Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, and Kingston Technology, the independent world leader in memory products, today announced a collaborative development of a threaded module prototype using DDR3 DRAM technology. Initial silicon results show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules.

As demand grows for throughput-intensive computing in notebooks, desktops and servers, the performance requirements on DRAM memory subsystems rises dramatically. As a result, multi-core computing requires more bandwidth and higher rates of random access from DRAM memory.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company's standard DDR3 DIMMs.

In this product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most PCBs are made of, and one-third less copper. These DIMMs have already been tested exhaustively with a variety of hardware and software to ensure they meet Super Talent's rigid quality standards, and are backed with Super Talent's lifetime warranty.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a very low profile (VLP) DDR3-1333 Registered DIMM designed for use in servers with compact and low-profile enclosures.

This 2GB ECC registered module is only 0.72-inches tall, nearly half an inch shorter than standard height DDR3 modules. "We made this product for high density servers and embedded computers where space inside the chassis is severely constrained", explained Super Talent Director of Marketing, Joe James. VLP modules also make sense in 1U servers since their small stature improves airflow inside the chassis.

Hynix Semiconductor, Inc. announced the 4Gb (Gigabits) mobile DDR SDRAM is now supported on Intel's 'Moorestown' platform for MID (Mobile Internet Device) applications.

This high density memory device packs twice the storage capacity over current 2Gb mobile memory solutions and is offered in small form factor packages such as MCP (Multi Chip Package) and PoP(Package on Package). It boasts maximum operating speed of 400Mbps (Megabits per second), processing up to 1.6GB (Gigabytes) of data per second with a 32-bit I/O.

World class memory/DRAM module manufacturer, Silicon Power sets the sight on server class DDR3 DRAM module. Officially released as of today, the modules come with built-in temperature sensors and are made specifically for servers and workstations. Available in 1333/1066 MHz speeds, they are compatible with Intel Nehalem-based Xeon 5500 platform in tri-channel operation. With its built-in temperature sensor, it can effectively prevent system crashes, maximize efficiency and improve overall performances. It is the perfect fit for servers and workstation PCs that require stability, efficiency and processing power.

For serves and workstation PCs, platform stability is always a concern with system's heat production. Silicon Power's DDR3 1333/1066 temperature sensor can be monitored by the system and will address memory workloads accordingly to prevent overheating or overworking the modules. It effectively lowers module temperatures by evenly distributing workloads to ensure maximum system performance and stability.

A-DATA Technology Co., Ltd., the worldwide leader in DRAM modules and Flash application products, leads the industry by announcing today the availability of high-capacity 4GB single module for its entire DDR3 offering, which includes U-DIMM for desktops, SO-DIMM for laptops, and unbuffered ECC-DIMM/ECC Registered DIMM for workstations and servers.

Memory standards have been quickly evolving to the next generation DDR3 as memory requirement for both hardware and software has grown significantly to cope with the increasingly sophisticated applications and the latest platforms. To address the needs for a more powerful memory support, A-DATA makes high-density memory upgrade available and much easier by offering high-capacity 4GB DDR3 in single module.

Corsair, a worldwide leader in high-performance computer memory, power supplies, and flash memory products including solid-state drives, today re-introduced the popular Dominator GT line of memory modules. These modules had been removed from the market due to unacceptable failure levels of the Elpida "Hyper" components with which the modules are constructed.

"The issue with the Hyper RAMs was discovered with the help of the enthusiast community, and we worked closely with them to solve it," stated John Beekley, VP of Applications Engineering at Corsair. "Our lab was able to correlate the failures to specific batches of early material, we worked very closely with Elpida to determine the root cause of the issue and to define the associated corrective actions to take. We are confident that every GT module using the Elpida Hyper IC Corsair ships from today will meet our strict quality and reliability standard."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first two gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.

"We see market adoption to DDR3 picking up steam and are accommodating that with early entry of 2Gb DDR3 using the most efficient DRAM manufacturing technology available today," said Jim Elliott, Vice President, Memory Marketing, Samsung Semiconductor, Inc. "This will set the pace for a new standard in premium, eco-friendly DRAM solutions offering the most advanced, low power RDIMM for servers anywhere."

