Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced plans to build the largest semiconductor fabrication facility in the history of the United States. The new megafab will increase domestic supply of leading-edge memory and create nearly 50,000 New York jobs, including approximately 9,000 high paying Micron jobs.

Micron intends to invest up to $100 billion over the next 20-plus years to construct a new megafab in Clay, New York, with the first phase investment of $20 billion planned by the end of this decade. This represents the largest private investment in New York state history. Micron's investment in Onondaga County, New York, will complement the company's previously announced high-volume manufacturing fab in Boise, Idaho. Micron will design, build and operate the facility in accordance with its sustainability goals. The site could eventually include four 600,000 square foot cleanrooms, for a total of 2.4 million square feet of cleanroom space - the size of approximately 40 U.S. football fields.

According to a TrendForce investigations, memory pricing began to decline from 4Q21 due to weakening demand for certain consumer electronics. Coupled with the impact of rising inflation, the Russian-Ukrainian war, and pandemic policies, demand in peak season was weak, resulting in inventory pressure that has extended from the buyer side to manufacturers. In response to the aforementioned situation, Micron announced last week that it would cut production of DRAM and NAND Flash, becoming the first major memory manufacturer to officially reduce its capacity utilization plan. In terms of NAND Flash, the market situation is more severe than that of DRAM. As the average contract price of mainstream capacity wafers has fallen to their cash cost and is approaching the periphery of selling at a loss for various manufacturers, Kioxia also announced that it will reduce NAND Flash capacity utilization by 30% from October on the heels of Micron's announcement.

In terms of DRAM, current contract pricing remains higher than the total production cost of various mainstream suppliers. Therefore, compared with NAND Flash, it remains to be seen whether there will be a significant reduction in production. In addition to mentioning the slight reduction in capacity utilization in this sector currently, Micron mainly emphasized its sharp downward revision of capital expenditures in 2023 and that the annual growth of DRAM production bits next year will only be around 5%. TrendForce believes, according to Micron, to actualize such conservative bit growth means that there is still room for a significant downward revision in capacity utilization and the extent to which Micron's subsequent production reductions are implemented remains to be seen.

The economic downturn keeps pushing the PC and related manufacturing markets down, following slumps in demand stemming from increased cost of living, the veritable arms race to technological products during COVID-19, and manufacturer's efforts to increase output to provide enough product to meet said demand. But all that goes up must eventually come down, and now South Korean manufacturers are facing the result of months of decreased consumption, with stock levels increasing ahead of actual product uptake (stocks have reached 67.3% of produced goods and factory shipments have declined 20.4%). This has now led to a 1.7% decline in August's output when compared to the same period last year - the first time the South Korean industry has seen negative growth since 2018.

Samsung and Kioxia both have announced a reduction in production output in the months to come, which should give distribution enough time to clear some of the accumulated inventory. The scales of production typically occur in cycles - ones with excess manufacturing against demand, and other times where the reverse happens. It seems we're now in the descending part of the spectrum, with prices - especially of NAND - being expected to drop in the coming months. It will take a while until the manufacturing reduction makes itself felt in the overall IC pricing landscape. Micron too has announced it's slowing down the production ramp-up of its 232-layer 3D NAND so as not to contribute in excess towards an already over-saturated market.

NVIDIA today unveiled the GeForce RTX 40 Series of GPUs, designed to deliver revolutionary performance for gamers and creators, led by its new flagship, the RTX 4090 GPU, with up to 4x the performance of its predecessor. The world's first GPUs based on the new NVIDIA Ada Lovelace architecture, the RTX 40 Series delivers massive generational leaps in performance and efficiency, and represents a new era of real-time ray tracing and neural rendering, which uses AI to generate pixels.

"The age of RTX ray tracing and neural rendering is in full steam, and our new Ada Lovelace architecture takes it to the next level," said Jensen Huang, NVIDIA's founder and CEO, at the GeForce Beyond: Special Broadcast at GTC. "Ada provides a quantum leap for gamers and paves the way for creators of fully simulated worlds. With up to 4x the performance of the previous generation, Ada is setting a new standard for the industry," he said.

