BIOSTAR, a leading manufacturer of Edge AI embedded computers, IPC solutions motherboards, graphics cards, and PC peripherals, is excited to announce x86 Edge AI platform showcase at CES 2025. Scheduled to take place from January 7 to 10 in Las Vegas, Nevada, USA, BIOSTAR, in partnership with DEEPX, an AI semiconductor company from South Korea, will showcase cutting-edge x86 Edge AI solutions at DEEPX's booth (#9045) in the North Hall of the Las Vegas Convention Center.

DEEPX is a pioneering company in on-device AI. It develops advanced AI semiconductors that optimize performance, reduce power consumption, and enhance cost efficiency across various industries, including smart camera modules, smart mobility, smart factories, consumer electronics, smart cities, surveillance systems, and AI servers. Building upon their successful collaborations, BIOSTAR and DEEPX set to unveil their latest joint innovations at CES 2025, further enhancing their prominence in the industrial computing ecosystem.

CyberLink Corp., a leading provider of digital creative editing software and artificial intelligence (AI) solutions, is showcasing the cutting-edge AI capabilities and NPU (Neural Processing Unit) optimizations of their Generative AI digital marketing design software, Promeo, and award-winning video and photo editing software, PowerDirector and PhotoDirector, this week during CES 2025 in Las Vegas.

Cognizant of the expanding adoption from PC makers of the latest Intel LunarLake platform and capabilities for AI, CyberLink's close partnership with Intel is ensuring PC makers releasing LunarLake enabled hardware, from laptops to mini-PCs, will be able to take advantage of CyberLink's creative editing software's AI functionalities.

GIGABYTE, the world's leading computer brand, unveiled its next-gen AI PCs at CES 2025. GiMATE, a groundbreaking AI agent for seamless hardware and software control, takes center stage in the all-new lineup, redefining gaming, creation, and productivity in the AI era. Powered by NVIDIA GeForce RTX 50 Series Laptop GPUs and NVIDIA NIM microservices for advanced AI NIM and RTX AI, AMD Ryzen AI, Intel NPU AI, and enhanced by Microsoft Copilot, the AORUS MASTER, GIGABYTE AERO, and the GIGABYTE GAMING series deliver cutting-edge performance with upgraded WINDFORCE cooling in sleek, portable designs.

GiMATE, GIGABYTE's exclusive AI agent, integrates with an advanced Large Language Model (LLM) and the "Press and Speak" feature, making laptop control more natural and intuitive. From AI Power Gear II for optimal energy efficiency to AI Boost II's precision overclocking, GiMATE ensures optimal settings for every scenario. AI Cooling delivers 0dB ambiance, perfect for work environments, while AI Audio and AI Voice optimize sound for any setting. Safeguard your screen with AI Privacy, which detects prying eyes and activates protection instantly. GiMATE aims to be users' smart AI Mate, that redefines laptops in users' daily lives.

ASUS today announced the groundbreaking Zenbook A14 (UX3407) - the lightest 14-inch Copilot+ PC on the market, and also the first all-Ceraluminum ASUS laptop. Zenbook A14 is also the first Zenbook model powered by the latest Snapdragon X Series AI-enabled processors. Zenbook A14 redefines lightweight laptops, addressing traditional challenges like durability, performance, cooling, battery life, limited ports, and cost. Its all-Ceraluminum chassis is ultra-light at under 980 g, durable, and low-maintenance, designed for everyday use. Snapdragon X Series processors deliver outstanding power efficiency and performance with multi-working-day battery life, and the dual-fan thermal system ensures optimal cooling and boosts CPU TDP up to 45 W with minimal noise. As a Copilot+ PC, it enhances productivity and creativity with advanced AI capabilities.

