Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

MSI introduced the PRO B650-A WIFI, a feature-rich entry-mainstream Socket AM5 motherboard under its PRO series. Built in the standard ATX form-factor, the board features a 6-layer PCB, and includes heatsinks for all its M.2 slots, The board draws power from a 24-pin ATX and two 8-pin EPS power connectors and uses a 14+2+1 phase VRM solution that's capable of even the top 170 W TDP Ryzen 9 chips. The CPU socket is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two M.2 NVMe Gen 4 slots. The board's third M.2 Gen 4 slot is wired to the B650 FCH.

The MSI PRO B650-A WIFI offers a fairly premium onboard audio solution driven by a Realtek ALC4080 CODEC. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 type-C port, three 10 Gbps USB 3.2 Gen 2 type-A, four 5 Gbps USB 3.2 Gen 1, and a few USB 3.2 and USB 2.0 ports by internal headers. Display outputs include HDMI and DisplayPort. Networking connectivity includes a 2.5 GbE interface driven by a Realtek 8125B controller, and an AMD/Mediatek sourced WLAN module with Wi-Fi 6E and Bluetooth 5.3. Besides the three M.2 Gen 4 slots, you get four SATA 6 Gbps ports. The board supports USB BIOS Flashback. The company didn't reveal pricing.

Western Digital stealthily introduced a spacious 8 TB variant of its performance WD Black SN850X M.2 NVMe Gen 4 SSD. The drive debuted in 2022 and had topped off at 4 TB. The new 8 TB variant is priced at $849 for the bare drive (without heatsink, model number WDS800T2X0E), and $899 with the PS5-friendly heatsink (model: WDS800T2XHE). The drive combines an in-house controller by Western Digital, with KIOXIA-sourced 3D TLC NAND flash. We're not sure if it's using the same 112-layer BiCS5 that the 4 TB variant does.

Western Digital claims performance figures of up to 7200 MB/s sequential reads, up to 6600 MB/s sequential writes, and up to 1.2 million IOPS 4K random reads/writes. The read speed is a touch lesser than the 7300 MB/s max sequential reads of the 4 TB variant. The write endurance of the 8 TB variant is rated at an impressive 4,800 TBW. Built in the M.2-2280 form-factor the drive takes advantage of the PCI-Express 4.0 x4 interface. Western Digital is backing these drives with 5-year warranties.

ATP Electronics, the global leader in specialized storage and memory solutions, proudly unveils the N651Si Series E1.S solid state drives (SSDs), which offer best in class performance, endurance, and data retention capabilities for the most demanding applications.

Supporting industrial temperature operating range (-40°C to 85°C) along with hardware power loss protection (HW PLP), the new SSDs offer the highest levels of reliability and total cost of ownership value in harsh environments, making them especially beneficial for mission-critical applications running under extreme temperatures, such as automotive, data logger, data centers, and defense/aerospace. Engineered for 1U Edge servers, the EDSFF offering with 9.5 mm symmetrical enclosure is available with up to 8 TB capacity and is constructed with 512 Gb prime NAND die 176-layer 3D triple level cell (TLC).

Lenovo announced the ThinkCenter Neo Ultra, a compact high-performance desktop meant for power users and creative professionals. This desktop is larger than what would qualify as a mini-PC, with its 3.6 L volume, but is significantly smaller than a tower. Despite its compact size, it comes with a full-featured I/O. The desktop is powered by Intel's 14th Gen Core vPro "Raptor Lake Refresh" platform, and uses a custom form-factor desktop motherboard based on Intel Q670 chipset that supports various commercial desktop features under vPro. The processor and memory are socketed and hence user upgradeable.

Processor options range from the Core i5-14500 (6P+8E), going all the way up to the Core i9-14900 (8P+16E), including vPro and regular SKUs; and energy-efficient "T" SKUs. Memory options range from 16 GB (1x 16 GB) up to 64 GB (2x 32 GB) DDR5-4800. The sole graphics option is an NVIDIA GeForce RTX 4060 desktop GPU, all four of its display connectors are directly wired out on the rear I/O. There are two M.2-2280 Gen 4 slots, storage options range from 1x 256 GB Gen 4, to 2x 1 TB Gen 4. Networking connectivity include 2.5 GbE and Wi-Fi 6E. USB ports include a 20 Gbps USB 3.2 Gen2x2 type-C on the front-panel, two 10 Gbps USB 3.2 Gen 2, and four additional USB 3.2 type-A ports at the back. The case measures 195 mm x 191 mm x 108 mm, and depending on the configuration, can weigh around 3.5 kg.

