Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, is proud to announce the launch of the new EMC210 e.MMC (embedded Multi-Media Card) storage solution. The MLC-based EMC210 features simplified interface design, enhanced storage capacities, upgraded performance and a set of comprehensive functions. The small factor e.MMC is an embedded storage ideal for mobile devices, embedded devices and industrial applications, and is compliant with JEDEC (Joint Electron Device Engineering Council) version 4.51 standards.

The e.MMC is comprised of the NAND Flash and the Flash Memory Controller in a 153-ball BGA package. By integrating the controller into the flash memory package, the e.MMC supports the MMC interface and streamlines the development of new products that comply with a simpler set of industry-standard specifications for memory management. Transcend's e.MMC solution provides greater flexibility with interface voltage of either 1.65~1.95V or 2.7V~3.6V. Consequently, manufacturers can benefit from a more efficient design process, lower costs, and reduced time-to-market for end products.

Micron Technology, Inc., and Intel Corporation today revealed the availability of their 3D NAND technology, the world's highest-density flash memory. Flash is the storage technology used inside the lightest laptops, fastest data centers, and nearly every cellphone, tablet and mobile device.

This new 3D NAND technology, which was jointly developed by Intel and Micron, stacks layers of data storage cells vertically with extraordinary precision to create storage devices with three times higher capacity than competing NAND technologies. This enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments.

Toshiba Corporation today announced development of the world's first 48-layer three dimensional stacked cell structure flash memory called BiCS, a 2-bit-per-cell 128-gigabit (16 gigabytes) device. Sample shipments of products using the new process technology start today. The BiCS is based on a leading-edge 48-layer stacking process, which enhances the reliability of write/erase endurance and boosts write speed, and is suited for use in diverse applications, primarily solid state drives (SSD).

Since making the world's first announcement of technology for 3D Flash memory, Toshiba has continued development towards optimizing mass production. To meet further market growth in 2016 and beyond, Toshiba is proactively promoting the migration to 3D Flash memory by rolling out a product portfolio that emphasizes large capacity applications, such as SSD.

OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced a new series of SATA III SSDs to add to its Intrepid 3000 enterprise portfolio. The new Intrepid 3700 SSD Series delivers superior performance and I/O latency responses that dramatically improve application performance and I/O efficiencies, and supports higher storage densities up to 2TB representing OCZ's largest capacity enterprise SATA SSDs to date.

"Datacenter customers have asked for larger solid state drives that do not make any sacrifices in performance or endurance to address the need to manage the ever growing amounts of data being generated by today's computing environments," said Daryl Lang, CTO at OCZ Storage Solutions. "Our new Intrepid 3700 Series is designed to meet these market requirements for an easy to deploy solid state solution that delivers the very best balance of features, endurance, and capacity."

Toshiba Corporation's Semiconductor & Storage Products Company today announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting "command queuing" and "secure write protection". The new products integrate NAND chips fabricated with 15nm process technology and are designed for application in a wide range of digital consumer products, including smartphones, tablets and wearable devices. Sample shipment of the 16GB and 64GB products start today, with 32GB and 128GB products to follow.

The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm generation process technology with a controller to manage basic control functions for NAND applications in a single package. In October 2014, Toshiba launched the industry's first e∙MMC products supporting all mandatory features of JEDEC e∙MMC Version 5.1, which was officially issued by JEDEC on February 24, 2015. The new additions to the line-up support two optional features of e∙MMC Version 5.1, "command queuing" and "secure write protection."

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a high-performance mobile memory storage based on Embedded MultiMediaCard (eMMC) 5.0 technology. The new 128-gigabyte (GB), 3-bit NAND-based eMMC 5.0 storage is targeted at the smartphone and tablet mass markets.

