The Chinese Government could retaliate to the U.S. ban on YMTC NAND flash memory products by banning American memory maker Micron Technology. This comes as the country initiated a "cybersecurity review" of Micron products to check if they conform to China's network security Laws. These are essentially the same grounds on which the US-FCC banned YMTC, forcing large customers like Apple to cancel orders of YMTC NAND flash products, derailing the company's growth. YMTC's 3D NAND flash products and their development roadmaps can be considered "contemporary," against those of Micron, Kioxia, SK hynix, and Samsung. If banned, China would force Chinese companies, such as Lenovo, HMD International, etc., to remove Micron from their qualified vendor lists.

Galax is joining the PCIe 5.0 SSD crowd with its newest HOF Extreme 50 SSD that has been launched in China, and should come to the rest of the markets soon. The Galax HOF Extreme 50 will be only available in 1 TB and 2 TB capacities, and comes with thick heatsink with active cooling via PWM fan.

As it is the case with all other PCIe 5.0 SSDs currently on the market, the HOF Extreme 50 is based on Phison E26 controller paired up with Micron 232-layer 3D NAND flash and up to 4 GB of LPDDR4 DRAM cache. The Galax HOF Extreme 50 is not the fastest Phison E26-based PCIe 5.0 SSD announced, as Gigabyte Aorus Gen 5 1000, MSI Spatium M570 Pro, and Crucial T700, are coming and reaching up to 12 GB/s (12.4 GB/s for the Crucial T700).

Micron Technology, Inc. (Nasdaq: MU) today announced results for its second quarter of fiscal 2023, which ended March 2, 2023. "Micron delivered fiscal second quarter revenue within our guidance range in a challenging market environment," said Micron Technology President and CEO Sanjay Mehrotra. "Customer inventories are getting better, and we expect gradual improvements to the industry's supply-demand balance. We remain confident in long-term demand and are investing prudently to preserve our technology and product portfolio competitiveness."

Investments in capital expenditures, net were $2.16 billion for the second quarter of 2023, which resulted in adjusted free cash flows of negative $1.81 billion. Micron ended the second quarter of 2023 with cash, marketable investments, and restricted cash of $12.12 billion. Micron's Board of Directors has declared a quarterly dividend of $0.115 per share, payable in cash on April 25, 2023, to shareholders of record as of the close of business on April 10, 2023.

TrendForce reports that several suppliers, such as Micron and SK hynix, have started scaling back DRAM production. The ASP of DRAM plunged 20% in 1Q23, and this price decline is predicted to slow down to 10~15% next quarter. It's uncertain whether or not demand will recover in 2H23. Therefore, the ASP of DRAM has continued to fall as inventory levels are high from the suppliers' side, and prices will only rebound if there is a significant decrease in production.

PC DRAM: Purchase quantity from buyers has fallen drastically over the past three quarters; buyers have around 9~13 weeks of PC DRAM stock remaining. Despite suppliers having already cut production in the PC DRAM segment, DDR4 8 GB module is still likely to fall by more than 10% in 2Q23. There is a possibility that PC OEMs may purchase more DRAM because prices have been down to a relatively low level, but it is still under observation whether or not this can mitigate the inventory overstock situation from the suppliers' side. TrendForce predicts the ASP of PC DRAM will fall between 10~15%.

Semiconductor manufacturers worldwide are forecast to increase 300 mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026, SEMI announced today in its 300 mm Fab Outlook to 2026 report. After strong growth in 2021 and 2022, the 300 mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.

"While the pace of the global 300 mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors," said Ajit Manocha, SEMI President and CEO. "The foundry, memory and power sectors will be major drivers of the new record capacity increase expected in 2026."

Crucial is keen to drum up early interest for an upcoming SSD model, and the Linus Tech Tips team has received and tested a sample unit. The T700 is a PCIe Gen 5 NVMe M.2 SSD storage solution based around a Phison PS5026-E26 controller, which is a very common choice for the current generation of PCIe 5.0 SSDs available on the market. Micron 3D NAND chips look to be present on the T700's PCB, and a Crucial-branded heatsink is mounted to the provided sample unit. It is interesting to note that the uncovered T700 unit bears a striking resemblance to Phison's E26 Engineering Reference sample, although the latter appears to feature SK Hynix memory chips, instead of Micron.

The LTT team posted benchmark results from a Crystal Disk Mark test session, and the T700 achieved maximums of 12.4 GB/s sequential read and 11.9 GB/s write speeds. This represents an almost two fold jump over the performance of Crucial's PCIe 4.0 based P5 Plus SSD, which is a substantial improvement and also very impressive considering the T700's usage of a passive cooling solution.

