Hynix Semiconductor, Inc. has announced the Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.

Hynix's newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.

The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. The productivity of Hynix's 40nm class 2Gb DDR3 is increased by more than 60% over 50nm class process technology.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed a 1-gigabit GDDR5 (product name: EDW1032BABG) that operates at a world-class high speed of 6Gbps. The new graphic memory (GDDR: Graphics Double Data Rate) device marks Elpida's first successful step in the GDDR market.

Applications for GDDR memory devices used with GPU (Graphics Processing Unit) are found not only in such graphic processing equipment as game consoles and PC graphics cards but also in equipment that require high-performance computing for use in such areas as science and technology, physical simulation, digital image processing and video conversion.

Kingston is out with its newest 12 GB triple-channel DDR3 memory kit. Unlike the last time, when the company came out with a three-module kit consisting of 4 GB modules, with the KHX1600C9D3K6/12GX, the new 12 GB kit consists of six modules. What is also noteworthy, is that the new kit costs a fraction: Around 350 Euro versus over 1000 Euro.

The six 2 GB modules are cooled by the classic Kingston HyperX heatspreaders. They are rated to operate at 1600 MHz (PC3-12800) with DRAM timings of 9-9-9-27, with module voltage of 1.65V, along with Intel XMP support, making them just about ideal for socket LGA-1366 desktops and importantly, 2-socket workstations.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced new 450X, 533X, and 600X high speed CompactFlash media cards which achieve read/write speeds up to 90MB/sec. The new high speed CF cards are offered in four different capacities: 8GB, 16GB, 32GB and 64GB.

CF is one of the world's most popular digital mass-storage card formats and is widely used on DSLR cameras as well as in embedded computing. Super Talent designed these high speed CF cards especially for the demanding requirements of performance oriented photographers. The cards use MLC NAND Flash as the medium which works silently, lasts longer and is lightning fast. The 600X cards reach transfer speeds up to 90MB/sec which accommodate the high read/write requirements of premium DSLR cameras.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and solid-state storage with solid quality, has today released the world's fastest DRAM modules rated at a groundbreaking DDR3 2200 CL7-10-10-28 1.65V 4GB (2GBx2), and specially tuned for Intel Lynnfield Core i7 870, 860 processors.

Furnished with the brand new design PI series heatspreader, these modules once again represent G.Skill's commitment to pushing the boundaries and providing overclocking enthusiasts and extreme gamers with the best DRAM modules for breaking overclocking world records. The kits will be sold with G.Skill's Turbulence memory fan to decrease the system temperatures and provide further overclocking headroom during tweaking.

Elpida Memory, Inc. and ProMOS Technologies announced today the signing of a DRAM foundry agreement. This agreement marks the beginning of mutually beneficial business cooperation.

According to the agreement, Elpida will provide advanced DRAM process and product technologies to ProMOS, while ProMOS will provide certain amount of manufacturing capacity at ProMOS' Taichung 300mm wafer fab to Elpida for the manufacturing of Elpida's advanced 1Gb DDR3 device. Trial runs will be completed in the first half of 2010, with mass production following in the second half of the same year.

Dr. M. L. Chen, President & Chairman of ProMOS Technologies, noted that Elpida has long been globally recognized as a leader in the development of leading edge DRAM technologies. The synergistic partnership built through this agreement will combine strengths from both companies; Elpida's 1Gb DDR3 device is among the most cost-competitive product in the industry, pairing well with ProMOS' strength in 300mm manufacturing. Dr. Chen further noted that through this agreement, ProMOS will be able to rapidly increase its capacity utilization rate at its Taichung 300mm facilities. With the recent turnaround in the DRAM market, ProMOS has embarked on the road to recovery.

Memory manufacturer Kingmax announced the Hercules line of high-end DDR3 PC3-17600 memory modules for overclockers. Available in dual-channel kits for now, the Hercules can operate at 2200 MHz, with CAS latency of 10T, with DRAM voltage in the range of 1.5~1.7V. Optimized for Intel socket LGA-1156 processors, the modules support Intel Extreme Memory Profiles. Each kit includes two 2 GB modules. At 2200 MHz, each module provides a theoretical bandwidth of 17.6 GBps. There is no word on the availability or pricing.

RAM cooling is crucial for maintaining high clock rates as well as to avoid any damages caused by overheat. In order to offer an efficient tool to lower RAM temperature, the Swiss IT cooling solution provider ARCTIC COOLING today launched the new ARCTIC RC PRO, an advanced RAM cooler designed for DDR2 and DDR3 SDRAM modules.

Following the design concept of the award-winning ARCTIC RC, this Pro version also features long aluminium fins as well as highly conductive thermal pads. The fins are extended to 5cm which lead to a significant increase in heat transfer area and optimized natural convection.

