MSI, a global leader in gaming PC hardware, is thrilled to announce the release of its highly anticipated SSD powerhouse, the SPATIUM M580 FROZR, ushering in a new era of storage performance. With cutting-edge technology and innovative thermal solutions, this SSD is set to redefine the standards of speed and reliability in storage solutions.

SPATIUM M580 FROZR, Reaching New Heights with Crowned Speeds
The SPATIUM M580 FROZR sets a new benchmark in storage performance with its revolutionary features. Powered by the state-of-the-art PHISON E26 PCIe Gen 5 controller and equipped with advanced 3D NAND flash modules boasting 232 layers, this SSD achieves mind-blowing read speeds of up to 14.6 GB/s and write speeds of up to 12.7 GB/s, up to 2 times faster transfer rates compared to current PCIe 4.0 SSDs. This represents a significant leap in speeds, boosted by a DRAM cache buffer and a SLC Cache, providing users with lightning-fast data access and gaining valuable milliseconds in latency for gaming, content creation, and professional applications. Additionally, the M580 FROZR is fortified with LPDC ECC and E2E Data Protection, ensuring data integrity and reliability. With a high TBW (Terabytes Written) value and backed by a comprehensive 5-year warranty, users can trust in the durability and longevity of the SPATIUM M580 FROZR in 1 TB, 2 TB and 4 TB variants after an easy installation.

Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory module portfolio and showcased its latest HBM3E technology, reinforcing leadership in high-performance and high-capacity solutions for AI applications.

In a keynote address to a packed crowd at Santa Clara's Computer History Museum, Jin-Hyeok Choi, Corporate Executive Vice President, Device Solutions Research America - Memory at Samsung Electronics, along with SangJoon Hwang, Corporate Executive Vice President, Head of DRAM Product and Technology at Samsung Electronics, took the stage to introduce new memory solutions and discuss how Samsung is leading HBM and CXL innovations in the AI era. Joining Samsung on stage was Paul Turner, Vice President, Product Team, VCF Division at VMware by Broadcom and Gunnar Hellekson, Vice President and General Manager at Red Hat to discuss how their software solutions combined with Samsung's hardware technology is pushing the boundaries of memory innovation.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today introduced the new generation FerriSSD NVMe PCIe Gen 4 x4 BGA SSD. This latest solution features support for i-temp and integrates advanced IntelligentSeries technology, delivering robust data integrity in extreme temperature environments that meet the rigorous demands of industrial embedded systems and automotive applications.

The latest FerriSSD BGA SSD supports PCIe Gen 4 x4 and uses high density 3D NAND within a compact 16 mm x 20 mm BGA chip-scale package. With storage capacities up to 1 TB, these high-performance embedded SSDs utilize Silicon Motion's latest innovations to achieve high sequential read speeds exceeding 6 GB/s and sequential write speeds exceeding 4 GB/s. Equipped with Silicon Motion's proprietary IntelligentSeries data protection technology that enhances reliability and performance through the use of encryption, data caching, data scanning and protect features, as well as supporting the i-temp requirements of operating in extreme temperatures from -40°C to + 85°C. This latest FerriSSD offers a high performance and highly reliable embedded storage solution for a broad range of applications and operating environments including in-car computing, thin client computing, point-of-sale terminals, multifunction printers, telecommunications equipment, factory automation tools, and a wide range of server applications.

InnoGrit's low-wattage 12 nanometer IG5666 controller popped up on the T-FORCE GE PRO PCIe 5.0 SSD series earlier in the year, but attention has turned to another consumer-grade design. Parent company—Yingren Technology—is not well known outside of China, although its InnoGrit brand has started to make inroads within Western markets. The enterprise-level YRS900 PCIe 5.0 SSD controller was announced last September—this open-source RISC-V-based solution was designed/engineered to "align with U.S. export restrictions." According to cnBeta and MyDrivers reports, a new YRS820 controller has successfully reached the mass production phase. This is a PCIe 5.0 consumer-grade controller, likely derived from its big sibling (YRS900).

