Apacer's consumer and gaming DDR5 memory modules are finally available! The DDR5-4800 delivers 16 GB of DRAM at 4800 MHz and draws just 1.1 V. That leaves DDR4 modules far behind in the rear-view mirror. Performance, capacity, stability and power efficiency are all taken to the next level. In addition to the standard DDR5 memory module, Apacer is launching a NOX DDR5 gaming memory module. This will provide gamers with extremely stable overclocking capabilities with a single click. Power consumption management is also upgraded in DDR5.

Apacer's DDR5-4800 modules are compliant with the JEDEC standard. And their operating frequency of 4800 MHz is a 50% increase in bandwidth compared to the standard DDR4 upper frequency limit of 3200 MHz.

Micron Technology, Inc. (Nasdaq: MU) today announced results for its first quarter of fiscal 2022, which ended Dec. 2, 2021. "Micron delivered solid fiscal first quarter results led by strong product portfolio momentum," said Micron Technology President and CEO Sanjay Mehrotra. "We are now shipping our industry-leading DRAM and NAND technologies across major end markets, and we delivered new solutions to data center, client, mobile, graphics and automotive customers. As powerful secular trends including 5G, AI, and EV adoption fuel demand growth, our technology leadership and world-class execution position us to create significant shareholder value in fiscal 2022 and beyond."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2 GB GDDR6 DRAM and 2 GB DDR4 DRAM for high-performance infotainment systems, as well as 2 GB GDDR6 DRAM and 128 GB Universal Flash Storage (UFS) for autonomous driving systems.

"With the recent proliferation of electric vehicles and the rapid advancement of infotainment and autonomous driving systems, the semiconductor automotive platform is facing a paradigm shift. What used to be a seven to eight-year replacement cycle is now being compressed into a three to four-year cycle, and at the same time, performance and capacity requirements are advancing to levels commonly found in servers," said Jinman Han, executive vice president and head of Memory Global Sales & Marketing at Samsung Electronics. "Samsung's reinforced lineup of memory solutions will act as a major catalyst in further accelerating the shift toward the 'Server on Wheels' era."

SK hynix today announced that it has shipped samples of 24 Gigabit (Gb) DDR5* DRAM with the industry's largest density for a single DRAM chip. The announcement of SK hynix releasing the industry's largest density DDR5 chip comes in just 14 months after the Company became the first to release DDR5 DRAM in October 2020, further solidifying the chipmaker's technological leadership in DDR5.

The new 24 Gb DDR5 was produced with the cutting-edge 1 anm technology that utilizes EUV process. It has a density of 24Gb per chip, which is up from the existing density of 16 Gb in 1 ynm DDR5, with improved production efficiency and increased speed by up to 33%. In addition, SK hynix managed to reduce the product's power consumption by *25% compared to existing products while lowering energy use in manufacturing through enhanced production efficiency. SK hynix expects the product to bring about reduction in carbon emissions as well, which is meaningful in the context of ESG management.

In its relentless pursuit of Moore's Law, Intel is unveiling key packaging, transistor and quantum physics breakthroughs fundamental to advancing and accelerating computing well into the next decade. At IEEE International Electron Devices Meeting (IEDM) 2021, Intel outlined its path toward more than 10x interconnect density improvement in packaging with hybrid bonding, 30% to 50% area improvement in transistor scaling, major breakthroughs in new power and memory technologies, and new concepts in physics that may one day revolutionize computing.

"At Intel, the research and innovation necessary for advancing Moore's Law never stops. Our Components Research Group is sharing key research breakthroughs at IEDM 2021 in bringing revolutionary process and packaging technologies to meet the insatiable demand for powerful computing that our industry and society depend on. This is the result of our best scientists' and engineers' tireless work. They continue to be at the forefront of innovations for continuing Moore's Law," said Robert Chau, Intel Senior Fellow and general manager of Components Research.

ZADAK, announces the next step forward in gaming DRAM. The newest member of its high-end SPARK lineup is a DDR5 RGB illuminated gaming DRAM module which is available in 16 GB and 32 GB capacities. Gamers who demand the fastest clock speeds will be able to choose from modules ranging from 4800 MHz all the way up to 7200 MHz.

DDR5 also features another important upgrade: power management is no longer handled by the motherboard, but by a PMIC (power management integrated circuit) on the module itself. While DDR4 modules consume 1.2V, DDR5 modules only require 1.1V. It sounds like a small difference, but over hours and days of gaming, it adds up to significant power savings. The PMIC also gives overclockers more options when it comes to tweaking settings.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

DDR5 may soon have reason to be an even more expensive early-adopter piece of tech than it currently is, according to electronic component supplier 12chip. While semiconductor manufacturers worldwide grapple with logistics and components shortages, the DRAM market has been left somewhat unscathed - up to now. DRAM fabrication - even DDR5 - isn't done on leading-edge nodes but on older, more mature ones (such as 14 nm). According to 12chip, manufacturers are having no problem in scaling their DRAM manufacturing on these older nodes to meet demand.

