Based on a report by Tom's Hardware, AMD's CEO Lisa Su is planning a trip to Taiwan in the next couple of months. It is said that she is planning to meet with multiple partners in Taiwan, such as ASUS, Acer and maybe more importantly, ASMedia, which will be the sole maker of chipsets for AMD, once the X570 chipset is discontinued. AMD is apparently also seeing various less well known partners that deliver parts for its CPUs, such as Nan Ya PCB, Unimicron Technologies and Kinsus Interconnects.

However, it appears that the main reason for Lisa Su herself to visit Taiwan will be to meet with TSMC, to discuss future collaboration with CC Wei, TSMC's chief executive. This is so AMD can secure enough wafer allocation on future nodes, such as its 3 nm and 2 nm class nodes. The move to these nodes is obviously not happening in the near future for AMD, but considering that TSMC is currently the leading foundry and is operating at capacity, it makes sense to get in early, as the competition is stiff when it comes to getting wafer allocation on cutting edge nodes. It's unclear which exact 3 nm class node AMD will be aiming for, but it might be the N3P node, which is said to kick off production sometime next year. Lisa Su is also said to have meetings with TSMC, SPIL and Ase Technology when it comes to advanced packaging for AMD's products. This includes technologies such as chip-on-wafer-on-substrate (CoWoS) and fan-out embedded bridge (FO-EB), with AMD already being expected to use some of these technologies in its upcoming Navi 3x GPUs.

The Consumer Technology Association (CTA) today announced Dr. Lisa Su, AMD Chair and CEO, will deliver an in-person keynote address at CES 2023, the world's most influential technology event. Dr. Su will share AMD's vision—a perennial highlight of the CES season—on how high-performance and adaptive computing transforms lives by addressing the world's toughest problems.

"Over the last few years computing has become an essential and pervasive part of our daily lives, helping each of us adapt how we work and learn remotely, while keeping us connected and entertained," said Dr. Su. "I am excited for the opportunity to deliver a keynote at CES 2023 to highlight the next generation of high-performance and adaptive computing innovations, and products that will push the boundaries on what is possible and play an important role helping solve our most important challenges."

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

Today, AMD (NASDAQ: AMD) announced "together we advance_PCs," a livestream premiere to unveil next generation AMD PC products. Chair and CEO Dr. Lisa Su, CTO and EVP Mark Papermaster, and other AMD executives will present details on the latest "Zen 4" architecture that powers upcoming AMD Ryzen processors and the all new AM5 platform built around the latest technologies including DDR5 and PCIe 5.0, all designed to drive a new era of performance desktop PCs.

The show will premiere at 7 p.m. ET on Monday, August 29, on the AMD YouTube channel. A replay can be accessed a few hours after the conclusion of the event at AMD.com/Ryzen.

AMD in its Q2-2022 financial results call with analysts, confirmed that the company's next-generation Ryzen 7000 desktop processors based on the "Zen 4" microarchitecture will debut this quarter (i.e. Q3-2022, or before October 2022). CEO Dr Lisa Su stated "Looking ahead, we're on track to launch our all-new 5 nm Ryzen 7000 desktop processors and AM5 platforms later this quarter with leadership performance in gaming and content creation."

The company also stated that its next-generation Radeon 7000 series GPUs based on the RDNA3 graphics architecture are on-track for launch "later this year," without specifying whether it meant this quarter, which could mean launch any time before January 2023. AMD is also on course to beating Intel to the next-generation of server processors with DDR5 and PCIe Gen 5 support, with its EPYC "Genoa" 96-core processor slated for later this year, as Intel struggles with a Q1-2023 general availability timeline for its Xeon Scalable "Sapphire Rapids" processor.

AITRA (Taiwan External Trade and Development Council) announced today that Dr. Lisa Su, Chair and CEO of AMD, is invited back to be the first speaker of the COMPUTEX 2022 CEO Keynote series. This digital keynote will take place on Monday, May 23, at 2:00 PM (UTC+8), with the keynote theme "AMD Advancing the High-Performance Computing Experience". Dr. Lisa Su is delighted and honored to join COMPUTEX again, marking her third occasion delivering a CEO Keynote at the pre-eminent global conference. "High-performance computing plays such an essential role in our daily lives, and AMD is committed to always pushing the envelope on performance and innovation. At this year's COMPUTEX, AMD will share how we accelerate innovation with our broad ecosystem of partners," said Dr. Lisa Su.