"With the introduction of our value-focused, 3-bit NAND-based eMMC 5.0 line-up, we expect to take the lead in the expansion of high-density mobile storage," said Dr. Jung-Bae Lee, Senior Vice President of Memory Product Planning and Application Engineering Team, Samsung Electronics. "We are continuing to enhance our next-generation embedded mobile memory offerings with improved performance and higher densities to meet increasing customer demand across the mobile industry."

SanDisk Corporation, a global leader in flash storage solutions, today introduced the iNAND 7132 storage solution, the most advanced embedded storage solution from SanDisk to date. Designed for use in flagship mobile devices, the iNAND 7132 storage solution features SanDisk's new iNAND Accelerator Architecture with SmartSLC technology, an innovative new storage architecture that quickly and intelligently responds on-demand to mobile users' needs and gives superior experiences to the most data-intensive applications. Available in capacities up to 64GB, iNAND 7132 storage solution enables original equipment manufacturers (OEMs) to introduce a new generation of high-capacity smartphones, tablets and connected devices that offer exceptional user experiences.

"iNAND 7132 is the perfect high capacity storage solution for the next generation of smartphones, tablets and smart devices," said Drew Henry, senior vice president and general manager for Mobile and Connected Solutions at SanDisk. "Featuring our new iNAND Accelerator Architecture with SmartSLC, our best-in-class iNAND 7132 storage solution delivers amazing performance for faster burst photography and 4K Ultra HD video capture, supports the newest 802.11 standards with ease, and enables blazingly fast data side-loading."

SanDisk Corporation, a global leader in flash storage solutions, today introduced the company's first high endurance microSDXC memory card built to withstand up to 10,000 hours of Full HD Video recording.

Leveraging its deep expertise in NAND flash and systems technology capabilities, SanDisk developed a proprietary technology and process to enable high-intensity recording. Through rigorous testing, the new technology has proven itself to enable the company to reach a new milestone -- a 64GB microSDXC card that allows consumers to write and rewrite up to 10,000 hours of Full HD video recording.

Micron Technology, Inc., and Seagate Technology plc today announced a strategic agreement that establishes a framework for combining the innovation and expertise of both companies. The framework of the agreement will enable customers of the two companies to benefit from a focused approach to deliver industry-leading storage solutions, helping them innovate faster and more effectively

While initially focusing on next-generation SAS SSDs and strategic NAND supply, Micron and Seagate anticipate that this multi-year agreement will extend into future collaboration on enterprise storage solutions featuring Micron NAND flash memory. "As two of our key partners, we look forward to the benefits of this Micron and Seagate collaboration in future NAND flash-based storage technologies," said Mike Kerouac, President of Global Product Operations for EMC Corporation.

"The strategic agreement between Micron and Seagate promises to deliver new and innovative flash-based storage solutions," said Trevor Schick, Senior Vice President, EG Global Supply Chain, HP.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced a pair of next-generation encrypted USB Flash drives designed to safeguard an organization's valuable data. The DataTraveler 4000 Gen. 2 and DataTraveler 4000 Gen. 2 Management Ready protect sensitive information with high-level encryption.

DataTraveler 4000 G2 is FIPS 140-2 Level 3 certified so it provides a tamper-evident seal for physical security to detect and respond to attempts to access, use or modify the cryptographic module. Data is protected by hardware-based 256-bit AES encryption in XTS mode and the drive casing is made of titanium coated stainless steel. The drive is designed to reduce the possibility of successful brute force attacks as it locks down and reformats after 10 failed password attempts.

SanDisk Corporation, a global leader in flash storage solutions, today introduced a new suite of robust, automotive grade NAND flash solutions designed for next-generation 'connected cars' and automotive infotainment systems. SanDisk Automotive storage solutions are optimized to bring reliable, high-performance storage to a wide range of in-vehicle applications, including 3D mapping and advanced augmented reality in navigation systems, entertainment systems, intuitive driver assist technology, data event recorders, and more. By providing the responsiveness and capacity of SanDisk flash storage technology, SanDisk Automotive solutions offer the potential for car manufacturers to continue to push the boundaries of connected car application experience.

