NVIDIA today announced its first data center CPU, an Arm-based processor that will deliver 10x the performance of today's fastest servers on the most complex AI and high performance computing workloads.

The result of more than 10,000 engineering years of work, the NVIDIA Grace CPU is designed to address the computing requirements for the world's most advanced applications—including natural language processing, recommender systems and AI supercomputing—that analyze enormous datasets requiring both ultra-fast compute performance and massive memory. It combines energy-efficient Arm CPU cores with an innovative low-power memory subsystem to deliver high performance with great efficiency.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

Hewlett Packard Enterprise (HPE) today announced it is accelerating space exploration and increasing self-sufficiency for astronauts by enabling real-time data processing with advanced commercial edge computing in space for the first time. Astronauts and space explorers aboard the International Space Station (ISS) will speed time-to-insight from months to minutes on various experiments in space, from processing medical imaging and DNA sequencing to unlocking key insights from volumes of remote sensors and satellites, using HPE's Spaceborne Computer-2 (SBC-2), an edge computing system.

Spaceborne Computer-2 is scheduled to launch into orbit on the 15th Northrop Grumman Resupply Mission to Space Station (NG-15) on February 20 and will be available for use on the International Space Station for the next 2-3 years. The NG-15 spacecraft has been named "SS. Katherine Johnson" in honor of Katherine Johnson, a famed Black, female NASA mathematician who was critical to the early success of the space program.

AMD has won a contract to empower the LUMI supercomputer, designed for the EuroHPC Joint Undertaking (EuroHPC JU) in conjunction with 10 European countries. The contract will see AMD provide both the CPU and GPU innards of the LUMI, set to be populated with next-generation AMD Epyc CPUs and AMD Instinct GPUs. The supercomputer, which is set to enter operation come next year, will deliver an estimated 552 petaflop/s - higher than the world's current fastest supercomputer, Fugaku in Japan, which reaches peak performance of 513 petaflop/s - and is an Arm-powered affair.

The contract for LUMI's construction has been won by Hewlett Packard Enterprise (HPE), which will be providing an HPE Cray EX supercomputer powered by the aforementioned AMD hardware. LUMI has an investment cost set at 200 million euros, for both hardware, installation, and the foreseeable lifetime of its operation. This design win by AMD marks another big contract for the company, which was all but absent from the supercomputing space until launch, and subsequent iterations, of its Zen architecture and latest generations of Instinct HPC accelerators.

Los Alamos National Laboratory has completed the installation of a next-generation high performance computing platform, with aim to enhance its ongoing R&D efforts in support of the nation's response to COVID-19. Named Chicoma, the new platform is poised to demonstrate Hewlett Packard Enterprise's new HPE Cray EX supercomputer architecture for solving complex scientific problems.

"As extensive social and economic impacts from COVID-19 continue to grip the nation, Los Alamos scientists are actively engaged in a number of critical research efforts ranging from therapeutics design to epidemiological modeling," said Irene Qualters, Associate Laboratory Director for Simulation and Computing at Los Alamos. "High Performance Computing is playing a critical role by allowing scientists to model the complex phenomena involved in viral evolution and propagation."

Marvell (NASDAQ: MRVL) today introduced the industry's first native NVMe RAID 1 accelerator, a state-of-the-art technology for virtualized, multi-tenant cloud and enterprise data center environments which demand optimized reliability, efficiency, and performance. Hewlett Packard Enterprise (HPE) is the first of Marvell's partners to support the new accelerator in the HPE NS204i-p NVMe OS Boot Device offered on select HPE ProLiant servers and HPE Apollo systems.

As the industry transitions from legacy SAS and SATA to NVMe SSDs, Marvell's offering helps data centers fast-track the move to higher performance flash storage. The innovative accelerator lowers data center total cost of ownership (TCO) by offloading RAID 1 processing from costly and precious server CPU resources, maximizing application processing performance. IT organizations can now deploy a "plug-and-play," NVMe-based OS boot solution, like the HPE NS204i-p NVMe OS Boot Device, that protects the integrity of flash data storage while delivering an optimized, application-level user experience.

