Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, delivers an expanded portfolio of purpose-built infrastructure solutions to accelerate performance and increase efficiency in 5G and telecom workloads. With one of the industry's most diverse offerings, Supermicro enables customers to expand public and private 5G infrastructures with improved performance per watt and support for new and innovative AI applications. As a long-term advocate of open networking platforms and a member of the O-RAN Alliance, Supermicro's portfolio incorporates systems featuring 5th Gen Intel Xeon processors, AMD EPYC 8004 Series processors, and the NVIDIA Grace Hopper Superchip.

"Supermicro is expanding our broad portfolio of sustainable and state-of-the-art servers to address the demanding requirements of 5G and telco markets and Edge AI," said Charles Liang, president and CEO of Supermicro. "Our products are not just about technology, they are about delivering tangible customer benefits. We quickly bring data center AI capabilities to the network's edge using our Building Block architecture. Our products enable operators to offer new capabilities to their customers with improved performance and lower energy consumption. Our edge servers contain up to 2 TB of high-speed DDR5 memory, 6 PCIe slots, and a range of networking options. These systems are designed for increased power efficiency and performance-per-watt, enabling operators to create high-performance, customized solutions for their unique requirements. This reassures our customers that they are investing in reliable and efficient solutions."

To answer network operators' demands for energy-efficient scaling, Intel Corporation disclosed two major updates to drive footprint, power and total cost of ownership (TCO) savings across 5G core networks: the preview of its Intel Xeon next-gen processors, code-named Sierra Forest, with up to 288 Efficient-cores (E-cores), and the commercial availability of the Intel Infrastructure Power Manager (IPM) software for 5G core.

"Communication service providers require greater infrastructure efficiency as 5G core networks continue to build out. With the majority of 5G core networks deployed on Intel Xeon processors today, Intel is uniquely positioned to address these efficiency challenges. By introducing new Efficient-cores to our roadmap and with the commercial adoption of our Intel Infrastructure Power Manager software, service providers can slash TCO while achieving unmatched performance and power savings across their networks," said Alex Quach, Intel vice president and general manager of Wireline and Core Network Division. Energy consumption and reduction of the infrastructure footprint remain top challenges that network operators face in building out their wireless 5G core network.

The JEDEC Board of Directors presented its prestigious 2024 Distinguished Executive Leadership Award to Intel CEO, Pat Gelsinger, in a ceremony held at Intel's offices in Santa Clara, CA earlier this month. This award stands as JEDEC's highest honor and recognizes the most distinguished senior executives in the electronics industry who promote and support the advancement of JEDEC standards.

"Throughout Pat Gelsinger's distinguished career, he has consistently championed the development of open standards, as evidenced by Intel's contributions in this domain. Under his leadership, Intel has made a tremendous impact on many groundbreaking memory and IO technologies in JEDEC," said Mian Quddus, JEDEC Board of Directors Chairman. He added, "JEDEC is grateful for his invaluable support and that of the Intel team."

GIGABYTE, a global leader in high-performance computing solutions, collaborates with industry partner Xenon at SupercomputingAsia 2024, held at the Sydney International Convention and Exhibition Centre from February 19 to 22. This collaboration showcases cutting-edge technologies, offering diverse solutions that redefine the high-performance computing landscape.

GIGABYTE's Highlights at SCA 2024
At booth 19, GIGABYTE presents the G593-SD0, our flagship AI server, and the industry's first Nvidia-certified HGX H100 8-GPU Server. Equipped with 4th/5th Gen Intel Xeon Scalable Processors, it incorporates GIGABYTE's thermal design, ensuring optimal performance within its density-optimized 5U server chassis, pushing the boundaries of AI computing. Additionally, GIGABYTE introduces the 2U 4-node H263-S62 server, designed for 4th Gen Intel Xeon Scalable Processors and now upgraded to the latest 5th Gen, tailored for hybrid and private cloud applications. It features a DLC (Direct Liquid Cooling) solution to efficiently manage heat generated by high-performance computing. Also on display is the newly released W773-W80 workstation, supporting the latest NVIDIA RTX 6000 Ada and catering to CAD, DME, research, data and image analysis, and SMB private cloud applications. At SCA 2024, explore our offerings, including rackmount servers and motherboards, reflecting GIGABYTE's commitment to innovative and reliable solutions. This offers a valuable opportunity to discuss your IT infrastructure requirements with our sales and consulting teams, supported by GIGABYTE and Xenon in Australia.