According to InnoGrit presentation material, their new model is based on: "RISC-V instruction architecture, adopts a 4-channel PCIe 5.0 interface, is equipped with 8 NAND flash memory channels, supports NVMe 2.0 protocol, has an interface transmission rate of 2667MT/s, can be paired with 3D TLC/QLC, and supports a maximum capacity of up to 8 TB." Company representatives stated that the YRS820 controller is destined to be fitted on high-end consumer parts—the AI PC market segment is a key goal, since the YRS820 is able to: "accelerate data processing for specific applications and have high stability, consistency and security." cnBeta highlighted some anticipated performance figures: "YRS820 achieves sequential read 14 GB/s, sequential write 12 GB/s, random read and random write up to 2000K IOPs and 1500K IOPs respectively." InnoGrit did not reveal a release timetable, since their latest consumer-grade controller is going through a validation process. The company is currently collaborating with domestic NAND flash memory and DRAM manufacturers, as well as other industry bodies.

SK hynix press release about its upcoming PCB01 PCIe 5.0 SSD was a bit light on details and Anandtech got a closer look at the upcoming drive at GTC 2024. Not entirely unsurprising, the drive will be called the Platinum P51 rather than the PCB01, which is a continuation of the branding SK hynix is using for its current range of SSDs. As we already know, it'll feature a custom SK hynix controller and no further data was revealed to Anandtech, but the publication did manage to get some more details with regards to the NAND flash used.

The Platinum P51 is SK hynix first consumer SSD with its new-ish 238-layer 4D NAND flash based on the company's PUC (peri. under cell) technology, which places the peripheral circuits under the cell array. The official performance figures of the Platinum P51 appears to be somewhat lower than the press release from earlier today stated, with sequential read speeds of up to 13.5 GB/s and sequential write speeds of 11.5 GB/s. SK hynix will apparently release the drive in the typical SSD sizes of 500 GB, 1 TB and 2 TB. It'll be interesting how SK hynix in-house controller will compare to the second generation of Phison E26 based drives paired with Micron B58R NAND flash once it becomes available later this year.

SK hynix unveiled a new consumer product based on its latest solid-state drive (SSD), PCB01, which boasts industry-leading performance levels at GPU Technology Conference (GTC) 2024. Hosted by NVIDIA in San Jose, California from March 18-21, GTC is one of the world's leading conferences for AI developers. Applied to on-device AI PCs, PCB01 is a PCIe fifth-generation SSD which recently had its performance and reliability verified by a major global customer. After completing product development in the first half of 2024, SK hynix plans to launch two versions of PCB01 by the end of the year which target both major technology companies and general consumers.

Optimized for AI PCs, Capable of Loading LLMs Within One Second
Offering the industry's highest sequential read speed of 14 gigabytes per second (GB/s) and a sequential write speed of 12 GB/s, PCB01 doubles the speed specifications of its previous generation. This enables the loading of LLMs required for AI learning and inference in less than one second. To make on-device AIs operational, PC manufacturers create a structure that stores an LLM in the PC's internal storage and quickly transfers the data to DRAMs for AI tasks. In this process, the PCB01 inside the PC efficiently supports the loading of LLMs. SK hynix expects these characteristics of its latest SSD to greatly increase the speed and quality of on-device AIs.

TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilization rates to nearly 90%—a move not widely adopted by their competitors.

TrendForce points out that to meet the demand surge in the second half of the year, especially given Kioxia and Western Digital's currently low inventory, the production increase is mainly targeting 112-layer and select 2D products. This strategy is expected not only to secure profitability within the year but also to contribute to a projected 10.9% rise in the annual NAND Flash industry supply bit growth rate for 2024.

Phison Electronics, a leading provider of NAND controllers and storage solutions, today announced aiDAPTIV+ partnerships with ASUS, Gigabyte, MAINGEAR, and MediaTek. At GTC 2024, Phison and partners will demonstrate aiDAPTIV+, a hybrid hardware and software large language model (LLMs) fine-tune training solution that enables small and medium-sized businesses (SMBs) to process and retain local control of their sensitive machine learning (ML) data.

