AMD is planning to crash Intel's big 12th Gen Core "Alder Lake-P" mobile processor launch with its own next-gen launch, the Ryzen 6000 mobile processor series. These chips are the company's first built on the TSMC N6 (6 nm) silicon fabrication process, and combine up to 8 "Zen 3+" CPU cores, with a next-generation iGPU based on the RDNA2 graphics architecture. The company has given the Media CoreNext and Video CoreNext engines incremental updates, according to a leaked slide scored by VideoCardz.

Ryzen 6000 "Rembrandt" processors come with hardware-accelerated decode of the AV1 video format. The Display CoreNext (display I/O engine) now supports DisplayPort 2.0, complete with DSC, UHBR10, HDR10+, and variable refresh-rate. The HDR pipeline has awareness for the various display panel types, including OLED and mini-LED. The iGPU on "Rembrandt" features up to 12 compute units (768 stream processors). It remains to be seen if Ray Accelerators are featured, as that would make this the first iGPU (on the PC platform) with DirectX 12 Ultimate support.

TechPowerUp and KIOXIA come together to bring you a change to win one of three KIOXIA Exceria client SSDs. The Exceria range of SSDs span 2.5-inch SATA and M.2 NVMe form-factors, and combine KIOXIA's in-house BiCS flash memory, and the legacy of being the inventors of flash memory. Up for grabs are a KIOXIA Exceria Plus G2 2 TB M.2 NVMe SSD, a KIOXIA Exceria 1 TB M.2 NVMe SSD, and a KIOXIA Exceria SATA 960 GB SSD. The Giveaway is open worldwide (wherever legal), entries close on January 9, 2022. To participate, simply fill up a brief form to help us get back to you if you've won. All the best!

For more information and to participate, visit this page.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly presents its first-ever PCIe 3.0 NVMe solid-state drive - the COLORFUL WarHalberd CN600. COLORFUL collaborated with Yangtze Memory (YMTC) and Maxio Technology for the CN600 SSD. The cooperation between the companies will ensure the quality and performance of the flash components and the NVMe controller.

The COLORFUL WarHalberd CN600 NVMe SSD is a low-profile NVMe SSD in a standard 2280 M.2 form factor, designed for desktop PCs, laptops, ultrabooks, and mini-PCs. Using PCIe 3.0 X4 interface, the WarHalberd CN600 delivers speeds of up to 3300 MB/s read and up to 2600 MB/s write. The SSD will be offered in 256 GB and 512 GB capacities.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces it will be on location in Las Vegas during the 2022 CES show (Jan. 5-8). Under the theme of 'Dawn of a New Xtreme,' it will be showing off the latest products from XPG and ADATA including gaming systems, peripherals, accessories, and components, such as the newest DDR5 memory, PCIe 5.0 solid state drives (SSD) and the latest state-of-the-art Platinum PSU.

XPG's and ADATA are gearing up to bring next-generation performance to gamers and other users with its latest PCIe Gen5x 4 SSDs and DDR5 DRAM. At the booth, visitors will get a first look at the XPG LANCER RGB DDR5 and CASTER RGB DDR5 that deliver next-level performance of up to 6000 MT/s and 7000 MT/s, respectively. ADATA's industrial-grade DDR5-4800 U/SO/R-DIMM memory with on-die ECC & PMIC will also be on display.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung's advanced sixth-generation V-NAND.

"For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and reliability by leading enterprise server customers including corporations, governments and financial institutions," said Yong Ho Song, Executive Vice President and Head of the Memory Controller Development Team at Samsung Electronics. "The introduction of our PCIe 5.0 SSD, along with PCIe 6.0-based product developments that are underway, will further solidify our technological leadership in the enterprise server market."

Akasa, a leading provider of SSD accessories has just released a new heatsink for M.2 drives, called the Gecko Pro. Working from their previous SSD heatsink, the new Smart Fin design improves airflow over the fins and allows optimum heat dissipation. The Gecko Pro is compatible with 2280 sized SATA and NVMe M.2 drives.