Following earlier reports of failing memory modules with Elpida Hyper chips, first Corsair and now OCZ Technology is stopping sales of Elpida Hyper DRAMs. Although OCZ claims it has not yet seen extended failures in its Elpida Hyper equipped memory modules, because an earlier batches were used, it is also pulling out the presumably affected memory modules and memory kits. This is OCZ's official statement:

In regards to the potential issues relating to Elpida Hyper IC's, OCZ has not yet seen extended failures in the field, and the Elipda Hyper IC's we have used came from earlier batches so we do not yet know if this is the reason why we are not seeing field issues but as a proactive measure based on the latest information from media reviewers like AnandTech we have officially held the use of any Elpida Hyper IC's at this time. Any customers that are seeing issues are encouraged to contact us and we will absolutely take care of all customers with a no questions asked refund or exchange for another OCZ product of equal value, whichever the customer prefers. We want to make sure that our customers have peace of mind and the confidence that we will take care of any and all issues related to modules that utilize Elpida Hyper chips.

Patriot Memory, a global pioneer in high-performance memory, NAND flash and computer technology, today announced the release of their Torqx M28 Series with capacities in 128 GB and 256 GB, backed by a new industry leading 10 year warranty for all Torqx SSD products.

The Torqx M28 SSD has been specifically designed with cutting-edge technology by increasing the DRAM cache from 64 MB to 128 MB of cache in conjunction with its current NAND flash technology. The ultimate result is an SSD that allows faster transfer rates between the controller and the host device. Compared to today†s hard drives, the Torqx SSD provides for better stability, faster access times, and lower power consumption. Consumers will also find added value with Patriot's included SSD bracket which makes using SSDs universal across all platforms; desktop or mobile.

Silicon Power's DDR3-1333/1066 dual channel memory module packs not only support the new Intel / AMD platforms but also benefits from Intel's Core i7 Quick Path Interconnect (QPI) technology boosting bandwidths up to 6.4GB/s. It is best suited for gaming, HD multimedia, intense graphic and video editing / processing work.

Silicon Power's DDR3-1333 /1066 memory modules are in compliance with JEDEC DDR3 standards. Using the new Fly-by circuit design for efficient communications between DRAM modules and the controller; its On-DIE Termination (ODT) technology dramatically reduces unwanted reflection signals and maximizes speed. Silicon Power insists on using original memory modules and FBGA packaging for better heat dissipation and accurate data transfer. Tested 100% proof for dual channel operation, Silicon Power's dual channel DDR3 memory pack is stable, durable and highly compatible.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, today introduced its new 64 GB capacity XPG Xupreme 200X flash drive, which is the first flash drive compatible with Windows 7 (32-bit and 64-bit). Coated with an elegant dark grey aluminum color, the XPG Xupreme 200X flash drive presents the high-performance USB flash drive in a simple yet stylish design of XPG product line. It offers capacity from 8GB to incredible 64GB, and supports up to 30MB/s (200X) read speed.

The XPG Xupreme 200X flash drive also certified for Windows Vist and Windows ReadyBoost, offering the high performance advantages to this operation system. Moreover, the XPG Xupreme 200X flash drive also comes with a practical leather strap and provides true "Plug and Play" function to make your storage utilization more convenient.

Transcend Information (Transcend), a worldwide leader in storage and multimedia products, today released a new line of server-grade DDR3 ECC DIMM and Registered DIMM premium memory modules equipped with thermal sensors. This advanced innovation in thermal monitoring technology can greatly enhance memory reliability, efficiency, and overall system stability, making these new modules perfect for use in dedicated servers as well as workstations.
For high-end systems that constantly process huge amounts of data under non-stop operating conditions, CPU speed regulation and various other techniques to prevent overheating have become increasingly important in hardware design. In order to provide increased performance, Transcend now offers server-grade DDR3 modules that come equipped with an advanced thermal sensor. This allows motherboard chipsets to monitor the exact temperature of each memory module and adjust the memory load accordingly, ensuring the best possible system performance while at the same time protecting the DRAM modules from potentially catastrophic failure and compromised system stability.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping a new line of IDE flash disk modules (FDMs), primarily developed for embedded computing applications, that deliver unmatched reliability and fast transfer speeds.