At Computex this year, Biwin also showcases a range of PCIe M.2 2280 SSDs, spanning from PCIe Gen 5 and Gen 4 to PCIe Gen 3. The reason behind this diverse lineup seems to be Biwin's intention to cater to users who may not have newer systems but still wish to benefit from PCIe M.2 storage advantages at lower costs. For PCIe Gen 5, Biwin has the X570 M.2 SSDs (512 GB, 1 TB, 2 TB, 4 TB) that are capable of reaching speeds of up to 14500 MB/s sequential read, 14000 MB/s sequential write.

For users with PCIe Gen 4 platforms, Biwin shows the NV7400 M.2 (and NV7400 Heatsink) SSDs that reach speeds up to 7450 MB/s read, and 7200 MB/s write, and NV7200 (7200 MB/s read, 6200 MB/s write). Both come with 512 MB, 1 TB, 2 TB, and 4 TB capacities. Now for even older platforms, Biwin has the NV3500 PCIe 3.0 SSD, capable of 3500 MB/s read, and 3000 MB/s write speeds (max), and is available with 512 GB, 1 TB, and 2 TB capacities.

You may have heard about Apex's new storage solution called the X21, we wrote about it a while ago. If not, let us remind you that is a huge single expansion card that can hold up to 21 M.2 solid-state drives (SSDs), which is incredible. Apex has also made x16 versions of this card, and it is currently in the late testing stage. The back side of the Apex X16 has 8 M.2 slots, giving it a total of 16 M.2 slots. Although these two cards are impressive with their unmatched speed and capacity, Apex is not stopping there.

Today, we are showing some early pictures and benchmark numbers of the Sabrent Apex X16 Rocket 5 Destroyer. As you can see, this new 5th generation (Gen 5) card from Apex holds 16 of Sabrent's Rocket 5 4 TB SSDs. This gives it a maximum capacity of 64 TB using the fastest Gen 5 SSDs on the market. The expansion card uses a single PCIe Gen 5 x16 slot, which leaves plenty of space for other cards or even another X16 card. Multiple X16 cards can be combined, or it can be paired with other Apex series cards like the Sabrent Apex X21 Destroyer, for a total of 168 TB of incredible 4th generation (Gen 4) speeds. The Sabrent Apex X16 Rocket 5 AIC can reach amazing speeds of 56 GiB/s Seq Reads and 54 GiB/s Seq Writes. For 4K Random IOPS, it can reach 20 million 4K Reads and 19 million Write IOPS. The Sabrent Apex X16 Rocket 5 will be available to order soon.

German PC OEM Schenker, along with its two brands—XMG targeted at high-performance mobile workstations and gaming notebooks; and Tuxedo, targeting Linux-friendly notebooks; made a splash at the 2024 Computex. We visited their pullout booth. The EVO 14 is a 14-inch class performance notebook powered by choices of Intel Core Ultra 7 155H "Meteor Lake" or AMD Ryzen 7 8845HS "Hawk Point" mobile processors; an innovative new dual-fan cooling solution, with 65 W sustained power delivery, and an 80 Wh battery pack. The 14-inch display features a 16:10 aspect ratio, 400 nits brightness, and 3K resolution. Memory options go all the way up to 96 GB, and I/O includes either USB4 or Thunderbolt 4, depending on the hardware platform. The EVO 15 is almost identical in terms of specs, but with a larger 99.8 Wh battery, and a 15.3-inch 500 nits display, and a full-sized edge-to-edge keyboard.Update 07:03 UTC: We have some pricing and availability details from Schenker.

Exascend, a service-oriented provider of innovative storage and memory solutions, today unveiled its AS500 series NVMe Ball Grid Array solid state drive (BGA SSD). Engineered to address the demanding data storage requirements of next-generation connected and autonomous vehicles, the AS500 combines exceptional endurance with virtualization capabilities in an ultra-compact BGA form factor.

