Gigabyte Announces GA-EG45M-UD2H Ultra Durable 3 Motherboard
GIGABYTE Technology Co., LTD, a leading manufacturer of motherboards and graphics cards today is proud to announce the new GIGABYTE GA-EG45M-UD2H powered by the Intel G45 Express chipset. Featuring the GIGABYTE Ultra Durable 3 Technology with 2 ounces of copper for both the Power and Ground layers, the GA-EG45M-UD2H is able to provide dramatically lower system temperatures and improved energy efficiency, and combined with a rich array of multi-media connectivity options, promises to deliver an exceptional high-definition video and audio experience for the latest high-definition digital multimedia systems.
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable 3 motherboards are able to deliver up to 50°C cooler working temperatures than traditional motherboards.
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable 3 motherboards are able to deliver up to 50°C cooler working temperatures than traditional motherboards.