The Alliance for Computing at Extreme Scale (ACES), a partnership between Los Alamos National Laboratory and Sandia National Laboratories, announced the details of a $105 million contract awarded to Hewlett Packard Enterprise (HPE) to deliver Crossroads, a next-generation supercomputer to be sited at Los Alamos.

"This machine will advance our ability to study the most complex physical systems for science and national security. We look forward to its arrival and deployment," said Jason Pruet, Los Alamos' Program Director for the Advanced Simulating and Computing (ASC) Program.

Asetek today announced a collaboration with Hewlett Packard Enterprise (HPE) to deliver its premium data center liquid cooling solutions in HPE Apollo Systems, which are high-performing and density-optimized to target high-performance computing (HPC) and Artificial Intelligence (AI) needs. The integration enables deployment of high wattage processors in high density configurations to support compute-intense workloads.

When developing its next-generation HPC server solutions, HPE worked closely with Asetek to define a plug and play HPC system that is integrated, installed, and serviced by HPE that serves as the ideal complement to HPE's Gen10 Plus platform. With the resulting solution, HPE is able to maximize processor and interconnect performance by efficiently cooling high density computing clusters. HPE will be deploying these DLC systems, which support warm water cooling, this calendar year.

The National Energy Research Scientific Computing Center (NERSC), the mission high-performance computing facility for the U.S. Department of Energy's Office of Science, has moved another step closer to making Perlmutter - its next-generation GPU-accelerated supercomputer - available to the science community in 2020.

In mid-April, NERSC finalized its contract with Cray - which was acquired by Hewlett Packard Enterprise (HPE) in September 2019 - for the new system, a Cray Shasta supercomputer that will feature 24 cabinets and provide 3-4 times the capability of NERSC's current supercomputer, Cori. Perlmutter will be deployed at NERSC in two phases: the first set of 12 cabinets, featuring GPU-accelerated nodes, will arrive in late 2020; the second set, featuring CPU-only nodes, will arrive in mid-2021. A 35-petabyte all-flash Lustre-based file system using HPE's ClusterStor E1000 hardware will also be deployed in late 2020.

Global supercomputer leader Cray, a Hewlett Packard Enterprise company, and leading Japanese information and communication technology company Fujitsu, today announced a partnership to offer high performance technologies for the Exascale Era. Under the alliance agreement, Cray is developing the first-ever commercial supercomputer powered by the Fujitsu A64FX Arm -based processor with high-memory bandwidth (HBM) and supported on the proven Cray CS500 supercomputer architecture and programming environment. Initial customers include Los Alamos National Laboratory, Oak Ridge National Laboratory, RIKEN Center for Computational Science, Stony Brook University, and University of Bristol. As part of this new partnership, Cray and Fujitsu will explore engineering collaboration, co-development, and joint go-to-market to meet customer demand in the supercomputing space.

"Our partnership with Fujitsu means customers now have a broader choice of processor technology to address their pressing computational needs," said Fred Kohout, senior vice president and CMO at Cray, a Hewlett Packard Enterprise company. "We are delivering the development-to-deployment experience customers have come to expect from Cray, including exploratory development to the Cray Programming Environment (CPE) for Arm processors to optimize performance and scalability with additional support for Scalable Vector Extensions and high bandwidth memory."

NVIDIA today announced that the United States Postal Service - the world's largest postal service, with 485 million mail pieces processed and delivered daily - is adopting end-to-end AI technology from NVIDIA to improve its package data processing efficiency. The new system starts with high-performance servers powered by NVIDIA V100 Tensor Core GPUs and deep learning software to train multiple AI algorithms. The trained models are then deployed to NVIDIA EGX edge computing systems at close to 200 Postal Service facilities throughout the U.S. to enable more efficient package data processing. The NVIDIA-powered systems are being purchased by the Postal Service under contract with Hewlett Packard Enterprise.