Today's vehicles are rapidly becoming more technologically sophisticated, with many featuring advanced connected applications that were once only possible on a smartphone. A recent Gartner Research report forecasted that "about one in five vehicles on the road worldwide will have some form of wireless network connection by 2020, amounting to more than 250 million connected vehicles in service".

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, is honored to announce that its XPG Z1 DDR4 3333 Gold Edition computer memory is able to clock up to 4255MHz CL17 when used with an ASUS ROG Rampage V Extreme motherboard cooled with liquid nitrogen. This creates a new overclocking world record for production line DDR4 memory.

In cooperation with motherboard manufacturers, ADATA strives to achieve the best performance in DDR4 memory compliant with the Intel X99 architecture. The XPG Z1 DDR4 3333 Gold Edition breaks the record with extremely high clock frequency of 4255MHz CL17, impressing both gamers and standard CPU clock users alike with outstanding sustained performance, cooling and stability! XPG Z1 DDR4 3333 overclocking memory keeps stable supply to fulfill the market demand, enabling every overclocker, gamer or enthusiast to pursue the ultimate in performance.

Plextor launched its flagship SSD for PC enthusiasts, the M6e Black Edition. Clearly intended for enthusiast PC builds, miles away from an enterprise environment, this drive features a focus on product design, with its matte black PCB, full-length metal shroud, and a racy red aluminium heatsink popping out from a cutout in that shroud. This heatsink cools the controller and NAND flash chips. The drive comes in three capacities - 128 GB, 256 GB, and 512 GB.

Under the hood, the M6e Black Edition is essentially an M.2 riser with PCI-Express 2.0 x4 wiring. The drive sitting on its M.2 slot is driven by a Marvell 88SS9183 controller, wired to Toshiba-made 19 nm Toggle NAND flash, and 1 GB of DRAM cache. The drive offers sequential transfer rates of up to 770 MB/s reads, with up to 625 MB/s writes; with up to 105,000 IOPS 4K random reads, and up to 100,000 IOPS 4K random writes. In addition to PCIe bus power, the drive requires power from a SATA power connector. Features include PlexTurbo 2.0 technology that shuttles hot data to system memory, TRIM, NCQ, and NVMe. The drive is bootable.

Patriot, a leading manufacturer of computer memory, USB/flash, SSDs and mobile accessories, today launched its latest addition to the solid-state drive (SSD) market, the Patriot Ignite SATA III SSD. One of the fastest drives available, the Ignite has record shattering speeds and impressive capacities to boost PC performance at a cost efficient value.

Boasting Patriot's largest capacity SSD yet, the Ignite will be available to consumers in capacities of 480GB and 960GB meeting an ever-growing demand for larger and faster storage solutions. The Patriot Ignite is a first-rate option for content creators, gamers and performance enthusiasts looking to upgrade their system response time without spending thousands of dollars on a new computer.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards is hosting a press conference today to launch two new products, the GIGABYTE X99-SOC Champion motherboard as well as a new GIGABYTE BRIX compact PC built around the new 5th Gen Intel Core processors. Held at the Neopolitan Ballroom of the Caesars Palace in Las Vegas, USA, the press event also includes a live overclocking demonstration where the new motherboard will be put to the test by GIGABYTE's evangelist overclockers HiCookie, Sofos1990 and Dinos22. Currently holding the highest DDR4 memory frequency World Record, the GIGABYTE X99-SOC Champion will be overclocked on Liquid Nitrogen to see if a new world record can be achieved live at the event.