Foundational training of LLMs gives a broad understanding of language but aiDAPTIV+ enables the fine-tuning process that molds these models into specialized tools capable of understanding the topics that deliver precise results for your business needs. Commodity workstation hardware is enhanced with aiDAPTIV+ software, and first generation aiDAPTIVCache Series ai100 SSDs to enable larger training models than previously possible in a workstation form-factor.

MAINGEAR, a leading provider of high-performance custom PC systems, and Phison, a global leader in NAND controllers and storage solutions, today unveiled groundbreaking MAINGEAR PRO AI workstations with Phison's aiDAPTIV+ technology. Specifically engineered to democratize Large Language Model (LLM) development and training for small and medium-sized businesses (SMBs), these ultra-powerful workstations incorporate aiDAPTIV+ technology to deliver supercomputer LLM training capabilities at a fraction of the cost of traditional AI training servers.

As the demand for large-scale generative AI models continues to surge and their complexity increases, the potential for LLMs also expands. However, this rapid advancement in LLM AI technology has led to a notable boost in hardware requirements, making model training cost-prohibitive and inaccessible for many small to medium businesses.

With the effective reduction of production by suppliers, the price of memory is rebounding, and the semiconductor memory market finally shows signs of recovery. From the perspective of market dynamics and demand changes, NAND Flash, as one of the two major memory products, is experiencing a new round of changes. Since 3Q23, NAND Flash chip prices have been on the rise for several consecutive months. TrendForce believes that, under the precondition of a conservative market demand prospect for 2024, chip price trends will depend on suppliers' production capacity utilization.

There have been frequent developments in the NAND flash memory industry chain, with some manufacturers indicating a willingness to raise prices or increase production capacity utilization. Wallace C. Kou, General Manager of NAND Flash Supplier SIMO, stated that prices for the second quarter of NAND Flash have already been settled down, which will increase by 20%; some suppliers have started to make profits in the first quarter, and most suppliers will earn money after the second quarter.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

As the IT sector continues to seek answers for scaling data processing performance while simultaneously improving efficiency - in terms of performance and density per watt, per system, per rack, and per dollar of CapEx and OpEx - ScaleFlux is answering the call with innovative design choices in its SSD controllers. The SFX 5016 promises to set new standards both for performance and for power efficiency.

In addition to carrying forward the transparent compression feature that ScaleFlux first released in 2020 in upgraded in 2022 with the SFX 3016 computational storage drive controller, the new SFX 5016 SOC processor includes a number of design advances.

According to TPU's SSD database, the Microsoft Z1000 M.2 22110 form factor solid-state drive launched back in 2020—last week, well-known hardware tipster, yuuki_ans, leaked a set of photos and specifications. Their March 7 social media post showcases close-ups of a potential enterprise product—sporting a CNEX Labs CNX-2670AA-CB2T controller, Toshiba BiCS4 96-layer eTLC NAND flash dies and 1 GB Micron MT40A1G8SA-075:E DDR4 RAM cache. The mysterious storage device appears to be an engineering sample (PV1.1)—an attached label lists a possible manufacturing date of May 18, 2020, but its part number and serial code are redacted in yuuki's set of photos. PCIe specifications are not disclosed, but experts reckon that a 4.0 standard is present here (given the prototype's age).

The long form factor and presence of a CNEX Labs controller suggest that Microsoft has readied a 960 GB capacity model for usage in data servers. Unoccupied spaces on the board provide evidence of different configurations. Extra BGA mounting points could introduce another DRAM chip, and there is enough room for additional capacitors—via solder pads on both sides of the Z1000's PCB. It is speculated that 2 TB and 4 TB variants exist alongside the leaked 960 GB example—a "broad portfolio" of finalized Z1000 products could be in service right now, but the wider public is unlikely to see these items outside of Microsoft facilities.