TrendForce's latest investigations reveal that the global NAND Flash market has been facing a demand headwind since 2H22. In response, the supply chain has been scrambling to clear out inventory, driving down NAND Flash contract prices by 20-25%. Enterprise SSD took the brunt of the fall with prices plummeting 23-28%. Despite manufacturers lowering prices in an attempt to drive up demand, clients are hesitant to purchase more components for fear of overstock. As a result, NAND Flash bit shipments rose by a mere 5.3% as ASP fell 22.8%. Global NAND Flash revenue was reported to be US$10.29 billion in 4Q22—down 25% QoQ.

TrendForce reports that Kioxia and Micron saw both a reduction in production and price in 4Q22. Kioxia's revenue plunged 30.5% due to weak demand from PC and smartphone clients and data centers readjusting their inventory. Micron generated a quarterly revenue of US$1.1 billion—a staggering 34.7% QoQ drop—that has led them to drastically decrease their capacity utilization rate for fabs. Luckily, Micron was able to ship their 232-layer client SSDs in 4Q22 as scheduled, and with the 176-layer QLC enterprise SSD hot on its heels, Micron's bit shipments are predicted to steadily improve in 2023 with their revenue climbing gradually quarter by quarter.

According to TrendForce's latest survey of the server market, many cloud service providers (CSPs) have begun large-scale investments in the kinds of equipment that support artificial intelligence (AI) technologies. This development is in response to the emergence of new applications such as self-driving cars, artificial intelligence of things (AIoT), and edge computing since 2018. TrendForce estimates that in 2022, AI servers that are equipped with general-purpose GPUs (GPGPUs) accounted for almost 1% of annual global server shipments. Moving into 2023, shipments of AI servers are projected to grow by 8% YoY thanks to ChatBot and similar applications generating demand across AI-related fields. Furthermore, shipments of AI servers are forecasted to increase at a CAGR of 10.8% from 2022 to 2026.

According to TrendForce's research, global DRAM revenue fell by 32.5% QoQ to US$12, 281 million for 4Q22. The QoQ decline for 4Q22 is larger than the QoQ decline of 28.8% for 3Q22 and comes close to the QoQ decline of 36% for the final quarter of 2008, when the global economy was in the midst of a major financial crisis. The main cause of the steep revenue drop in 4Q22 was the plummeting overall ASP. DRAM suppliers experienced a rapid accumulation of inventory in 3Q22 due to a freeze in buyers' demand. Subsequently, suppliers were much more energetic in price negotiations for 4Q22 contracts as they were struggling for market share. Among the major categories of DRAM products, server DRAM suffered the sharpest price drop in 4Q22. Contract prices of DDR4 and DDR5 server DRAM products registered QoQ drops of 23~28% and 30~35% respectively.

It appears things are tougher at Micron than expected, as according to Boise State Public Radio, the company is looking at cutting an additional five percent of its workforce. Back in December, Micron announced it was planning to lay off around 10 percent of its global workforce, which at the time sat at around 49,000 employees, but it appears that cut wasn't enough, as company spokesman Tate Tran has confirmed the total headcount reduction is expected to around 15 percent, although that is for the entire year of 2023. This suggests that there might be several stages of layoffs, unless things improve and demand for Micron's products pick up.

The company is also lowering its capex, not just for 2023, but also for 2024, although the company is expecting more on building new fabs. Micron has already reduced its wafer starts, for both DRAM and NAND flash by around 20 percent. This is all taking place while the company is slowing down its tech node transitions and as such, its 1-gamma note will be moved to 2025. This means that Micron will be stuck at 232-layer 3D TLC NAND for longer than initially planned, which could lead to Micron losing market to its competitors, specifically SK Hynix and Samsung in this case, while allowing other competitors to catch up. Micron will reports is financial Q2 '23 results at the end of March, with previous quarters results indicating that Micron is expecting a drop in revenue of up to US$300 million compared to the previous quarter.

Back in December, Micron CEO Sanjay Mehrotra announced that the company would be laying off around 10 percent of its staff and according to the Idaho Statesman, Micron will start at its Boise, Idaho fab. This is despite the company investing US$15 billion in a new leading-edge fab there. That said, it doesn't look like Boise will see any huge cuts in staff, as Micron hasn't issued a WARN notice, which is required when a company is planning on laying off more than 500 people within a 30-day period.

