SK Hynix Inc. announced that it has developed the world's first highest density of 128 GB (Gigabytes) module based on 8 Gb(Gigabit) DDR4 using its advanced 20 nm class technology.

This module has double density compared to existing 64 GB by taking advantage of TSV(Through Silicon Via) technology. This new product works at 2133 Mbps and with a 64-bit I/O it processes up to 17 GB of data per second. It also runs at ultra low-voltage of 1.2V which does at lower voltage than 1.35V of existing DDR3.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has announced the launch of new DDR4 modules. Working in close cooperation with Intel, ADATA has successfully developed and launched DDR4 RDIMM (ECC Registered DIMM) that are fully compatible with the newly announced, next generation platform of Intel Xeon processor E5-2600 v3 product family.

Coming in densities of 4, 8 & 16 gigabytes, the new modules run at 1.2 volts, and at a frequency of 2133 MHz. The higher clock frequencies, faster data transfer rates, and low voltage operation of DDR4 memory make it especially suited for use in the growing cloud server, storage and networking application fields.

Micron Technology, Inc., a leading provider of advanced memory and storage solutions for enterprise data centers and high-performance computing applications, today announced it is ramping production of DDR4 memory to support upcoming Intel CPU launches. The improved power and performance of DDR4 technology is a critical requirement for the growing enterprise computing market, delivering a power improvement of up to 35% compared to standard DDR3.

Micron is ramping its 4 Gb-based DDR4 module production at 2133 megatransfers per second (MT/s) in support of Intel's Xeon processor E5-2600 v3 product family-based systems. Micron is also sampling a 2400 MT/s device in anticipation of follow-on products targeted for 2015.

SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, has been actively involved in developing and standardizing DDR4 module technology and today announced the first products in its DDR4 DRAM module portfolio.

SMART's initial lineup of DDR4-2133 modules are loaded with technology advancements inherent to the DDR4 platform. Those advancements include power efficiencies, faster speeds and higher densities, all key benefits for next generation server, storage and networking applications.

At GDC, Intel announced a backpedal from its plans to eventually reshape desktop CPUs into components that come hardwired to the motherboards across the line, by announcing three new CPU families. It includes the Haswell-E HEDT platform, Broadwell performance platform, and Devil's Canyon. The three are expected to launch in reverse order, beginning with Devil's Canyon. A variant of existing "Haswell" silicon in the LGA1150 package, Devil's Canyon is codename for a breed of hand-picked chips with "insane" overclocking potential. In addition to binned dies, the chips feature a performance-optimized TIM between the die and the integrated heatspreader (IHS). The dies will be placed on special "high tolerance" packages, with equally "special" LGA contact points. The chips will be designed with higher voltage tolerance levels. Devil's Canyon is expected to branded under the existing Core i7-4xxx series, possibly with "Extreme" brand extension. It will be compatible with motherboards based on the Z97 chipset.

Next up, is "Broadwell." A successor to Haswell, Broadwell is its optical shrink to Intel's new 14-nanometer silicon fab process, with minor improvements to IPC, new power-management features, and likely added instruction sets, much like what "Ivy Bridge" was to "Sandy Bridge." It will take advantage of the new process to step up CPU and iGPU clock speeds. Broadwell is expected to launch in the second half of 2014. Lastly, there's Haswell-E. Built in the company's next-gen LGA2011 socket (incompatible with the current LGA2011), this HEDT (high-end desktop) processor will feature up to eight CPU cores, up to 15 MB of L3 cache, a 48-lane PCI-Express 3.0 root complex, and a quad-channel DDR4 integrated memory controller (IMC). Intel is also planning to launch a socketed variant of the Core i7-4770R, which is based on the company's Haswell GT3e silicon, which features the Iris Pro 5200 graphics core, with 40 execution units, and 128 MB of L4 cache.

Here is the first picture of a DDR4 SO-DIMM module, exhibited by Crucial at its 2014 International CES booth. The company revealed its first DDR4 server memory lineup, as its DDR4 SO-DIMMs, targeting micro-servers, and future notebooks, tagged along. DDR4 DIMMs and SO-DIMMs measure roughly the same as their standard (full-height) DDR3 counterparts, except that the index notch is positioned differently. DDR4 promises to up memory bandwidths, densities, and energy efficiency. Intel's next-generation HEDT (high-end desktop) platform could be the first client platform to support DDR4. Crucial unveiled the first Ballistix-branded DDR4 memory module, targeting some of those systems. DDR4 memory modules could start at speeds of up to 2133 MT/s, and module voltages as low as 1.2V. Compare those to the 1066 MT/s and 1.8V DDR3 started off with!