The third quarter of 2023 witnessed suppliers dramatically cutting production, which underpinned enterprise SSD prices. The fourth quarter saw a resurgence in contract prices, driven by robust buying activity and heightened demand from server brands and buoyed by optimistic capital expenditure forecasts for 2024. This, combined with increased demand from various end products entering their peak sales period and ongoing reductions in OEM NAND Flash inventories, resulted in some capacity shortages. Consequently, fourth-quarter enterprise SSD prices surged by over 15%. TrendForce highlights that this surge in demand and prices led to a 47.6% QoQ increase in enterprise SSD industry revenues in 4Q23, reaching approximately $23.1 billion.

The stage is set for continued fervor as we settle into the new year and momentum from server brand orders continues to heat up—particularly from Chinese clients. On the supply side, falling inventory levels and efforts to exit loss-making positions have prompted enterprise SSD prices to climb, with contract prices expected to increase by over 25%. This is anticipated to fuel a 20% revenue growth in Q1.

TrendForce reports a substantial 24.5% QoQ increase in NAND Flash industry revenue, hitting US$11.49 billion in 4Q23. This surge is attributed to a stabilization in end-demand spurred by year-end promotions, along with an expansion in component market orders driven by price chasing, leading to robust bit shipments compared to the same period last year. Additionally, the corporate sector's continued positive outlook for 2024 demand—compared to 2023—and strategic stockpiling have further fueled this growth.

Looking ahead to 1Q24, despite it traditionally being an off-season, the NAND Flash industry is expected to see a continued increase in revenue by another 20%. This anticipation is underpinned by significant improvements in supply chain inventory levels and ongoing price rises, with clients ramping up their orders to sidestep potential supply shortages and escalating costs. The ongoing expansion of order sizes is expected to drive NAND Flash contract prices up by an average of 25%.

Samsung Electronics, the world leader in advanced memory technology, today announced that it has started sampling its 256-gigabyte (GB) SD Express microSD card with sequential read speed of up to 800 megabytes per second (MB/s) and has commenced mass production of its 1-terabyte (TB) UHS-1 microSD card. With the introduction of its next-generation microSD card line-up, Samsung aims to provide differentiated memory solutions required for tomorrow's mobile computing and on-device AI applications.

"With our two new microSD cards, Samsung has provided effective solutions to address the growing demands of mobile computing and on-device AI," said Hangu Sohn, Vice President of the Memory Brand Product Biz Team at Samsung Electronics. "Despite their tiny size, these memory cards deliver powerful SSD-like performance and capacity to help users get more out of demanding modern and future applications."

Micron Technology, Inc. announced today that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in the world's most compact UFS package at 9x13 millimeters (mm). Built on its advanced 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides best-in-class performance and end-to-end innovation, enabling faster and more responsive experiences on flagship smartphones.

Micron UFS 4.0 accelerates data-intensive experiences with up to 4300 megabytes per second (MBps) sequential read and 4000 MBps sequential write speed, twice the performance of previous generations. With these speeds, users will be able to launch their favorite productivity, creativity, and emerging AI apps more quickly. Large language models in generative AI applications can be loaded 40% faster, resulting in a smoother experience when initializing conversations with AI digital companions.

Transcend, a premier manufacturer of embedded memory products and storage solutions, is proud to announce the launch of the all-new MTS570P, a Power Loss Protection (PLP) SSD aimed at enhancing storage reliability for embedded systems. Engineered with a compact form factor without compromising on performance, it is an ideal solution for edge servers, IoV systems, network switches, POS machines, and various other types of edge devices.

Power Loss Protection (PLP) stands as a critical feature in modern embedded systems, particularly when used in rugged environments. Its main purpose is to safeguard data integrity during unstable power supply or unexpected power loss/failure, ultimately enhancing overall system reliability and safety by providing a stable and secure storage solution.

Patriot Memory, a leading manufacturer of high-performance enthusiast memory modules, SSDs, flash storage, and gaming peripherals, proudly introduces the Viper PV553 M.2 2280 PCIe Gen 5 x4 SSD. This groundbreaking SSD is designed with the core idea of delivering next-gen performance, featuring an innovative active cooling system.