AMD is the high-performance and adaptive computing leader with the industry's strongest portfolio of leadership computing, graphics, FPGAs and adaptive SoC products. At the CEO Keynote, Dr. Lisa Su will share the AMD vision to advance the PC experience through next generation mobile and desktop PC innovations. Combining cutting-edge CPUs, GPUs and software, AMD and its ecosystem partners will show breakthrough performance and leadership experiences for gamers, enthusiasts and creators. COMPUTEX 2022 will be grandly held at the Taipei Nangang Exhibition Center, Hall 1 from May 24 to May 27, 2022. In addition, TAITRA will simultaneously hold an online exhibition called COMPUTEX DigitalGo (May 24 to June 6). Meanwhile, Taiwan External Trade Development Council will organize COMPUTEX CEO Keynotes & Forum, where CEOs and senior executives from global tech giants share their insights.

AMD today announced a definitive agreement to acquire Pensando for approximately $1.9 billion before working capital and other adjustments. Pensando's distributed services platform includes a high-performance, fully programmable packet processor and comprehensive software stack that accelerate networking, security, storage and other services for cloud, enterprise and edge applications.

"To build a leading-edge data center with the best performance, security, flexibility and lowest total cost of ownership requires a wide range of compute engines," said Dr. Lisa Su, AMD chair and CEO. "All major cloud and OEM customers have adopted EPYC processors to power their data center offerings. Today, with our acquisition of Pensando, we add a leading distributed services platform to our high-performance CPU, GPU, FPGA and adaptive SoC portfolio. The Pensando team brings world-class expertise and a proven track record of innovation at the chip, software and platform level which expands our ability to offer leadership solutions for our cloud, enterprise and edge customers."

AMD (NASDAQ: AMD) today announced that its board of directors approved a new $8 billion share repurchase program. The new authorization is in addition to the $4 billion share repurchase program announced in May 2021, under which the company has repurchased approximately $3 billion of shares of AMD common stock.

"We are pleased to expand our share repurchase program based on the strength of our balance sheet and expectations for future free cash flow generation," said AMD Chair and CEO Dr. Lisa Su. "With our strong financial performance, we are able to increase investments to drive long-term growth while returning additional value to our shareholders."

AMD today announced that the AMD board has elected President and CEO Dr. Lisa Su as the chair of the board and John E. Caldwell as lead independent director. Caldwell joined the AMD board in 2006 and has served as chair since May 2016. AMD also announced that former Xilinx board members Jon Olson and Elizabeth Vanderslice have joined the AMD board in conjunction with the close of AMD's acquisition of Xilinx.

"Under Lisa's leadership, AMD has successfully executed a multi-year strategy that has significantly re-shaped the company's product portfolio and customer set and delivered industry-leading growth," said Caldwell. "As CEO and chair, Lisa will now have an ability to drive an even sharper focus for AMD and create greater shareholder value. I am also excited to welcome Jon and Elizabeth to the board as a part of the successful completion of the Xilinx acquisition. Their depth of industry knowledge and expertise are valuable additions to the board that will help AMD continue its strong growth."

AMD (NASDAQ: AMD) today announced the completion of its acquisition of Xilinx in an all-stock transaction. The acquisition, originally announced on October 27, 2020, creates the industry's high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics and adaptive SoC products. AMD expects the acquisition to be accretive to non-GAAP margins, non-GAAP EPS and free cash flow generation in the first year.

"The acquisition of Xilinx brings together a highly complementary set of products, customers and markets combined with differentiated IP and world-class talent to create the industry's high-performance and adaptive computing leader," said AMD President and CEO Dr. Lisa Su. "Xilinx offers industry-leading FPGAs, adaptive SoCs, AI engines and software expertise that enable AMD to offer the strongest portfolio of high-performance and adaptive computing solutions in the industry and capture a larger share of the approximately $135 billion market opportunity we see across cloud, edge and intelligent devices."