Taiwanese company ADATA Technology is gearing up for the arrival of DDR4 and at CES it showcased a couple of memory modules based on the standard. ADATA's DDR4 sticks have 8 GB and 16 GB capacities and run at 2133 MHz with CL15 latencies while powered at 1.2V.

The modules on display are 'suitable for servers' (they are R-DIMMs) but the company will surely have some consumer-oriented offerings for later this year when Intel launches the DDR4-supporting Haswell-E processors.

Kingston Technology Company Inc., the independent world leader in memory products, today announced it will hold the live finals for its Dota 2 and overclocking global contest during the 2014 International Consumer Electronics Show (CES) in Las Vegas, Nev. In addition, Kingston will showcase exciting new products and technologies coming this year.

Dota 2 is a competitive game of action and strategy, played both professionally and casually by millions of passionate fans worldwide. The HyperX Dota 2 League tournament began online last October with 16 professional gaming teams from around the world. The four finalists are: Alliance from Sweden, LGD Gaming, Vici Gaming from China, and Fnatic from Europe. The four teams will battle live for $50,000 (USD) in prize money.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has developed the industry's first eight gigabit (Gb), low power double data rate 4 (LPDDR4), mobile DRAM.

"This next-generation LPDDR4 DRAM will contribute significantly to faster growth of the global mobile DRAM market, which will soon comprise the largest share of the entire DRAM market," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "We will continue introducing the most advanced mobile DRAM one step ahead of the rest of the industry so that global OEMs can launch innovative mobile devices with exceptional user convenience in the timeliest manner."

Samsung's new high-speed 8Gb LPDDR4 mobile DRAM will provide the highest level of density, performance and energy efficiency for mobile memory applications, enabling end users to have faster, more responsive applications, more advanced features, and higher resolution displays while maximizing battery life.

Here's the first picture of Intel's next-generation Core i7 HEDT (high-end desktop) processor, codenamed "Haswell-E." Based on Intel's latest "Haswell" micro-architecture, the chip will be Intel's first HEDT processor to ship with eight cores, and the first client CPU to ship with next-generation DDR4 memory interface. In addition to IPC improvements over "Ivy Bridge" that come with "Haswell," the chip integrates a quad-channel DDR4 integrated memory controller, with native memory speeds of DDR4-2133 MHz; a PCI-Express gen 3.0 root complex with a total of 40 PCI-Express lanes, and yet the same DMI 2.0 (4 GB/s) chipset bus.

Built into the LGA2011-3 socket, "Haswell-E" will be incompatible with current LGA2011 motherboards, as the notches of the package will vary from LGA2011 "Ivy Bridge-E." Intel will introduce the new X99 Express chipset, featuring all 6 Gb/s SATA ports, integrated USB 3.0 controllers, and a PCI-Express gen 2.0 root complex for third-party onboard controllers. Interestingly, there's no mention of SATA-Express, which Intel's next-generation 9-series chipset for Core "Broadwell" platforms reportedly ships with; and X99 isn't looking too different from today's Z87 chipset. With engineering samples already out, it wouldn't surprise us if Intel launches "Haswell-E" along the sidelines of any of next year's big-three trade-shows (CES, CeBIT, and Computex).

Samsung Electronics Co., Ltd, a global leader in advanced semiconductor solutions, today announced its fifth generation of green memory at the Memory Solutions Forum 2013 at the Shilla hotel in Seoul.

Under a "New Memory Paradigm" theme, Samsung introduced advanced memory solutions optimized especially for next generation data centers that use cloud computing based on a big data platform. This type of infrastructure is rapidly increasing in support of the mobile computing industry. The newly presented fifth generation green memory solutions will help to resolve key data center issues by achieving dramatic performance improvements, securing additional physical space for systems, and saving large amounts of power.

G.SKILL International Co. Ltd., the world's leading designer and manufacturer of extreme performance memory, proudly displays several engineering sample DDR4 modules at the Intel Developer Forum (IDF). The next generation of DDR memory is still under development, and G.SKILL is working to push the new technology to its limits in the future. G.SKILL also features a live demo of DDR3 3000MHz 32GB (8x4GB) with the Intel Core i7-4960X CPU and ASUS X79-Deluxe motherboard. Driving the new Ivy Bridge-E processor to new limits, G.SKILL looks forward to offer a wide range of high performance memory kits on the Intel X79 platform.A video presentation follows.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, announced today that the company's new generation DDR4 SDRAM modules will be on display at the Intel Developer Forum 2013 (IDF13), held this year in San Francisco. Targeting server and render farm applications, the new DDR4 modules show that ADATA is once again at the front of the pack in providing new high-performance solutions to the enterprise market.