Lenovo (HKSE: 992) (ADR: LNVGY) has today announced that the General Purpose Partition of the MareNostrum 5, a new pre-exascale supercomputer running on Lenovo's HPC infrastructure, has been classified as the top x86 general-purpose cluster on the recently published TOP500 list of the most powerful supercomputers globally.

Officially inaugurated at Barcelona Supercomputing Center on December 21st, MareNostrum 5 has been built for the European High Performance Computing Joint Undertaking (EuroHPC JU). The pre-exascale supercomputer will bolster the EU's mission to provide Europe with the most advanced supercomputing technology and accelerate the capacity for artificial intelligence (AI) research, enabling new scientific advances that will help solve global challenges. It aims to empower a wide range of complex HPC-specific applications, from climate research and engineering to material science and earth sciences, adeptly handling tasks that extend beyond the capabilities of cloud computing.

Intel Corporation today reported fourth-quarter and full-year 2023 financial results. "We delivered strong Q4 results, surpassing expectations for the fourth consecutive quarter with revenue at the higher end of our guidance," said Pat Gelsinger, Intel CEO. "The quarter capped a year of tremendous progress on Intel's transformation, where we consistently drove execution and accelerated innovation, resulting in strong customer momentum for our products. In 2024, we remain relentlessly focused on achieving process and product leadership, continuing to build our external foundry business and at-scale global manufacturing, and executing our mission to bring AI everywhere as we drive long-term value for stakeholders."

David Zinsner, Intel CFO, said, "We continued to drive operational efficiencies in the fourth quarter, and comfortably achieved our commitment to deliver $3 billion in cost savings in 2023. We expect to unlock further efficiencies in 2024 and beyond as we implement our new internal foundry model, which is designed to drive greater transparency and accountability and higher returns on our owners' capital." For the full year, the company generated $11.5 billion in cash from operations and paid dividends of $3.1 billion.

On March 21, you'll be able to explore the Forbidden West, battle awe-inspiring machines and encounter new tribes. Horizon Forbidden West is the beloved follow up to Guerrilla's critically acclaimed Horizon Zero Dawn, and this Complete Edition for PC also includes the Burning Shores expansion, which continues Aloy's journey and takes players to a treacherous volcanic archipelago after completing the main quest.

Today we are excited to announce that the PC version of Horizon Forbidden West Complete Edition is now available for pre-purchase with bonus content, including:

• Blacktide Outfit and Blacktide Bow (available only with pre-purchase)
• Nora Legacy Outfit and Nora Spear (available only when linking your Steam account to PlayStation Network)
• 2 Special Outfits (Carja Behemoth Elite and Nora Thunder Elite)
• 2 Special Weapons (Carja Behemoth Short Bow and Nora Thunder Sling)
• In-game Resources Pack including ammunition, potions, and travel packs
• In-game Apex Clawstrider Machine Strike Piece
• Exclusive Photo Mode pose and face paint

Simply NUC, Inc, a leading mini PC solutions company, announced they are taking orders for their brand-new Emerald 2 NUC. As the successor to Emerald, Emerald 2 features Intel's latest 13th Gen Raptor Lake processors and Iris Xe graphics to provide a powerful computing performance. From home office to remote deployments to digital signage, Emerald 2 is designed to be used across many different computing applications.

"We are delighted to launch Emerald 2 as the latest addition to our exceptional lineup of mini PCs," said Jonny Smith, CEO of Simply NUC. "Following the remarkable success of Emerald, we are confident that Emerald 2 will exceed customers' expectations by delivering outstanding computing performance, an immersive visual experience, and versatile connectivity options."

SPARKLE is announcing the low-profile series: SPARKLE Intel Arc A380 GENIE graphics and SPARKLE Intel Arc A310 ECO graphics. Both graphics cards come as low-profile configurations with 1x HDMI and 2x mini-DP video outputs, a free additional short bracket in the box, and are packed with Intel Arc technologies. Advanced technologies include AI-enhanced Intel Xe Super Sampling (XeSS) for higher image quality and performance, DirectX 12 Ultimate support including hardware-accelerated ray tracing, full AV1 hardware encode and decode for the latest multimedia support, and Intel Deep Link Technologies for exclusive platform advantages combining Intel Core processor and Intel Arc graphics.

These cards are ready to fit into any magic lamp and make gaming wishes come alive! Furthermore, SPARKLE has built an exclusive Intel Arc A310 by successfully reducing the TBP (total board power) of the Intel Arc A310 from Intel's default 75 W to 50 W, providing the best balance of features, technologies and experiences in a small but advanced form-factor.