Anandtech asked AMD during a meeting at CES about the production nodes used to make its chips at TSMC and the importance of leading edge nodes for AMD to stay competitive, especially in light of the cost of using said nodes. Lisa Su confirmed in her answer to Anandtech that AMD is using an optimised high-performance 5 nm node for its upcoming Zen 4 processor chiplets, which there interestingly appears to be both 2D and 3D versions of. This is the first time we've heard a mention of two different chiplet types using the same architecture and it could mean that we get to see Zen 4 based CPUs with and without 3D cache.

What strikes us as a bit odd about the Anandtech article, is that they mention the fact that several of TSMC's customers are already making 4 nm and soon 3 nm chips and are questioning why AMD wouldn't want to be on these same nodes. It seems like Anandtech has forgotten that not all process nodes are universally applicable and just because you can make one type of chip on a smaller node, doesn't mean it'll be suitable for a different type of chip. For the longest of times, mobile SoCs or other similar chips seem to always have been among the first things being made on new nodes, with more complex things like GPUs and more advanced CPUs coming later, to tweaked versions of the specific node. The fact that TSMC has no less than three 7 nm nodes, should be reason enough to realise that the leading edge node might not be the ideal node for all types of chips.

AMD today announced that AMD President and CEO Dr. Lisa Su will host its 2022 Product Premiere on January 4, 2022. Dr. Su will highlight innovations and solutions featuring upcoming AMD Ryzen processors and AMD Radeon graphics. The AMD Product Premiere livestream will be accessible to the public beginning at 10 a.m. EST on Tuesday, January 4 at AMD.com; replays will be available after the conclusion of the livestream event. The link to the AMD 2022 Product Premiere event page can be found below.

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

AMD today announced revenue for the third quarter of 2021 of $4.3 billion, operating income of $948 million, net income of $923 million and diluted earnings per share of $0.75. On a non-GAAP basis, operating income was $1.1 billion, net income was $893 million and diluted earnings per share were $0.73. "AMD had another record quarter as revenue grew 54% and operating income doubled year-over-year," said AMD president and CEO Dr. Lisa Su. "3rd Gen EPYC processor shipments ramped significantly in the quarter as our data center sales more than doubled year-over-year. Our business significantly accelerated in 2021, growing faster than the market based on our leadership products and consistent execution."

AMD will host its Accelerated Data Center Premiere on November 8, 2021 at 11 a.m. ET, showcasing the company's upcoming innovations with AMD EPYC processors and AMD Instinct accelerators. The virtual event is slated to feature presentations from AMD President and CEO Dr. Lisa Su, Senior Vice President and General Manager, Data Center and Embedded Solutions Business Group Forrest Norrod, and Senior Vice President and General Manager, Server Business Unit Dan McNamara. The event will be accessible to the public at this page starting at 11 a.m. ET. A replay will be available and can be accessed after the conclusion of the livestream event.

Editor's Note: We expect AMD to announce several SKUs in its MI200-series "Aldebaran" compute accelerator family, along with a new line of EPYC "Milan-X" enterprise processors that leverage the new "Zen 3+" chiplet that comes with 64 MB 3D Vertical Cache memory on top of the 32 MB L3 cache.

Finally some potentially good news, as AMD's CEO Lisa Su is bringing hope that the current chip shortage situation might improve over the next 18 to 24 months according to a new piece on CNBC. She's expecting new chip fabs to have come online by then, although no details were mentioned, one would presume it involves TSMC in AMD's case.

Lisa Su is quoted saying "We've always gone through cycles of ups and downs, where demand has exceeded supply, or vice versa, this time, it's different." "The pandemic has just taken demand to a new level". This isn't exactly breaking news by now, but it also seems like the demand for computers has reached its peak and is now plateauing ahead of what will likely be a drop in sales come next year, but that doesn't mean the demand for chips will go down. Lisa Su is also expecting further consolidation in the industry, which has its upsides and downsides, but her take on it is that "if you want to do something very large for the industry, you know, scale is important." AMD should know this better than most companies, since they've scaled their business from the brink of bankruptcy to where they are today.