Micron issued a statement earlier this week, saying that its layoffs are a combination of "voluntary attrition, workforce reductions and reduced external hiring," which tends to mean that third party contractors will bear the brunt of the layoffs. Micron is also said to be cutting executive salaries, while also suspending bonuses for employees across the board. Further cost reductions include a halted share buyback program and a reduced production output, the latter due to lower demand. Micron has some 49,000 employees globally, with some 6,000 located in Idaho. The company expects to have completed its job cuts by the end of this month.

In Japan, the first consumer focused PCIe 5.0 NVMe SSDs have gone on sale and one of these drives has been put through some quick synthetic benchmarks by @momomo_us on Twitter. We're not familiar with the CFD Gaming brand which the drive is sold under, but the CSSD-M2M2TPG5NFZ—as the drive is called—is based on Phison's E26 controller and it's paired with Micron's B58R 3D TLC NAND, suggesting it's based around a reference design from Phison. CFD Gaming offers the drive in 1, 2 and 4 TB sizes and @momomo_us tested the 2 TB version.

Before we go into the performance figures, there's one thing that needs to be highlighted about this drive, it produces a high pitch noise during use, thanks to its tiny 17x17 mm, 21,000 rpm fan from Sunon. @momomo_us provided a video on Twitter which is linked below, so you can hear it in action for yourself. Hopefully this isn't the future of NVMe SSDs, as it's going to put off many potential customers from getting one. @momomo_us only tested the drive with CrystalDiskMark 8.0.4, which shows that sequential write speeds are slightly faster than claimed by CFD Gaming, with the sequential write speeds being bang on the money. For those hoping for higher random performance, things aren't looking so great, as the drive only performs slightly better than the best PCIe 4.0 NVMe drives.

Micron Technology, Inc., today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over previous generations, which is essential to fueling the rapid growth of cores in today's data center processors. Transitioning to DDR5 will help alleviate a potential bottleneck for years to come by providing higher bandwidth to unlock more computer power per processor. Micron DDR5, in combination with 4th Gen Intel Xeon Scalable processors, benefits a wide range of workloads including SPECjbb, which delivers up to 49% performance improvement on benchmarking for Critical-jOPS (Java operations per second) compared to previous generations. In addition to increased memory bandwidth and performance, Micron DDR5 memory is also designed to improve reliability across the data center with features such as on-die Error Correction Code (ODECC) and bounded faults. On-die ECC corrects single-bit errors and detects multi-bit errors.

"The deep collaboration we have established with Intel as a highly valued ecosystem partner, has allowed Micron to remain at the forefront of the industry transition to DDR5," said Raj Hazra, senior vice president and general manager of Micron's Compute and Networking Business Unit. "This work has been pivotal in developing solutions that meet the complex needs and challenges of our data center customers as they convert massive amounts of data into insights."

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

Micron Technology, today announced the Micron 9400 NVMe SSD is in volume production and immediately available from channel partners and to global OEM customers for use in servers requiring the highest levels of storage performance. The Micron 9400 is designed to manage the most demanding data center workloads, particularly in artificial intelligence (AI) training, machine learning (ML) and high-performance computing (HPC) applications. The drive delivers an industry-leading 30.72 terabytes (TB) of storage capacity, superior workload performance versus the competition, and 77% improved input/output operations per second (IOPS). The Micron 9400 is the world's fastest PCIe Gen4 data center U.3 drive shipping and delivers consistently low latency at all capacity points.

"High performance, capacity and low latency are critical features for enterprises seeking to maximize their investments in AI/ML and supercomputing systems," said Alvaro Toledo, vice president and general manager of data center storage at Micron. "Thanks to its industry-leading 30 TB capacity and stunning performance with over 1 million IOPS in mixed workloads, the Micron 9400 SSD packs larger datasets into each server and accelerates machine learning training, which equips users to squeeze more out of their GPUs."

TrendForce's latest analysis of the DRAM market finds that the inventory pressure on suppliers remain significant due to the persistently weak demand for consumer electronics. Among the top three DRAM suppliers, only Samsung has seen a slight drop in inventory level thanks to its highly competitive pricing strategy. To prevent DRAM prices as a whole from making another sharp dive, a few suppliers such as Micron have been cutting production. Therefore, the QoQ decline in DRAM prices are projected to shrink to around 13~18% for 1Q23. However, the slump will have yet to reach the bottom at that time. Regarding the QoQ changes in the prices of the major categories of DRAM products for 1Q23, PC DRAM and server DRAM are projected to again register a drop that is near 20%. Conversely, mobile DRAM will experience the smallest price decline because its profit margin is ready the thinnest.

