gets fresh blood with the introduction of the DDR4 specification. The company showed off the first Dominator Platinum DDR4 memory module. This particular one is prepped to run at DDR4-2400 MHz speeds. Right next to it, is the Value Select DDR4, Corsair's entry-level module. The company didn't reveal its clock speeds, but given that DDR4 starts at 2133 MHz, that's likely what this module runs at. What sets the Value Select apart from the Dominator Platinum, is probably not just a tiny 267 MHz clock speed difference; but timings. The Dominator Platinum will run at far tighter timings.

EVGA showed us one of the more 'complete' socket LGA2011-2 motherboards, decked up with its heatsinks. The company will likely name it X99 FTW. Designed for enthusiast PCs with three or more graphics cards, and high-bandwidth PCIe SSDs, and built in the ATX form-factor, the X99 FTW draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, with optional stabilizing inputs from a 6-pin PCIe and a 4-pin Molex. Barring the EPS, all other connectors are angled away, to help reduce cable clutter. The CPU socket is powered by an 8-phase VRM, with 4-phase memory VRM. It's flanked by four DDR4 DIMM slots on either side, supporting up to 64 GB of quad-channel memory.

Expansion slots include five PCI-Express 3.0 x16 wired to the CPU (x16, x8, x8, x16, x8); and one PCI-Express 2.0 x4, wired to the X99 PCH. Storage connectivity includes six SATA 6 Gb/s ports from the PCH, and four SATA 6 Gb/s from a third-party controller. 8-channel HD audio, and two gigabit Ethernet interfaces complete the connectivity. The board's real goods are its overclocker-friendly features, including PCIe slot disabling DIP switches, POST sequence LEDs and error code readouts, two clear CMOS buttons, and EVGA EVBot support. EVGA is expected to launch this board, alongside Intel's Core i7 "Haswell-E" HEDT processors, later this year.

ASRock unveiled prototypes of its first LGA2011-2 motherboards based on Intel X99 Express chipset, ready for the company's upcoming Core i7 "Haswell-E" HEDT processors. The color-scheme and heatsink designs are not finalized. Both boards are built in the ATX form-factor, and draw power from a combination of 24-pin ATX, 8-pin EPS, and 4-pin Molex power connectors; and use 12-phase VRM to condition power to the CPU. Both further feature eight DDR4 DIMM slots. They differ in their expansion slot areas. The Extreme4 features a total of four PCI-Express 3.0 x16 slots, while the Extreme6 features three, which uses the space saved to drop in two storage slots, an Ultra-M.2 (x4 link layer) and an mSATA. The Extreme6 offers two Intel-made GbE connections, while the Extreme4 offers just one.

ADATA's claim of being the first memory maker with DDR4 overclocking modules wouldn't fly with anyone, if they weren't using a live Haswell-E HEDT platform to show it off. The system appears to be using a prototype Intel X99 chipset micro-ATX motherboard by ASRock, and a Haswell-E engineering sample. The module comes with JEDEC SPD profile of 2133 MHz, but claims to offer tons of overclocking headroom. The system was wired to a display, and evidently, CPU-Z can't read the memory config. It can, however, read out DRAM clock and timings. The system was doing 1373 MHz (2746 MHz DDR), with timings of 14-14-14-36-CR2T.

GeIL showed off its first DDR4 memory module, which will serve as a common platform for a number of the company's consumer memory lines. Depending on the DRAM chip density, the module will come in capacities of 4 GB, 8 GB, and 16 GB. The module voltage will stay at 1.2V, and it will come in clock speeds of 1600 MHz (CL 10~12), 1866 MHz (CL 12~14), 2133 MHz (CL 14~16), 2400 MHz (CL 15), 2666 MHz, and 3200 MHz. GeIL will craft out several models based on this common PCB.

At its Computex 2014 booth EVGA is showcasing a prototype motherboard powered by Intel's upcoming X99 chipset. This Haswell-E-supporting LGA2011 board packs eight DDR4 memory slots, ten SATA ports, five PCI-Express x16 slots allowing for SLI/Crossfire setups, 7.1 channel audio, dual Gigabit Ethernet, and various goodies to help overclockers get the most out of their setup.

EVGA's X99 board is likely set to debut as soon as Intel launches the chipset and the new Core i7-5xxxK line of processors, sometime in Q3.

MSI showed off its very first LGA2011-2 motherboard, based on Intel's X99 Express chipset, supporting Core i7 "Haswell-E" HEDT processors. The unnamed board is still in its early stages of development, none of its product styling (colors, heatsinks/lack-thereof) are final. The board features eight DDR4 DIMM slots, with which it should support up to 64 GB of quad-channel DDR4 memory. The CPU is powered by an 8-phase VRM. Expansion slots include four PCI-Express 3.0 x16. Storage connectivity includes one each of SATA-Express, M.2, and eight SATA 6 Gb/s ports. Most of its connectors are not even placed, but one can expect multiple USB 3.0 ports, two gigabit Ethernet connections, Thunderbolt, etc.