M.2 drives are increasingly becoming more important in PC builds, being a popular option for both laptops, tablets, and tower PCs. As the technology improves over time, they have become an essential in fast, reliable data storage. One problem that occurs when continuously reading and writing data to the drive is overheating; data transfer speeds are reduced at high temperatures.

Today marks the simultaneous launch of three XPC cubes on the market on the European continent. The "XPC" series from the Taiwanese Mini-PC manufacturer has been impressing users since 2001 with its compact design and wide range of possible applications. The SH570R6, SH570R6 Plus and SH570R8 models are based on the Intel H570 chipset, which is suitable for Intel Core processors of the 11th generation (Rocket Lake) and 10th generation (Comet Lake). Shuttle states that the current top-performing model is the Intel Core i9-11900K with 125 Watt TDP, 8 cores, 16 threads, 16 MB cache and a turbo frequency of 5.3 GHz.

To match the comprehensive processor support, up to 128 GB of RAM, spread across four slots, can be installed. There are also very few upper limits when it comes to suitable mass storage devices. Fast NVMe SSDs can be fitted in the M.2-2280 slot and, thanks to the four SATA ports, so can the corresponding number of hard drives or SSDs. The R6 chassis provides space for two 3.5" data carriers (one internal, one external) and a 5.25" drive; the R8 model, by contrast, can be fitted with four internal 3.5" data carriers - with a corresponding adapter 2.5" formats are of course also suitable.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles. The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2 GB GDDR6 DRAM and 2 GB DDR4 DRAM for high-performance infotainment systems, as well as 2 GB GDDR6 DRAM and 128 GB Universal Flash Storage (UFS) for autonomous driving systems.

"With the recent proliferation of electric vehicles and the rapid advancement of infotainment and autonomous driving systems, the semiconductor automotive platform is facing a paradigm shift. What used to be a seven to eight-year replacement cycle is now being compressed into a three to four-year cycle, and at the same time, performance and capacity requirements are advancing to levels commonly found in servers," said Jinman Han, executive vice president and head of Memory Global Sales & Marketing at Samsung Electronics. "Samsung's reinforced lineup of memory solutions will act as a major catalyst in further accelerating the shift toward the 'Server on Wheels' era."

OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC Docking Solutions, Network Attached Storage, and Performance Upgrade Kits, announces the OWC miniStack STX, the world's first Thunderbolt 4 Certified storage and hub expansion solution that seamlessly stacks with the Mac mini. It is also a Plug and Play expansion companion for Thunderbolt or USB-equipped Macs, PCs, iPads, Chromebooks, and Android tablets.

Three Thunderbolt 4 (USB-C compatible) ports connect to millions of Thunderbolt, USB-C and future USB4 devices and accessories. A universal HDD/SSD bay and an NVMe M.2 SSD slot provide massive storage capacity expansion and can be combined in a RAID 1 configuration. With up to 770 MB/s of storage performance, the OWC miniStack STX is great for bandwidth-intensive video editing, photography, audio, virtual machines, and everyday data backup and access tasks. Its heat-dissipating aircraft-grade aluminium with an internal heat sink and high-efficiency fan provides cool, nearly silent operation.

Leading global memory provider TEAMGROUP has been actively expanding in the industrial field for many years. In response to the development of 5G communication and the increasing demand for smart edge computing, TEAMGROUP today has announced two industrial-grade M.2 PCIe solid-state drives equipped with patented heat dissipating modules, the N75A-M80 and N75G-M80. The two products can be used in a limited space environment and provide excellent cooling performance during 24-hour high-speed operation, overcoming the extreme environments and ever-changing challenges of industrial applications.

To solve the issue of heat generated by SSDs under heavy workloads, TEAMGROUP launched two industrial M.2 PCIe SSDs that feature patented heat dissipating modules: N75A-M80, which comes with an aluminium fin heat sink (Taiwan Utility Model Patent No.: M541645), and N75G-M80, fitted with a graphene copper foil (Taiwan Invention Patent No.: I703921; US Invention Patent No.: US11051392B2). The two patented heat dissipating modules effectively reduce SSD slowdowns caused by high operating temperatures and significantly improve stability. The graphene heat sink of the N75G-M80 has a thickness of less than 1 mm, allowing for the SSD to be easily installed without interference. Even in 5G and IoT equipment, where installation space is limited, it can provide excellent cooling performance. The N75G-M80's outstanding technical performance was recognized in COMPUTEX d&i Awards 2021 and the Taiwan Excellence Awards 2022, winning awards from both.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched the 3-bay RAID 5 2.5 GbE TS-364 NAS with M.2 PCIe Gen3 NVMe SSD slots and 2.5 GbE connectivity, providing optimized performance in home/office environments. Supporting light virtualization/containers and HDMI output, the TS-364 provides a centralized storage, backup, file sharing, and multimedia solution that features rich NAS applications for greater productivity and boundless entertainment.