The intuitive design includes an enlarged touchpad supporting Smart Gestures and a versatile range of I/O ports. Seamless integration with Windows Phone Link and Snapdragon Seamless lets users answer calls, manage notifications, and transfer files directly from the laptop. Users can even turn their phone into a webcam. Entertainment shines with the FHD ASUS Lumina OLED display and a powerful super-linear speaker system, offering a cinematic experience. Security is robust with the Microsoft Pluton processor and Windows passkeys for secure authentication storage. AI-driven features like the AI IR Camera system provide facial recognition for automatic login and logout, Adaptive Lock, and Adaptive Dimming, ensuring enhanced privacy and usability. With its lightweight design, robust performance, and advanced features, Zenbook A14 is a true game-changer in portable computing.

Today, Lenovo announced a lineup of new Lenovo Yoga and IdeaPad devices and software at CES 2025 that are designed to transform the way smarter technology adapts to and streamlines creative and productivity tasks. Lenovo Yoga laptops feature inventive form factors, never-before-seen innovations, intuitive ecosystems, and functional AI implementations designed to channel users' creative passions and maximize their potential. Embodying this pursuit are:

• The new Lenovo Yoga Slim 9i (14", 10) with its 98% screen-to-body ratio PureSight Pro OLED display courtesy of its world's first camera-under-display technology in a laptop.
• The Lenovo Yoga Book 9i (14", 10), featuring two larger PureSight OLED screens that act as the ultimate canvas for AI-driven creative pursuits.
• The Lenovo Yoga 9i 2-in-1 Aura Edition (14", 10), the newest addition to the Lenovo Yoga Aura Edition family imagined with Intel, a Copilot+ PC2 with a PureSight OLED display and up to Intel Core Ultra 7 processor.
• The Lenovo Yoga Tab Plus, Lenovo's first on-device AI tablet for amazing productivity with personalized AI experiences.

At CES 2025, Lenovo unveiled a bold lineup of AI-powered business solutions designed to redefine the modern workplace. Highlights include the boldly redesigned Lenovo ThinkPad X9 Aura Editions, the innovative and unique ThinkBook Plus Gen 6 with rollable display, and the latest commercial desktops, including the high performance ThinkCentre M90a Pro Gen 6, and the groundbreaking ThinkCentre neo 50q QC powered by Snapdragon. Lenovo also introduces its next-generation ThinkVision P Series monitors and a comprehensive ecosystem of smart accessories, all engineered to elevate productivity and connectivity. Rounding out the announcements, Lenovo showcases cutting-edge proof-of-concept innovations that push the boundaries of technology, offering a glimpse into the future of intelligent, adaptable business solutions.

Lenovo Unveils ThinkPad X9 Series: Revolutionary Design Meets Pro-Level Performance
Lenovo introduces the ThinkPad X9 14 and X9 15 Aura Editions, its latest premium business laptops designed for innovative thinkers from prosumers to small and medium businesses to large corporations. These Copilot+ PCs powered by Intel Core Ultra processors are cutting-edge, AI-enhanced devices for creative professionals that combine powerful and efficient Intel and Windows 11 platforms, personalized AI-enabled experiences, in an all-new progressive design. ThinkPad X9 offers the ideal toolkit for today's hybrid users who demand high performance, proven reliability, and seamless productivity.

Expanding its AI PC leadership, Qualcomm Technologies, Inc. announced the Snapdragon X Platform, the 4th platform to join the Snapdragon X Series compute portfolio, designed to deliver performance, multi-day battery life, and Copilot+ PC experiences for even more users globally.

Redefining the PC Category for Mainstream Devices at $600
Utilizing the power of an 8-core Qualcomm Oryon CPU, Snapdragon X is delivering essential performance to the next-generation of PCs. This platform delivers up to 163% faster performance at ISO-power than our competitors who also require 168% more power at ISO-performance, the Snapdragon X processor balances performance and built-in intelligence with a 45 TOPS NPU that runs Copilot+ PC experiences more efficiently. With an integrated power efficient GPU, Snapdragon X supports dynamic graphics ideal for creating presentations, web browsing, or streaming content. Snapdragon X is an ideal solution for students, freelance workers, and budget-conscious consumers who need a reliable and powerful laptop that can keep up with their busy lives. Devices powered by Snapdragon X are expected to be available from leading OEMs including Acer, ASUS, Dell Technologies, HP and Lenovo in early 2025 enabling Copilot+ PCs in the $600 range.