On the evening of September 17, an earthquake with a magnitude of 6.4 on the Richter scale occurred in Guanshan Township, Taitung. Yesterday (9/18) afternoon, an earthquake with a magnitude of 6.8 on the Richter scale occurred in Chishang Township, Taitung. Following up on these recent powerful earthquakes, TrendForce's investigation into their impact on Taiwan's semiconductor and panel industries is as follows:

In terms of foundries, due to shock-absorbing plant designs, earthquake vibrations inside fabs are one level of magnitude less than outside. In terms of equipment manufacturers, currently there are no reports of substantial factory damage. In the worst case, some machinery required initialization after crashing. In terms of memory, Nanya Technology has already carried out a shutdown inspection. If there was any wafer damage, Nanya maintains sufficient inventory to compensate. Micron recalled engineers to inspect equipment and has confirmed no losses. Thus, the capacity utilization rate of these two companies has not been affected nor has supply.

The first batch of PCIe 5.0 SSDs are all likely to be based on Phison's PS5026-E26 controller, which offers eight NAND channels, capable of supporting NAND speeds of up to 2400 MT/s. Phison's own figures for the controller are 13 GB/s writes and 12 GB/s reads, with up to 1.5 million random read IOPS and 2 million random write IOPS. However, as we've already seen from various SSD brands, many PCIe 5.0 SSDs won't exceed 10 GB/s when it comes to the sequential read/write speeds. This is because the current NAND flash simply isn't fast enough to saturate the PCIe 5.0 bus, which is capable of 15.75 GB/s. That said, Micron's 232-layer 3D NAND should be able to boost the performance up to 12.4 GB/s based on the numbers Gigabyte announced for their Aorus Gen 10000 SSD.

Based on an article over at Tom's Hardware, we shouldn't expect too many drives that exceed 10 GB/s sequential writes at launch, due to most drives using 176-layer 3D NAND flash, that is limited to 1600 MT/s. As such, it might be wise to hold off on buying the first generation of PCIe 5.0 drives and wait for better availability of 232-layer 3D NAND, as beyond Micron, SK Hynix is expected to have a 238-layer 3D NAND flash in the market sometime in the first half of 2023. If you're not really eager to have the fastest SSD out there for pure bragging rights, it would seem that mid 2023 might be the right time to get a PCIe 5.0 SSD.

Micron Technology, Inc. (NASDAQ: MU), one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced plans to invest approximately $15 billion through the end of the decade to construct a new fab for leading-edge memory manufacturing in Boise, Idaho. This will be the first new memory manufacturing fab built in the U.S. in 20 years, ensuring domestic supply of leading-edge memory required for market segments like automotive and data center, fueled by accelerating adoption of artificial intelligence and 5G.

This is the first of Micron's multiple planned U.S. investments following the passage of the CHIPS and Science Act, and represents the largest private investment ever made in Idaho. Co-locating the new manufacturing fab with Micron's R&D center at the company's headquarters will enhance operational efficiency, accelerate technology deployment and improve time to market.

According to TrendForce research, material supply improvement and spiking demand for enterprise SSDs from North American hyperscale data center and enterprise clients in 2Q22 coupled with the Kioxia contamination incident in 1Q22 prompted customers to ramp up procurement to avoid future supply shortages. Manufacturers also give priority to meeting the needs of server customers due to the high pricing of enterprise SSD. In the second quarter, overall revenue of the enterprise SSD market increased by 31.3% to US$7.32 billion.

As the market leader, Samsung has grown its enterprise SSD revenue to US$3.26 billion with the recovery of enterprise SSD procurement. Especially in the second quarter, when orders for other consumer products continued to decline, enterprise SSD became the company's outlet for reducing production capacity. At present, Samsung has been continuously investing in the development of next-generation transmission specification products such as the CXL 2.0 product released at the Flash Summit in early August, in order to maintain a leading position in the market.

In President Biden's first year in office, the Biden-Harris Administration has implemented an industrial strategy to revitalize domestic manufacturing, create good-paying American jobs, strengthen American supply chains, and accelerate the industries of the future. These policies have spurred an historic recovery in manufacturing, adding 642,000 manufacturing jobs since 2021. Companies are investing in America again, bringing good-paying manufacturing jobs back home. The construction of new manufacturing facilities has increased 116 percent over last year.