DDR4 SDRAM stands for double data rate fourth generation synchronous dynamic random-access memory, and its most notable features are faster clock frequencies and data transfer rates as compared to DDR3, as well as low power consumption. Running at just 1.2 volts, these new modules are expected to achieve transfer rates of 3.2Gbps, at frequencies as high as 2133MHz, far outstripping the capabilities of previous generations of DRAM. In large scale server applications, the advantages of DDR4 will lead to lower costs and greatly improved overall system performance. The new DDR4 SDRAM modules will be showcased along with the company's other premium memory solutions at booth number 554 at IDF13.

Kingston Technology Company, Inc., the independent world leader in memory products, today announced they will be showcasing working DDR4 memory, XMP certified HyperX memory on a new Ivy Bridge-E based desktop, 2133 MHz SO-DIMMs for a Haswell based notebook and ECC memory in an Avoton based microserver at the Intel Developers Forum (IDF) 2013. IDF will be held at the Moscone center in San Francisco, California on September 10th - 12th.

During IDF 2013 Kingston will be showcasing four demo systems. The DDR4 memory demo will highlight 192 GB of working 2133 MT/s DDR4 Registered DIMMs at 1.2V operating on a future Intel reference platform. The Kingston HyperX demo will be showcasing the latest HyperX memory that has been validated through Intel's XMP certification process. The demos will be shown using an X79 motherboard and one of Intel's newest Ivybridge E processors. Our 2133 MHz SO-DIMM memory demo will be shown working on a Haswell based notebook. The Microserver demo will be demonstrating 1600 MHz 1.35V low voltage ECC SODIMM memory on an Intel Atom C2000-series "Avoton" microserver. Kingston's ECC SODIMM memory has been validated on the Intel "Edisonville" microserver system, and is posted on Intel's website.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is mass producing the most advanced DDR4 memory, for enterprise servers in next-generation data centers.

With the introduction of these high-performance, high-density DDR4 modules, Samsung can better support the need for advanced DDR4 in rapidly expanding, large-scale data centers and other enterprise server applications.

G.SKILL International Co. Ltd., the leading high-performance memory designer and manufacturer, announced to participate this year's Intel Developer Forum at San Francisco as part of Intel's memory community at booth no. 165, displaying maximum DDR3 memory frequency & capacity on the new Intel Core i7 processor family for socket LGA-2011 platform, also sharing plans for future technology such as DDR4. "As this is our first time attending IDF, we are very excited to show our high performance quad channel DDR3 memory and also announce our plans for DDR4," said Mark Yu, Technical Marketing at G.SKILL.

Intel's first chips based on the company's new, and Industry first, 14-nanometer manufacturing process are expected to hit markets in late 2015. With Skylake, Intel will introduce their new 9th-generation Intel HD IGP. The new platform will be the first to bring dual-channel DDR4 memory support. Skylake won't be the first platform to support DDR4 memory. In the 2H of 2014, Intel will launch their enthusiast grade Haswell-E platform, with support for quad-channel DDR4 memory. Skylake will be more of an evolution of Broadwell, which in turn is essentially an die shrink of Haswell to 14nm.

Additionally, the new mainstream platform will bring in support for PCI-E 4.0, essentially doubling the bandwidth offered by the current PCI-E 3.0 standard. More powerful GPUs from NVIDIA and AMD should be able to take advantage of the improved bandwidth, as their cards keep getting more and more powerful with each passing generation. Skylake will also introduce support for SATA Express. The advantage? SATA Express allows for a max bandwidth of about 16 Gb/s, more than 2.5x the 6 Gb/s bandwidth offered by the current SATA standard. While the product slide doesn't specify exactly as to when the first Skylake based products are scheduled to hit the market, our best guess places it at the end of 2015.

Another day, another Intel leak and a few surprises as well. During the last few days we covered Intel's desktop roadmap for the next twelve months, bringing you news and insights on Intel's plans for the aforementioned time interval. Today we bring you news on what's to follow in the second half of 2014, specifically, on Intel's Premium Desktop plans for the interval, namely Haswell-E, DDR4 and the X99 PCH.

Haswell-E will be Intel's last and best offering using the 22 nm fabrication process, it will come in two versions, core count wise, 8 core part(s) as well as 6 core part(s) with hyper-threading enabled, therefore, boasting no less that 16 execution threads for the 8 core chips and 12 execution threads for the 6 core version(s). Judging by that alone, Haswell-E should constitute a far superior upgrade over Ivy Bridge-E, compared to what the latter will be in relation to Sandy Bridge-E, Haswell-E offering two additional physical cores that translate into four additional execution threads. The new chips will boast 2.5 MB of L3 Cache per core, summing up to 20 MB total L3 cache for the 8 core parts. TDP will remain in the same neighborhood it was in the case of its predecessors, around 130-140 W.