These FDMs, also known as disk on module (DOM), are made first and foremost for extreme reliability in embedded computing applications. They incorporate a standard IDE hard drive interface and use solid state NAND flash as the storage media. With no moving parts, these FDMs will have a very long worry-free usable life in harsh manufacturing environments where hard drives would not survive, such as areas exposed to high levels of dust, shock, vibration or extreme temperatures. Super Talent included wear leveling, ECC and bad bit management as standard features to further enhance reliability and endurance.

DRAM major Elpida, like most other Japanese companies, is not seeing the best of days, in fact its worst. The world's third largest DRAM company holds great importance to the Japanese electronics industry. The state-backed Development Bank of Japan (DBJ) will acquire shares in the company, and the government has approved dispatching 30 billion Yen to the company as early as by next week. DBJ separately plans to offer 10 billion Yen, while another state-backed financial institution Japan Bank for International Cooperation, will provide 20~30 billion Yen in emergency loans.

Three of Japan's megabanks and others are expected to lend around 100 billion Yen to Elpida, said Nikkei daily, adding that a public-private fund that supports innovation will also consider providing tens of billions of Yen. In all, at least US 2.1 billion worth of aid is coming Elpida's way. More companies will follow suit and seek government aid.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today showcased a silicon demonstration of a complete XDR memory system running at data rates up to 7.2Gbps with superior power efficiency. This silicon demonstration consists of Elpida's recently-announced 1Gb XDR DRAM device and an XIO memory controller transmitting realistic data patterns. The XIO memory controller is up to 3.5 times more power efficient than a GDDR5 controller, and the total memory system can provide up to two times more bandwidth than GDDR5 at equivalent power. In addition, the XIO memory controller demonstrated bi-modal operation with support for both XDR DRAM as well as next-generation XDR2 DRAM.

"Future graphics and multi-core processors require significantly higher memory performance under extremely challenging power and thermal constraints," said Martin Scott, senior vice president of Research and Technology Development at Rambus. "This technology demonstration highlights the outstanding power efficiency of the XDR and XDR2 memory architectures at performance levels from 3.2 to 7.2Gbps with scalability to well over 10Gbps."

Samsung Electronics Co., Ltd. and Numonyx B.V. today announced they are jointly developing market specifications for Phase Change Memory (PCM) products, a next generation memory technology that will help enable makers of feature-rich handsets and mobile applications, embedded systems* and high-end computing devices to meet the increasing performance and power demands for platforms loaded with content and data. Creating common hardware and software compatibility for PCM products should help simplify designs and shorten development time, enabling manufacturers to quickly transition to high-performance, low-power PCM products from both companies.

Phase change memory produces very fast read and write speeds at lower power than conventional NOR and NAND flash memory, and allows for bit alterability normally seen in RAM.

"Our joint efforts with Numonyx will enable a more secure path for introducing PCM into the mobile environment," said SeiJin Kim, vice president, mobile memory technology planning and enabling, Samsung Electronics. "We anticipate that PCM will eventually be a major addition to our family of memory products, one that will nicely compliment our other mobile memory solutions and ultimately increase our leadership in the industry," he added.

Samsung Electronics, the world leader in advanced memory technology, announced today that it has developed the world's first 32 Gigabyte (GB) DDR3 module - for use in server systems. The new module operates at 1.35-volts, in support of the global trend to cut power usage in mass storage computing environments.
"Compared to the 8GB memory modules used in today's servers, our new module packs an eco-sensitive wallop with four times the density at significantly reduced power levels and no increase in the overall footprint," said Jim Elliott, vice president, memory marketing, Samsung Semiconductor, Inc. "For data centers, it's a powerhouse in energy efficiency and performance," he added.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today launched a new line of MasterDrive SX SSDs that incorporate 128MB of DRAM cache and reach new performance levels in high performance laptops.