ASUS today announced the exciting 2023 version of the 16-inch Zenbook Pro 16X OLED (UX7602BZ) creator laptop, featuring a unique Intel processor and a brand-new ASUS Supernova system-on-module (SoM) Design. Developed in partnership with leading technology companies, this new laptop is the most powerful version ever released.

The breakthrough, ultra-compact ASUS Supernova SoM Design enables ultra-powerful performance from the 13th Gen Intel Core i9-13905H processor, NVIDIA GeForce RTX 4080 Laptop GPU with NVIDIA Studio drivers, and support for LPDDR5X DRAM that offers 7500 MHz memory frequency speeds, which is much higher than the previous LPDDR5. The new 2023 Zenbook Pro 16X OLED will noticeably improve video-editing performance and 3D rendering capacity—drastically shortening processing times for creative workflows.

As we're nearing the end of 2022, there is more news about layoffs and this time around it's Micron that is looking at laying off some 10 percent of its workforce. The company announced its FQ1 '23 earnings today, or fiscal quarter one 2023, since not all companies follow the standard year when it comes to financial reporting. Micron saw revenues of US$4,085 billion for the quarter, down from US$6,643 billion in the previous quarter and down from US$7,687 billion the same quarter a year ago. However, the company made a net loss of US$195 million.

Micron's CEO Sanjay Mehrotra stated "Micron's strong technology, manufacturing and financial position put us on solid footing to navigate the near-term environment, and we are taking decisive actions to cut our supply and expenses. We expect improving customer inventories to enable higher revenue in the fiscal second half, and to deliver strong profitability once we get past this downturn." These decisive actions include cutting 10 percent of its workforce according to Reuters, although this won't take place until sometime in 2023. Micron is also planning a cut in its CAPEX plans for its fiscal 2024, i.e. the company won't be investing as heavily as planned in new fabs, despite being granted money to do so by the US government.

YMTC, the Chinese DRAM and NAND flash company that recently announced a 232-layer 3D NAND flash memory that threatened to disrupt entrenched players Samsung, Micron Technology, Kioxia, and SK Hynix, has been blacklisted by the U.S. Department of Commerce, forcing American consumer electronics and PC manufacturers to stop sourcing from the company. Capitalizing on just this, Samsung raised prices of its NAND flash memory chips by as much as 10%, according to a DigiTimes report.

YMTC peaked when Apple struck a NAND flash supply deal with the company in 2020, which would see its storage devices power pretty much every Apple product you can think of, however, under political pressure, Apple withdrew from this deal in 2022. The Department of Commerce contention has been to that YMTC has access to cutting-edge technology, and is backed by Chinese state-capacity, which can help it drive out competitors. All is not well between the U.S. and China geopolitically, either. Samsung's 10% increase in the first half of December 2022 concerns spot-pricing, which could mean its contract pricing (usually used by customers placing very large orders), could be different. It is conceivable that the exit of YMTC from the U.S. market could raise NAND flash product prices across the board.

For those looking at upgrading—or adding an SSD—to their Steam Deck, there's now a new option from Sabrent. The company has launched an M.2 2230 sized version of its Rocket SSD that will be available in sizes of 256 GB, 512 GB and 1 TB. As one would expect, due to the form factor, we're looking at DRAM-less drives. Sabrent has gone with Phison's E21T controller and it has been paired with Micron's B47R, 176-layer NAND.

In other words, we're not talking about a high-performance drive here, but that might be a good thing as well, since it'll produce less heat, which should prevent drive throttling in the tiny space available inside the Steam Deck. Sabrent rates the drives as having a sequential read speed of up to 5,000 MB/s and a sequential write speed of up to 4,300 MB/s. The read IOPS are rated at up to 450K, with the write IOPS at up to 920K, which once again varies between the drive sizes. The 512 GB drive appears to have the overall best performance. The drives are rated for 200, 300 and 600 TBW and come with a five year warranty. No pricing has been revealed so far.

Micron Technology, Inc.,, today announced it is shipping the Micron 2550 NVMe SSD to global PC OEM customers for use in mainstream laptops and desktops. The 2550 is the world's first client SSD to ship using NAND over 200 layers. Delivering performance that eclipses the competition through its density and power advantages, the 2550 provides users with responsiveness and the low power consumption needed to extend battery life for work and home PCs.

