It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.

The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.

The processor-motherboard combination as PC enthusiasts know it could end, with Intel LGA1150 processors under the "Haswell" micro-architecture, likely to becoming the last client processors to ship in the retail channel (processor-in-box). Future Intel client processors, codenamed "Broadwell" could ship only in BGA (ball-grid array) packages, with existing motherboard vendors selling their products with processors permanently soldered onto them. The information comes from Japanese PC Watch, which cites sources in the PC industry.

With a compacted socket-processor launch cycle that spans nearly 2 years under the company's "tick-tock" product strategy, the scope for processor updates in the client computing industry might be lower than what it was in the LGA775 days. Perhaps statistics at Intel don't show a sizable proportion of people upgrading processors on existing motherboards, or upgrading motherboards while retaining the processor, rather buying a combination of the two, not to mention the fact that pre-built PCs outsell DIY assembled ones in major markets. With the processor being "tied" to the motherboard, Intel gets room to compact the platform further, combining processor and core logic completely into a single package. It's likely that Intel could still leave processor interchangeability to its HEDT (high-end desktop) platform, which sees processors start at $300, and motherboards at $200.

ECS has less than stable RSS and media channels (to our advantage). It may have accidentally blurted out model names of at least three upcoming Intel 8-series chipset based motherboards, for socket LGA1150 Core "Haswell" processors. Among the three are Z87H3-AX Extreme, Z87H3-AX Golden, and H87H3-M4. The two Z87H3-AX motherboards, going by the company's current 7-series chipset motherboard lineup, appear to be identical, with the Z87H3-AX Golden pimping out with gold-colored components and heatsinks. The boards will likely max out the feature-set of Intel's "Lynx Point" chipset family. The Z87 PCH succeeds the current Z77, in supporting overclocking, in addition to all features of the platform, including Small Business Advantage. The H87H3-M4 sounds like the name typically given by ECS to a micro-ATX motherboard based on the H87 chipset. H87 supports nearly every feature the Z87 does, except CPU overclocking.

Korean PC cooling components maker Thermolab introduced LP53, a new low-profile CPU cooler. Measuring 100 x 94 x 53 mm (WxDxH), and weighing 410 g (owing to its material), the cooler is made of a dense copper fin stack that is arranged along the plane of the motherboard, to which heat drawn from a copper CPU base is conveyed by two 8 mm-thick copper heat pipes. The heatsink is ventilated by a 92 mm PWM-controlled fan, which spins at 1,000~2,000 RPM, with 16~27.1 dBA noise output. The cooler supports Intel LGA115x mount hole spacing, which makes it fit for LGA1156, LGA1155, and future LGA1150 socket types. It is priced around US $50.

Noctua today presented its new NH-L9i and NH-L9a low profile CPU coolers for Intel and AMD. At a super-low profile of only 37mm, the NH-L9 coolers are ideal for extremely slim cases and with footprints tailored to the respective socket keep-out zones, they provide full compatibility with tall RAM modules and VGA cards on mini-ITX mainboards. Topped off with the new NF-A9x14 PWM premium fan, the NH-L9 coolers fuse everything users have come to expect from Noctua's larger coolers into a super-compact package for slim HTPC systems.

"The response on our first low profile cooler, the NH-L12, has been overwhelming", says Mag. Roland Mossig, Noctua CEO. "However, users asked for even smaller, lower height models that also provide better compatibility for extra slim, ITX based HTPCs. We're thrilled that we can now meet this demand with the new NH-L9 coolers."

Intel's 4th generation Core processor family will introduce socket LGA1150, and 8-series chipset. The company's own Desktop Board division plans as many as nine motherboard models for March 2013. The three 8-series chipset models making up the lineup are Z87 (high connectivity options, overclocking features), H87 (high connectivity options), and Q87 (essential connectivity, enterprise client features).

Intel plans as many as four motherboard models on the overclocking-ready Z87 chipset, two each in the Extreme Series and Media Series. The Extreme Series models include the DZ87KLT-75K "Kinsley Thunderbolt," DZ87KL-70K "Kinsley" (sans Thunderbolt); the Media Series models include DZ87CA-55K "Carryville," and DZ87CO-50K "Colebrook." The H87 lineup includes DH87MC "Meadow Creek," DH87RL "Round Lake," and DH87FB "Flat Bay." Among the Q87-based models are the DQ87RG "Rainbow Ridge" and DQ87PG "Spring Cave." Their specifications are tabled below.

Intel's next high-end desktop (HEDT) platform, codenamed "Ivy Bridge-E," is slated for Q3-2013, according to the latest platform road-map slide sourced by VR-Zone. According to the leaked slide, launch of Ivy Bridge-E Core i7 processors follows that of Core "Haswell" socket LGA1150 processors (Q2-2013). What's more, the upcoming Ivy Bridge-E chips will be compatible with existing socket LGA2011 motherboards, based on Intel X79 Express chipset.

