KINGMAX, leading manufacturer of DRAM Module and Flash Products, announces the high density solution for DDR3 memory for Intel Core i5 and i7, provide the most stable compatibility for desktop and laptop platforms. These DIMMs are available in single, dual and triple channel configurations and are specifically tuned for Intel CPUs; unleash the best performance for gaming operation.

KINGMAX high density solution DRAM Module improves the performance of 64 bit OS efficiently. The efficiency would be upturned after adopting KINGMAX high density DRAM Module, while operating video decoding, large image file handling and modifying and performance demanding games.

A-DATA Technology, the world leader in DRAM modules and flash memory products, launched the industry first ever combo flash drive N002 that features the dual interface of USB 3.0 and SATA II, designed to maximize data transfer speed to the ultimate. Adopting the industry-leading 8-channel architecture, N002 is able to boost transfer speed tenfold compared to ordinary flash drives with USB 2.0 interface by delivering up to ultra-fast 200 MB/s and 170 MB/s in sequential read/write performance respectively.

Ready to hit the market by January, 2010, N002 makes USB 3.0 a reality. It supports all latest platforms that come with USB 3.0 ports, while also being backward compatible with USB 2.0 ports at a lower speed performance. Available in 64GB, 128GB and 256GB, N002 is ideal for users who are thirsty for super-sized storage capacities with unrivaled speed via the innovative USB 3.0 and SATA II dual interface. A combination of speed, storage and portability altogether into one device, N002 is by all means the most effective solution to access and transfer large amount of data, including high-resolution images, multimedia files and whole lot more, at an instant and on the go.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had completed development of a 65nm XS extra-shrink version 1-Gigabit DDR3 SDRAM that is as cost-competitive as 50nm process memory devices.

In response to the slump in the DRAM market that has lasted since 2008, Elpida is taking a two-track R&D approach that focuses on conventional process migration and on layout innovations that reduce the cost of capital investment. Along with migrating to advanced processes such as 50nm and 40nm the company is developing shrunken chip versions through extensive use of existing ArF dry scanner equipment. As a result, a 65nm S shrink version was developed in 2008 and now a 65nm XS extra-shrink version has been completed.

The 65nm XS is a smaller version of the already shrunken 65nm S and delivers 25% more chips per 300mm wafer compared with its predecessor. In addition to its extremely small chip size the XS shortens the manufacturing process and helps to greatly reduce equipment costs through the use of ArF dry scanner equipment. Chips costs are comparable to 50nm process products.

Transcend Information Inc., a worldwide leader in the manufacture of high-performance memory modules, today launched 4GB aXeRam DDR3-2000 memory kits for use with Intel's LGA1156 Core i5 and Core i7 platforms. The XMP-ready DDR3 kits are designed to operate at a blazing-fast clock frequency of 2000 MHz with an exceptionally low voltage of just 1.65V.

Featuring memory bandwidth up to an incredible 32GB/s, Transcend's new aXeRam dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i5 platform to the next level of memory overclocking performance. The Core i5, based on Intel's new Nehalem architecture, is the first Intel processor to integrate both a 16-lane PCI Express 2.0 graphics port and a two-channel DDR3 memory controller, enabling all input/output and manageability functions to be handled by the single-chip Intel P55 core-logic.

Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, today announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are available from today, and mass production will start in the first quarter of 2010.

The new 64GB embedded device combines sixteen pieces of 32Gbit (equal to 4GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers. Toshiba offers a comprehensive line-up of single-package embedded NAND Flash memories in densities ranging from 2GB to 64GB. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.

A-DATA Technology Co., Ltd., the worldwide leader in DRAM modules and Flash application products, today announced a collaboration with SandForce Inc. on A-DATA's solid state drives (SSDs). As its major partner, A-DATA will work closely together with SandForce on a broad-scale basis in developing enterprise storage solutions for high-end workstations/servers in light of the emerging cloud computing technology in the near future. A-DATA has also planned to include the next-generation SandForce-based SSDs in its product lineup.

"Combining high-performance SSD Processors from SandForce with A-DATA's experienced design team and complete manufacturing base is expected to create synergy to further propel the SSD performance to the ultimate," said Gibson Chen, Vice President of A-DATA Technology. "From enterprise solutions designed for high-end workstations to mainstream solutions for general personal computing, A-DATA strives to optimize each aspect and detail to bring out an outstanding performance."