However, DDR5 is being directly impacted by the current logistics issues due to lack of adequate Power Management Integrated Circuit (PMIC) chips - which DDR5 has integrated in the DIMM proper. Currently, lead times for PMIC orders are estimated at 35 weeks, placing additional strain on system assemblers and DRAM manufacturers - and forcing delays and bottlenecks throughout the supply chain. Additionally, the fact that PMIC chips for DDR5 are ten times as expensive as equivalent DDR4 power management solutions doesn't bode well for future price action on DDR. Should this situation continue, higher prices for DDR5 modules are to be expected due to a deteriorating supply/demand ratio - particularly relevant if you're thinking about putting together a build based on Intel's Alder Lake platform. As always, take this report with a grain of salt.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry's first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

"In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding," said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. "Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles."

Despite the forecasted 18.6% YoY growth in total DRAM bit supply next year, the global DRAM market is still expected to shift from a shortage situation to an oversupply, according to TrendForce's latest investigations. This shift can primarily be attributed to the fact that, not only are most buyers now carrying a relatively high level of DRAM inventory, but DRAM bit demand is also expected to increase by only 17.1% YoY in 2022. On the price front, the oversupply situation will result in a drop in DRAM ASP in 2022 but not a major decline in annual DRAM revenue, thanks to the oligopolistic nature of the DRAM industry. Annual DRAM revenue for 2022 is expected to reach US$91.54 billion, which represents a slight YoY increase of 0.3%.

Based on an analysis of DRAM sufficiency ratio (which refers to the surplus of supply in comparison with demand) for each quarter in 2022, TrendForce forecasts a 15% YoY decrease in DRAM ASP for 2022, with prices undergoing the more noticeable declines during the first half of the year. Heading into 2H22, however, owing to the rise in DDR5 penetration rate, as well as the arrival of peak seasonal demand, the decline in DRAM ASP will likely narrow. TrendForce does not rule out the possibility that DRAM ASP may even hold flat or undergo an increase in 2H22.

PNY today announces specifications and availability for its upcoming Desktop Performance and XLR8 Gaming DDR5 memory products. The three models include the overclocked XLR8 Gaming MAKO and MAKO RGB models, running at 5600 MHz and a CAS latency of 36, as well as the PNY Performance model that follows JEDEC standards.

The XLR8 Gaming MAKO and MAKO RGB modules have been designed to meet the needs of gamers and enthusiasts. The designs for both modules feature aluminium heat spreaders with elements inspired by the powerful, fast and aggressive Mako shark from which they get their name. An XLR8 logo and GAMING text is proudly emblazoned on the side of the module and silver angled relief lines are machined into the heatspreader to reflect other components' lighting and provide unmatched flair and style.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces a new series of solid state drives (SSD), the ADATA LEGEND series, geared toward creators of different needs and budgets. They include the ADATA LEGEND 740, 750, and 840.

The LEGEND 740 and 750 utilize PCIe Gen3 x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the LEGEND 840 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5,000/4,500 MB per second.

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today is proud to announce their first DDR5 high-performance memory will be available in the market in November 2021. The Signature DDR5 memory is approximately 75% faster performance over similar high-end and overclocked DDR4 memory right out of the gate. The memory kit provides high-speed frequencies up to 4800 MHz, with future versions ranging up to 8400 MHz. The single modules are available in various capacities, from 8 GB to 64 GB, and the perfect choice for system integrators and those looking to expand their DDR5 system memory.

"We've been working jointly with motherboard makers to ensure our DDR5 memory product line has excellent stability and compatibility with INTEL's latest ALDER LAKE desktop processor and Z690 platforms," said Roger Shinmoto, the VP of PATRIOT Memory. PATRIOT Signature DDR5 memory is designed to deliver a significant performance improvement. Only requiring 1.1 V of power, Signature DDR5 offers lower power consumption and produces less heat despite the higher frequency of 4800 MHz. Further power improvements include an onboard Power Management IC (PMIC), which provides better control of local voltage regulation while offering increased threshold protection, simultaneous monitoring, INTELligent voltage, and power management supporting increased voltage tweaking and more comprehensive adjustment ranges.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today kicked off the DDR5 era with the launch of DOMINATOR PLATINUM RGB DDR5 and VENGEANCE DDR5. Leveraging more than 25 years of experience crafting premium, high-performance memory, these new modules open the way to far higher frequencies, greater capacities, and faster performance. Launching initially at speeds of up to 5,200 MHz and capacities of up to 32 GB per module, DDR5 pushes the performance limit further than ever before alongside next-generation platforms, starting with 12th Generation Intel Core Processors and Z690 motherboards. With your choice between the iconic styling and stunning lighting of DOMINATOR PLATINUM RGB DDR5 or the compact, minimalist profile of VENGEANCE DDR5 in kits of 32 GB - 64 GB, CORSAIR has the options to equip your new cutting-edge PC with the unprecedented performance of DDR5.