ASRock Industrial is proud to announce the launch of its highly anticipated NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series built to revolutionize AI-driven computing. Powered by Intel Core Ultra 200H processors (Arrow Lake-H), the series delivers up to 99 TOPS of AI inferencing power, offering cutting-edge performance in a compact form factor. Designed to meet the growing needs of industries such as AI-enhanced business operations, immersive content creation, and high-performance gaming, the NUC(S) Ultra 200 BOX Series is engineered to provide next-level computing power with Intel's latest performance hybrid architecture, Intel Arc GPU, and NPU.

These compact systems are built for users who demand powerful multitasking capabilities, from AI inferencing to media-rich applications and data processing. With its space-saving design and exceptional versatility, the NUC(S) Ultra 200 BOX Series ensures efficient, high-speed performance across a range of applications—redefining what's possible in modern computing.

ASRock Industrial unveils the 4X4 BOX AI300 Series, a compact powerhouse designed to redefine AI computing with AMD Ryzen AI 300 Series processors. Featuring the Ryzen AI 7 350 and Ryzen AI 5 340 processors, this series delivers up to 50 TOPS of NPU performance, supporting Copilot+ PC experiences and AI-enhanced multitasking. With up to 96 GB dual-channel DDR5 5600 MHz memory, quad display up to 8K, and versatile connectivity, including dual LAN ports, Wi-Fi 6E, five USB ports with two USB4, it combines exceptional AI performance with scalability and efficiency.

Equipped with Ryzen AI as its dedicated AI engine, the 4X4 BOX AI300 Series ensures responsive AI processing paving the way for next generation productivity. Living up to its slogan, "Tiny Box AI Rocks," the 4X4 BOX AI300 Series is engineered for AI PCs, gaming, content creation, tech enthusiasts, prosumers, and AIoT applications.

ASUS and Republic of Gamers (ROG) today announced a suite of innovative networking products at CES 2025, pushing the boundaries of Wi-Fi 7 connectivity for gamers, network enthusiasts and home users. In addition, ASUS RT-BE58 Go, a compact mini travels router with versatile connectivity; and ASUS 5G-GO, a sleek 5G mobile router with roaming support in up to 232 countries, both received the prestigious CES 2025 Innovation Award. The latest lineup includes ROG Rapture GT-BE19000AI, the world's first AI-powered gaming router with a built-in NPU; and the ZenWiFi outdoor series, a robust outdoor Wi-Fi 7 mesh solution. All of these solutions are designed to deliver unparalleled performance, security, and flexibility.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

AMD today vastly fleshed out its mobile processor lineup with the introduction of two new processor lines besides the Ryzen AI Max 300 series. This includes the introduction of more processor models in the Ryzen AI 300 series that are powered by the "Strix Point" silicon, and the introduction of the Ryzen 200 series mobile processors, which are based on the older "Hawk Point" silicon. In 2024, AMD had debuted the Ryzen AI 300 series "Strix Point," but with just the top-end Ryzen AI 9 370 and 365, which came with maxed out 12-core/24-thread (4x Zen 5 + 8x Zen 5c) core configuration, and a maxed out iGPU with 16 CU. Today the company is introducing the Ryzen AI 7 350, the Ryzen AI 5 340, and their AMD PRO variants for commercial notebooks. Both the consumer and commercial parts have identical specs, except for the latter featuring the AMD PRO feature-set.