Mushkin Enhanced is out with a pair of new DDR3 dual-channel and triple-channel memory kits utilizing the the company's new Blackline PC3-12800 high-density 4 GB module. These kits operate at 1333 MHz, with timings of 7-7-7-20, with DRAM voltage of 1.65V. In dual and triple channel kits, they offer 8 and 12 GB of memory, respectively. Below are the details of the kits as listed by the company:

• 996776 - Mushkin Enhanced Blackline PC3-12800 8192 MB Dual Channel Kit CL 7-7-7-20 1.65V
• 998776 - Mushkin Enhanced Blackline PC3-12800 12288 MB Triple Channel Kit CL 7-7-7-20 1.65V

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces that its A-DATA standard DRAM modules are now adopting the latest DNA authentication technology, in order to protect its intellectual property of DRAM modules against counterfeiting and fraud.

The DNA authentication technology involves the embedded sequence of a unique DNA in the product label. In addition, A-DATA uses this technology in conjunction with advanced identification systems, to provide an effective solution in cause of protecting consumers' rights, and the intellectual property of A-DATA as a quality manufacturer of DRAM modules.

Active Media Products, manufacturer of SSDs and innovative USB drives, today announced imminent arrival of a line of Predator-X7 2.5-inch SATA-II 3Gbps Windows 7 compatible SSDs built with the new Jmicron JM612 controller.

Predator X7 SSDs will be offered in capacities from 32GB to 256GB. At the heart of these SSDs is the JMF612 controller, which boasts numerous advances in features and performance. The 8-channel flash controller combined with 128MB of DRAM cache achieves sequential read speeds up to 230MB/sec and sequential write speeds up to 180MB/sec. "One big advantage of this controller is its support for a USB 2.0 port, which can be used for cloning the contents of your old hard drive onto the Predator X7. The mini USB port makes installation and setup a lot faster and easier." stated Active Media Products' VP of Sales, Jerry Thomson.

Acer, the third largest vendor in the worldwide PC market, today announced the Acer Aspire Z5610-U9072, a truly elegant, no-compromise all-in-one desktop PC featuring intuitive multi-touch technology and Windows 7 Home Premium. A powerful entertainment hub for the home, the Z5610 packs first-class performance and feature-rich functionality in a striking design. It will be available this holiday season at online retailers for an attractive price of $899.99.

Engineered to eliminate clutter and maximize workspace, this practical all-in-one streamlines the home or office with a flash of style and offers a unique blend of features and architecture. Boasting a stunning 23-inch HD display, ATI Mobility Radeon graphics and Intel Pentium Dual Core processing, the Aspire Z5610 offers world-class digital prowess.

Hynix Semiconductor, Inc. has announced the second generation 1Gb (Gigabits) DDR3 using 54nm process technology. Hynix's new 1Gb DDR3, offered in x4 (H5TQ1G43TFR) and x8 (H5TQ1G83TFR) organizations, has innovative design modifications that significantly reduce power consumption of the device.

The new product operates at 1.5V (volts) power supply as the existing 1Gb DDR3 product and further reduces power consumption by 30% over the existing one. This second generation product is the highest performing memory in the industry among 1Gb density category which is the mainstream of the products. According to the iSuppli, a market research firm, the portion of the world wide 1Gb DDR3 is currently estimated to be 87%. The iSuppli estimates that higher densities will become the mainstream when it is expected to account for more than 50% in 2011.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had finished development of the smallest high-speed low-power 40nm 2-gigabit DDR3 SDRAM in the DRAM industry.

The new 2-gigabit DDR3 SDRAM uses a smaller chip size to achieve a 44% higher chip yield per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6Gbps, the highest speed standard for current DDR3. Compared with 50nm products, it uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, thus reducing power consumption by as much as 45%.

Korean cooling specialist Zalman rolled out its first memory area cooler called the ZM-RC1000. Like similar products from popular memory vendors such as Corsair, Kingston, and A-Data to name a few, the cooler latches on to the motherboard's long DRAM slots and blows air onto the installed memory modules with its two 60 mm fans. The cooler measures 66 (L) x 155 (W) x 70 (H) mm, weighing 160 g. The retention mechanism has anti-vibration grips to dampen noise, and its thumb-screws make it tool-free. The fans spin at 2700 rpm with a maximum noise output of 25 ± 2.5 dBA. It comes with two panel colours: silver and blue. An early listing by a European store prices it at 16.30 EUR.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces that its XPG series DDR3 DRAM modules are fully compatible with ASUS P7P55D series and ROG Maximus III series motherboards. Once again, A-DATA has established an undisputed industry-leading position.

Moreover, in order to present the leading position and technology alliances between two major players in the IT industry, A-DATA and ASUS have demonstrated together their latest products for Intel P55 platform at ASUS P55 Technical Seminar. During this event A-DATA showcased its XPG series DDR3 DRAM modules including the Plus Series DDR3-2200+ 4GB dual channel kit, which adopts 2oz copper PCB (printed circuit board), while ASUS presented the P7P55D series and ROG Maximus III series motherboards.

Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, and Kingston Technology, the independent world leader in memory products, today announced a collaborative development of a threaded module prototype using DDR3 DRAM technology. Initial silicon results show an improvement in data throughput of up to 50 percent, while reducing power consumption by 20 percent compared to conventional modules.

