OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs), today launched the Indilinx Everest-based Octane SATA 3.0 and SATA 2.0 SSD series, striking the ideal balance between capacity, physical size, and speed. In addition to being the world's first SSD to achieve up to a 1TB capacity in a compact 2.5 inch format, OCZ's Octane SSD series combines high-speed data transfer rates with record-breaking access times to provide a superior user experience and improved application performance.

"OCZ has reached an important milestone in the development of its own controller technology," said James E. Bagley, Senior Analyst with Storage Strategies NOW. "The high sustained performance, even with compressed files, the rapid boot feature and high access speeds using SATA 3.0 protocol puts their controller technology in the major league."
"Until now SSDs have been tailored for specific applications, forcing users into a product which maximizes performance for a narrow band of applications, but is significantly lacking in others," said Ryan Petersen, CEO of OCZ Technology. "The Octane Series solves this problem by providing the highest level of performance across varied workloads including mixed file sizes and mixed compressible and uncompressible data, all while nearly doubling NAND flash endurance."

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, has launched a full range of USB 3.0 products. This USB 3.0 product lineup from ADATA offers a comprehensive range of styles, all of which incorporate new heights of performance excellence, leading consumers to experience the new era of USB 3.0 whirlwind speed.

After ADATA announced the different functionality and high performance USB 3.0 hard drive solutions SH14 & SH12, the constant pursuit for high quality, high efficiency, and the differing needs of consumers has spurred the company to re-launch its USB 3.0 flash drive line. This first new launch includes three models of ADATA USB 3.0 Flash drive: the N005 Pro, the first choice for those looking for professional performance, and the performance and value entries S102 Pro and C103. The N005 Pro and S102 Pro are advanced versions offering professional performance and improved overall speed, more than twice that of previous models.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the world's first high-performance quad channel Dominator 32GB DDR3 memory kit.

The Dominator 32GB Quad Channel kit (part number CMT32GX3M4X1866C9) consists of four rigorously-screened 8GB DDR3 DRAM modules with Corsair's patented DHX+ heatsinks. It operates at 1.5V and is designed to run at 1866MHz, with 9-10-9-27 C9 timing. Corsair has compatibility tested the new 32GB Quad Channel kit with upcoming quad channel platforms as well as current dual channel platforms.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of its new Premier Pro DRAM modules.

The Premier Pro DRAM modules are designed for IT professionals who need to deliver rock-solid quality computer systems to their customers. The quality of ADATA Premier Pro modules are enhanced in two aspects. First, the modules are engineered for long term reliability. "When memory devices are not reliably engineered," said Ukyo Jeong, Vice President of DRAM product engineering at ADATA, "there is very high chance that the memory module will fail within the first year of usage." He continued: "a 1.6 to 3.2% rate of system failure due to problems with DRAM is not acceptable for IT professionals, and this is the typical failure range when a DRAM module uses components that are not subjected to burn-in process."

Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design also reduces the Voltage requirements a full 10%, from the traditional 1.5V traditional voltage to the new 1.35 volt standard.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the addition of 8GB DDR3 memory modules to its Vengeance and Value Select product lines.

The new 8GB Vengeance DDR3 memory operates at 1.5V for compatibility with the new 2nd generation Intel Core processor family and is guaranteed to operate at 1600MHz. Providing 8GB of rigorously-screened DRAM on a single module allows gamers and performance enthusiasts to build systems with 32GB of high-performance memory.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the release of the S510 Solid State Drive (SSD), a mid-range version of the company's flagship S511. Implementing the SATA III (6Gb/sec) specification, the S510 is aimed at the growing pool of users who recognize the cost and performance advantages of solid state drive upgrades for both desktop and portable computers.

The performance advantages of the SATA III transfer specification are becoming well-known among consumers, and the S510 capitalizes on this trend with native support through adoption of the SandForce SF-2200 series chip. Its read and write speeds are twice that of SSDs using the older SATA II specification, and in real world test simulations reached 550/510MB read and write speeds respectively, with 4K random write speeds as high as 85,000 IOPS.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced the USB 3.0 DataGuardian, a password protected USB 3.0 flash drive that makes data security easy and affordable.

By now almost everyone is familiar with USB flash drives. They are incredibly useful and have become an indispensible part of our computing environments. We all know that we should be using a secure solution, but the fact is security solutions are expensive, cumbersome and limit the usefulness of a flash drive. That is, until now.

Elpida Memory, Inc., the Japan-based third largest Dynamic Random Access Memory (DRAM) maker in the world, today announced it had completed development of the industry's first 25-nanometer (nm) process 4-gigabit DDR3 SDRAM. The new chip is also the smallest 4-gigabit DRAM. The new cutting-edge smallest available 4-gigabit chip uses ultra fine-width 25nm process migration technology. Back in May, Elpida finished development of a 2-gigabit DDR3 SDRAM using the advanced 25nm process and began sample shipments in July.