Intel's next-generation Ivy Bridge-E chips are up-scaled versions of today's Core "Ivy Bridge" chips, built on the same 22 nm process, with more processing cores, memory channels, cache, and PCI-Express 3.0 certified system interfaces. It remains to be seen if Intel launches a new chipset to go with the new processor, or retains the X79 chipset with a few minor updates in the form of steppings. The company retained its X58 Express chipset over the first two HEDT processor generations (45 nm Core i7 "Bloomfield" and 32 nm Core i7 "Westmere").

With its 22 nm "Ivy Bridge" CPU and 7-series "Panther Point" platform turning into a reality, Intel is moving on to development of the new 22 nm "Haswell" architecture. Entry-thru-performance segment Core "Haswell" processors will be built on the new LGA1150 package, and will be driven by a new series of platform controller hubs, codenamed "Lynx Point". We already know a tiny bit about the way Haswell+Lynx Point platform is structured, and the features that could come standard with it. A new VR-Zone report lists out all the chipset models Intel will carve out using the silicon.

The lineup is quite predictable. At the top of the pile is the feature-rich Z87, which has all the features of the platform, plus overclocking features. This is followed by Z85, which apart from features such as Rapid Storage Technology, could lack RAID for its SATA ports (could only feature AHCI and IDE modes). Then there's H87, which has all the features of Z87, except platform overclocking features. Q87 and Q85 are for large business desktops, and feature various client management features. Then there's B85, for small businesses. Lynx Point could feature as many as six SATA 6 Gb/s ports. Rapid Storage Technology will be updated to present users with a level of customization. Then there's Fast Boot, which speeds up system startup, provided an Intel SSD is used for caching.

Even as its 22 nm "Ivy Bridge" Core processors and compatible 7-series "Panther Point" chipset are only taking shape, with chains of product-launches starting late-March, extending through June; there's little denying that Intel has the successor to this platform ready, and a DigiTimes report pins its launch as early as March 2013. These upcoming product lines include a new processor architecture "Haswell", and compatible "Lynx Point" chipset. We knew Haswell's March-June 2013 launch schedule from a slightly older report that cited a leaked road-map slide. This latest DigiTimes report cites sources from upstream component suppliers. Haswell processor platform will introduce a new socket, LGA1150, which is not compatible with current LGA1155 platforms.

Intel "Lynx Point" 8-series chipset, which will form the foundation of 4th Generation Core processors in the LGA1150 package, codenamed "Haswell", was detailed in a leaked company slide. A slightly older report this week focused on Haswell chips having DirectX 11.1 graphics, and a reorganized display output logic that sees digital display outputs being wired to the processor package, while analog display outputs being routed to the chipset. This chipset talks to the processor's embedded graphics controller over a slightly less functional Flexible Display Interface (FDI).

Lynx Point chipset is a platform controller hub (PCH), much like all the Intel client-platform chipsets released since P55. A crude way to define its function would be to call it a "glorified southbridge", which handles all the connectivity of the system, while lacking the main PCI-Express root complex of the system to which graphics cards are ideally connected, as that's relocated to the CPU package. The PCH does have a narrower 8-lane PCIe hub, but to wire out x1 and x4 expansion slots, and onboard controllers. The Lynx Point chipset connects to the processor primarily over DMI, although the slide doesn't detail the DMI bandwidth. Most likely, it's similar to Cougar Point's 4 GB/s. Lynx Point also lacks a supplementary 4 GB/s PCIe link from the processor that's found on X79 chipset.

As Intel's tick-tock CPU development Juggernaut rolls on, things seem very much on track, looking into the near future. Intel will launch its new "Ivy Bridge" 3rd Generation Core processor family in early-April 2012, which is a miniaturization of what is essentially the "Sandy Bridge" to the new 22 nm process, with IPC and instruction-set improvements, along with a faster graphics controller. The new process will also up clock speeds and overclocking headroom for chips that support it. What's more interesting, though, is that the architecture that succeeds Ivy Bridge, codenamed "Haswell", will be less than an year away in April...well almost.

A roadmap slide sourced by DonanimHaber pins the launch of Haswell to March-June, 2013. Haswell is a brand new CPU architecture that will succeed Ivy Bridge. According to the conventional idea of Intel's tick-tock CPU development strategy, it will be built on the 22 nm fab process, which will have gained some maturity by then. Intel follows a "tick-tock" product development model. Every year, Intel's product lineup sees either of the two. A "tock" brings in a new x86 architecture, a "tick" miniaturizes it to a newer silicon fabrication process. Earlier reports indicated that Haswell Core processors will be based on a newer socket, the LGA1150, and hence it will not be compatible with LGA1155 platforms.