"The immense data demands of autonomous driving, infotainment systems, digital cockpits and advanced driver assistance systems (ADAS) require ruggedized storage solutions capable of withstanding extreme automotive conditions," said Frank Chen, CEO of Exascend. "The AS500 BGA SSD delivers sustained performance and virtualization support, offering automakers a compact, robust and power-efficient storage solution for in-vehicle deployments. We're particularly proud that the innovative AS500 series recently took home a Best in Show honor at Embedded World 2024."

Building on the foundation of its award-winning Super X-Fi Headphone Holography, Creative Technology will be unveiling the all-new Super X-Fi Gen 4 audio profile. This latest release boasts significant enhancements in dynamic range, clarity, and spatial awareness. The Super X-Fi Gen 4 isn't just raising the bar; it's redefining the standard for immersive audio experiences. With this latest update, users can enjoy an expanded dynamic range, delivering richer, more detailed audio reproduction. Coupled with improved clarity, users can indulge in crystal-clear sound that captures every subtle nuance, while the refined sense of space offers a more expansive and lifelike soundstage.

Super X-Fi technology elevates the audio experience for users by recreating the immersive soundstage of high-end surround speaker systems within headphones, further personalized by the power of Artificial Intelligence (AI) for a remarkably natural listening experience. Since its debut at CES 2019, users and critics have been impressed by the realism of personalized audio, which is tailored according to their anthropometric profiles. From immersing in the heart-pounding action of a blockbuster movie to feeling the raw energy of a live concert or delving into the captivating world of gaming, Super X-Fi can bring it all to life with breath-taking detail and precision.

Renowned global memory brand Team Group Inc. is committed to providing consumers with diverse and optimal storage solutions. Today, it proudly unveils the Team Group MP44Q M.2 PCIe 4.0 Solid State Drive, featuring the latest 3D QLC NAND technology, combining cutting-edge technology with the trend of demanding high storage capacity to meet daily system and file storage needs.

Team Group MP44Q M.2 PCIe 4.0 SSD utilizes the latest 3D QLC NAND, offering capacities of up to 4 TB. With the PCIe Gen 4 x4 interface and SLC Caching technology, it achieves maximum sequential read and write speeds of up to 7,400 MB/s and 6,500 MB/s, respectively. The MP44Q SSD operates with low power consumption, catering to all document processing and storage applications, significantly enhancing work efficiency. Paired with Team Group's exclusively patented graphene heat dissipation sticker, whose thickness is less than 1 mm, eliminating the potential for mechanical interference in any assembly, coupled with the native heat sink of the motherboard, such an arrangement effectively addresses the heat generated by high performance, extending the SSD's lifespan.

KLEVV today announced the CRAS C925 line of mid-range M.2 NVMe SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, to provide sequential transfer speeds of up to 7400 MB/s reads, and up to 6500 MB/s sequential writes, depending on the model. There are three of these based on capacity—500 GB, 1 TB, and 2 TB. All three offer up to 7400 MB/s sequential reads, while the maximum write speeds are up to 6200 MB/s for the 500 GB model, up to 6300 MB/s for the 1 TB model, and up to 6500 MB/s for the 2 TB model. Both the 500 GB and 1 TB models offer up to 670,000 IOPS 4K random reads, and up to 980,000 IOPS random writes; while the 2 TB model does up to 700,000 IOPS random reads, with up to 1 million IOPS random writes.

The KLEVV CRAS C925 combines a MaxioTech MAP1602 DRAMless controller with an unspecified brand of 3D TLC NAND flash memory. The drive features a single-sided design, in that even the top 2 TB model has all its components on one side of the PCB. You can use the included aluminium heat-spreader that reduces temperatures by 12%, or the heatsink your motherboard includes. KLEVV rates the write endurance of these drives at 600 TBW for the 500 GB model, 1,200 TBW for the 1 TB model, and 2,400 TBW for the 2 TB model. The company is backing the drives with a 5-year warranty. The company didn't reveal pricing, but mentioned that the drives will be available from May 2024.

