We are excited to announce the upcoming availability of the new Shuttle DN11-Series, featuring the DN11H5, DN11H7, and DN11H9. These AI-powered, high-performance barebone PCs are designed to meet the needs of modern business, industrial, and creative applications.

Powerful AI Performance in a Compact Form
At the heart of the DN11-Series are Intel Core Ultra processors, offering a significant performance boost with their hybrid core architecture, Intel Arc graphics, and a dedicated NPU (Neural Processing Unit) for AI acceleration. These systems provide up to 34 TOPS of AI performance, making them ideal for machine learning, data analysis, multimedia processing, and industrial automation.

AMD presented its next generation mobile processor that succeeds its current Ryzen AI 300 "Strix Point" to its industry partners. This presentation allegedly got leaked to the web. The 2026 successor to "Strix Point" is codenamed "Gorgon Point," and offers a significant single-threaded performance uplift while interestingly retaining the CPU core and iGPU IP. The slides mention "Gorgon Point" as combining up to 12 CPU cores based on "Zen 5" or "Zen 5c," an iGPU based on the RDNA 3.5 graphics architecture, and an NPU based on XDNA 2—so for the most part the IP is unchanged. The CPU, iGPU, and NPU, get performance upgrades over the current "Strix Point" chip.

AMD accompanied the specs slides with first party performance numbers. The multithreaded CPU performance numbers are moderately higher, which seem to indicate that the CPU core configuration of 4x "Zen 5" + 8x "Zen 5c" seems to be carried over; but the single-threaded performance sees a significant increase. We're not sure what's driving this, but there are two theories. The more obvious one is a significant increase in clock speeds, helped by an updated power management; but the second more radical theory is that AMD updated the "Zen 5" P-cores to have full fat 512-bit FP capabilities, similar to the "Zen 5" cores in "Fire Range" and "Strix Halo" processors. If you recall, the "Zen 5" cores in "Strix Point" have their FPUs limited to dual-pumped 256-bit paths to execute AVX512 instructions, a design choice probably driven by power considerations. The NPU throughput has been moderately increased to deliver over 55 AI TOPS, AMD enabled the full NPU performance across all tiers of Ryzen AI SKUs based on this chip. In all, "Gorgon Point" is to "Strix Point" what "Hawk Point" was to "Phoenix Point."

At its annual Amplify Conference, HP Inc. today announced new products and services designed to shape the future of work, empowering people and businesses to create and manage their own way of working. The company unveiled more than 80 PCs, AI-powered print tools for SMBs, and Workforce Experience Platform enhancements all built to drive company growth and professional fulfillment.

"HP is translating AI into meaningful experiences that drive growth and fulfillment," said Enrique Lores, President and CEO at HP Inc. "We are shaping the future of work with game-changing AI innovations that seamlessly adapt to how people want to work."

Today marks the launch of ASUS Vivobook S14/S16 (S3407QA/S3607QA), a pair of Copilot+ PCs engineered to be the ideal companions for everyday life.

Featuring the latest high-performance Snapdragon X processor with up to 45 TOPS NPU, these ultra-slim, lightweight laptops deliver powerful AI capabilities, extended battery life, and next-level connectivity. For work, study, or play, Vivobook S14/S16 provide an immersive entertainment experience with stunning 16:10 FHD OLED or 2.5K 144 Hz IPS displays, along with Snapdragon Sound and Dolby Atmos audio. Designed for style and durability, these devices ensure effortless AI computing with premium metallic chassis, military-grade resilience, and advanced security features for total peace of mind.

Minisforum is proud to unveil AI X1 Pro, the world's first Copilot-empowered AI mini PC, setting a new standard in low power efficiency and redefining performance. Powered by the cutting-edge AMD Ryzen AI 9 HX 370 processor, the AI X1 Pro delivers next-level AI technology, supercharging multitasking, boosting productivity, and enhancing teamwork like never before. With performance up to 45% faster than competitors, this mini PC is designed to meet the demands of professionals, creators, and gamers alike.

Unmatched Gaming and Creativity
Equipped with the powerful AMD Radeon 890M processor, AI X1 Pro transforms your gaming experience. Dive into AAA titles with smooth, breathtaking visuals and zero lag. Every battle and adventure comes to life in stunning detail, delivering pure excitement. For creators, the AI X1 Pro is optimized for AI workloads, featuring total 80 TOPS NPU for all-local AI processing. Streamline your daily tasks, enhance creativity, and save valuable time with unparalleled convenience.