Super Talent, a leading manufacturer of Flash storage solutions and DRAM memory modules, proudly released a brand new compact digital storage product line, CFast storage cards. Just like the traditional SD card and its enhanced version, SDHC, the CFast storage card, with SATA interface, has improved, unmatched write/read performance speeds.

Super Talent CFast storage card is an evolution of the traditional CompactFlash card which has been in the industry for over 14 years, satisfying storage needs for mobile digital devices such as PDAs, digital cameras, etc. CFast has a bandwidth of 375MB/s which is four times more than the fastest High Speed 600x (90MB/s) CompactFlash card while still keeping the small original CF mechanical form factor. The new CFast storage card breaks the speed bottleneck between the SSD and the device by using a SATA interface. Super Talent has clocked these CFast cards at up to 200MB/sec read speeds. With Super a Talent CFast storage card installed, there will be no waiting time for the camera to catch up, and it will be much swifter to view pictures on a camera or to copy them to computer.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had begun sample shipments of a 2-gigabit x32-bit I/O DDR2 SDRAM that operates up to a high speed of 1066 Mbps. The new memory device is capable of meeting the need for 1.8V x32-bit and x16-bit I/O as well as low-voltage 1.5V x32-bit and x16-bit I/O.

Rapid advances in the image quality and functionality of digital TV, digital still cameras and other new digital consumer equipment have led to a growing need for memory that can deliver faster speeds, higher densities and wide-bit configurations. Elpida's newly developed 2-gigabit density x32-bit I/O product provides an optimal solution for these needs. Systems with a 32-bit CPU that require 2-gigabit memory density have until now had rely on a conventional 1-gigabit x16-bit I/O two-chip design. Elpida's new 2-gigabit x32-bit I/O product, however, reduces by half the number of mounted memory chips, simplifies high-speed memory bus design, conserves chip mounting space and lowers power consumption.

A-DATA Technology Co., Ltd., the worldwide leader in DRAM memory and Flash application products, released today its new compact Flash card CF633X, the ultimate memory card fast enough to keep up with your digital SLR cameras. Performing at the industry's fastest read/write speed up to 93/92 MB/s, the new A-DATA CF633X adopts the turboMLC technology and delivers the performance of SLC at the cost of MLC.

With an ECC automatic error-checking program in place, the CF633X consumes less power and extends the use of a DSLR. Capacity available in 16GB and 32GB, the CF633X is the perfect storage device for users to store more high resolution images and high definition video clips.

Hynix Semiconductor, Inc. has announced the Intel validation of 2Gb (Gigabit) DDR3 DRAM using 40nm class process technology.

Hynix's newly validated products are 2Gb DDR3 SDRAM component, 4GB (Gigabyte) DDR3 SODIMM (Small Outline Dual In-line Memory Module) and 2GB DDR3 UDIMM (Un-buffered Dual In-line Memory Module) at the operating speed of 1333MHz with 1.5V power supply.

The products can offer the maximum data transfer speed of 1867MHz with 16-bit I/O and 3.7GB/s (Gigabytes per second) bandwidth. The productivity of Hynix's 40nm class 2Gb DDR3 is increased by more than 60% over 50nm class process technology.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had developed a 1-gigabit GDDR5 (product name: EDW1032BABG) that operates at a world-class high speed of 6Gbps. The new graphic memory (GDDR: Graphics Double Data Rate) device marks Elpida's first successful step in the GDDR market.

Applications for GDDR memory devices used with GPU (Graphics Processing Unit) are found not only in such graphic processing equipment as game consoles and PC graphics cards but also in equipment that require high-performance computing for use in such areas as science and technology, physical simulation, digital image processing and video conversion.

Kingston is out with its newest 12 GB triple-channel DDR3 memory kit. Unlike the last time, when the company came out with a three-module kit consisting of 4 GB modules, with the KHX1600C9D3K6/12GX, the new 12 GB kit consists of six modules. What is also noteworthy, is that the new kit costs a fraction: Around 350 Euro versus over 1000 Euro.

The six 2 GB modules are cooled by the classic Kingston HyperX heatspreaders. They are rated to operate at 1600 MHz (PC3-12800) with DRAM timings of 9-9-9-27, with module voltage of 1.65V, along with Intel XMP support, making them just about ideal for socket LGA-1366 desktops and importantly, 2-socket workstations.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced new 450X, 533X, and 600X high speed CompactFlash media cards which achieve read/write speeds up to 90MB/sec. The new high speed CF cards are offered in four different capacities: 8GB, 16GB, 32GB and 64GB.