"AI is transforming multiple industries, enabling processes, accuracy and efficiency not possible before," said Anthony Robbins, vice president of the Federal Sector Business at NVIDIA. "The U.S. Postal Service's adoption of AI demonstrates how this powerful technology can improve an excellent service that we rely on every day. Benjamin Franklin would be proud." The Postal Service operates the world's highest volume logistics operation, processing and delivering some 146 billion pieces of mail annually, including more than 6 billion packages. The new AI system will process package data 10x faster and with higher accuracy.

Today, Alibaba, Cisco, Dell EMC, Facebook, Google, Hewlett Packard Enterprise, Huawei, Intel Corporation and Microsoft announce the incorporation of the Compute Express Link (CXL) Consortium, and unveiled the names of its newly-elected members to its Board of Directors. The core group of key industry partners announced their intent to incorporate in March 2019, and remain dedicated to advancing the CXL standard, a new high-speed CPU-to-Device and CPU-to-Memory interconnect which accelerates next-generation data center performance.

The five new CXL board members are as follows: Steve Fields, Fellow and Chief Engineer of Power Systems, IBM; Gaurav Singh, Corporate Vice President, Xilinx; Dong Wei, Standards Architect and Fellow at ARM Holdings; Nathan Kalyanasundharam, Senior Fellow at AMD Semiconductor; and Larrie Carr, Fellow, Technical Strategy and Architecture, Data Center Solutions, Microchip Technology Inc.

AMD invited TechPowerUp to their launch event and editor's day coverage of Zen 2 EPYC processors based on the 7 nm process. The event was a day-long affair which included product demos and tours, and capped off with an official launch presentation which we are able to share with you live as the event goes on. Zen 2 with the Ryzen 3000-series processors ushered in a lot of excitement, and for good reason too as our own reviews show, but questions remained on how the platform would scale to the other end of the market. We already knew, for example, that AMD secured many contracts based on their first-generation EPYC processors, and no doubt the IPC increase and expected increased core count would cause similar, if not higher, interest here. We also expect to know shortly about the various SKUs and pricing involved, and also if AMD wants to shed more light on the future of the Threadripper processor family. Read below, and continue past the break, for our live coverage.21:00 UTC: Lisa Su is on the stage at the Palace of Fine Arts events venue in San Francisco to present AMD's latest developments on EPYC for datacenters, using the Zen 2 microarchitecture.21:10 UTC: AMD focuses not just on delivering a single chip, but it's goal is to deliver a complete solution for the enterprise.

NVIDIA today announced a GPU-acceleration platform for data science and machine learning, with broad adoption from industry leaders, that enables even the largest companies to analyze massive amounts of data and make accurate business predictions at unprecedented speed.

RAPIDS open-source software gives data scientists a giant performance boost as they address highly complex business challenges, such as predicting credit card fraud, forecasting retail inventory and understanding customer buying behavior. Reflecting the growing consensus about the GPU's importance in data analytics, an array of companies is supporting RAPIDS - from pioneers in the open-source community, such as Databricks and Anaconda, to tech leaders like Hewlett Packard Enterprise, IBM and Oracle.

Intel is hit by crippling inventory shortages for many of its fast-selling 8th generation Core desktop processor SKUs. A number of factors are contributing to these shortages, as we discussed in this article. A key short-term consequence of shortages in Intel's inventories is more uninitiated buyers discovering AMD processors, now that they've achieved the highest levels of competitiveness against Intel in over a decade. Stock market analyst firm Jefferies has raised AMD's outlook for Q4-2018, and projects that its $30 stock price could hit $36, by raising its target price.