Qualcomm Technologies, Inc. today announced the Dragonwing FWA Gen 4 Elite, the world's first 5G Advanced-capable FWA platform. Powered by the Qualcomm X85 5G Modem-RF, the platform sets a new benchmark for 5G broadband performance with downlink speeds up to 12.5 Gbps. The Dragonwing FWA Gen 4 Elite platform introduces comprehensive AI enhancements and integrates a powerful network Edge AI coprocessor with up to 40 TOPS of NPU processing power. This optimizes wireless connectivity across 5G broadband and Wi-Fi, while unlocking the power of generative AI for more devices, enabling a more reliable and harmonized user experience.

"The Dragonwing FWA Gen 4 Elite Platform is a technological breakthrough, building on over 500 5G FWA designs to date, and extends our tradition of delivering platforms that solve the broadband industry's greatest challenges," said Gautam Sheoran, vice president and general manager, wireless broadband and communications, Qualcomm Technologies, Inc. "By integrating unprecedented AI and connectivity capabilities, with the Qualcomm X85 at its core, this platform offers ultra-fast speeds, reliability and flexibility at a lower total cost than wired broadband, ultimately, enabling a future where seamless, intelligent networks transform the way we live and work."

Today at MWC 2025, Lenovo announced new Yoga and IdeaPad AI laptops, alongside software and innovative new proofs of concept visuals and accessories that leverage the power of AI to supercharge creativity and productivity for consumers. With a greater selection of Copilot+1 AI PCs offering AI-enabled experiences like Windows Studio Effects, new NVIDIA GPU options for heavy-duty processing tasks, and new Lenovo Aura Edition laptops imagined with Intel that streamline the PC experience, Lenovo's new Yoga and IdeaPad laptops make creating, completing tasks, and enjoying content seamless, simple, and fun. Lenovo's new AI laptops, software, and concepts unveiling at MWC continue to expand on the company's wide AI portfolio, embodying its promise to deliver Smarter Technology for All - combining cutting-edge innovation, user-centric versatility, and exceptional value to meet the needs of more consumers.

"As we push the limits of AI innovation higher than ever, it is important to remember that delivering access to AI for all is equally a core tenet of Lenovo's philosophy. Likewise, as we endeavor to redefine the boundaries of power in technology, we must ensure that it continues to be a positive force," said Jun Ouyang, Lenovo's Senior Vice President and General Manager of the Consumer Segment, Intelligent Devices Group. "With the announcement of innovations like the Yoga Pro 9i Aura Edition, the IdeaPad Slim 3x, and the Lenovo Yoga Solar PC Concept, Lenovo has delivered a suite of new devices and proofs of concept that empower end users to let their creativity shine, their 'process' unbounded by the processing of their PC thanks to AI-powered innovation."

It's that time again! 3DExperience World 2025 kicks off on February 23 and runs through February 26 at the George R. Brown Convention Center in Houston, Texas. The show is hosted by Dassault Systèmes and highlights annual advances and improvements throughout its product ecosystem. It's a great opportunity to meet the engineers, students, and industry professionals who use SolidWorks and other Dassault Systèmes applications across browsers, local workstations, and the cloud.

One of the best parts of the event for me is showcasing how advances in silicon engineering can lead to transformational products - systems that offer performance, features, and efficiency that wasn't possible before. In 2024, the AMD Ryzen Threadripper PRO 7000 WX-Series processor stole the proverbial show with its excellent single-thread performance, support for multi-GPU configurations for AI training, and up to 96 cores and 2T B of memory for the largest and most demanding projects. This year, AMD has complemented these full-size tower systems with compact and mobile workstations based on the new AMD Ryzen AI Max PRO Series processors. Drop by booth #919 and see the array of systems and demos on exhibit.

Advantech, a leader in edge computing solutions, is excited to announce the launch of the UBX-330M, a compact NUC-sized edge computer designed to power intelligent city services with advanced AI capabilities.