With the zeitgeist of AI technology taking the world by storm, MSI, a world-leading premium laptop brand, has taken it in stride through its professionalism over luxurious aesthetics, extreme performance and innovative technology. Announcing the world's first gaming handheld powered by Intel Core Ultra Processor - the Claw. Equipped with ARC graphics featuring up to 8 Xe cores and advanced XeSS technology, the Claw ensures smooth gameplay across various AAA titles. Its robust HyperFlow cooling system and a large 53Wh battery, coupled with Thunderbolt 4 connectivity, make it an exceptional handheld gaming device for gamers.

"In our commitment to enhancing the gaming experience for our users, we aim to address market pain points and dedicate efforts to the handheld space," said Eric Kuo, the Executive Vice President& NB BU GM of MSI. "We have fine-tuned specific designs tailored exclusively for gamers, debuting our very first handheld, Claw, which redefines the standards in the handheld market."

Intel Corporation today announced the appointment of Justin Hotard as executive vice president and general manager of its Data Center and AI Group (DCAI), effective Feb. 1. He joins Intel with more than 20 years of experience driving transformation and growth in computing and data center businesses, and is a leader in delivering scalable AI systems for the enterprise.

Hotard will become a member of Intel's executive leadership team and report directly to CEO Pat Gelsinger. He will be responsible for Intel's suite of data center products spanning enterprise and cloud, including its Intel Xeon processor family, graphics processing units (GPUs) and accelerators. He will also play an integral role in driving the company's mission to bring AI everywhere.

Intel on Wednesday held a pre-launch round-table with HotHardware, in which it made several performance disclosures of its upcoming Core "Meteor Lake" mobile processor, comparing it with the current U-segment chips based on the 13th Gen Core "Raptor Lake," and competing AMD Ryzen 7040 "Phoenix." In these, the company is claiming that its next-generation iGPU based on the Xe-LPG graphics architecture, armed with 128 EU, is significantly outperforming the Radeon 780M RDNA3 iGPU of the Ryzen 7040, while its CPU is ahead in multi-threaded performance.

In its comparison, the company picked the Core Ultra 7 165H, a middle-of-the-market performance segment part in the 28 W class. This is compared to the Core i7-1370P "Raptor Lake," and the AMD Ryzen 7 7840U. The company also dropped in the fastest Windows-ready Arm chip in the market, the Qualcomm 8cx Gen 3. In the 33 games that the 165H was compared to the 7840U, the Intel iGPU is shown posting performance leads ranging between 3% to 70% over the Radeon 780M, in 23 out of 33 games. In one of the games, the two perform on par with each other. In 9 out of 33 games, the Radeon 780M beats the Intel Xe-LPG by 2% to 18%. The iGPU of the 165H packs 8 Xe cores, or 128 EU (1,024 unified shaders). The Radeon 780M is powered by 12 RDNA3 compute units (768 stream processors).

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, unveils an immersion cooling solution that delivering significant PUE (Power Usage Effectiveness) enhancement and showcases its latest server platforms powered by 4th Gen. Intel Xeon Scalable Processors targeting HPC, AI and Cloud Computing applications at SC23, Booth #1917.

Significant PUE Enhancement shown in an Immersion-cooling Tank vs. Conventional Air-cooling Operation Cabinet
The immersion cooling system live demonstrated at TYAN booth during SC23 is a 4U hybrid single phase tank enclosure equipped with 4 units of TYAN GC68A-B7136 cloud computing servers. Comparing to conventional Air-cooling operating cabinet, this hybrid immersion cooling system could offer huge improvement of PUE which makes it become an ideal mission-critical solution for the users aimed in energy-saving and green products.

Intel Innovation 2023 - September 13, 2023 - MiTAC Computing Technology, a professional IT solution provider and a subsidiary of MiTAC Holdings Corporation, will showcase its DSG (Datacenter Solutions Group) product lineup powered by 4th Gen Intel Xeon Scalable processors for enterprise, cloud and AI workloads at Intel Innovation 2023, booth #H216 in the San Jose McEnery Convention Center, USA, from September 19-20.

"MiTAC has seamlessly and successfully managed the Intel DSG business since July. The datacenter solution product lineup enhances MiTAC's product portfolio and service offerings. Our customers can now enjoy a comprehensive one-stop service, ranging from motherboards and barebones servers to Intel Data Center blocks and complete rack integration for their datacenter infrastructure needs," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.92 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 6.92 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 6.92 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 6.92 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The latest AIDA64 update introduces AVX-512 optimized benchmarks for Intel Sapphire Rapids processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by AMD, Intel and NVIDIA.,

DOWNLOAD: FinalWire AIDA64 Extreme v6.92

We're at a once-in-a-generation inflection point in computing. The traditional ways of designing and building computing infrastructure are no longer adequate for the exponentially growing demands of workloads like generative AI and LLMs. In fact, the number of parameters in LLMs has increased by 10x per year over the past five years. As a result, customers need AI-optimized infrastructure that is both cost effective and scalable.