Panram unveiled its first consumer DDR4 memory modules, ready for upcoming Haswell-E HEDT platform, the Ninja-V. Equipped with simple and contemporary looking heatspreaders that aren't much taller than the module itself, the first Ninja-V modules will stick to JEDEC standard speeds of DDR4-2133. They'll run at 2133 MHz, with standard timings, and module voltage of 1.2V. The company will launch the Ninja-V towards the end of this year, when Intel launches the Haswell-E HEDT platform, which features a quad-channel DDR4 IMC, which could offer system memory bandwidths in excess of 80 GB/s.

Crucial, a leading global brand of memory and storage upgrades, is now shipping DDR4 server memory. Designed to enable next generation enterprise environments with increased speed, bandwidth, and energy efficiency, Crucial DDR4 server memory modules are available for immediate purchase through select global channel partners and at crucial.com.

The modules are up to twice as fast and deliver double the memory bandwidth over DDR3 technology when it was introduced (1066 MT/s and 8.5 GB/s with DDR3 vs. 2133 MT/s and 17 GB/s on DDR4), and are expected to get even faster as the technology matures. Operating at 1.2V, Crucial DDR4 server memory uses up to 20 percent less voltage than DDR3 technology when it was introduced (1.5V). In addition, Crucial DDR4 server memory can be up to 40 percent more energy efficient than previous generations of DDR3 memory, when coupled with other technologies introduced with DDR4. Crucial DDR4 server memory is optimized for future Intel Xeon processor E5-2600 v3 product family-based systems.

Crucial, a leading global brand of memory and storage upgrades, today announced new Crucial Ballistix Elite DDR4 memory modules, which deliver the next generation of memory to high performance gaming. Designed for gamers and enthusiasts, Ballistix Elite DDR4 memory delivers introductory speeds that start at 2666 MT/s and 3000 MT/s and is expected to get faster as the technology matures.

The new modules offer nearly twice the bandwidth of mainstream DDR3 memory at up to 24 GB/s, and deliver improved system responsiveness and increased frame rates. Furthermore, Ballistix Elite DDR4 memory delivers up to 40 percent more power efficiency than standard DDR3 memory.

ADATA Technology Co., Ltd., a leading manufacturer of high-performance DRAM modules and NAND Flash application products, collaborated with AsRock to run a demo system equipped with ADATA's overclocking memory modules and AsRock's motherboard, whose performance reached a breakthrough record. ADATA's XPG series DDR3 3100 memory modules going with AsRock's the latest Z97 OC Formula motherboard and Devil Canyon I7 4790K CPU processor reached the 3400MHz outstanding performance, which will be displaying at ADATA's booth and bring you with an amazing experience.

ADATA XPG Series exclusively designed for overslockers can meet the needs of professional gamers with the ultra-high speed performance and ultra-fast cool down function. At this year's Computex, ADATA will be showcasing its latest XPG Series V3, DDR3 3000 8GB x 4, whose 32GB capacity can match ASRock Z97 OC Formula motherboard bringing out a steady speed of 3000MHz, and fulfill overclockers' picky needs of high capacity and high performance as well. In addition, its replaceable heat sink design allows users to customize the memory modules' color to complement their high performance system. ADATA is the first one who is able to steadily provide customers with 8GB x 4 pack memory module house in the industry.

Here is the first picture of ADATA's XPG V3 DDR3 DRAM module. It will be launched alongside the company's first enthusiast-grade DDR4 modules. ADATA's XPG Z1 DDR4 modules will come in densities as high as 16 GB, clocked at JEDEC-standard DDR4-2133 MHz, and run at module voltages of 1.2V. The same heatspreader design as the one pictured below, will also be used on the company's new XPG V3 line of DDR3 modules, and will come in a number of color options, to match your motherboard's color scheme. The first client platforms with support for DDR4 memory include Intel "Broadwell," and "Haswell-E" HEDT.

Intel's next-generation Core i7 "Haswell-E" HEDT (high-end desktop) processor lineup, slated for later this year, accompanied by the company's X99 Express chipset, will launch at three price-points, predictably, succeeding the current Core i7-4820K, i7-4930K, and i7-4960X. The platform will herald a new LGA socket, which will have 2,011 pins, but will not be compatible with current LGA2011 platforms based on the X79 Express chipset. That's because "Haswell-E" will be among the first client platforms to support DDR4-SDRAM memory. All Haswell-E chips will support DDR4-2133 MHz out of the box.