OEMs are not happy with Intel. Haphazard roadmap and platform changes have forced them to revise their product designs way too frequently, and now they're faced with the prospect of a short-supply. A report from research firm Fubon predicts that by next year, 1 in every 3 personal computers sold by HP (Hewlett Packard) will run an AMD processor. "Fubon's report that Intel will undersupply the PC market between 4Q18 and 2Q19 leaves us with higher conviction that AMD will report improving revenue, pricing and margins near term, and that is positioned to take share in the high end PC MPU and server market long term," said stock market analyst Mark Lipacis. He predicts that AMD's CPU market-share climbing to 30% through next year (a very huge feat for AMD).

NVIDIA will host thousands of the world's leading AI experts at its ninth annual GPU Technology Conference (GTC) on March 26-29 at the San Jose McEnery Convention Center. NVIDIA founder and CEO Jensen Huang will deliver a keynote address on Tuesday, March 27, at 9 a.m. Pacific time to an expected 8,000 attendees representing the diverse, rapidly expanding AI and GPU computing community.

"GTC is where the world's leading researchers and business leaders learn how to harness the power of AI," said Greg Estes, vice president of Developer Programs at NVIDIA. "As GPU computing continues to drive the AI revolution, GTC is where you'll see the future take shape."

​AMD today announced that the new Hewlett Packard Enterprise ProLiant DL385 Gen10 server, powered by AMD EPYC processors set world records in both SPECrate2017_fp_base and SPECfp_rate2006. The secure and flexible 2P 2U HPE ProLiant DL385 Gen10 Server joins the HPE Cloudline CL3150 server in featuring AMD EPYC processors. With designs ranging from 8-core to 32-core, AMD EPYC delivers industry-leading memory bandwidth across the HPE line-up, with eight channels of memory and unprecedented support for integrated, high-speed I/O with 128 lanes of PCIe 3 on every EPYC processor.

"HPE is joining with AMD today to extend the world's most secure industry standard server portfolio to include the AMD EPYC processor. We now give customers another option to optimize performance and security for today's virtualized workloads," said Justin Hotard, vice president and GM, Volume Global Business Unit, HPE. "The HPE ProLiant DL385 featuring the AMD EPYC processor is the result of a long-standing technology engagement with AMD and a shared belief in continuing innovation."

AMD has been steadily increasing output and availability of their latest take on the server market with their EPYC CPUs. These are 32-core, 64-thread monsters that excel in delivering a better feature set in 1P configuration than even some of Intel's 2P setups, and reception for these AMD processors has been pretty warm as a result. The usage of an MCM design to create a 4-way cluster of small 8-core processor packages has allowed AMD to improve yields with minimum retooling and changes to its manufacturing lines, which in turn, has increased yields and profits for a company that sorely needed a a breakout product.

On the heels of the recent Gen-Z interconnect announcement, an aggregate of some of the most recognizable names in the tech industry have once again banded together. This time, it's an effort towards the implementation of a fast, coherent and widely compatible interconnect technology that will pave the way towards tighter integration of ever-more heterogeneous systems.

Technology leaders AMD, Dell EMC, Google, Hewlett Packard Enterprise, IBM, Mellanox Technologies, Micron, NVIDIA and Xilinx announced the new open standard to appropriate fanfare, considering the promises of an up-to 10x performance uplift in datacenter server environments, thus accelerating big-data, machine learning, analytics, and other emerging workloads. The interconnect promises to provide a high-speed pathway towards tighter integration between different types of technology currently making up the heterogeneous server computing's needs, ranging through fixed-purpose accelerators, current and future system memory subsistems, and coherent storage and network controllers.

AMD today announced AMD Multiuser GPU (MxGPU) for blade servers, AMD FirePro S7100X GPU. AMD MxGPU is the industry's first and only hardware-virtualized GPU compliant with the SR-IOV (Single Root I/O Virtualization) PCIe virtualization standard. The AMD FirePro S7100X GPU is a simple, secure solution for graphics virtualization providing workstation-class experience for up to 16 users that is practically indistinguishable from a native desktop experience.