The MasterDrive SX is based on an advanced new 8-channel controller and MLC NAND Flash. Its 8-channel architecture combined with a hefty 128MB of DRAM cache takes full advantage of the 3Gbps SATA-II bandwidth. The MasterDrive SX is capable of sequential read speeds up to 220 MB/sec and sequential write speeds up to 200 MB/sec.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting the killer speed of eight A-DATA S592 SSDs with XPG 3.5" converter configure in RAID 0 at Computex Taipei 2009. With the utilization of XPG 3.5" converter, the capacity can reach up to 1TB to perform 825 MB/s read and 1,115 MB/s write transfer rate.

The eight A-DATA S592 SSDs adopting the latest XPG EX93 3.5" SSD converter, equipped with safety lock mechanism that can easily secure the SSD/hard drive in 3.5"drive bay without purchasing any accessories, to keeps the valuable data operate in a safety environment. This functional and worthful XPG EX93 3.5" SSD converter is the best choice for those PC user and enthusiasts.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, announced it is introducing the PCIe RAIDDrive Workstation. These Workstations use Super Talent's patented RAIDSSD Technology to accelerate the adoption of systems with very high performance solid state disk subsystems through the integration of large numbers of SSDs. PCIe RAIDDrive Workstations are based on Intel's newest Quad-Core Core I7 Processors, and Super Talent's 1333MHz DDR3 DIMMs.

PCIe RAIDDrive Workstations scale up 6TB in a Workstation Tower form factor. Benchmarking data taken with Crystal Disk Mark v2.2 shows sustained sequential read speed of over 1.5 GB/sec (1500 MB/sec), sequential write speed of nearly 1.35 GB/sec (1350 MB/sec). Benchmarking data taken with HDBench showed random read speed of 725 MB/sec and random write speed of 515 MB/sec.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today unveiled a set of innovations that can advance computing main memory beyond current DDR3 data rate limits to 3200Mbps. These innovations, available for licensing, build on Rambus' award-winning designs and include patented and patent pending technologies. Through this collection of innovations, designers can achieve higher memory data rates, higher effective throughput, better power efficiency and the increased capacity necessary for future computing applications.

"Product advancements in multi-core computing, virtualization and chip integration put ever-increasing demands on the memory sub-system, a key performance limiter in today's performance computing systems," said Craig Hampel, Rambus Fellow. "This collection of breakthrough innovations from Rambus allows for memory systems that are better suited for the bandwidth and workloads of these throughput-oriented multi-core processors, increasing the design and solution space for future main memory to enable a new generation of computing platforms."

GeIL wants to be the first manufacturer touting the term "hexa-channel" (6-channel) DDR3 memory. While machine architectures using 6-channels (384-bit wide) memory interfaces don't exist, dual-Nehalem Xeon machines use two triple-channel memory arrays. It's a play of the word "6-channels" there. In any case, GeIL is now selling DDR3 memory in kits of six modules. Its lineup spans across three of its main memory product-lines: Value, Ultra, and Gaming series. The kits are available in a variety of configurations that include specified DRAM speeds, and timings, as listed by the table below. The kits come backed by the company's lifetime warranty.

Samsung Electronics, the world leader in advanced semiconductor technology solutions, today announced that it is ramping up 50-nm class production of DDR3 memory chips this month - the most advanced system memory available. This is in response to increased demand stemming from Intel Corporation's launch of its Intel Xeon processor 5500 series.
Samsung's DDR3 enables OEMs to design servers that use up to 192 gigabytes (GBs) per system (16 GBx12) and provides numerous improvements over its predecessor, DDR2, including at least a 60 percent improvement in power consumption and double the system performance, with speeds up to 1333 Megabits per second (Mbps).

A-DATA Technology Co., Ltd., a worldwide leader in high performance memory products, today introduced its newly speed of XPG Gaming Series DRAM module in DDR2-1066, as dual channel 2GBx2/1GBx2 and single channel kits up to 2GB. Designed for consumers who want to enhance their gaming ability, the XPG Gaming Series DDR2-1066G DRAM module provide CL6-6-6-18 timing at 2.0V±0.1V to delivering outstanding performance, speed, and gamer experience.

Optimized for the latest gaming platform, the XPG Gaming Series DDR2-1066G DRAM module delivers the perfect blend of performance, durability, and stability with low power consumption. It is an affordable midrange offering for gamer of all levels and the professionals demanding the latest DDR2 technology.