As demand grows for throughput-intensive computing in notebooks, desktops and servers, the performance requirements on DRAM memory subsystems rises dramatically. As a result, multi-core computing requires more bandwidth and higher rates of random access from DRAM memory.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company's standard DDR3 DIMMs.

In this product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most PCBs are made of, and one-third less copper. These DIMMs have already been tested exhaustively with a variety of hardware and software to ensure they meet Super Talent's rigid quality standards, and are backed with Super Talent's lifetime warranty.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced a very low profile (VLP) DDR3-1333 Registered DIMM designed for use in servers with compact and low-profile enclosures.

This 2GB ECC registered module is only 0.72-inches tall, nearly half an inch shorter than standard height DDR3 modules. "We made this product for high density servers and embedded computers where space inside the chassis is severely constrained", explained Super Talent Director of Marketing, Joe James. VLP modules also make sense in 1U servers since their small stature improves airflow inside the chassis.

Hynix Semiconductor, Inc. announced the 4Gb (Gigabits) mobile DDR SDRAM is now supported on Intel's 'Moorestown' platform for MID (Mobile Internet Device) applications.

This high density memory device packs twice the storage capacity over current 2Gb mobile memory solutions and is offered in small form factor packages such as MCP (Multi Chip Package) and PoP(Package on Package). It boasts maximum operating speed of 400Mbps (Megabits per second), processing up to 1.6GB (Gigabytes) of data per second with a 32-bit I/O.

World class memory/DRAM module manufacturer, Silicon Power sets the sight on server class DDR3 DRAM module. Officially released as of today, the modules come with built-in temperature sensors and are made specifically for servers and workstations. Available in 1333/1066 MHz speeds, they are compatible with Intel Nehalem-based Xeon 5500 platform in tri-channel operation. With its built-in temperature sensor, it can effectively prevent system crashes, maximize efficiency and improve overall performances. It is the perfect fit for servers and workstation PCs that require stability, efficiency and processing power.

For serves and workstation PCs, platform stability is always a concern with system's heat production. Silicon Power's DDR3 1333/1066 temperature sensor can be monitored by the system and will address memory workloads accordingly to prevent overheating or overworking the modules. It effectively lowers module temperatures by evenly distributing workloads to ensure maximum system performance and stability.

A-DATA Technology Co., Ltd., the worldwide leader in DRAM modules and Flash application products, leads the industry by announcing today the availability of high-capacity 4GB single module for its entire DDR3 offering, which includes U-DIMM for desktops, SO-DIMM for laptops, and unbuffered ECC-DIMM/ECC Registered DIMM for workstations and servers.

Memory standards have been quickly evolving to the next generation DDR3 as memory requirement for both hardware and software has grown significantly to cope with the increasingly sophisticated applications and the latest platforms. To address the needs for a more powerful memory support, A-DATA makes high-density memory upgrade available and much easier by offering high-capacity 4GB DDR3 in single module.

Corsair, a worldwide leader in high-performance computer memory, power supplies, and flash memory products including solid-state drives, today re-introduced the popular Dominator GT line of memory modules. These modules had been removed from the market due to unacceptable failure levels of the Elpida "Hyper" components with which the modules are constructed.

"The issue with the Hyper RAMs was discovered with the help of the enthusiast community, and we worked closely with them to solve it," stated John Beekley, VP of Applications Engineering at Corsair. "Our lab was able to correlate the failures to specific batches of early material, we worked very closely with Elpida to determine the root cause of the issue and to define the associated corrective actions to take. We are confident that every GT module using the Elpida Hyper IC Corsair ships from today will meet our strict quality and reliability standard."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first two gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.

"We see market adoption to DDR3 picking up steam and are accommodating that with early entry of 2Gb DDR3 using the most efficient DRAM manufacturing technology available today," said Jim Elliott, Vice President, Memory Marketing, Samsung Semiconductor, Inc. "This will set the pace for a new standard in premium, eco-friendly DRAM solutions offering the most advanced, low power RDIMM for servers anywhere."

Following earlier reports of failing memory modules with Elpida Hyper chips, first Corsair and now OCZ Technology is stopping sales of Elpida Hyper DRAMs. Although OCZ claims it has not yet seen extended failures in its Elpida Hyper equipped memory modules, because an earlier batches were used, it is also pulling out the presumably affected memory modules and memory kits. This is OCZ's official statement:

In regards to the potential issues relating to Elpida Hyper IC's, OCZ has not yet seen extended failures in the field, and the Elipda Hyper IC's we have used came from earlier batches so we do not yet know if this is the reason why we are not seeing field issues but as a proactive measure based on the latest information from media reviewers like AnandTech we have officially held the use of any Elpida Hyper IC's at this time. Any customers that are seeing issues are encouraged to contact us and we will absolutely take care of all customers with a no questions asked refund or exchange for another OCZ product of equal value, whichever the customer prefers. We want to make sure that our customers have peace of mind and the confidence that we will take care of any and all issues related to modules that utilize Elpida Hyper chips.