"We focused on delivering a superior user experience for PC users with this SSD," said Praveen Vaidyanathan, vice president and general manager of the Client Storage Group at Micron. "The new 2550 SSD builds on our established and broadly adopted PCIe Gen4 architecture. It also incorporates Micron's industry-leading 232-layer NAND and focuses on thermal architecture and power design. These capabilities deliver impressive application performance and phenomenal power savings."

TrendForce reports that the recent easing of tight supply for components has led to rising shipments for enterprise servers. Furthermore, ODMs for the most part have been able to sustain the momentum of data center build-out with the demand from ByteDance and the tenders issued by Chinese telecom companies. Nevertheless, the performance of the enterprise SSD market on the whole has been impacted by falling NAND Flash prices. For 3Q22, the NAND Flash industry's enterprise SSD revenue dropped by 28.7% QoQ to US$5.22 billion. Furthermore, all enterprise SSD suppliers recorded a negative performance for the period as well.

Regarding individual enterprise SSD suppliers' revenue figures for 3Q22, Samsung posted around US$2.12 billion. Its market share also shrank to 40.6% from 44.5% in 2Q22. Samsung's performance was mainly dragged down by the decline in its NAND Flash ASP. In the aspect of product development, SSDs featuring 128L NAND Flash and PCIe 4.0 will remain Samsung's main offerings for enterprise storage during 2023.

Micron Technology, Inc., today announced that in response to market conditions, the company is reducing DRAM and NAND wafer starts by approximately 20% versus fiscal fourth quarter 2022. These reductions will be made across all technology nodes where Micron has meaningful output. Micron is also working toward additional capex cuts. In calendar 2023, Micron now expects its year-on-year bit supply growth to be negative for DRAM, and in the single-digit percentage range for NAND.

Recently, the market outlook for calendar 2023 has weakened. In order to significantly improve total inventory in the supply chain, Micron believes that in calendar 2023, year-on-year DRAM bit supply will need to shrink and NAND bit supply growth will need to be significantly lower than previous estimates. "Micron is taking bold and aggressive steps to reduce bit supply growth to limit the size of our inventory. We will continue to monitor industry conditions and make further adjustments as needed," said Micron President and CEO Sanjay Mehrotra. "Despite the near-term cyclical challenges, we remain confident in the secular demand drivers for our markets, and in the long term, expect memory and storage revenue growth to outpace that of the rest of the semiconductor industry."

Global market intelligence firm TrendForce reports that for 3Q22, the revenue of the whole DRAM industry dropped by 28.9% QoQ to US$18.19 billion. This decline is the second largest to the one that the industry experienced in 2008, when the global economy was rocked by a major financial crisis. Regarding the state of the DRAM market in 3Q22, the QoQ decline in contract prices widened to the range of 10~15% as the demand for consumer electronics continued to shrink. Server DRAM shipments, which had been on a relatively stable trend compared with shipments of other types of DRAM products, also slowed down noticeably from the previous quarter as buyers began adjusting their inventory levels.

Turning to individual DRAM suppliers' performances in 3Q22, the top three suppliers (i.e., Samsung, SK hynix, and Micron) all exhibited a QoQ drop in revenue. Samsung posted US$7.40 billion and a QoQ drop of 33.5%, which was the largest among the top three. SK hynix's revenue fell by 25.2% QoQ to around US$5.24 billion. As for Micron, its revenue came to around US$4.81 billion. Since Micron marks its fiscal quarters differently, its DRAM ASP showed a QoQ decline that was smaller than the ones suffered by the two Korean suppliers. And as a result of this, Micron's QoQ revenue decline was also the smallest among the top three. TrendForce points out that the top three are still maintaining a relatively high operating margin at this moment. Nevertheless, the inventory correction period that has started this year will last through the first half of next year, so they will experience a continuing squeeze on profit.

Eliyan Corporation, credited for the invention of the semiconductor industry's highest-performance and most efficient chiplet interconnect, today announced two major milestones in the commercialization of its technology for multi-die chiplet integration: the close of its Series A $40M funding round, and the successful tapeout of its technology on an industry standard 5-nanometer (nm) process.

Eliyan's NuLink PHY and NuGear technologies address the critical need for a commercially viable approach to enabling high performance and cost-effectiveness in the connection of homogeneous and heterogenous architectures on a standard, organic chip substrate. It has proven to achieve similar bandwidth, power efficiency, and latency as die-to-die implementations using advanced packaging technologies, but without the other drawbacks of specialized approaches.