The Ryzen AI 7 350 comes with a CPU configuration of 8-core/16-thread (4x Zen 5 + 4x Zen 5c). All cores have a base frequency of 2.00 GHz, the Zen 5 cores boost up to 5.00 GHz. The iGPU on offer is the Radeon 860M, with 12 CU and an engine clock of up to 3.00 GHz. TDP is configurable between 15 W to 55 W. The Ryzen AI 5 340 comes with a 6-core/12-thread configuration (3x Zen 5 + 3x Zen 5c), and CPU clock speeds of 2.00 GHz base with 4.80 GHz boost achievable on the Zen 5 cores. The iGPU is heavily cut down, with just 4 CU available, and an iGPU engine clock of 2.90 GHz. Notebook designers can configure this chip with a wide power range from 15 W to 55 W. All four processor models mentioned above come with a Ryzen AI XDNA 2 NPU that's capable of 50 AI TOPS, which means they're all Microsoft Copilot+ AI PC logo eligible.

MSI, a global leader in computing solutions, is excited to announce the launch of its latest innovation in mini PCs: the Cubi NUC AI Series. This new lineup features the Cubi NUC AI+ 2M and the Cubi NUC AI 1UM, both carefully designed to deliver exceptional performance in impressively compact formats.

Cubi NUC AI+ 2M: The Ultimate Copilot+ PC
Measuring just 0.826 liters, the Cubi NUC AI+ 2M sets a new standard for mini PCs. Despite its compact size, it is powered by an Intel Core Ultra Processor from the Lunar Lake platform and comes with AI tools designed to enhance productivity and improve the user experience. Equipped with a dedicated AI Boost NPU, it functions as a Copilot+ PC, seamlessly integrating with AI-driven applications like CoCreator, Windows Studio Effects, Live Captions, and Live Translation—making it ideal for both professional and personal use. One of its standout features is the one-touch fingerprint power button, which provides both security and convenience. Additionally, a dedicated Copilot button offers instant access to AI assistance, streamlining workflows and daily tasks. The built-in microphone and speaker further enrich the user experience, enabling smooth communication and voice-activated commands. Connectivity is another strong point, with two Thunderbolt 4 ports, one of which supports up to 100 W Power Delivery input. This means the Cubi NUC AI+ 2M can be powered directly through a monitor using a Type-C connection, minimizing cable clutter and simplifying your setup.

Samsung Electronics Co., Ltd. today announced the global launch of the Galaxy Book5 Pro and Galaxy Book5 360, expanding the Galaxy Book5 lineup to meet a wider range of AI needs for all users. Powered by Intel Core Ultra processors (Series 2) featuring NPUs up to 47 TOPs, these latest PCs come directly integrated with Galaxy AI capabilities like the innovative AI Select as well as cutting-edge features that deliver personalized experiences across the Galaxy ecosystem. With the addition of AI Select, PC users can easily search anything, anytime with a simple click, just like on their phone except on a much larger, immersive display.

"We are thrilled to make Galaxy AI and cutting-edge innovation accessible to more people than ever before, addressing their unique productivity needs on PC and other Galaxy devices," said Changtae Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "Alongside our trusted industry partners, we are delivering an AI experience on Galaxy Book that empowers users to work, create and connect in more intelligent ways through our growing ecosystem."

The Core Ultra 200H series of mobile processors is designed to cover the majority of mobile device use-cases from the next-generation. These chips are very much based on the latest "Arrow Lake" microarchitecture, but with a few clever design changes. This is a tile-based processor, just like the 200HX series; but the various tiles are different. The Compute tile, which packs the main CPU complex, is noticeably smaller, with 6 "Lion Cove" P-cores, and two "Skymont" E-core clusters with 8 E-cores sharing a 24 MB L3 cache, and a ringbus interconnect. Things get interesting with the SoC tile, which now contains two Low-power Island E-cores. At this point, it is unclear if these are "Skymont," or are older generation "Crestmont" cores, which would mean that Intel has carried over the SoC tile from "Meteor Lake-H."