The UBX-330M is powered by Intel Core Ultra Processors (Meteor Lake H and U), which integrate a CPU, GPU, and NPU to deliver exceptional AI performance in a small form factor. Built as an AI-ready platform, the UBX-330M is perfect for applications requiring robust processing power across industries such as smart retail, hospitality, public spaces, education, entertainment, enterprise, and smart buildings.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

Intel is reported to be eyeing a revival of its "Arrow Lake Refresh" desktop processor design—Golden Pig Upgrade disclosed this "strange" revelation via an updated Weibo blog post. Back in 2023, the Chinese hardware reviewer and leaker extraordinaire theorized that Team Blue's much-rumored shelving of "ARL-S/HX Refresh" came down to cost/benefit considerations relating to accommodating an upgraded NPU in the chip's tile-based design. Last September, reports suggested that Intel had put the final kibosh on a 14th Gen Core Ultra 8P+32E "Arrow Lake Refresh" processor series—leaked roadmaps had a launch window marked down for late 2025, going into 2026. Industry watchdogs have picked up on Golden Pig Upgrade's latest forecast—prompting further theorizing.

Intel has its mobile segment's future covered with Panther Lake (later in 2025) and Nova Lake (2026), but a notable gap exists in their desktop world. Nova Lake's desktop S-series is slated for launch at some point in 2026, so this year could be prime territory for a mild refresh of existing Arrow Lake-S processors—on the LGA1851 socket. Golden Pig Upgrade reckons that refreshes of ARL-S (desktop) and ARL-HX (high-end laptop) are back on Team Blue's upcoming product roadmap. Industry moles reckon that an updated NPU design—potentially similar to the one housed in Lunar Lake mobile chips—will be the only major upgrade lined up for the so-called "Core Ultra 300" processor series. Intel's current-gen flagship model—Core Ultra 9 285K—has NPU performance topping off at 13 TOPS. Refreshed Arrow Lake SKUs could be deployed with an improved NPU aspect, perhaps capable of hitting 48 TOPS.

Intel's Core Ultra 7 255H "Arrow Lake" processor has demonstrated impressive performance improvements in recent PassMark benchmarks, achieving a 32% higher single-core score compared to its "Meteor Lake" predecessor. The Arrow Lake-H chip recorded 4,631 points in single-threaded tests, significantly outpacing the Core Ultra 7 155H's 3,500 points while delivering a 15% overall improvement in CPU Mark ratings. The performance leap comes from Intel's architectural overhaul, implementing "Lion Cove" performance cores alongside "Skymont" efficiency cores on TSMC's N3B process node. This combination enables the 255H to achieve higher boost frequencies while maintaining the same core configuration as its predecessor—six P-cores, eight E-cores, and two Low Power Efficiency (LPE) cores.

Notable in this iteration is the absence of Hyper-Threading, resulting in 16 threads compared to the 155H's 22 threads. Arrow Lake-H maintains Intel's heterogeneous structure, incorporating up to eight Xe-LPG+ graphics cores derived from the Alchemist architecture. The neural processing unit (NPU) capabilities remain consistent with Meteor Lake, delivering 13 TOPS of INT8 performance. This positions the chip below Lunar Lake's 45 TOPS. Despite performance improvements, market success will largely depend on system integrators' ability to deliver compelling devices at competitive price points, particularly as AMD's Strix Point platforms maintain strong positioning in the $1,000 range. The battle of laptop chip supremacy is poised to be a good one in the coming quarters, especially as more Arm-based entries will force both Intel and AMD to compete harder.

Microsoft will roll out "NPU-optimized versions of DeepSeek-R1" directly to Copilot+ PCs—yesterday's announcement revealed that Qualcomm Snapdragon X-equipped systems will be first in line to receive support. Owners of devices—that harbor Intel Core Ultra 200V "Lunar Lake" processors—will have to wait a little longer, and reports suggest that AMD Ryzen AI 9 HX-based Copilot+ PCs will be third in Microsoft's queue. Interestingly, Team Red has published DeepSeek R1 model-related guides for Radeon RX graphics cards and Ryzen AI processors. Starting off, Microsoft's first release will be based on DeepSeek-R1-Distill-Qwen-1.5B—made available in AI Toolkit. Teased future updates will be 7B and 14B variants. These are expected to "arrive soon."