By using ultra-fine process technology the 4-gigabit DDR3 SDRAM becomes a more energy efficient chip and achieves higher productivity. As a 4-gigabit product, its density is double that of Elpida's 2-gigabit DDR3 SDRAM based on the same process node. The newly developed 4-gigabit DRAM enhances productivity by about 45% compared with Elpida's 30nm 4-gigabit DDR3 SDRAM. Compared with this same 30nm DDR3, it reduces operating current by about 25-30% and standby current by about 30-50%. It has also realized the industry's highest speed data transfer rate.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun operations of its new Line-16 memory semiconductor fabrication facility, which will provide the industry's largest production capacity. It also announced the start of mass production of the industry's first double data rate-3 (DDR3) dynamic random access memory (DRAM) based on 20 nanometer (nm) class process technology, which offers significant improvements to productivity and reduces energy consumption. The announcements were made during a ceremony at Samsung's Nano City Complex in Hwaseong, Gyeonggi Province, where the new Line-16 is located.

Receiving the first wafer from the new memory line, Samsung Electronics Chairman Kun-hee Lee said: "The global semiconductor industry is in a period of fierce cyclical volatility, so the opening of this new memory fab and the start of mass production of the world's first 20nm-class DRAM are important milestones to reinforce Samsung's industry leadership."
"We must prepare for an intensifying storm in the semiconductor industry by further enhancing our technological capabilities and expertise in order to maintain our leadership position," he said.

Weeks ahead of its market launch, AMD pulled off a nice PR feat by setting making its trusty squad of overclockers, Sami Mäkinen, Brian Mclachlan, Pete Hardman, and Aaron Schradin set a new clock speed world record (as in Guinness World Record). With just one of its four modules enabled, the eight-core FX-8150 engineering sample was overclocked to a stunning 8429.38 MHz. The chip was able to tolerate a brutal core voltage of 2.016V. Even for a one-in-a-million cherry-picked chip, those are staggering numbers.

8429.38 MHz was achieved using a base clock of 271.92 MHz, with 31.0X multiplier. The memory used was a Corsair Dominator GT single module, which apparently tolerated 3:10 DRAM ratio and timings of 2-16-2-22. That's right, 2-16-2-22. ASUS Crosshair V Formula seated the platform. Cooling was care of a custom liquid-nitrogen evaporator setup. The team used liquid nitrogen as its cooling medium, and switched to liquid helium halfway, which has a lower boiling point. The team cherry-picked chips from the best lots on-site.A video of the feat follows.

Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced that it will demonstrate the dual-face down (DFD) implementation of its new multi-die face-down (xFD) packaging technology at the Intel Developer's Forum (IDF) in San Francisco September 13-15, 2011.

As a result of rapid growth in multi-core processing and computing virtualization, today's data center servers require increased DRAM capacity and performance. New applications for notebook computers, tablets and smart phones also demand additional device performance balanced with battery life and reduced form-factor. A market-ready packaging platform, the Invensas xFD technology is cost-effective and improves capacity and performance for DRAM devices and memory modules.

AMD's release of APU processor is a huge revolution. The new Llano architectures are a shot in the arm for integrated graphics, delivering the most powerful discrete-level graphics performance in mainstream market. Following the great launch of ASRock A75 mobo platform, ASRock is delighted to introduce its fantastic APU Motherboard Series based on the AMD A55 chipset. Supporting AMD Fusion A-Series APU, Socket FM1, DirectX 11 technology and a wide range of ASRock signature functions, ASRock brand new A55 APU Motherboard Series will surely bring the perfect components and combos to build up the ultimate rig.

Commenting on the new release, James Lee, V.P of ASRock Sales and Marketing, is with confidence. "ASRock A55 APU Motherboard Series has more to offer than just the combined powers of integrated graphics processor, as ASRock motherboards are best known for its perfect balance between price and performance. If users are looking for a value mobo supporting AMD's full-power 32nm Llano processor, then ASRock A55 platform is unambiguously the best choice!" He stated.

Crucial, a leading global brand of memory and storage upgrades, today introduced Crucial 8GB DDR3-1333 MHz UDIMM (desktop) and SODIMM (laptop) memory modules to fully support the latest 2nd generation Intel Core i7 and i5 processors. Users demand more from their computers than ever before, simultaneously running and switching between multiple, complex applications such as photo editing, high-definition video editing, and gaming software. With that in mind, Crucial high-capacity 8GB desktop and laptop memory modules enable users to meet these computing challenges head on, enhancing the user experience by providing a more responsive system.