For two decades, Google has built some of the industry's leading AI capabilities: from the creation of Google's Transformer architecture that makes gen AI possible, to our AI-optimized infrastructure, which is built to deliver the global scale and performance required by Google products that serve billions of users like YouTube, Gmail, Google Maps, Google Play, and Android. We are excited to bring decades of innovation and research to Google Cloud customers as they pursue transformative opportunities in AI. We offer a complete solution for AI, from computing infrastructure optimized for AI to the end-to-end software and services that support the full lifecycle of model training, tuning, and serving at global scale.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is delivering a high-throughput, low latency E3.S storage solutions supporting the industry's first PCIe Gen 5 drives and CXL modules to meet the demands of large AI Training and HPC clusters, where massive amounts of unstructured data must be delivered to the GPUs and CPUs to achieve faster results.

Supermicro's Petascale systems are a new class of storage servers supporting the latest industry standard E3.S (7.5 mm) Gen 5 NVMe drives from leading storage vendors for up to 256 TB of high throughput, low latency storage in 1U or up to a half petabyte in 2U. Inside, Supermicro's innovative symmetrical architecture reduced latency by ensuring the shortest signal paths for data and maximized airflow over critical components, allowing them to run at optimal speeds. With these new systems, a standard rack can now hold over 20 Petabytes of capacity for high throughput NVMe-oF (NVMe over Fabrics) configurations, ensuring that GPUs remain saturated with data. Systems are available with either the 4th Gen Intel Xeon Scalable processors or 4th Gen AMD EPYC processors.

IBM has launched a new tool to help enterprises track greenhouse gas (GHG) emissions across cloud services and advance their sustainability performance throughout their hybrid, multicloud journeys. Now generally available, the IBM Cloud Carbon Calculator - an AI-informed dashboard - can help clients access emissions data across a variety of IBM Cloud workloads such as AI, high performance computing (HPC) and financial services.

Across industries, enterprises are embracing modernization by leveraging hybrid cloud and AI to digitally transform with resiliency, performance, security, and compliance at the forefront, all while remaining focused on delivering value and driving more sustainable business practices. According to a recent study by IBM, 42% of CEOs surveyed pinpoint environmental sustainability as their top challenge over the next three years. At the same time, the study reports that CEOs are facing pressure to adopt generative AI while also weighing the data management needs to make AI successful. The increase in data processing required for AI workloads can present new challenges for organizations that are looking to reduce their GHG emissions. With more than 43% of CEOs surveyed already using generative AI to inform strategic decisions, organizations should prepare to balance executing high performance workloads with sustainability.

Today, Intel announced a strategic collaboration agreement with Ericsson to utilize Intel's 18A process and manufacturing technology for Ericsson's future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to optimize 4th Gen Intel Xeon Scalable processors with Intel vRAN Boost for Ericsson's Cloud RAN (radio access network) solutions to help communications service providers increase network capacity and energy efficiency while gaining greater flexibility and scalability.

"As our work together evolves, this is a significant milestone with Ericsson to partner broadly on their next-generation optimized 5G infrastructure. This agreement exemplifies our shared vision to innovate and transform network connectivity, and it reinforces the growing customer confidence in our process and manufacturing technology," said Sachin Katti, senior vice president and general manager of the Network and Edge group at Intel. "We look forward to working together with Ericsson, an industry leader, to build networks that are open, reliable and ready for the future."

AIC has launched the new high-availability storage server HA401-TU, which is optimized for mission-critical, enterprise-level storage applications. This cluster-in-a-box solution with active-active failover design and eliminates single points of failure. HA401-TU is a 4U high-availability (HA) server with 2 controller nodes and supports 24 3.5" SAS 12 Gb/s drives. Each controller node is equipped with an AIC Tucana server board that is powered by dual 3rd Gen Intel Xeon Scalable processors and Intel C621A chipset, which supports UPI speed up to 11.2 GT/s. HA401-TU provides enterprise users with a number of crucial benefits. The redundant hardware components ensure that there is no single point of failure.