The PV553 introduces a revolutionary cooling solution as Patriot's first SSD with a blower fan design. Patriot Memory's cutting-edge advancements ensure active thermal dissipation, providing consistent cooling even during extended usage for intense gaming sessions. Crafted with premium materials and a slim 16.5 mm aluminium heat shield, the PV553 incorporates an embedded thermal sensor, guaranteeing unwavering high performance. With a 5-year warranty, this SSD exemplifies quality and reliability.

Kioxia Corporation and Western Digital Corporation announced today that their joint venture manufacturing facilities at Yokkaichi and Kitakami plants have been approved to receive an up to 150 billion yen subsidy, including facilities that will produce its latest generation of 3D flash memory based on the innovative wafer bonding technology and future generation advanced nodes. The subsidy will be granted under a designated government program aimed at facilitating corporate investment in cutting-edge semiconductor production facilities and securing stable production of semiconductors in Japan. This marks the second time that Kioxia's and Western Digital's joint venture manufacturing facilities are receiving this subsidy from the Japanese government. Previously, the joint venture manufacturing facility at Yokkaichi was approved to receive up to 92.9 billion yen subsidy from the Japanese government in 2022.

Leveraging an over 20-year joint venture partnership, Kioxia and Western Digital will continue to enhance the development and production capabilities of cutting-edge flash memory at the Yokkaichi and Kitakami plants in Japan. In addition, the two companies will contribute to the development of semiconductor-related industries and talent.

With the advent of high-resolution video and surveillance systems, the demand for stable performance (Sustained Performance) and Power Loss Protection in SSD storage devices continues to rise among video recording equipment and surveillance system integrators. Therefore, Phison Electronics (8299TT), a leading provider of NAND controllers and NAND storage solutions, today announced the launch of specialized SSD storage solutions for video and surveillance systems, including the mid-high-range S12DI and the cost-effective S17T SSD solutions.

With the advent of high-resolution video and surveillance systems, the demand for stable performance (Sustained Performance) and Power Loss Protection in SSD storage devices continues to rise among video recording equipment and surveillance system integrators. Therefore, Phison Electronics (8299TT), a leading provider of NAND controllers and NAND storage solutions, today announced the launch of specialized SSD storage solutions for video and surveillance systems, including the mid-high-range S12DI and the cost-effective S17T SSD solutions.

Phison Electronics, a leading provider of NAND controllers and NAND storage solutions, today announced it has introduced a full range of UFS (Universal Flash Storage) controllers (PS8325, PS8327, PS8329, PS8361). Phison's new UFS solutions support entry-level, middle, premium and flagship smartphone devices to achieve maximum performance in mobile storage and enhance user experiences.

As smartphone devices require higher performance, the storage devices of many entry-level 5G models have transitioned from eMMC to UFS 2.2 storage, and even flagship models of 4G phones have begun adopting the UFS 2.2 specification. Compared to the half-duplex mode of eMMC, the full-duplex mode of UFS 2.2 significantly increases read speeds by three times, not only handling smartphone functions that require processing large amounts of data (such as high-resolution recording and video playback), but also consuming lower power under the same performance speed as eMMC. This helps improve the battery life of smartphones and tablets, meeting the high-performance and low-power consumption needs of mobile devices.

Japanese tech giant Canon hopes to shake up the semiconductor manufacturing industry by shipping new low-cost nanoimprint lithography (NIL) machines as early as this year. The technology, which stamps chip designs onto silicon wafers rather than using more complex light-based etching like market leader ASML's systems, could allow Canon to undercut rivals and democratize leading-edge chip production. "We would like to start shipping this year or next year...while the market is hot. It is a very unique technology that will enable cutting-edge chips to be made simply and at a low cost," said Hiroaki Takeishi, head of Canon's industrial group overseeing nanoimprint lithography technological advancement. Nanoimprint machines target a semiconductor node width of 5 nanometers, aiming to reach 2 nm eventually. Takeishi said the technology has primarily resolved previous defect rate issues, but success will depend on convincing customers that integration into existing fabrication plants is worthwhile.