Today, President Biden will sign into law the bipartisan CHIPS and Science Act of 2022, which will build on this progress, making historic investments that will poise U.S. workers, communities, and businesses to win the race for the 21st century. It will strengthen American manufacturing, supply chains, and national security, and invest in research and development, science and technology, and the workforce of the future to keep the United States the leader in the industries of tomorrow, including nanotechnology, clean energy, quantum computing, and artificial intelligence. The CHIPs and Science Act makes the smart investments so that American to compete in and win the future.

Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced its plans to invest $40 billion through the end of the decade to build leading-edge memory manufacturing in multiple phases in the U.S. With the anticipated grants and credits made possible by the CHIPS and Science Act, this investment will enable the world's most advanced memory manufacturing in America. Micron expects to begin production in the second half of the decade, ramping overall supply in line with industry demand trends.

Micron's planned investment, the largest in memory manufacturing in U.S. history, will ultimately create up to 40,000 new American jobs including approximately 5,000 highly paid technical and operational roles at Micron. The Micron investment will also enrich surrounding communities by bolstering education, workforce training, transportation and several other services. Micron is finalizing its specific U.S. expansion plans and will share additional details in the coming weeks.

Memory giant Micron Technology has commenced mass-production of 21 Gbps and 24 Gbps-rated GDDR6X memory chips that will be exclusively used by NVIDIA in its next-generation RTX 40-series "Ada" graphics cards. GDDR6X is a derivative of GDDR6 co-developed by NVIDIA and Micron, which leverages PAM4 signaling to increase data-rates. Depending on the graphics card model, NVIDIA will use 8 Gbit (1 GB) or 16 Gbit (2 GB) density memory chips. We're hearing that 21 Gbps will be the standard data-rate used by SKUs that succeed the RTX 3080 and RTX 3080 Ti; while 24 Gbps will be used by the faster RTX 3090/Ti successors. The part numbers of these memory chips are listed below.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

Micron Technology, Inc. (NASDAQ: MU) commends and thanks the Biden Administration for their leadership and the bipartisan work of Congress for passing the "Chips and Science" legislation. This is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness for years to come.

This legislation will bring leading-edge semiconductor manufacturing to the U.S., creating tens of thousands of jobs and tens of billions of dollars of new investments - transforming U.S. semiconductor innovation and supply chain resilience.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices today announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications. Silicon Motion's new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a high degree of flexibility and accelerated time to market, all while reducing engineering cost.

"SSD storage solutions are evolving to address new challenges in data centers which demand changes in storage platforms and operating models," said Nelson Duann, Silicon Motion's Senior Vice President of Marketing and R&D. "Our MonTitan SSD solution is an innovative PCIe Gen5 SSD platform designed to satisfy the unique demands of datacenters today while providing flexibility and programmability to meet future evolving standards."

Micron Technology, Inc., today announced that it has begun volume production of the world's first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry's highest areal density and delivers higher capacity and improved energy efficiency over previous generations of Micron NAND, to enable best-in-class support of the most data-intensive use cases from client to cloud.

"Micron's 232-layer NAND is a watershed moment for storage innovation as first proof of the capability to scale 3D NAND to more than 200 layers in production," said Scott DeBoer, executive vice president of technology and products at Micron. "This groundbreaking technology required extensive innovation, including advanced process capabilities to create high aspect ratio structures, novel materials advancements and leading-edge design enhancements that build on our market-leading 176-layer NAND technology."

Based on a report from IC Insights, it appears that the demand for semiconductors and memory is starting to slow down. The slowdown is industry wide, with most major players having seen a reduction in sales in June compared to May. Although the report is focused on Taiwanes semiconductor companies, it also mentions Micron, who is expecting a slowdown in the third quarter of this year. Micron is reportedly expecting a drop in sales by as much as 17 percent, although this past quarter the company saw an increase in sales by 11 percent compared to the previous quarter, or 19 percent compared to last year, so it could simply be that the market is starting to normalise.

As for the Taiwanese semiconductor companies, TSMC saw a reduction in sales of five percent in June, although its competitor UMC saw an increase of two percent. Two other Taiwanese foundries, Powerchip and Vanguard, saw a decrease of four percent and an increase of three percent respectively, which shows that the foundry businesses are seeing change based on the type of chips they make. Apart from Winbond and Macronix, the other four companies in the report saw a decrease in sales by anything between two and 26 percent. Novatek, a manufacturer of semiconductors for the display industry saw the biggest dip in sales, with memory manufacturer Nanya seeing a drop of 16 percent. It should be pointed out that Novatek saw an increase in sales of 78 percent during the pandemic, which suggests their customers might not be seeing the same demand for their end products as they did over the past two years. For now, this could just be a slowdown over the summer months, when demand is usually quite low, but it could also be an indication of a return to a more normalised market.

