Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announced it has acquired a number of patents from Inapac Technology, Inc. to broaden its offerings for the mobile memory market. These patented innovations complement the high-bandwidth, low-power memory technologies developed by Rambus as part of its Mobile Memory Initiative, announced earlier this year. Specific terms of the deal are not disclosed.
These newly acquired patented innovations are key enablers for achieving high manufacturing yields in System-in-Package (SiP) implementations. SiP consists of a number of stacked integrated circuits (IC) - such as a media processor, DRAM, and Flash memory device - enclosed in a single package or module. This technology allows designers to achieve high functionality in a very compact space, ideal for mobile products such as mobile phones and mobile gaming devices. Given its performance characteristics, SiP has applicability in computing and consumer electronics products as well.