The SoC tile also contains at 13 TOPS-class NPU, which means these chips miss out on Microsoft Copilot+ AI PC logo. The idea behind this could be that Intel is trying to promote the Core Ultra 200V series "Lunar Lake," which comes with a powerful 45 TOPS NPU. The company is announcing several new models of "Lunar Lake" today, including vPro ones. Switching focus back to "Arrow Lake-H," and our attention is drawn back to the SoC and I/O tiles, which miss out on the number of PCIe lanes, particularly Gen 5 ones, which the Core Ultra 200HX chips come with. The game changer for this chip, however, is the large Graphics tile. The iGPU of "Arrow Lake-H" is based on the same Xe-LPG graphics architecture as the one on "Meteor Lake," and not Xe2 "Battlemage" like on "Lunar Lake." However, this iGPU is vastly different from the one the "Arrow Lake-HX" comes with.

Intel kicked off a slew of 2025 International CES announcements with the Core Ultra 200HX series. The HX segment of mobile processors covers a range of premium gaming notebooks and mobile workstations. These chips tend to be essentially the desktop S-segments of processors but redesigned for the mobile BGA package, letting the platform have the highest possible CPU core count from a client architecture. The same is the case with the Core Ultra 200HX series. It is based on the same chiplet based "Arrow Lake" die with a maximum CPU core count of 8P+16E. AI acceleration comes from a 13 TOPS-class NPU—this won't power Copilot+, but is enough for a few entry-level local AI acceleration workloads. The iGPU is the smallest "Arrow Lake" has to offer, but the idea is that its target platform will have discrete graphics.

The series is led by the Core Ultra 9 285HX, with the maximum 8P+16E core count, a maximum P-core boost frequency of 5.50 GHz. Next up, is the Core Ultra 9 275HX. This chip has the same 8P+16E core CPU configuration has the 285HX, but at slightly lower frequencies, with its P-core boost reaching up to 5.40 GHz. After this, is the Core Ultra 7 265HX, featuring an 8P+12E core CPU configuration, and 5.30 GHz maximum P-core boost. Positioned right below is the Core Ultra 7 255HX, with the same core configuration as the 265HX, but with 100 MHz lower clocks. The 275HX and 255HX appear to be designed for greater volumes.

GEEKOM, a Taiwanese tech company famous for making high quality mini PCs, is heading to CES for the second consecutive year in 2025 with an exciting lineup of new products. Known as the Green Mini PC Global Leader, GEEKOM always focuses on improving the quality and reliability of its products, and it also spares no effort in cutting down carbon emissions and making the world a greener place.

Among the many mini PCs that GEEKOM plans to put on show at CES 2025, there are many industry firsts. The GEEKOM QS1, for instance, is the world's first mini PC powered by a Qualcomm chipset. The tiny computer sports an Arm-based Qualcomm Snapdragon X1E-80-100 processor with twelve 4.0 GHz Oryon CPU cores, a 3.8 TFLOPS Adreno X1-85 GPU and a 45 TOPS Hexagon NPU. It is smart and fast enough to breeze through all of your daily home and office computing chores, yet energy-efficient enough to significantly cut down your electric bill.

ASUS today announced ASUS NUC 14 Pro AI, the world's first mini PC featuring Intel Core Ultra processors (Series 2) integrated with Microsoft Copilot+. This revolutionary device is engineered to deliver unparalleled performance for use across diverse sectors, easily handling business, entertainment, and industrial apps. Boasting compact dimensions and advanced AI capabilities, ASUS NUC 14 Pro AI sets a new benchmark for mini PC innovation, offering an alternative to traditional desktops in a compact package.

World's first AI-enabled mini PC, powered by Intel Core Ultra processors (Series 2)
ASUS NUC 14 Pro AI represents a major leap in AI mini PC technology. It's powered by up to the latest Intel Core Ultra 9 processors (Series 2) that feature a multi-architecture design incorporating CPU, GPU, and NPU technologies. Delivering a total of 120 platform TOPS and 48 NPU TOPS, ASUS NUC 14 Pro AI provides 3X the AI performance of previous-generation NUC models, making it ideal for commercial use, edge computing, and IoT applications.