Using AMD Multiuser GPU (MxGPU) technology, the AMD FirePro S7100X GPU harnesses silicon expressly designed for graphics virtualization and conforming with the virtualization industry standard, SR-IOV to allow easy integration into existing hypervisor ecosystems. The AMD FirePro S7100X GPU is the newest addition to the AMD line of graphics virtualization products, designed in an ultra-compact form factor with a TGP of just 100W that makes it ideal for blade server deployments. Hewlett Packard Enterprise (HPE) is the first to offer the AMD FirePro S7100X GPU in HPE ProLiant WS460c Gen9 Graphics Server Blades available now.

Worldwide PC shipments totaled 64.8 million units in the first quarter of 2016, a 9.6 percent decline from the first quarter of 2015, according to preliminary results by Gartner, Inc. This was the sixth consecutive quarter of PC shipment declines, and the first time since 2007 that shipment volume fell below 65 million units.

"The deterioration of local currencies against the U.S. dollar continued to play a major role in PC shipment declines. Our early results also show there was an inventory buildup from holiday sales in the fourth quarter of 2015," said Mikako Kitagawa, principal analyst at Gartner.

A California man filed suit against printer manufacturer HP and office-supply retailer Staples Inc. in federal court on Monday, alleging the two companies broke antitrust law in a price-fixing collaboration on ink cartridge sales. Ranjit Bedi of Pacific Palisades, California accused HP of approaching Staples Inc. in 2006 with at least $100 million in "market development funds" and incentives, in exchange for an agreement to stop selling third-party HP-compatible ink cartridges. According to the lawsuit, Staples then used HP's exclusivity to raise prices on the HP cartridges it offered. Staples is the largest retailer of aftermarket ink in the United States, with profits from HP-compatible ink sales exceeding $300 million in 2006. Of that total, $75 million came from the sale of third party ink.

Intel has announced the formation of the USB 3.0 promoters group, a consortium that aims to create a "super speed personal USB interconnect."

The first members of the promoter group (HP, Intel, Microsoft, NEC Corporation, NXP Semiconductors and Texas Instruments) said that USB 3.0 will deliver more than ten times the data transfer bandwidth of USB 2.0, which tops out at 480 Mb/s. The new interface will be designed to be used in consumer electronics and mobile applications and able to deal with digital media file sizes that are likely to exceed 25 GB.

Intel stated that USB 3.0 will be based on current USB technology and ports and cabling will be backwards compatible; however version 3.0 will offer enhancements for better protocol efficiency and lower power consumption. The development group will also integrate an upgrade path to optical capabilities for USB. A completed USB 3.0 specification is expected to be released in the first half of 2008.

According to market watcher NPD, Apple was the third largest laptop vendor during June, with only Toshiba and HP selling more machines. This puts Apple ahead of other major names such as Dell, Gateway and Lenovo, as buyers continue to choose Apple's updated MacBook and MacBook Pro notebooks over the more conventional brands. Figures show that Apple accounted for 17.6% of the laptop market, up from 14.3% in May, which also means that more than one in six laptops sold in the USA are made by Apple. However, these are only based on retailer sales, so the direct-to-buyer figures may tell a completely different story. This news comes soon after Apple managed to take the third-spot in overall computer sales, tied with Gateway on 5.6% (behind Dell and HP).

SAN FRANCISCO, July 13 (Reuters) - Two years into his role as leader of Hewlett-Packard Co. (HPQ.N: Quote, Profile, Research), Chief Executive Mark Hurd says the the world's biggest computer company has improved but has a very long way to go.
"I would give us a good grade on improvement. I think we are better incrementally. I think we are still poor absolutely," Hurd said in an on-stage interview at Fortune Magazine's annual technology conference in San Francisco.
Hurd joined Palo Alto, California-based Hewlett-Packard a little over two years ago from a smaller computer rival, NCR Corp. (NCR.N: Quote, Profile, Research), and has seen a sharp revival in the company's stock price built on solid market-share gains.
"We are doing better. We are not doing great," Hurd said. "On an absolute basis, we have a ton to do.