With the hot-swappable functionality, the controller canisters protect enterprises from the loss of revenue that can occur when access to mission-critical data or applications is disrupted. Both controller nodes process data input/output (I/O) operations and users can experience simultaneous and balanced access to logical devices. In the event of failover, the secondary node will automatically take over the devices, client connections and all the processes and services running in the system. This high-availability design significantly enhances the overall performance of clusters, enabling seamless handling of demanding workloads.

What's New: As part of a collaboration with Intel and Dell Technologies, the United Kingdom Atomic Energy Authority (UKAEA) and the Cambridge Open Zettascale Lab plan to build a "digital twin" of the Spherical Tokamak for Energy Production (STEP) prototype fusion power plant. The UKAEA will utilize the lab's supercomputer based on Intel technologies, including 4th Gen Intel Xeon Scalable processors, distributed asynchronous object storage (DAOS) and oneAPI tools to streamline the development and delivery of fusion energy to the grid in the 2040s.

"Planning for the commercialization of fusion power requires organizations like UKAEA to utilize extreme amounts of computational resources and artificial intelligence for simulations. These HPC workloads may be performed using a variety of different architectures, which is why open software solutions that optimize performance needs can lend portability to code that isn't available in closed, proprietary systems. Overall, advanced hardware and software can make the journey to commercial fusion power lower risk and accelerated - a key benefit on the path to sustainable energy."—Adam Roe, Intel EMEA HPC technical director

Intel Labs, in collaboration with Blockade Labs, has introduced Latent Diffusion Model for 3D (LDM3D), a novel diffusion model that uses generative AI to create realistic 3D visual content. LDM3D is the industry's first model to generate a depth map using the diffusion process to create 3D images with 360-degree views that are vivid and immersive. LDM3D has the potential to revolutionize content creation, metaverse applications and digital experiences, transforming a wide range of industries, from entertainment and gaming to architecture and design.

"Generative AI technology aims to further augment and enhance human creativity and save time. However, most of today's generative AI models are limited to generating 2D images and only very few can generate 3D images from text prompts. Unlike existing latent stable diffusion models, LDM3D allows users to generate an image and a depth map from a given text prompt using almost the same number of parameters. It provides more accurate relative depth for each pixel in an image compared to standard post-processing methods for depth estimation and saves developers significant time to develop scenes," said Vasudev Lal, AI/ML research scientist, Intel Labs.

ASUS today announced ESC N8-E11, its most advanced HGX H100 eight-GPU AI server, along with a comprehensive PCI Express (PCIe) GPU server portfolio—the ESC8000 and ESC4000 series empowered by Intel and AMD platforms to support higher CPU and GPU TDPs to accelerate the development of AI and data science.

ASUS is one of the few HPC solution providers with its own all-dimensional resources that consist of the ASUS server business unit, Taiwan Web Service (TWS) and ASUS Cloud—all part of the ASUS group. This uniquely positions ASUS to deliver in-house AI server design, data-center infrastructure, and AI software-development capabilities, plus a diverse ecosystem of industrial hardware and software partners.

ASUS today announced a showcase of the latest HPC solutions to empower innovation and push the boundaries of supercomputing, at ISC High Performance 2023 in Hamburg, Germany on May 21-25, 2023. The ASUS exhibition, at booth H813, will reveal the latest supercomputing advances, including liquid-cooling and AI solutions, as well as outlining a slew of sustainability breakthroughs - plus a whole lot more besides.

Comprehensive Liquid-Cooling Solutions
ASUS is working with Submer, the industry-leading liquid-cooling provider to demonstrate immersion-cooling solutions at ISC High Performance 2023, focused on ASUS RS720-E11-IM - the Intel -based 2U4N server that leverages our trusted legacy server architecture and popular features to create a compact new design. This fresh outlook improves the accessibility on I/O ports, storage and cable routing, and strengthens the structure to allow the server to be placed vertically in the tank, with durability assured.

Increasing its HPL score from 1.02 Eflop/s in November 2022 to an impressive 1.194 Eflop/s on this list, Frontier was able to improve upon its score after a stagnation between June 2022 and November 2022. Considering exascale was only a goal to aspire to just a few years ago, a roughly 17% increase here is an enormous success. Additionally, Frontier earned a score of 9.95 Eflop/s on the HLP-MxP benchmark, which measures performance for mixed-precision calculation. This is also an increase over the 7.94 EFlop/s that the system achieved on the previous list and nearly 10 times more powerful than the machine's HPL score. Frontier is based on the HPE Cray EX235a architecture and utilizes AMD EPYC 64C 2 GHz processors. It also has 8,699,904 cores and an incredible energy efficiency rating of 52.59 Gflops/watt. It also relies on gigabit ethernet for data transfer.