DFI, the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce two of the world's first Industrial MicroATX motherboards to support Intel Core 12th, 13th, and 14th (Alder Lake-S, Raptor Lake-S and Raptor Lake-S Refresh) Gen Processors. "With support for the latest Intel Core processors and features including dual GPU slots and dual 10GbE ports, RPS310 and ADS310 represent a significant leap forward in innovation for industrial and medical computing, empowering manufacturing and healthcare professionals to achieve new levels of efficiency," said Jarry Chang, General Manager of Products Center at DFI.

RPS310
Featuring dual PCIe x16 Gen 4 GPU slots, addresses key challenges for Factory Automation professionals working in Smart manufacturing field, enabling improved visualized data, complex imagery processing and quality monitoring in automated production lines. RPS310 is also perfect for medical professionals to analyze Medical imaging data with unprecedented image quality and efficiency, improving diagnosis accuracy on MRIs and CT Scanners and X-rays.

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

Cervoz brings its new storage solution to industrial applications with the launch of its new T425 Series M.2 NVMe SSDs-M.2 2230 (B+M) and M.2 2242 (B+M). Available in the compact 2230 and 2242 form factors, these PCIe Gen3x2 SSDs pack impressive performance into small footprints. Engineered for reliability and efficiency, the T425 Series provides industrial-grade solutions for embedded systems and space-constrained applications.

Space-Saving Form Factors for Seamless Integration
The tiny size of the T425 Series SSDs enables easy integration into small, fanless devices where internal space is limited. From in-vehicle systems and handheld scanners to medical equipment and industrial PCs, these SSDs allow seamless upgrades without compromising capacity or performance.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

MAINGEAR, a leading provider of high-performance custom PC systems, and Phison, a global leader in NAND controllers and storage solutions, today unveiled groundbreaking MAINGEAR PRO AI workstations with Phison's aiDAPTIV+ technology. Specifically engineered to democratize Large Language Model (LLM) development and training for small and medium-sized businesses (SMBs), these ultra-powerful workstations incorporate aiDAPTIV+ technology to deliver supercomputer LLM training capabilities at a fraction of the cost of traditional AI training servers.

As the demand for large-scale generative AI models continues to surge and their complexity increases, the potential for LLMs also expands. However, this rapid advancement in LLM AI technology has led to a notable boost in hardware requirements, making model training cost-prohibitive and inaccessible for many small to medium businesses.

Colorful unveiled the iGame B760M Ultra Z, a Socket LGA1700 motherboard in the Micro-ATX form-factor, with a distinctive white PCB, but that's hardly the story—this is Colorful's first motherboard with backside connectors, for more discretely cabled PC builds. The board doesn't use any marketing buzzwords such as "BTF" or "Project Zero," but has its onboard connectors aligned to support PC cases with motherboard tray cutouts for either of the two standards. The board draws power from a combination of 24-pin ATX and 4-pin ATX connectors (sufficient for Intel Performance Power Delivery profile). The processor is wired to a PCI-Express 5.0 x16 slot, and an M.2-2280 Gen 4 slot. Colorful used the region of the PCB next to the four DDR5 memory slots—where you'd normally have 24-pin and other connectors—to position an additional M.2 slot hidden behind a heatsink. There is yet another M.2 slot between the two PCIe slots.

The backside of the PCB has the board's power connectors, four SATA 6 Gbps ports, the USB- and HD audio headers, fan headers, and the front-panel headers. Networking connectivity include Wi-Fi 6E and 2.5 GbE. USB connectivity includes two 5 Gbps type-A USB 3.2 Gen 1 ports, a 10 Gbps type-C USB 3.2 Gen 2 port, and four USB 2.0 ports. There are two additional 5 Gbps ports via an internal header. HDMI and DisplayPort make up the display connectivity. The motherboard offers the USB BIOS Flashback feature. Available now in the Chinese market, the Colorful iGame B760M Ultra Z is priced at RMB ¥1,199 or (converts to USD $167).

ECS Industrial Computer Co., Ltd., also known as ECSIPC, proudly unveils its latest generation of mini PCs for quad-display industrial applications, the LIVA Z5 series, which includes the LIVA Z5 Plus, LIVA Z5E Plus, and LIVA Z5F Plus. Committed to providing industry-specific value solutions, ECSIPC focuses on developing niche products and solutions for vertical industry applications. ECSIPC has achieved success in various application areas, including educational electronic whiteboards in Europe and the US, airport real-time flight systems in India, image projection for Japan's Shinkansen bullet trains, and electronic menu and POS systems for KFC in South America, while also exploring applications in vending machines and digital signage.