As the performance and capabilities of modern CPUs continue to increase, your system needs upgraded memory to keep up and make the most of its potential. DDR5 ensures that today's high-end CPUs receive data as quickly as possible, and take system performance to the next level. While previous generations of DRAM were limited to less precise motherboard-based control for voltage regulation, DDR5 modules are the first equipped with onboard voltage regulation now conveniently controlled through CORSAIR iCUE software, resulting in more finely tuned and stable overclocking. iCUE also enables you to customize and save your own Intel XMP 3.0 profiles with ease, to tailor performance by app or task.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5A DDR5 SDRAM standard. This update to the JEDEC DDR5 SDRAM standard includes features designed to enhance reliability and performance in a wide range of applications involving client systems and high-performance servers. JESD79-5A is now available for download from the JEDEC website.

Added features designed to meet industry demand for improved system reliability include bounded fault error-correction support, Soft Post-Package Repair (sPPR) undo and lock, Memory Built-In Self-Test Post Package Repair (MBIST and mPPR), Adaptive RFM, and an MR4 extension. JESD79-5A expands the timing definition and transfer speed of DDR5 up to 6400 MT/s for DRAM core timings and 5600 MT/s for IO AC timings to enable the industry to build an ecosystem up to 5600 MT/s. The nomenclature for core timing parameters and their respective definitions has been revamped to closely align with the upcoming JEDEC JESD400-5 DDR5 Serial Presence Detect (SPD) Contents V1.0 standard. The document can be accessed here.

SK hynix Inc. (or 'the Company', www.skhynix.com) today announced financial results for its third quarter 2021 ended on September 30, 2021. The consolidated revenue of the third quarter 2021 was 11.805 trillion won, while the operating profit amounted to 4.172 trillion won and the net income 3.315 trillion won. Operating margin for the quarter was 35% and net margin was 28%.

SK hynix achieved record high quarterly revenue since its foundation, and regained operating profit more than 4 trillion won after two and a half years since the fourth quarter of 2018. The increased semiconductor memory demand for server and smartphone (mobile) applications, alongside the improved product prices, contributed to the Company's record-breaking quarterly revenue.

Remember the "Lego"/"Tetris" DRAM modules that Galaxy was showing off last week? Well, now we have the first benchmarks of said memory running at 4,800 MHz/MT/s with standard timings of 36-36-36-76 and the results are pretty much in line with DDR4 at the same clocks, but with a CAS latency of 19. That said, this doesn't take the latency into account and this is where the issue lies, just as expected.

Despite the change in memory architecture by going to a dual 32-bit bus per DIMM, instead of a 64-bit bus, there is somewhat surprisingly no real gains to be had in AIDA64, even when using two DIMMs. Earlier AIDA64 DDR5 memory benchmarks have only been with a single DIMM, so it has been a bit hard to compare the performance. However, the latency is up by about 30 ns compared to equivalent speed DDR4 memory, which is quite a jump. This does admittedly happen every time there's a transition to a new DRAM technology, but the increase in memory latency has never been this high before. Hopefully RAM with tighter timings and improved CPU memory controllers will help reduce the latency over time, since it'll have an adverse affect on a lot of things, least not many games.

ADATA XPG, a fast-growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts, today announces that the XPG HEADSHOT gaming mouse and GENESIS DDR5 memory module have been recognized for design excellence with 2021 Good Design Awards.

The XPG HEADSHOT gaming mouse is a one-of-a-kind gaming mouse manufactured via 4D printing and AI technology. 4D printing is used to create a mechanical structure with a lattice mesh exterior that provides for an incredibly sturdy yet lightweight mouse. Thanks to 4D printing, the HEADSHOT can be custom-made to match the shape of an individual's hands for personalized ergonomics. Its design process was started with three key aspects, light weight, incomparable ergonomics and stylish design. XPG HEADSHOT also recently won Taiwan's most influential design award, the Golden Pin Design Award.

Micron Technology, Inc. (Nasdaq: MU), the only U.S.-based manufacturer of memory and one of the world's largest semiconductor manufacturers, today announced that it intends to invest more than $150 billion globally over the next decade in leading-edge memory manufacturing and research and development (R&D), including potential U.S. fab expansion. Micron's investment will address increasing demand for memory that is essential to all computing.

Memory and storage are a growing portion of the global semiconductor industry, and today represent approximately 30% of the semiconductor market. Secular growth drivers like 5G and AI will expand usage of memory and storage across the data center and the intelligent edge, and in areas like automotive and a diversity of user devices.