Microsoft reckons that the optimized models will: "let developers build and deploy AI-powered applications that run efficiently on-device, taking full advantage of the powerful Neural Processing Unit (NPUs) in Copilot+ PCs. The on-board AI-crunching solution is advertised as a tool for empowerment—allowing: "developers to tap into powerful reasoning engines to build proactive and sustained experiences. With our work on Phi Silica, we were able to harness highly efficient inferencing—delivering very competitive time to first token and throughput rates, while minimally impacting battery life and consumption of PC resources." Western companies appear to be participating in a race to swiftly adopt DeepSeek's open source model, due to apparent cost benefits. Certain North American organizations have disclosed their own views and reservations, but others will happily pay less for a potent alternative to locally-developed systems. In a separate bulletin (also posted on January 29), Microsoft's AI platform team revealed that a cloud-hosted DeepSeek R1 model is available on Azure AI Foundry and GitHub.

ASUS is working on a new line of NUC mini PCs powered by the AMD Ryzen AI MAX "Strix Halo" mobile processors that come with oversized iGPUs and CPU core counts as high as 16-core/32-thread "Zen 5." This was sniffed out in shipping manifests by Olrak29_ on its way to being tested by the BIS (Bureau of Indian Standards) for regulatory certification similar to CE, with the manifest describing the NUC model as the "NUC14LNS," meaning that this box is from the NUC 14 series. The manifest describes the NUC sample as featuring the top of the line Ryzen AI MAX+ 395.

The Ryzen AI MAX+ 395 maxes out everything on the silicon, featuring 16 "Zen 5" CPU cores across two CCDs with full 512-bit FPUs, with 80 MB of "total cache" (L3+L2) between them; a 50 TOPS-class NPU that can locally accelerate Microsoft Copilot+, and that large RDNA 3.5 iGPU with 40 compute units (2,560 stream processors), 80 AI accelerators, and 40 ray accelerators. What's interesting about this NUC is that it will not come with SO-DIMM slots, since the "Strix Halo" SoC features a 256-bit wide LPDDR5X memory interface. It will either have hardwired memory, or use a pair of LPCAMM2 modules (each with a 128-bit bus width), which is less likely. With all the rage about AI developers using M4-powered Mac minis to accelerate DeepSeek, is ASUS eying a slice of the AI market?

Elitegroup Computer Systems (ECS), a globally recognized leader in motherboards, mini PCs, and laptops, will participate in the renowned Bett 2025 education technology exhibition in London from January 22 to 24, 2025. ECS will showcase its new series of education laptops integrated with AI technology and multifunctional mini PCs, designed to enhance teaching efficiency and the learning experience. These products not only offer exceptional performance and portability but also incorporate innovative solutions to provide smarter technological support for the education sector.

A New Series of AI-Powered Education Laptops, Delivering Smart Learning Solutions
At Bett 2025, ECS will feature a series of lightweight AI laptops tailored for higher education, including the 14-inch UP40ML, UP42KP, and UP42PW models, as well as the 15.3-inch UP52PW model. These laptops are focused on improving the teaching and learning experience by offering powerful computing capabilities and advanced features. They support multiple processor platforms, such as Intel, AMD and Snapdragon, providing flexibility to meet various needs while maintaining a high-quality metal chassis for durability in campus environments.

Intel's Core Ultra 3 205 processor's spec sheet appeared online for a short period of time—members of the Team Blue subreddit discovered an official product page (now removed) and other related details. In part, discussion focused on the alleged lower-end "Arrow Lake-S" (ARL-S) desktop CPU being "reserved for OEMs." Previously, this SKU's existence was leaked out at various points back in 2024. VideoCardz has kindly preserved the latest set of information, prior to its removal from Intel's official web presence—showing a potential new addition to the Core Ultra 200S (Series 2) lineup.

The Core Ultra 3 205 model appears to slot into a segment previously occupied by (now retired) budget-oriented Pentium and Celeron products—based on the specification sheet listing of a 57 W TDP (aligning with past ratings). The Maximum Turbo Power limit is 76 W. Team Blue has inadvertently revealed that this is an eight-core processor, comprised of four Lion Cove P-Cores and four Skymont E-Cores—so 8 (4P + 4E). The performance-oriented cores can (Max Turbo) boost up to 4.9 GHz, while the efficiency-focused units are capable of reaching up to 4.4 GHz. The on-board AI Boost NPU is rated for a peak rating of 13 TOPS (Int8). The Core Ultra 3 205's GPU seems to only utilize two out of the four available Arc Xe-LPG cores. The product page mentioned that the Core Ultra 3 205 is due for launch in Q1 2025, although the "Market Status = Launched" segment adds to the confusion surrounding this now de-listed SKU.