CF is one of the world's most popular digital mass-storage card formats and is widely used on DSLR cameras as well as in embedded computing. Super Talent designed these high speed CF cards especially for the demanding requirements of performance oriented photographers. The cards use MLC NAND Flash as the medium which works silently, lasts longer and is lightning fast. The 600X cards reach transfer speeds up to 90MB/sec which accommodate the high read/write requirements of premium DSLR cameras.

G.Skill International Co. Ltd., manufacturer of extreme performance memory and solid-state storage with solid quality, has today released the world's fastest DRAM modules rated at a groundbreaking DDR3 2200 CL7-10-10-28 1.65V 4GB (2GBx2), and specially tuned for Intel Lynnfield Core i7 870, 860 processors.

Furnished with the brand new design PI series heatspreader, these modules once again represent G.Skill's commitment to pushing the boundaries and providing overclocking enthusiasts and extreme gamers with the best DRAM modules for breaking overclocking world records. The kits will be sold with G.Skill's Turbulence memory fan to decrease the system temperatures and provide further overclocking headroom during tweaking.

Elpida Memory, Inc. and ProMOS Technologies announced today the signing of a DRAM foundry agreement. This agreement marks the beginning of mutually beneficial business cooperation.

According to the agreement, Elpida will provide advanced DRAM process and product technologies to ProMOS, while ProMOS will provide certain amount of manufacturing capacity at ProMOS' Taichung 300mm wafer fab to Elpida for the manufacturing of Elpida's advanced 1Gb DDR3 device. Trial runs will be completed in the first half of 2010, with mass production following in the second half of the same year.

Dr. M. L. Chen, President & Chairman of ProMOS Technologies, noted that Elpida has long been globally recognized as a leader in the development of leading edge DRAM technologies. The synergistic partnership built through this agreement will combine strengths from both companies; Elpida's 1Gb DDR3 device is among the most cost-competitive product in the industry, pairing well with ProMOS' strength in 300mm manufacturing. Dr. Chen further noted that through this agreement, ProMOS will be able to rapidly increase its capacity utilization rate at its Taichung 300mm facilities. With the recent turnaround in the DRAM market, ProMOS has embarked on the road to recovery.

Memory manufacturer Kingmax announced the Hercules line of high-end DDR3 PC3-17600 memory modules for overclockers. Available in dual-channel kits for now, the Hercules can operate at 2200 MHz, with CAS latency of 10T, with DRAM voltage in the range of 1.5~1.7V. Optimized for Intel socket LGA-1156 processors, the modules support Intel Extreme Memory Profiles. Each kit includes two 2 GB modules. At 2200 MHz, each module provides a theoretical bandwidth of 17.6 GBps. There is no word on the availability or pricing.

RAM cooling is crucial for maintaining high clock rates as well as to avoid any damages caused by overheat. In order to offer an efficient tool to lower RAM temperature, the Swiss IT cooling solution provider ARCTIC COOLING today launched the new ARCTIC RC PRO, an advanced RAM cooler designed for DDR2 and DDR3 SDRAM modules.

Following the design concept of the award-winning ARCTIC RC, this Pro version also features long aluminium fins as well as highly conductive thermal pads. The fins are extended to 5cm which lead to a significant increase in heat transfer area and optimized natural convection.

Mushkin Enhanced is out with a pair of new DDR3 dual-channel and triple-channel memory kits utilizing the the company's new Blackline PC3-12800 high-density 4 GB module. These kits operate at 1333 MHz, with timings of 7-7-7-20, with DRAM voltage of 1.65V. In dual and triple channel kits, they offer 8 and 12 GB of memory, respectively. Below are the details of the kits as listed by the company:

• 996776 - Mushkin Enhanced Blackline PC3-12800 8192 MB Dual Channel Kit CL 7-7-7-20 1.65V
• 998776 - Mushkin Enhanced Blackline PC3-12800 12288 MB Triple Channel Kit CL 7-7-7-20 1.65V

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces that its A-DATA standard DRAM modules are now adopting the latest DNA authentication technology, in order to protect its intellectual property of DRAM modules against counterfeiting and fraud.