Moving on to the actual lineup, and it begins with the Core i7-5820K. This is a six-core chip, and a welcome departure from Intel's sub-$400 HEDT chips being quad-core. Whether it supports HyperThreading, is not known. You still get 6 physical cores to plow through work. The chip also features a staggering 15 MB of L3 cache, clock speed of 3.30 GHz with a couple of notches of Turbo Boost, and a quad-channel DDR4 integrated memory controller. Oh, and there's the unlocked BClk multiplier. Sounds too good to be true for a sub-$400 chip? Here's the catch - its on-die PCI-Express Gen 3.0 root complex will have fewer lanes. It can spare just 16 + 8 lanes for discrete graphics cards. For boards with three long x16 slots, that would mean x16/NC/x8, or x8/x8/x8, with an additional x4 link.

ADATA revealed its flagship consumer SSD in the M.2 form-factor, the SR1020NP series, which is an evolution of the AXNP280e it unveiled at this year's International CES. The drive comes in capacities of up to 1 TB, is based on LSI-SandForce 3700 series processor wired to MLC NAND flash, and a host interface with wiring for PCI-Express 2.0 x4 physical layer. Most M.2 SSDs, in contrast, are being designed for PCI-Express 2.0 x2.

That's not all, most motherboards launched on Intel's 9-series chipset feature M.2 slots with just PCI-Express 2.0 x2 wiring, with the exception of ASRock's top-end Z97-Extreme6, which features a special M.2 slot with PCI-Express 2.0 x4 wiring. Using that slot, however, will eat into the bandwidth meant for graphics cards, and the primary PCI-Express 3.0 x16 slot will run at 3.0 x8, because ASRock wired the slot to the CPU's root complex. Under ideal conditions, SandForce 3700 series processors are advertised to offer sequential transfer rates as high as 1.8 GB/s. Given that, this drive should be bottlenecked on most motherboards with PCI-Express 2.0 x2 based M.2 slots. ADATA will display the drive at the 2014 Computex, early next month, alongside gaming-grade and overclocker-grade DDR4 modules.

Crucial, a leading global brand of memory and storage upgrades, is now sampling DDR4 server memory through its new Technology Enablement Program. Aimed at channel partners who are currently developing or evaluating DDR4-capable platforms, the program provides early access to select Crucial server DDR4 modules and relevant technical resources, as well as notification of new modules as they become available. The Crucial Technology Enablement Program comes on the heels of Micron's recent ramp up in DDR4 production.

Designed to enable next generation enterprise environments, Crucial DDR4 server memory delivers data rates that start at 2133 MT/s (up to twice as fast as DDR3 when it was introduced) and is expected to get even faster as the technology matures. What's more, when used with Intel Xeon processor E5-2600 v3 product family-based systems, Crucial DDR4 server memory doubles memory bandwidth from 8.5 GB/s to 17 GB/s. Additionally, Crucial DDR4 memory uses up to 20 percent less voltage than DDR3 technology, operating at 1.2V compared to 1.5V for standard DDR3 memory, and delivers up to a 40 percent reduction in power usage.

Virtium, a leading provider of embedded SSD and industrial memory modules, today announced its embedded infrastructure market support for DDR4, and the company's initial DDR4 RDIMM products. As one of the first to offer DDR4 memory modules, Virtium's embedded industrial OEM customers are able to have early test and development access to the lower power, high bandwidth and density benefits of this latest DRAM technology. Delivering significant power savings of up to 40% and up to twice the bandwidth over DDR3, the new DDR4 modules from Virtium are excellent solutions for server blades, networking and telecom applications.

Virtium is a proven innovator of VLP (Very Low Profile - 0.72-inch or 0.738-inch) and ULP (Ultra Low Profile - 0.70-inch) memory modules for space-constrained applications. Continuing Virtium's exclusive support for the embedded infrastructure market, these first DDR4 modules are offered in the lower profile ULP RDIMM height in capacities ranging from 4 to 16 gigabytes (GB). The new DDR4 modules feature low 1.2 V configurations with data transfer speeds of 1866 MT/s.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel Xeon processor E5-2600 v3 product family. DDR4 is the most advanced memory for server and high-performance computing applications.

"At Samsung, we are taking the lead in readying the DDR4 market to coincide with the introduction of the next-generation Intel Xeon processor E5-2600 v3 product family, and plan to contribute to creating a bigger market for DRAM in the second half of 2014," said Jim Elliott, corporate vice president, Memory Marketing, Samsung Semiconductor, Inc. "We will continue to introduce high-density DDR4 modules for global OEMs that will facilitate the launch of next-generation enterprise servers and will maximize IT investment efficiency."

SK Hynix Inc. announced that it has developed the world's first highest density of 128 GB (Gigabytes) module based on 8 Gb(Gigabit) DDR4 using its advanced 20 nm class technology.

This module has double density compared to existing 64 GB by taking advantage of TSV(Through Silicon Via) technology. This new product works at 2133 Mbps and with a 64-bit I/O it processes up to 17 GB of data per second. It also runs at ultra low-voltage of 1.2V which does at lower voltage than 1.35V of existing DDR3.