The newly launched LIVA Z5 series is powered by Intel 13th and 14th generation Core processors, delivering significant performance improvements with up to 10 cores capable of efficiently handling various demanding tasks. The series has Wi-Fi 6E speeds up to 9.6 Gbps for enhanced data transmission efficiency, allowing seamless playback of high-quality audiovisual content. Additionally, the multi-storage design accommodates PCIe Gen 4 M.2 NVMe SSDs and a 2.5-inch SSD or HDD, offering greater storage flexibility. The series ensures high-speed data processing in industrial environments with two 2.5G Base-T (2.5G) ports. At the same time, support for vPro and physical TPM significantly enhances the value of industrial applications.

Sparkle introduced the PCIe Gen 4 Quad M.2 Riser Card. This single-slot, full-height card is meant to be installed on a PCI-Express 4.0 x16 slot, which it wires out as four M.2-22110 slots with Gen 4 x4 wiring, and mounting bolt set to M.2-2280 by default. With the drives in place, the card is meant to be covered up by a metal shroud; there's no contact between this shroud and the drives underneath. Cooling comes in the form of two lateral-blower fans that guide airflow under the shroud.

The first (intake) fan is 60 mm in size, while the second one (exhaust, near the tail-end), is 50 mm. Both are controlled by a localized fan-speed control, with three speed settings that can be selected by a 3-way switch on the rear I/O shield. Next to it, are four LEDs that denote power/activity of the individual drives. The card is 28 cm long, and 12 cm tall. What sets Sparkle's card apart from other brands is that the card relies entirely on the PCIe slot for powering itself—unlike some other cards that use a 6-pin connector. The company didn't reveal pricing.

Senao Networks, a leading network solution provider, proudly announces its launch of SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design. This cutting-edge NIC, harnessing the power of PCIe Gen 4 technology and fueled by the Intel Xeon D processor, sets an unprecedented standard in high-performance network computing. Senao will showcase a system demonstration at the Intel booth during the upcoming MWC in Barcelona. As transformative shift in networking edge, enterprises are increasingly leaning on scalable edge infrastructure. In order to cater the demands of workloads, low latency, local data processing, and robust security, SX904 marks a significant leap forward.

The combination of Intel XeonD processor, PCIe Gen 4 technology, dual 25 Gbps SFP28 support, and DDR4 ECC memory support enables the SX904 to achieve unparalleled data transfer rates and maximum bandwidth utilization, ideal for modern server architectures. It provides higher performance from the latest Intel Xeon D processor and Intel Ethernet Controller E810 and supports the latest Intel Platform Firmware Resilience, BMC, and TPM 2.0. SX904 enables the seamless offload of applications optimized for Intel architecture with zero changes, optimizing performance transmission effortlessly into an Intel-based server in PCIe add-in-card form factor.

Samsung is partnering with Square Enix to launch a limited collector's edition package of the 990 PRO 2 TB SSD co-branded with Final Fantasy VII Rebirth (FFVII Rebirth). The package consists of a special 180 mm x 180 mm x 175 mm (WxDxH) cuboidal box with branding and imagery from FFVII Rebirth characters. Inside, you'll find a Samsung 990 PRO 2 TB M.2 NVMe SSD with its reference heatsink. The heatsink makes the drive compatible with the PlayStation 5. There are no changes in the specs of the drive—it offers 2 TB of storage with a 2 GB LPDDR4 DRAM cache, and transfer speeds of up to 7450 MB/s sequential reads, and up to 6950 MB/s sequential writes, making it among the fastest Gen 4 SSDs in the market. But that's it with the bundle—you don't actually get the game, but a special edition box that can make for a good background prop if you're streaming. The limited collector's edition is expected to come out some time in March 2024.