Advantech, a global leader in embedded IoT computing, is excited to launch its latest Edge AI solutions featuring the advanced AMD Ryzen Embedded 8000 Series processors. The SOM-6873 (COMe Compact), AIMB-2210 (Mini-ITX motherboards), and AIR-410 (AI Inference System) deliver exceptional AI performance leveraging the first AMD embedded devices with integrated Neural Processing Units. These integrated NPUs are optimized to enhance AI inference efficiency and precision. Together with traditional CPU and GPU elements, the architecture delivers performance up to 39 TOPS. They also support dual-channel DDR5 memory and PCIe Gen 4, providing ample computing power with flexible TDP options and thermal solutions.

Within value-added software services, such as the Edge AI SDK that integrates the AMD Ryzen AI software, the model porting procedure is accelerated. These features make the solutions ideal for edge applications such as HMI, machine vision in industrial automation, smart management and interactive services in urban entertainment systems, and healthcare devices such as ultrasound machines.

Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

ASUS today announced the ExpertBook B3 series, an all-new lineup of AI-powered laptops that offers extensive customization to empower daily business needs. Equipped with up to the latest Intel Core Ultra 7 processor (Series 2) with Intel vPro, Intel AI Boost NPU and Intel Arc graphics, ExpertBook B3 delivers solid performance to tackle a wide range of tasks seamlessly. These new laptops also feature powerful AI tools such as ASUS AI ExpertMeet], Microsoft Copilot and AI noise-canceling technology, delivering unmatched productivity experiences.

With a build that's as lightweight as 1.4 kg, a 180° lay-flat hinge, military-grade durability, comprehensive connectivity, and advanced security features, the latest ExpertBook B3-series AI PCs ensure flexibility and efficiency on the go. In addition, with long battery life, exceptional visuals and audio, and an eco-friendly design, ExpertBook B3 series supports streamlined workflows - keeping employees productive, wherever they work.

Samsung has revealed two new laptop models at CES 2025: the Galaxy Book5 Pro and Galaxy Book5 360, both featuring Intel's latest processors and artificial intelligence capabilities. The Galaxy Book5 Pro comes in two sizes. The 16-inch version weighs 1.56 kg and includes a 76.1Wh battery, while the 14-inch model weighs 1.23 kg with a 63.1 Wh battery. Both laptops use AMOLED displays with 2880×1800 resolution and variable refresh rates from 48 to 120 Hz. Storage options reach 1 TB, with either 16 GB or 32 GB of memory available.

The Galaxy Book5 360 features a 15.6-inch touchscreen that can fold back 360 degrees, effectively turning the laptop into a tablet. It has a 1920×1080 resolution display and weighs 1.46 kg, with a 68.1 Wh battery. Both models use Intel's Core Ultra processors with built-in NPUs that Samsung uses for features like AI Select for searching and Photo Remaster for image enhancement. The laptops also integrate with other Samsung devices through features like Multi Control for unified device navigation and Quick Share for file transfers. The new laptops include standard connectivity options like Wi-Fi 7 and Bluetooth 5.4. Samsung claims the Pro models can achieve up to 25 hours of battery life, though real-world usage typically yields shorter durations.

Advantech, a leader in embedded IoT computing solutions, is excited to introduce their AI-integrated desktop platform series: the Mini-ITX AIMB-2710 and Micro-ATX AIMB-589. These platforms are powered by Intel Core Ultra Processors (Series 2) S-Series, featuring the first desktop processor with an integrated NPU, delivering up to 36 TOPS for superior AI acceleration. Designed for data visualization and image analysis, both models offer PCIe Gen 5 support for high-performance GPU cards and feature 6400 MHz DDR5 memory, USB4 Type-C, multiple USB 3.2 Gen 2 and 2.5GbE LAN ports for fast and accurate data transmission in real time.

The AIMB-2710 and AIMB-589 excel in high-speed computing and AI-driven performance, making them ideal for applications such as medical imaging, automated optical inspection, and semiconductor testing. Backed by comprehensive software support, these platforms are engineered for the next wave of AI innovation.

BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX's booth (#9045) in the North Hall of the Las Vegas Convention Center.

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.