SK hynix Inc. announced that it has become the first in the industry to successfully develop the High Bandwidth Memory 3, the world's best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination of multiple DRAM chips vertically connected, is a high value product that innovatively raises the data processing rate.

The latest development, which follows the start of mass production of HBM2E in July last year, is expected to help consolidate the company's leadership in the market. SK hynix was also the first in the industry to start mass production of HBM2E. SK hynix's HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.

The global memory provider TEAMGROUP has announced the T-FORCE VULCAN DDR5 GAMING MEMORY. Designed for overclocking, the new RAM takes the design language of the sleek and compact DDR4 series even further. Its aluminium alloy heatspreader comes in a unibody design, created through a sophisticated stamping process. It features a gorgeous streamlined body and multi-angular design, outlining its one-of-a-kind visual aesthetics. With the highest-spec kit providing capacity of 2X32GB for dual channel mode and frequency of up to 5,200 MHz, the T-FORCE VULCAN DDR5 will lead the new generation of overclocking memory with its beauty and performance.

The T-FORCE VULCAN DDR5 GAMING MEMORY, debuted at the recent TEAMGROUP Online Launch Event 2021, has been highly anticipated by both gaming and overclocking enthusiasts worldwide. It uses a special thermal conducting silicone to strengthen the adhesion between the heat sink and memory, enhancing the cooling of the power management IC. The ingenious thermal design quickly dissipates heat from top to bottom, allowing the memory to maintain the optimal working temperature and provide more stable operation. It is available in frequencies of 4,800 MHz and 5,200 MHz and capacity options of single 16 GB and 32 GB sticks and dual-channel 2X16GB and 2X32GB kits, meeting the needs of a wide range of consumers seeking ultra-fast speeds. The VULCAN DDR5 GAMING MEMORY is fully tested for compatibility and reliability and will deliver incredible performance to gamers and overclocking enthusiasts around the world.

With the rapid development of advanced technologies, such as 5G, the Internet of Things (IoT), Artificial Intelligence (AI), and 8K, people are placing more stringent requirements on the convenience, intelligence, and functional integration of their electronics. This has given rise to new development opportunities in the storage industry. As we progress further into the digital revolution, intelligent electronics will require small-capacity storage products which feature an increased level of reliability and stability. High-temperature tolerance in storage products will be vital for customers in the intelligent and small-sized consumer electronics market.

Longsys recently launched the FORESEE DDR4, which utilizes 96-ball thin fine ball grid array (TFBGA) encapsulation. The product's manufacturing process, transmission speed, power consumption, and high-temperature reliability all perform at an industry-leading level.

DIMM designs by the various DRAM module manufacturers are always something of a personal taste thing and then there's the polarising issue of RGB or not. Well, it looks like Galax has worked on something special for its upcoming Gamer RGB DDR5 modules that is likely to cause mixed reactions, but we have a feeling they'll potentially be popular with younger gamers.

The new modules are expected to come in kits of two, ranging in size from 16 to 64 GB, with the 32 GB kit launching first. These are merely 4800 MHz modules, so there's not too much to get excited about there and no timings have been announced. However, these are the first customisable DIMMs we've ever come across, as the RGB LED strip at the top of the module is compatible with LEGO bricks, although presumably there's no official license involved here. Based on the fact that it's Galaxy China that has shown off these modules, they're unlikely to make an appearance in markets outside of China.

DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce's latest investigations. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices. While the buying and selling sides attempt to gain the advantage in future transactions, the DRAM market's movement in 2022 will primarily be determined by suppliers' capacity expansion strategies in conjunction with potential growths in demand. The capacity expansion plans of the three largest DRAM suppliers (Samsung, SK hynix, and Micron) for 2022 are expected to remain conservative, resulting in a 17.9% growth in total DRAM bit supply next year. On the demand side, inventory levels at the moment are relatively high. Hence, DRAM bit demand is expected to grow by 16.3% next year and lag behind bit supply growth. TrendForce therefore forecasts a shift in the DRAM market next year from shortage to surplus.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA DDR5-4800, a next-generation DDR5 memory module that is capable of reaching frequencies of up to 4800MT/s and comes with up to 32 GB of capacity. In addition, ADATA has worked with six major motherboard brands, including AORUS, ASROCK, ASUS, GIGABYTE, MSI and ROG to ensure optimal performance and compatibility across a wide range of motherboards.

"Through our strong R&D capabilities and close partnerships with the world's leading motherboard makers, we are committed to offering memory modules with next-generation performance, higher capacities, and enhanced stability," said Nick Dai, Senior Manager of DRAM Products at ADATA. "In the coming months, we will continue to launch a diverse array of DDR5 products to meet the different needs of creators, gamers, and other users."