From January 6th until the 8th, GIGABYTE will be showcasing their latest hardware solutions at the Neopolitan Ballroom of the Caesars Palace including 10 custom made demo systems especially for CES by system builders such as Cyberpower, iBuypower, Origin PC, Maingear, XOTIC PC, Falcon NW and Digital Storm. A few case mods will also be on display from renowned case modders Richard Surroz, Bob Stewart and Larry Andersen.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today launched the 850 EVO, the latest addition to its branded solid state drive (SSD) line-up. Based on Samsung's 3-bit 3D Vertical NAND (V-NAND) technology, the 850 EVO SSD provides a significant boost in performance and endurance as compared to its predecessor, making it ideal for use in mainstream PCs. With the slogan of "a new caliber of performance & endurance," the new drive will be globally launched in a total of 53 countries in the United States, Europe and Asian markets later this month.

"We are thrilled to be providing users with an improved computing experience through the new 850 EVO SSDs," said Unsoo Kim, Senior Vice President of the Branded Product Marketing team at Samsung Electronics. "Samsung will continue to introduce V-NAND-based SSDs in a variety of form factors, while accelerating the growth of the global SSD market."

Marvell, a worldwide leader in providing complete silicon solutions from mobile communications to storage, Internet of Things (IoT), cloud infrastructure, digital entertainment and in-home content delivery and Kinoma software enabling the "Smart Life and Smart Lifestyle," today announced the world's first DRAM-less NVMe (Non-Volatile Memory Express) solid state drive (SSD) controller for mass market mobile computing solutions with industry-leading NANDEdge low-density parity check (LDPC) technology supporting triple-level cell (TLC) and 3D NAND. Marvell's 88NV1140 and 88NV1120 enable small form factor SSD solutions with unparalleled performance for integration into low-z-height tablets, Chrome devices and the upcoming wave of new 2-in-1 hybrid/detachable mobile PC platforms.

"As mobile computing and cloud-based services become an integral part of our daily lives, fast, secure, reliable and cost effective storage solutions with a small form factor are the key to bringing the benefit of technology to the mass market. I believe our latest game-changing SSD controller will drive the fast deployment of a new wave of small form factor SSD solutions for the mass market mobile computing platforms," said Weili Dai, President and Co-Founder of Marvell. "I am very pleased to see Marvell's leadership and our long track record of invention and innovation including the world's first DRAM-less NVMe SSD controller and the industry's most advanced LDPC technology enabling the latest TLC and 3D NAND flash memory. I am very thankful for our global engineering teams who continuously raise the technology bar to move our industry forward faster."

More details emerged, of Samsung's next mainstream SSD, the 850 EVO. The drive will launch in five capacities, starting with 120 GB, and including 250 GB, 500 GB, 750 GB, and 1000 GB variants. Built in the 7 mm-thick, 2.5-inch, form-factor, with SATA 6 Gb/s interface, the drive will be based on Samsung's next-generation 3-bit 3D V-NAND chips, with an updated in-house made controller. The drive is now expected to launch some time in January, 2015. It will offer lower price-per-GB than the 850 Pro series, and slightly lower performance; targeting the mainstream market.

The shrinking NAND Flash production costs resulting from the NAND Flash industry's improving technology are expected to boost demand for various end products, including SSDs and eMMCs, according to DRAMeXchange, a research division of TrendForce. NAND Flash industry value is expected to rise consistently in 2015, reaching as high as US$ 27.6 billion on annual growth of 12%.

Based on the tendency for new hardware devices to be released in the third and fourth quarters of each year and the likelihood of demand being restrained in the first two quarters, Sean Yang, an assistant vice president of DRAMeXchange, believes the NAND Flash market will thrive mostly during the second half of 2015 rather than during the first half. Increased NAND Flash demand in both the third and fourth quarters is expected to benefit the NAND Flash industry tremendously by easing any potential oversupply that occurs in the two preceding quarters and allowing the market to reach a potential balance. By the end of 2015, the NAND Flash industry has a good chance of remaining healthy and growth is expected to continue.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, announces its updated DuraDrive AT7 built for approved automotive In-Vehicle-Infotainment (IVI) systems.