AMD CEO Dr. Lisa Su last Friday joined an exclusive list of personalities whose contributions to he semiconductor industry have been deemed relevant enough to receive the prestigious Robert N. Noyce medal. The award, attributed by the IEEE and funded by Intel, was awarded to Lisa Su in recognition of her "leadership in groundbreaking semiconductor products and successful business strategies that contributed to the strength of the microelectronics industry." Her current and past actions at AMD have pulled most of the weight behind this recognition, as Dr. Lisa Su has completely turned around a company that was bleeding talent and dollars, reversing its 2$ per share lows from AMD's 2014 up to today's $110 per share.

Lisa Su divides her carrier in two parts: the first ten to 15 years where she moved and produced as an MIT-trained electrical engineer, where she earned bachelor's, master's, and doctoral degrees on the subject. The move towards management of research and technological teams actually happened during her stint in IBM; after 11 years at the company, in 2006 she was appointed vice president of IBM's semiconductor research and development center in New York. She then moved on to AMD as senior vice president in charge of the company's global business units, where she was so impressively skilled it only took her two years to become President and CEO of AMD. Her nomination for the Robert N. Noyce Medal paints her as the first woman to have ever received it. In 1993, MIT female graduates where 32% of the total; in 2016, that number increased to 50%.

AMD CEO Dr Lisa Su, in the company's Q2-2021 financial results call, confirmed that the company is on-track to launch the Zen 4 CPU microarchitecture and RDNA3 graphics architecture, in 2022. Zen 4 would herald the first major desktop platform change since the original Zen architecture, with the introduction of a new CPU socket, and support for DDR5 memory. The RDNA3 graphics architecture, meanwhile, is expected to nearly triple SIMD resources over the previous generation, and introduce even more fixed-function hardware for raytracing.

In the meantime, AMD is preparing a counter to Intel's 12th Gen Core "Alder Lake-S" processor, in the form of Zen 3 with 3D Vertical Cache, which is also being referred to as the Zen 3+ architecture. These processors feature additional last-level cache, and the company claims a 15% gaming performance uplift, which should help it close the gaming performance gap with Intel, and win on sheer core-count of its big cores. It remains to be seen if Zen 3+ remains on Socket AM4 or if it debuts AM5, as AMD will be under pressure to match "Alder Lake" in platform I/O, which includes DDR5. Dr Su also confirmed that AMD has started shipping the Instinct MI200 "Aldebaran" compute accelerator based on the CDNA2 architecture. AMD's first MCM GPU with two logic dies, "Aldebaran" takes the fight to NVIDIA's top A100 series compute accelerators, and has already scored wins with ongoing HPC/supercomputing projects.

The partnership between Samsung and AMD began in 2019 when the two companies announced that they would work together to integrate Radeon graphics IP in Samsung Exynos processors. We can see the results of this partnership with Dr. Lisa Su confirming at Computex that RDNA2 graphics will be integrated into the next flagship Samsung Exynos SoC. The RDNA2 GPU found in the upcoming mobile chip will include support for raytracing and variable-rate shading with a strong possibility that it will power the next Galaxy S series flagship. Samsung was initially expected to announce this new chipset in June however the event was postponed until July where the complete details and performance numbers will be unveiled.

Update Jun 22nd: The upcoming GPU is expected to be 30% faster than the current Mali-G78 GPU present in Galaxy S21 Ultra which should give it a comfortable lead of ~10% against the next generation Mali GPU. The GPU does appear to suffer from quite severe thermal throttling with a 20% performance drop after the second run and 30% on the third run. Samsung seems pleased with the collaboration and has engaged in talks with AMD to extend the contract for future GPU architectures.

AMD and Google Cloud today announced T2D, the first instance in the new family of Tau Virtual Machines (VMs) powered by 3rd Gen AMD EPYC processors. According to Google Cloud, the T2D instance offers 56% higher absolute performance and more than 40% higher price performance for scale-out workloads. The Tau VM family provides customers with a leading combination of performance, price, and easy integration. The T2D instances, using the leadership performance of 3rd Gen AMD EPYC processors, excels at workloads including web servers, containerized micro-services, data logging-processing, large scale Java applications and more.