There is skepticism about Canon's ability to significantly disrupt the market led by ASML's expensive but sophisticated extreme ultraviolet (EUV) lithography tools. However, if nanoimprint can increase yields to nearly 90% at lower costs, it could carve out a niche, especially with EUV supply struggling to meet surging demand. Canon's NIL machines are supposedly 40% the cost of ASML machinery, while operating with up to 90% lower power draw. Initially focusing on 3D NAND memory chips rather than complex processors, Canon must contend with export controls limiting sales to China. But with few options left, Takeishi said Canon will "pay careful attention" to sanctions risks. If successfully deployed commercially after 15+ years in development, Canon's nanoimprint technology could shift the competitive landscape by enabling new players to manufacture leading-edge semiconductors at dramatically lower costs. But it remains to be seen whether the new machines' defect rates, integration challenges, and geopolitical headwinds will allow Canon to disrupt the chipmaking giants it aims to compete with significantly.

The PC master race has yielded many interesting activities for enthusiasts alike, with perhaps the pinnacle of activities being overclocking. Usually, subjects for overclocking include CPUs, GPUs, and RAM, with other components not actually being capable of overclocking. However, the enthusiast force never seems to settle, and today, we have proof of overclocking an off-the-shelf 2.5-inch SATA III NAND Flash SSD thanks to Gabriel Ferraz, a Computer Engineering graduate, and TechPowerUp's SSD database maintainer. He uses the RZX Pro 256 GB SSD in the video, a generic NAND Flash drive. The RZX Pro uses the Silicon Motion SM2259XT2 single-core, 32-bit ARC CPU running up to 550 MHz. It has two channels at 400 MHz, each with eight chip enable interconnects, allowing up to 16 NAND Flash dies to operate. The SSD doesn't feature a DRAM cache or support a host memory buffer. It has only one NAND Flash memory chip from Kioxia, uses BiCS FLASH 4 architecture, has 96 layers, and has 256 GB capacity.

While this NAND Flash die is rated for up to 400 MHz or 800 MT/s, it only ran at less than half the speed at 193.75 MHz or 387.5 MT/s at default settings. Gabriel acquired a SATA III to USB 3.0 adapter with a JMS578 bridge chip to perform the overclock. This adapter allows hot swapping of SSDs without the need to turn off the PC. He shorted two terminals in the drive's PCB to get the SSD to operate without its default safe mode. Mass Production Tools (MPTools), which OEMs use to flash SSDs, were used to change the firmware settings. Each NAND Flash architecture has its own special version of MPTools. The software directly shows control of the Flash clock, CPU clock, and output driving. However, additional tweaks like Flash IO driving with subdivisions need modifications. Control and Flash On-Die Termination (ODT) and Schmitt window trigger (referring to the Schmitt trigger comparator circuit) also needed a few modifications to make it work.

TrendForce's latest analysis reveals that the downswing of DRAM contract prices, which had lasted for eight consecutive quarters since 4Q21, was finally reversed in 4Q23. Likewise, NAND Flash rebounded in 3Q23 after four quarters of decline. The persistence of this rally in memory prices during 2024 will largely hinge on suppliers' ongoing and effective control over their capacity utilization rates.

According to TrendForce Senior Research Vice President, Avril Wu, the first quarter of this year is already shaping up to be a season of growth, with TrendForce confirming its initial projections: a hike of around 13-18% QoQ for DRAM contract prices and a hike of 18-23% for NAND Flash contract prices. Despite a generally conservative outlook for overall market demand in 2Q24, suppliers in both DRAM and NAND Flash markets have begun raising their capacity utilization rates since the end of 4Q23. Furthermore, NAND Flash buyers are anticipated to complete their inventory restocking in advance in 1Q24. Due to the rise in capacity utilization rates and earlier restocking efforts, leading to a more moderated QoQ price increase of 3-8% for both DRAM and NAND Flash contract prices for 2Q24.