AAEON, an industry leading developer of edge computing platforms, is happy to announce that it has joined the Azure Certified Device program, ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Azure IoT. This certification assures that AAEON's new NVIDIA Jetson AGX Orin -powered BOXER-8641AI has been tested for functionality and interoperability, ensuring that it has used the Microsoft reference configuration to become one of the market's first Azure-certified NVIDIA Jetson Orin devices.

This announcement illustrates AAEON's continued innovation in the edge AI space, as the BOXER-8641AI has been validated to work with Azure and the latest versions of IoT Edge. Such a certification gives AAEON customers confidence that when choosing the BOXER-8641AI for their application, it is fully IoT Edge compatible.

Intel has announced the availability of its 12th Gen Intel Core SoC processors for IoT Edge. Representing a new lineup of purpose-built edge products optimized for Internet of Things (IoT) applications, this first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a compact footprint to enable smaller innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs and helps customers achieve product sustainability goals.

"As the digitization of business processes continues to accelerate—fueled by workforce demand, supply chain constraints and changing consumer behavior—the amount of data created at the edge and the need for it to be processed and analyzed locally continues to explode. Intel understands the challenges that businesses face—across a wide range of vertical industries—and is committed to help them continue to deliver innovative use cases," said Jeni Panhorst, Intel vice president and general manager of the Network and Edge Compute Division.

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

As global adoption of Edge AI continues to rise through smart transitions, ASRock Industrial is excited to release the new iEPF-9010S/iEP-9010E Series Robust Edge AIoT Platform, enabled by 12th Gen Intel Core Processors (Alder Lake S) with R680E/H610 chipsets to bring breakthrough performance at the Edge. Featuring excellent computing power with energized Edge AI acceleration, the iEPF-9010S/iEP-9010E Series provide high memory capacity, rich I/Os and expandability, wide RF connectivity- 4G LTE, 5G, Wi-Fi 6E, BT 5.2 with real-time TSN/TCC, plus ruggedness for industrial environments. The Series is an effective all-in-one consolidation for high-demanding workloads, tailor-made for mission-critical industrial applications such as factory automation, machine automation, robotic control, AI AOI, autonomous vehicles, smart cities, and much more.

TSMC on Monday announced the N12e silicon fabrication node. An enhancement of its 12 nm FinFET node, N12e is designed for value 5G application processors, MODEMs, and IoT edge devices, such as true-wireless earbuds, smartwatch processors, wearables, VR HMDs, entry-level and mainstream SoCs, etc. The node has been derived from the company's 12FFC+_ULL node, and fits into the 12-16 nm class of nodes. It's intended to succeed the company's 22ULL node (in terms of pricing), offering a 76% increase in logic density, 49% increase in clock speed at a given power, 55% improvement in power draw at a given speed, 50% reduction in SRAM leakage current, and low Vdd, with support for logic voltages as low as 0.4 V. That last bit in particular should make the node suitable for tiny, battery-powered devices such as wearables.

Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES (GF ), the world's leading specialty foundry, today announced a hardware demonstration of a new artificial intelligence chip. Based on imec's Analog in Memory Computing (AiMC) architecture utilizing GF's 22FDX solution, the new chip is optimized to perform deep neural network calculations on in-memory computing hardware in the analog domain. Achieving record-high energy efficiency up to 2,900 TOPS/W, the accelerator is a key enabler for inference-on-the-edge for low-power devices. The privacy, security and latency benefits of this new technology will have an impact on AI applications in a wide range of edge devices, from smart speakers to self-driving vehicles.