The DNA authentication technology involves the embedded sequence of a unique DNA in the product label. In addition, A-DATA uses this technology in conjunction with advanced identification systems, to provide an effective solution in cause of protecting consumers' rights, and the intellectual property of A-DATA as a quality manufacturer of DRAM modules.

Active Media Products, manufacturer of SSDs and innovative USB drives, today announced imminent arrival of a line of Predator-X7 2.5-inch SATA-II 3Gbps Windows 7 compatible SSDs built with the new Jmicron JM612 controller.

Predator X7 SSDs will be offered in capacities from 32GB to 256GB. At the heart of these SSDs is the JMF612 controller, which boasts numerous advances in features and performance. The 8-channel flash controller combined with 128MB of DRAM cache achieves sequential read speeds up to 230MB/sec and sequential write speeds up to 180MB/sec. "One big advantage of this controller is its support for a USB 2.0 port, which can be used for cloning the contents of your old hard drive onto the Predator X7. The mini USB port makes installation and setup a lot faster and easier." stated Active Media Products' VP of Sales, Jerry Thomson.

Acer, the third largest vendor in the worldwide PC market, today announced the Acer Aspire Z5610-U9072, a truly elegant, no-compromise all-in-one desktop PC featuring intuitive multi-touch technology and Windows 7 Home Premium. A powerful entertainment hub for the home, the Z5610 packs first-class performance and feature-rich functionality in a striking design. It will be available this holiday season at online retailers for an attractive price of $899.99.

Engineered to eliminate clutter and maximize workspace, this practical all-in-one streamlines the home or office with a flash of style and offers a unique blend of features and architecture. Boasting a stunning 23-inch HD display, ATI Mobility Radeon graphics and Intel Pentium Dual Core processing, the Aspire Z5610 offers world-class digital prowess.

Hynix Semiconductor, Inc. has announced the second generation 1Gb (Gigabits) DDR3 using 54nm process technology. Hynix's new 1Gb DDR3, offered in x4 (H5TQ1G43TFR) and x8 (H5TQ1G83TFR) organizations, has innovative design modifications that significantly reduce power consumption of the device.

The new product operates at 1.5V (volts) power supply as the existing 1Gb DDR3 product and further reduces power consumption by 30% over the existing one. This second generation product is the highest performing memory in the industry among 1Gb density category which is the mainstream of the products. According to the iSuppli, a market research firm, the portion of the world wide 1Gb DDR3 is currently estimated to be 87%. The iSuppli estimates that higher densities will become the mainstream when it is expected to account for more than 50% in 2011.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that it had finished development of the smallest high-speed low-power 40nm 2-gigabit DDR3 SDRAM in the DRAM industry.

The new 2-gigabit DDR3 SDRAM uses a smaller chip size to achieve a 44% higher chip yield per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100% yield for DDR3 products that operate at 1.6Gbps, the highest speed standard for current DDR3. Compared with 50nm products, it uses about two-thirds less current and supports 1.2V/1.35V operation as well as DDR3 standard 1.5V, thus reducing power consumption by as much as 45%.

Korean cooling specialist Zalman rolled out its first memory area cooler called the ZM-RC1000. Like similar products from popular memory vendors such as Corsair, Kingston, and A-Data to name a few, the cooler latches on to the motherboard's long DRAM slots and blows air onto the installed memory modules with its two 60 mm fans. The cooler measures 66 (L) x 155 (W) x 70 (H) mm, weighing 160 g. The retention mechanism has anti-vibration grips to dampen noise, and its thumb-screws make it tool-free. The fans spin at 2700 rpm with a maximum noise output of 25 ± 2.5 dBA. It comes with two panel colours: silver and blue. An early listing by a European store prices it at 16.30 EUR.

A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and flash application products, today announces that its XPG series DDR3 DRAM modules are fully compatible with ASUS P7P55D series and ROG Maximus III series motherboards. Once again, A-DATA has established an undisputed industry-leading position.

Moreover, in order to present the leading position and technology alliances between two major players in the IT industry, A-DATA and ASUS have demonstrated together their latest products for Intel P55 platform at ASUS P55 Technical Seminar. During this event A-DATA showcased its XPG series DDR3 DRAM modules including the Plus Series DDR3-2200+ 4GB dual channel kit, which adopts 2oz copper PCB (printed circuit board), while ASUS presented the P7P55D series and ROG Maximus III series motherboards.