The new modules also allow for high-capacity memory in smaller form factors such as laptops, All-in-One PCs, and home theater PCs. Traditionally, most laptops have been limited to one or two DIMM slots for system memory needs. As form factors continue to shrink, providing even less space on the motherboard to populate memory, an 8GB Crucial laptop module is ideal for newer, more portable form factors that only have one DIMM slot available. Additionally, these new 8GB DDR3-1333MHz SODIMM modules are 1.35V, compared to their standard 1.5V counterparts. For laptops that support the lower voltage, the modules help reduce power consumption and operating temperature while increasing battery life.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced worldwide retail availability of 4GB DDR3 memory for Apple Mac desktop and laptop PCs.

Corsair's Mac memory kits are tested at Apple Developer Compatibility Labs and are guaranteed to work with any Mac desktop or notebook PC that supports 4GB DDR3 SODIMMs, including iMac, Mac mini, Mac Pro, MacBook, and MacBook Pro models. This includes virtually all models offered by Apple since 2010.

Japanese company Green House launched two lines of SSDs for use in compact devices and embedded applications. These include the GH-SSD*S-H in the "half-slim" SATA form factor (where * stands for number of GB in capacity), and GH-SSD*S-M in mSATA form factor. The half-slim form factor is basically a half length SSD PCB with its case stripped out, which makes it a lot more compact. The two are further available in two variants based on NAND flash type used, SLC and MLC. The SLC variants come in capacities starting from 1 GB to 16 GB, including 2, 4, and 8 GB models along the way; while the MLC variant includes capacities starting from 4 GB to 128 GB, with 8, 16, 32, and 64 GB models along the way.

Transfer rates are different between each specific model. The the SLC variant, it's 29 MB/s (read) / 17 MB/s (write) for the 1 GB, 55 MB/s (read) / 34 MB/s (write) for 2 GB, 100 MB/s (read) / 65 MB/s (write) for 4 GB, and 120 MB/s (read) / 100 MB/s for the 8 and 16 GB models. Moving on to MLC, it's 34 MB/s (read) / 12 MB/s (write) for the 4 GB, 66 MB/s (read) / 24 MB/s (write) for 8 GB, 120 MB/s (read) / 45 MB/s (write) for 16 GB, 135 MB/s (read) / 90 MB/s (write) for 32 GB, 200 MB/s (read) / 170 MB/s (write) for 64 GB, and 200 MB/s (read) / 200 MB/s (write) for the 128 GB model. All drives make use of a Phison-made controller, with 64 MB DRAM cache. The drives are rated to have 1,000,000 hours of MTBF, and pack standard features such as TRIM command support and NCQ. They are backed by 1 year warranty.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, today announced the USB 3.0 Express ST2, a new dual channel USB 3.0 flash that hits price points comparable to USB 2.0. As USB 3.0 begins to proliferate through the market, customers are anxious to utilize the new capabilities of these machines and get a taste of what USB 3.0 has to offer. Many are simply looking to hit speed here to fore impossible on the USB 2.0 bus, without breaking the bank. For those customers, the ST2 is perfect. Fully backward compatible to USB 2.0, the ST2 is future proof, offering excellent performance on bus the USB 2.0 or 3.0 bus.

Offering similar performance as our USB 3.0 Express DUO (67MB/s read, 24MB/s write), the ST2 now gives our customers a choice in case design. Based on our popular design recently debuted with the Express RC8, the ST2 is enclosed in a sleek aluminum housing and accented by a translucent blue plastic trim. The design characteristics offer both feature parity and a strong family resemblance. Just like the RC8, the translucent plastic features on the ST2 serve as both a means to retain the cap and it acts as a light pipe for the enclosed blue LED; even straight through the cap. Available in 8GB, 16GB and 32GB capacities, the new USB 3.0 Express ST2 is NOW IN STOCK and ready for immediate shipment. MSRP for the 8GB ST2 is $20 USD.

Mach Xtreme Technology Inc., a worldwide leader in top performance, high reliability and user-friendly designed PC components, today unveiled Urban Series Dual-Channel DDR3 high-density memory kits based on the latest DRAM chips.

Urban high-density DDR3 modules offer desktop users groundbreaking computing experience at an attractive price point. Featuring enhanced capacity of 4GB per module, these new high-density 8GB kits provide customers with cutting-edge memory solution that significantly increases memory space. Users working with the latest operating system can keep multiple applications open or run smoothly memory intensive graphic programs. The uniquely designed lightweight heatsink is made of specially imported top grade Japanese aluminum.

Elpida Memory, Inc., Japan's leading global supplier of Dynamic Random Access Memory (DRAM[1]), today announced that as of the end of July it had started sample shipments of the smallest chip now available in the DRAM semiconductor memory industry. The new chip uses ultra fine-width process migration technology to achieve a circuit line width of 25 nanometers (nm). Elpida completed development of this advanced manufacturing process in May and has begun to apply the process to commercial production.