Intel is significantly expanding its desktop Core Ultra 200 "Arrow Lake-S" lineup with new 65 W models along the sidelines of the 2025 International CES, but more importantly, it is bringing the "Arrow Lake" microarchitecture to the mobile space. The company is planning to launch at least 22 processor models this January, but not all of them are based on "Arrow Lake." Tom's Hardware reports that the lineup broadly revolves around the "Core 2-series" processor model numbering.

The Core Ultra 200H series consists of H-segment (conventional thickness notebook) processors in the 28 W to 45 W class, and are based on the "Arrow Lake-H" silicon. The Core Ultra 200HX series targets premium gaming notebooks and portable workstations, and consists of 55 W to 65 W class processors, including CPU overclocking capabilities on certain models. Things get interesting with the Core Ultra 200U series. These chips are based on the "Meteor Lake Refresh" silicon—an older microarchitecture—targeting the 7 W to 28 W segments for ultraportables. Lastly, there's the Core H 200 and Core U 200 series (no "Ultra" in the branding), which are based on the older "Raptor Lake" monolithic silicon, targeting mainstream notebooks.

During Barclays 22nd Annual Global Technology Conference, Intel was a guest and two of the interim company co-CEOs Michelle Johnston Holthaus and David Zinsner gave a little update on the state of affairs at Intel. One of the most interesting aspects of the talk was Intel's upcoming "Panther Lake" processor—a direct successor to Intel Core Ultra 200S "Arrow Lake-H" mobile processors. The company confirmed that Panther Lake would utilize an Intel 18A node and that a few select customers have powered on Panther Lake on the E0 engineering sample chip. "Now we are using Intel Foundry for Panther Lake, which is our 2025 product, which will land on 18A. And this is the first time that we're customer zero in a long time on an Intel process," said interim co-CEO Michelle Johnston Holthaus, adding, "But just to give some assurances, on Panther Lake, we have our ES0 samples out with customers. We have eight customers that have powered on, which gives you just kind of an idea that the health of the silicon is good and the health of the Foundry is good."

While we don't know what ES0 means for Intel internally, we can assume that it is one of the first engineering samples on the 18A. The "ES" moniker usually refers to engineering samples, and zero after it could be the first design iteration. For reference, Intel's "Panther Lake-H" will reportedly have up to 18 cores: 6 P-cores, 8 E-cores, and 4 LP cores. The design brings back low-power island E-cores in the SoC tile. The P-cores use "Cougar Cove," which should have a higher IPC than "Lion Cove," while keeping the existing "Skymont" E-cores. The SoC tile may move from Arrow Lake's 6 nm to a newer process to fit the LP cores and an updated NPU. The iGPU is said to use the Xe3 "Celestial" architecture. With Arrow Lake-H launching in early 2025, Panther Lake-H likely won't arrive until 2026.

Advantech, a leading provider of AIoT platforms and services, proudly unveils its latest AI acceleration modules: the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules deliver AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparable AI modules and GPU cards. Designed in standard M.2 and PCIe form factors, the EAI-1200 and EAI-3300 can be seamlessly integrated with diverse x86 and Arm-based platforms, enabling quick upgrades of existing systems and boards to incorporate AI capabilities. With these AI acceleration modules, developers can run inference efficiently on the Hailo-8 NPU while handling application processing primarily on the CPU, optimizing resource allocation. The modules are paired with user-friendly software toolkits, including the Edge AI SDK for seamless integration with HailoRT, the Dataflow Compiler for converting existing models, and TAPPAS, which offers pre-trained application examples. These features accelerate the development of edge-based vision AI applications.