The DuraDrive AT7 is Super Talent's latest industrial data storage solution that offers enhanced durability and high capacity. With the ability to withstand temperatures between -40°C to 85° paired with read speeds of up to 500 MB/s and write speeds of up to 400 MB/s, the AT7 is a powerhouse built to cover all your automotive needs, withstanding all elements of vibration and shock in the most mission critical of situations.

Toshiba Corporation's Semiconductor & Storage Products Company today announced the expansion of its line-up of enterprise SSDs with the addition of two new series of enterprise SSDs - the HK3R2 series for read-intensive workloads and the HK3E2 series for value-endurance workloads. These 6Gbit/s SATA enterprise SSDs join Toshiba's broad portfolio of enterprise storage solutions featuring a variety of endurance ratings to meet the needs of specific application requirements and customer environments. Shipment starts from today.

Read-Intensive HK3R2 Series: Available in capacities up to 960GB in a 2.5-inch standard form-factor (7mm Z-height). The HK3R2 series is designed for read-intensive applications and workloads such as read caching, video streaming and data center storage. It has an endurance rating of one DWPD (drive writes per day) for five years with a random 4KB enterprise workload.

PMC-Sierra, Inc. (PMC), the semiconductor and software solutions innovator transforming networks that connect, move and store big data, today announced that Memblaze Technology Co. Ltd, a leading provider of flash storage solutions, is utilizing PMC's Flashtec NVM Express (NVMe) controllers in its next-generation PCI Express (PCIe) flash accelerators.

The Flashtec-based Memblaze PBlaze4 products are targeted at hyperscale and Open Compute Project deployments. They provide ultra-low latency and the lowest CPU load in the industry, with read and write capabilities of up to 850,000 I/Os per second (IOPS) for random read and 265,000 IOPS for random write and 3.2 GB/s sequential read, 2.5 GB/s sequential write performance. Memblaze products enable its customers to define and alter key settings to ensure optimum performance in specific applications and platforms.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, announces line of DDR4 DRAM modules. DDR4 is the successor to DDR3 which is widely used in global enterprise computing solutions. Chip support for DDR4 comes with Intel's next-generation Xeon server processors based on Haswell architecture.

DDR4 provides double the rate of data that DDR3 is able to and allows for increased module densities to provide greater DRAM capacity. In addition, the power usage of these modules is 1.2V compared to DDR3's 1.5V - 20% lower than the previous generation's standard power draw. With lower power usage and higher bandwidth to work with, overhead costs can be reduced while providing increased bandwidth.

OCZ Storage Solutions -- a Toshiba Group Company and leading provider of high-performance solid-state drives (SSDs) for computing devices and systems, today announced its new enterprise-class Saber 1000 SSD Series designed for read-intensive applications targeting high-volume deployment hyperscale, web-hosting and distributed computing environments. The SATA-based Saber 1000 Series solves demanding key customer business challenges and supported by an enterprise-optimized feature-set, large storage capacities, and low total cost of ownership (TCO).

The new series leverages the latest A19nm NAND flash from Toshiba and is available in 240GB, 480GB and 960GB usable capacities. It utilizes OCZ's internally developed Barefoot 3 controller and firmware which delivers consistent sustained I/O performance across all capacities to accelerate enterprise applications.

OCZ Storage Solutions - a Toshiba Group Company and the most awarded solid state drive (SSD) brand of all time, today announced availability of the new Vertex 460A SATA III SSD series for mainstream users. This line includes all the features and performance specifications of the popular Vertex 460 series, with new enhancements including the use of next generation Toshiba A19 MLC NAND flash, and the Company's innovative ShieldPlus Warranty.

Hitting shelves this week, Vertex 460A SSDs were designed to provide the very best of both worlds for those seeking high-end performance and accessories at a competitive price point. With the proven OCZ Barefoot 3 controller at its core, Vertex 460A provides performance that stands apart from other solutions with focus on real world metrics such as sustained performance and mixed workloads, all designed to provide a faster, more responsive computing experience.