Micron today announced commercial and industrial channel partner availability of Micron DDR5 server DRAM in support of industry qualification of next-generation Intel and AMD DDR5 server and workstation platforms. The move to DDR5 memory enables up to an 85% increase in system performance over DDR4 DRAM. Micron's new server DDR5 memory maximizes performance for AI, HPC and data-intensive applications that require more CPU compute capacity and higher memory bandwidth than DDR4 technology can support.

"As data continues to grow exponentially, the need to derive insights from that data is critical to business success," said Teresa Kelley, vice president and general manager of Micron's Commercial Products Group. "Data center operators need to maximize platform performance with advanced memory capabilities and processor advancements. Micron DDR5 server DRAM provides unparalleled bandwidth to manage even the most memory-intensive applications. Micron has been on the forefront of the industry's transition to DDR5 memory technology and is committed to empowering data center customers and channel partners in their server DDR5 DRAM qualification and readiness efforts."

Micron Technology, Inc. (Nasdaq: MU) today announced results for its third quarter of fiscal 2022, which ended June 2, 2022. "Micron delivered record revenue in the fiscal third quarter driven by our team's excellent execution across technology, products and manufacturing," said Micron Technology President and CEO Sanjay Mehrotra. "Recently, the industry demand environment has weakened, and we are taking action to moderate our supply growth in fiscal 2023. We are confident about the long-term secular demand for memory and storage and are well positioned to deliver strong cross-cycle financial performance."

This week Embedded World 2022 is taking place in Nuremberg in Germany and Micron decided to launch its new i400-series of microSD cards at the show. Normally microSD cards aren't worth a writeup, but in this case there are at least two noticeable features that makes Micron's i400-series of cards stand out. First is the fact that the i400 cards come in sizes from 64 MB to 1.5 TB, which is the largest size microSD card in the market to date.This is according to Micron, enough storage space for up to four months of continuously recorded video from a security camera, albeit at unknown resolution.

This brings us to the second noteworthy feature of the i400-series, the endurance rating. Micron claims that the cards will last five years in a 24/7 write scenario, or 2 million hours mean time to failure. The cards are also said to be optimised for sustained performance, even during concurrent 4K video streams being recorded to the cards. That said, Micron doesn't provide any actual performance numbers beyond the fact that all the cards are Class 10, U3 and A2 rated, except possibly the 64 and 128 GB models that are seemingly also U1 rated. All cards are rated to operate from minus 25 degrees to plus 85 degrees celsius. No word on pricing, as the cards aren't intended for retail customers.

According to TrendForce research, despite the significance of peak season and rising DDR5 penetration, the 3Q22 DRAM market still succumbed to the negative impact of weak consumer electronics demand resulting from the Russian-Ukrainian war and high inflation, which in turn led to an increase in overall DRAM inventory. This is the primary reason for a 3-8% drop in DRAM prices in 3Q22 and a more than 8% pricing dip in certain DRAM products for PCs and smart phones cannot be ruled out.

In terms of PC DRAM, sustained weakening of demand has led to PC OEMs adjusting their annual shipment targets and also caused DRAM inventories to soar rapidly. In 3Q22, PC OEMs remain focused on adjusting and destocking DRAM inventories, making a rebound in purchasing momentum unlikely. At the same time, since the overall DRAM industry remains oversupplied, even if PC demand is sluggish, suppliers still experienced difficulties in reducing their PC DRAM supply, resulting in a slight quarterly increase in the number of supplied bits. Therefore, PC DRAM pricing is forecast to drop by 3~8%

Just under a month ago, ASUS posted a teaser for its first internal SSD, the ROG Strix SQ7 and now the company has finally released the full specs. It is indeed based around the 12 nm Phison E18 controller, as predicted by our Editor-In-Chief, something he spotted from the sneak peek picture. Although ASUS didn't specifically mention what kind of flash the drive is using, they kindly left the flash model number visible in one of its pictures of the drive. Although the full model name isn't visible, enough of it is visible to identify it as Micron's 176-layer TLC flash. The ROG Strix SQ7 also sports a DDR4 cache, as expected, although ASUS doesn't mention clock speeds.