GIGABYTE today introduced the Gen 4 4000E line of value M.2 NVMe SSDs that take advantage of the PCI-Express Gen 4 host interface, as it says on the tin. These drives form the company's new entry level M.2 NVMe SSD series. The drive comes in 250 GB, 500 GB, and 1 TB capacities, and are really targeted at the crowd that likes to pick up well-priced processor+motherboard+DRAM+SSD bundles in the DIY retail channel. The company didn't specify controller and NAND flash type, but we gather from the specs sheet that it uses a DRAMless controller.

The 1 TB variant (model: G440E1TB) offers sequential speeds of up to 4 GB/s reads, with up to 3.9 GB/s sequential writes. The 500 GB and 250 GB variants offer speeds that don't really need Gen 4 bandwidth. The 500 GB model (G440E500G) does up to 3.6 GB/s sequential reads, with up to 3 GB/s sequential writes. The 250 GB (G440E250G) model offers 3.5 GB/s reads, with up to 1.8 GB/s sequential writes. Endurance is rated at 320 TBW for the 1 TB model, 300 TBW for the 500 GB model, and 150 TBW for the 250 GB model. All three models are backed by 3-year warranties. The company didn't reveal pricing.

The current crop of PCIe Gen 5 based M.2 NVMe SSDs run scorching hot to deliver sequential transfer speeds of 10 GB/s, requiring some massive cooling solutions with tiny fans. All this might change, as Phison, a leading SSD controller manufacturer, unveiled three new controllers at the 2024 International CES. One of these that stands out, is the PS5031-E31T, which is built on the 7 nm node, and could power the first Gen 5 SSDs delivering 10 GB/s without elaborate cooling solutions. This is a big upgrade from the 12 nm node used by their first Gen 5 controllers. The PS5031-E31T is a DRAMless controller meant for mainstream Gen 5 SSDs. This controller has a 4-channel flash interface (16 CE), a PCI-Express 5.0 x4 host interface, supports capacities of up to 8 TB, and is claimed by Phison to offer sequential transfer rates of up to 10.8 GB/s, and up to 1500K IOPS random access; exceeding the fastest Gen 4 SSDs.

Phison also updated its high-end controller lineup with the new PS5026-E26 Max14um. This is a variant of the E26 that's designed for the upcoming Micron B58R NAND flash chip that offers 2400 MT/s per channel transfers. Over the 8-channel interface of the E26, this finally unlocks sequential transfer speeds exceeding 14 GB/s reads, and 12.7 GB/s sequential writes. This is merely a revision of the existing E26 with updated power-optimized firmware, the underlying silicon is identical. The E26 Max14um is the first controller to surpass 1000 MB/s in all three PCMark 10 storage tests. We have a sample of an SSD powered by the E26 Max14um in our labs, and will post our review soon.

The leading industrial memory and storage provider, Team Group has employed its advanced R&D capabilities and manufacturing processes to launch the industrial P745 SSD, which combines 112-layer 3D NAND flash memory, PCIe Gen 4x4 level speeds, and 8-channel controllers. Emphasizing high transfer speeds, power efficiency, and low latency, the P745 SSD delivers sequential read and write speeds of up to 7,000 MB/s and 6,200 MB/s, respectively, delivering excellent IOPS performance. To meet the demands of AI applications, temperature control was enhanced to maintain stable and high-speed performance. In the rapidly developing era of AI and high-performance computing, Team Group continues to provide the best industrial storage solutions.

The P745 SSD is available in both standard temperature (0 to 70°C) and wide temperature (-40 to 85°C) models. It integrates Team Group's cooling technology, the patented graphene and fin heat sinks, resulting in a significant temperature reduction of about 8-15% compared to common products without fin heat sinks. The P745 can be configured to meet the needs of different application environments, enabling the product to maintain stable operation at high temperatures and high performance. The P745 is also equipped with advanced firmware that protects data by automatically adjusting speeds when temperatures exceed the safe range. With a maximum capacity of 4 TB, the P745 is an NVMe 1.4 drive that uses the PCIe Gen 4x4 interface and is backward compatible with PCIe 3.0 platforms. It features a built-in DRAM cache buffer for high-speed AI computing that enhances system loading and data caching, reducing NAND flash wear and increasing product life span. In addition, the P745 is equipped with an LDPC error correction function and AES 256-bit high-level encryption technology to ensure the accuracy and security of data transmission.