"At Google Cloud, our customers' compute needs are evolving," said Thomas Kurian, CEO of Google Cloud. "By collaborating with AMD, Google Cloud customers can now leverage amazing performance for scale-out applications, with great price-performance, all without compromising x86 compatibility." "We designed 3rd Gen AMD EPYC processors to meet the growing demand from cloud and enterprise customers for high-performance, cost-effective solutions with optimal TCO," said AMD President and CEO Dr. Lisa Su. "We work closely with Google Cloud and are proud they selected AMD to exclusively power the new Tau VM T2D instance which provides customers with powerful new options to run their most demanding scale-out workloads."

AMD at its Computex event shed some light on its IP partnership with Samsung. We already knew this was going to be a closer collaboration than most IP licensing deals, as AMD themselves announced this would be a semi-custom solution designed between both companies. AMD CEO Lisa Su described the technology to be embedded in the upcoming Samsung Exynos SoC as being based on RDNA2 - but this likely is just a marketing and clarity perspective on AMD's technology being implemented, since between the design of RDNA2 and the announcement of the Samsung partnership a lot of water has necessarily run under AMD's graphics IP bridge.

Lisa Su did however confirm that two key RDNA2 technologies will find their way into Samsung's Exynos: Variable Rate Shading (VRS) and Raytracing. This isn't he first time VRS has made an appearance on a mobile SoC - it's already been implemented by Qualcomm in the Adreno 660 GPU (part of the Snapdragon 888 SoC design). However, Raytracing does seem to be a first for the SoC market, and Samsung might just edge out competition in its time to market with this technology. more details will certainly be shared as we get closer to the fabled AMD-partnered Exynos release.

AMD's next-generation HPC accelerator card, the Instinct MI200, is expected to launch later this year. CEO Dr Lisa Su, speaking at a financial event hosted by JPMorgan stated that the company would launch the next-generation of CDNA architecture this year. The card debuts the company's new CDNA2 compute architecture, and is on its way to supercomputers already announced. The Instinct MI200 HPC accelerator card is based on the new "Aldebaran" compute accelerator package, which is a multi-chip module of not just the compute silicon and memory dies; but one that has multiple compute dies.

AMD today announced that AMD President and CEO Dr. Lisa Su will keynote COMPUTEX 2021, one of the leading global technology tradeshows focused on the theme of "Building Global Technology Ecosystems" in 2021. Dr. Su will present the AMD vision for the future of computing, including the growing adoption of AMD high-performance computing and graphics solutions in the keynote titled "AMD Accelerating - The High-Performance Computing Ecosystem." The digital keynote will be livestreamed at 10:00 AM (GMT+8) on Tuesday, June 1 and can be accessed on the COMPUTEX 2021 Hybrid platform as well as AMD.com.

AMD (NASDAQ: AMD) today announced that its Board of Directors approved a new share repurchase program. Under this program, the company intends to repurchase up to $4 billion of outstanding AMD common stock. AMD expects to fund repurchases through cash generated from operations which have been strengthened by the company's strong operational results.

"Today's announcement reflects our confidence in AMD's business and the successful execution of our multi-year growth strategy," said Dr. Lisa Su, AMD president and CEO. "Our strong financial results and growing cash generation enable us to invest in the business and begin returning capital to our shareholders." Under this program, which is designed to return value to AMD stockholders, offset dilution from stock issuances, and reduce share count over time, the company will repurchase stock in the open market. This repurchase program has no termination date and may be suspended or discontinued at any time.

British competition regulator Competition and Markets Authority (CMA) on Monday, launched an enquiry into the ramifications of AMD's buy-out of FPGA maker Xilinx. The agency is soliciting opinions from the public on whether the $35 billion all-stock purchase will make goods and services less competitive for the UK. Unlike NVIDIA's Arm buyout the Xilinx acquisition is seeing no opposition from tech-giants. The Register notes that AMD could combine Xilinx's FPGAs with its x86 CPU and RDNA SIMD to create highly customizable HPC accelerators. AMD president Dr Lisa Su said "By combining our world-class engineering team and deep domain expertise, we will create an industry leader with the vision, talent and scale to define the future of high performance computing."