The new 25nm process-generation product now being shipped is a DDR3 SDRAM with a memory capacity of 2-gigabits (see product specifications below). A 25nm 4-gigabit DDR3 SDRAM is expected to become commercially available by the end of 2011.

OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today unveiled the Indilinx Everest SATA 3.0 SSD platform. The Everest platform features support of 6Gbps interface speeds, high transactional performance that is optimized for compressed files, and maximum capacities up to 1TB.

"The new Indilinx Everest platform is a complete customizable solution that delivers superior storage performance, features, and capabilities designed to exceed the needs of the most demanding SSD applications," said Bumsoo Kim, President of Indilinx. "Combining a 6Gbps SATA Revision 3.0 host interface, a dual-core CPU, and support for the latest, most advanced NAND Flash memory technology available, Everest offers SSD manufacturers unparallel flexibility in optimizing their designs for both performance and cost."

GeIL (Golden Emperor Industries Ltd.) rolled out two new lines of DDR3 desktop memory targering the gamer-enthusiast segment, the Enhance Corsa and Evo Corsa. Interestingly, these lines don't include triple-channel kits, but quad-channel ones consisting of four modules, aside from the usual dual-channel kits. Gearing up for the Sandy Bridge-E market early, I see. Among the two lines, the Enhance Corsa consists of bang-for-buck kits with DDR3-1333 MHz and DDR3-1600 MHz.

The USP here is that the 1333 MHz kits will pack an Intel XMP profile that runs the modules at 1500 MHz with CL9 timings, and DRAM voltage of 1.5V; while the DDR3-1600 MHz ones will pack a XMP profile that runs them at 1700 MHz with CL9 timings and 1.5V. Evo Corsa comes in dual and quad-channel kits, consisting of 2 GB or 4 GB modules, making up 4 GB or 8 GB dual-channel; and 8 GB or 16 GB quad-channel kits on offer.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of the NH13 portable hard drive. Geared towards business and professional users, the NH13 sports a USB 3.0 interface and a classic metallic finish.

For users of netbooks and USB compatible mobile devices, the NH13's stylish color options: glossy black and lustrous silver, make it an ideal digital accessory that adds class to any ensemble. The sleekly designed aluminum case provides scratch resistance and a sophisticated touch to data mobility.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, announced its latest product offering aimed at satisfying the needs of extreme gamers. In an industry first, the company has launched the single 8GB XPG Gaming Series DDR3L 1333G Desktop overclocking memory. With a high density of 8GB and low voltage of only 1.35V, it is anticipated to provide excellent system performance and overclocking capabilities to meet the requirements of power users and overclockers.

ADATA DRAM product planning department project manager Alex Wu explained, "With the popularity of 64-bit operating systems, high-density memory is a prerequisite in many gamers' minds. We are the first to launch DDR3L 1333G high-density 8GB memory modules, achieved in the XPG Gaming Series". He further stated: "This product adopts a 1.35 volt design, to offer gamers excellent stability and efficiency and also reduce waste heat and power consumption costs". The XPG Gaming Series DDR3L 1333G desktop overclocking memory features high density and low voltage, helping gamers achieve the ultimate in system effectiveness. At the same time, the reduced power consumption leads to lower carbon emissions, resulting in greater environmental sustainability.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, today announced their next generation SSD, the TeraDrive PT3.
Featuring the SandForce 2200 processor, SATA 6 Gb/s interface, and Double Data Rate, ONFiTM flash, the new TeraDrive PT3 offers a significant leap in performance over drives offered just a few months ago. The union of these 3 new technologies has forever changed the storage landscape. Right out of the gate, this new generation SSD stretches well within the new found bandwidth promised by the SATA 3.0 bus and breaks the 500MB/s barrier in both Read and Write scores. The comparisons between SSDs and HDDs just became a little harder to justify.

The only SSD processor to compress data before writing, SandForce's unique set of technologies enables the new TeraDrive PT3 to offer enhanced performance, flash durability and data integrity. Add to that the introduction of ONFi, double data rate flash, and the SATA 6 Gb/s interface, and we have one of the largest incremental leaps in performance that the storage market has ever seen.

ASUS today announced the launch of their new AMD A75 chipset-based F1A75 Series motherboards. Designed specially to optimize performance for the AMD Llano APUs, the F1A75 Series motherboards have exceptional overclocking capability for the versatile APU with a variety of integrated graphics built directly on the same die. This new series is also equipped with the latest ASUS-exclusive technologies and features, including the Dual Intelligent Processors 2 (DIP2) with DIGI+ VRM for precise power control, a graphical and mouse-controlled UEFI BIOS and the easy-to-use auto tuning for better performance.