Innodisk is proud to be among the first to supply (DDR4) registered DIMM product samples to key server companies for their next-generation systems. With this announcement, Innodisk, an industry leader in DRAM modules for industrial applications and embedded systems, will continue to offer the most advanced technology to its customers. The result of almost eight years of development, DDR4 (Double Data Rate 4) technology improves on the previous generation, DDR3, in every way. These new memory products provide users with greater performance, but can still cut costs by saving power and space, and reducing waste heat.

DDR4 offers a giant leap in peak performance over DDR3 technology, with a 3.2 Gbps data transfer rate. In fact, DDR4 could eventually even surpass this already high rate, according to standards organization JEDEC, in the same way that DDR3 surpassed its initial ceiling of 1.6 Gbps. DDR4 memory bus speeds start at 2133MHz, which already offers a huge jump in potential performance from the average bus speed of 1333MHz and 1666MHz offered by DDR3.

FinalWire announced AIDA64 v2.85, the popular system diagnostic and benchmarking suite is updated with 64-bit benchmarks optimized for AMD's "Richland" APUs, improved support for "Kaveri," "Kabini," and "Temash" APUs; and Intel "Haswell" and "Valleyview" CPUs; early support for AMD "Beema" APU, Intel "Avoton" SoC, "Crystalwell," "Ivy Bridge-E," and "Haswell-E" CPU, "Haswell-ULT" SoC; preliminary support for DDR4 and GDDR5 system memory types; and GPU support for AMD Radeon HD 8000 series and NVIDIA GeForce GTX Titan.DOWNLOAD: FinalWire AIDA64 v2.85 Installer (EXE), Archive (ZIP)

Crucial, a leading global brand of memory and storage upgrades, today announced its first DDR4 DRAM demonstration at CES 2013. As a global brand of Micron, the Crucial DDR4 DRAM demonstration is based on Micron's 30-nanometer (nm) technology, the 4-gigabit (Gb) DDR4 x8 part is the first piece of what is expected to be the industry's most complete portfolio of DDR4-based modules, which will include RDIMMs, LRDIMMs, SODIMMs and UDIMMs (standard and ECC).

The new Crucial DDR4 DRAM modules use up to 20 percent lower voltage than previous technology, enabling smaller, more efficient form factors and longer battery lives. The DDR4 DRAM will have lower voltage, operating at 1.2V in comparison to current DDR3 offerings operating from 1.35V to 1.5V. The new memory modules enable mainstream data rates that are up to twice as fast as DDR3 memory. This will enable systems to process data faster, load applications faster, improve system responsiveness, and increase the ability to multi-task and handle data-intensive programs.

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that its new xFD "DIMM-in-a-Package" memory technology has been licensed to an original equipment manufacturer (OEM), and this technology will be demonstrated in Intel-based Ultrabooks at CES 2013. These Ultrabooks contain SK hynix memory chips packaged with Invensas' xFD "DIMM-in-a-Package" memory technology and were built by a leading manufacturer of personal computers. Invensas will showcase the new Ultrabooks at the upcoming Pepcom Digital Experience event being hosted at CES 2013 in Las Vegas.

The DIMM-in-a-Package technology replaces Small-Outline-Dual-Inline-Memory-Modules (SODIMMs), traditionally used in notebook computers, with semiconductor package components that are approximately 80% smaller and offer significant cost and performance benefits. The product is designed to support standard Double-Data-Rate (DDR3 and DDR4) DRAM and Mobile DRAM chips, as well as Intel and ARM based processor architectures.

Still reeling with over-production, swelling inventories, and spot-prices on free-fall, the DRAM industry had been banking on Microsoft's Windows 8 operating system launch to come to their salvation. Apparently, it didn't. As is customary with each new Windows launch, orders for DRAM components go up, as PC makers announce new products, and consumers purchase new RAM to upgrade their systems. Windows 8, which is essentially based on the same (albeit slightly tweaked) kernel as Windows 7, isn't really heavier on system resources. Let alone that, Windows 8 in itself is not expected to bring consumers to get a new PC, because Microsoft made it extremely simple and cheap to upgrade Windows 7 to 8. The industry's only real hope now is for hardware makers Intel, AMD, and ARM to introduce platforms that make use of DDR4 DRAM.

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for 'many-core' enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the initial publication of its widely-anticipated Synchronous DDR4 (Double Data Rate 4) standard. JEDEC DDR4 (JESD79-4) has been defined to provide higher performance, with improved reliability and reduced power, thereby representing a significant achievement relative to previous DRAM memory technologies. The new DDR4 standard is available for free download from the JEDEC website at www.jedec.org/standards-documents/results/jesd79-4%20ddr4.

DDR4 offers a range of innovative features designed to enable high speed operation and broad applicability in a variety of applications including servers, laptops, desktop PCs and consumer products. In addition to the advantages described later in this release, the new technology has been defined with a goal of simplifying migration and enabling adoption of an industry-wide standard.