ASUS claims the drive will deliver sequential read speeds of up to 7000 MB/s and write speeds of up to 6000 MB/s, which places the ROG Strix SQ7 in direct competition with several other Phison E18 based high-end drives from the likes of Kingston, MSI, Sabrent and others. Unfortunately, ASUS doesn't mention IOPS or random performance, although an unspecified "large" SLC cache is mentioned. Other features include TGC Opal and AES 256-bit encryption. ASUS also provides its own SSD dashboard, which of course is ROG branded, but looks like a skinned version of Phison's standard SSD dashboard, rather than something custom made. ASUS also provides a copy of NTI Backup Now EZ software and the drives appear to have a five year warranty. ASUS mentions PS5 compatibility outside of the PC space. No word on pricing or retail availability was provided and so far ASUS has only listed a 1 TB model.

Although Micron is a predominantly US company, it also has some fabs in Japan, Singapore, the PRC and Taiwan, many of which became part of Micron after it bought other companies. Based on Micron's Computex presentation, it's getting ready to upgrade one of its three fabs in Taichung with extreme ultraviolet (EUV) lithography technology later this year. This is in preparation for the company to move to what it calls its 1-gamma process node for DRAM. Initially this seems to be a R&D node to help the company prepare for a wider rollout of EUV technology. Micron's current DRAM is based on its 1-alpha node and it's planning to move its 1-beta node into volume production next year, in its Taiwan fabs.

Micron's current 1-alpha node is based on DUV technology and was introduced last year, with the company claiming it had a 40 percent improvement in memory density over its previous 1Z node. Micron no longer mentions its die size in the commonly used nanometer measurement, but its 1Z node is said to have been around 11 to 13 nm, so it's likely that the 1-beta node will end up below 10 nm, if its 1-alpha node isn't already below 10 nm. Micron's longer term roadmap also includes a 1-delta node, which was meant to be its first EUV product, but this now seems to have been moved forward to its 1-gamma node. It's likely that Micron will be moving its other fabs to EUV in due time as well, but DRAM has so far not benefitted as much from node shrinks compared to most other types of integrated circuits, so it'll be interesting to see what gains EUV might bring.

According to TrendForce research, North American data centers saw an improvement in components supply after February, driving a recovery in purchase order volume. As Server brands returned to normal in-office work following the pandemic, the increase in capital expenditures on related information equipment has also boosted order growth. The addition of Kioxia's raw material contamination incident led to an increase in the pricing of certain rush orders, pushing up overall Enterprise SSD revenue in 1Q22 to US$5.58 billion, or 14.1% growth QoQ.

According to TrendForce, Samsung and SK hynix (including Solidigm) were the top two players in 1Q22. At the beginning of the year, demand from hyperscale data centers resulted in high inventory levels due to component mismatches, leading Samsung's order growth missing expectations. However, as repercussions from the WDC and Kioxia contamination incident hit NAND Flash production capacity in 1Q22, server customers quickly turned to Samsung for additional orders, driving the company's 1Q22 revenue to US$2.77 billion, up 14.8% QoQ.

According to TrendForce research, as manufacturers actively shifted production capacity to 128 layer products, the market turned to oversupply, resulting in a drop in contract prices in 1Q22, among which the decline in consumer-grade products was more pronounced. Although enterprise SSD purchase order volume has grown, demand for smart phone bits has weakened due to the Russian-Ukrainian war, the traditional off-season, and rising inflation. Client inventories have increased significantly, so it remains challenging for overall bit shipment volume to offset potential decline. In 1Q22, NAND Flash bit shipments and average selling prices fell by 0.5% and 2.3%, respectively, resulting in a 3.0% quarterly decrease in overall industry revenue to US$17.92 billion.

Although China's smartphone stocking momentum was marginally weak considering the off-season, due to sluggish supply on the part of Kioxia and WDC, Samsung's 1Q22 client SSD shipment bit growth was driven up by an influx of rush orders and North American enterprise SSD client orders also recovered significantly in March. Overall bit shipments increased by 9% QoQ and ASP decreased by 2% QoQ. In 1Q22, the NAND Flash portion of Samsung's electronics business posted revenue of US$6.32 billion, up 3.4% QoQ.