EAI-1200 M.2 AI Module: Accelerating Development for Vision AI Security
The EAI-1200 is an M.2 AI module powered by a single Hailo-8 VPU, delivering up to 26 TOPS of computing performance while consuming approximately 5 watts of power. An optional heatsink supports operation in temperatures ranging from -40 to 65°C, ensuring easy integration. This cost-effective module is especially designed to bundle with Advantech's systems and boards, such as the ARK-1221L, AIR-150, and AFE-R770, enhancing AI applications including baggage screening, workforce safety, and autonomous mobile robots (AMR).

The latest market data from Canalys reveals a complex landscape for AI-capable PCs, with Qualcomm's Snapdragon X platform showing modest growth in the age of AI PC. Despite sequential growth of 180% in Q3 2024, Snapdragon X-powered devices represent less than 1.5% of the Windows market, according to research. Qualcomm managed to sell around 720,000 Snapdragon X devices, which accounts for only 0.8% of all PCs sold in Q3 2024. Microsoft leads the adoption of the Snapdragon X, having integrated the platform across much of its Surface lineup. The broader AI-capable PC market, however, tells a different story. Shipments reached 13.3 million units in Q3 2024, claiming 20% of total PC shipments. Windows devices dominated this category for the first time, securing a 53% market share, driven by the Windows 11 refresh cycle and advances in processor technology.

Canalys also noted some significant challenges ahead. A recent survey indicates hesitancy among channel partners, with 31% planning to avoid Microsoft's Copilot+ PCs in 2025 and 34% expecting these devices to constitute less than 10% of their sales. These premium offerings, which require a minimum of 40 NPU TOPS, are constantly being evaluated over their value proposition. Major manufacturers are pursuing diverse strategies to differentiate themselves. HP focuses on ISV partnerships to enhance AI capabilities, while Lenovo develops proprietary tools like Creator Zone and Lenovo AI Now. Dell and Lenovo are integrating on-device AI within their broader service ecosystems. With Windows 10's end-of-support approaching, manufacturers face pressure to drive upgrades among users with aging devices. The industry's sequential growth of 49% in AI-capable PCs suggests increasing market appetite, though customer adoption of premium AI features remains selective.

Q.ANT, the leading startup for photonic computing, today announced the launch of its first commercial product - a photonics-based Native Processing Unit (NPU) built on the company's compute architecture LENA - Light Empowered Native Arithmetics. The product is fully compatible with today's existing computing ecosystem as it comes on the industry-standard PCI-Express. The Q.ANT NPU executes complex, non-linear mathematics natively using light instead of electrons, promising to deliver at least 30 times greater energy efficiency and significant computational speed improvements over traditional CMOS technology. Designed for compute-intensive applications such as AI Inference, machine learning, and physics simulation, the Q.ANT NPU has been proven to solve real-world challenges, including number recognition for deep neural network inference (see the recent press release regarding Cloud Access to NPU).

"With our photonic chip technology now available on the standard PCIe interface, we're bringing the incredible power of photonics directly into real-world applications. For us, this is not just a processor—it's a statement of intent: Sustainability and performance can go hand in hand," said Dr. Michael Förtsch, CEO of Q.ANT. "For the first time, developers can create AI applications and explore the capabilities of photonic computing, particularly for complex, nonlinear calculations. For example, experts calculated that one GPT-4 query today uses 10 times more electricity than a regular internet search request. Our photonic computing chips offer the potential to reduce the energy consumption for that query by a factor of 30."

ARBOR Technology has unveiled the boundaries of computing with its latest NUC-sized PC, featuring 34 TOPS of AI computing power driven by Intel Core Ultra processors and Intel Arc Graphics, offering unparalleled performance and efficiency in a compact design.

Experience AI-Accelerated Performance
Experience unparalleled performance and AI acceleration with the latest Intel Core Ultra processors. These cutting-edge chips feature a hybrid architecture that seamlessly blends CPU, GPU, and NPU capabilities, delivering up to a 14% boost in CPU productivity. Immerse yourself in stunning visuals and smooth computing experiences with integrated Intel Arc Graphics. These discrete graphics cards offer exceptional performance and energy efficiency.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.