"The new TS-364 NAS allows building a secure RAID 5 array with three disks for optimized storage capacity, cache performance and protection against one disk failing. With M.2 PCIe Gen3 slots, the TS-364 enables cache acceleration or SSD storage pools for improved performance, or Edge TPU for AI image recognition. Its 2.5 GbE port accelerates network transmission while its USB 3.2 Gen2 (10 Gbps) ports allow quickly transferring large media files," said Joseph Chiang, Product Manager of QNAP.

Mini-PC pioneer Shuttle is currently marketing two space-saving Mini-PCs in a 1.3-litre format which are also very much at home away from the usual office environment. The DL20N and DL20N6 models are fanless Barebones from the "XPC slim" family in two different performance classes. The XPC slim DL20N version operates with an Intel Celeron N4505 dual-core processor. By contrast, Shuttle's DL20N6 features an Intel Pentium Silver N6005 processor with four CPU cores. The appropriate model can be chosen to suit the requirements of the project.

"Shuttle Barebones with this design, such as the predecessor DL10J, are, to our own surprise, being used in places that we would not necessarily have expected," explains Tom Seiffert, Head of Marketing & PR at Shuttle Computer Handels GmbH. "Their flexibility and reliability makes them ideal for kiosk, control and digital signage applications."

KIOXIA America, Inc. today announced that it has bolstered its lineup of PCIe 4.0 solid state drives (SSDs) with the addition of the KIOXIA BG5 Series. Designed to bring a suitable balance of performance, cost and power to everyday gamers and PC users, the KIOXIA BG5 Series is built with a PCIe 64 GT/s interface (Gen4 x4 lanes) and accelerated by the company's fifth-generation BiCS FLASH 3D flash memory technology.

As a virtual multi-LUN (VML)-enabled client SSD, the KIOXIA BG5 Series unlocks back-end flash performance while maintaining affordability, making it an especially attractive option for a wide range of commercial and consumer notebooks and desktops. KIOXIA BG5 SSDs also support the latest Host Memory Buffer (HMB) technology to realize a finely optimized DRAM-less SSD. The KIOXIA BG5 ships in a compact M.2 2230 single-sided, thermally optimized form factor enabling mobility and work-from-home lifestyles. M.2 2280 single-sided form factor versions are also available.

Back in June, NVM Express, Inc announced the NVMe 2.0 specification, which included support for mechanical drives, also known as hard disk drives. Seagate has now demoed the first implementation of NVMe 2.0 on a HDD and is targeting market availability sometime in 2024. You might wonder why anyone would want an NVMe equipped hard drive and the short answer is that it's intended for the server space.

One of the key reasons that Seagate is even considering this, is because of its multi-actuator drives, which the company is expecting to surpass the interface speed of 12 Gbps SAS in the future. In addition to this, it makes sense having a single storage interface on servers, which allows for a mixed storage drive environment, where some drive bays can be fitted with SSDs and others with NVMe based hard drives. Seagate is planning to sample key customers with early drives in September 2022 and final drives will be backwards compatible with SATA and SAS.

KIOXIA America, Inc. today announced the production availability of its EM6 Series Enterprise NVMe-oF solid state drives (SSDs) for Ethernet Bunch of Flash (EBOF) systems. Using the Marvell 88SN2400 NVMe-oF SSD converter controller that converts an NVMe SSD into a dual-ported 25Gb NVMe-oF SSD, KIOXIA EM6 Series drives expose the entire SSD bandwidth to the network.

Due to their ability to scale performance of NVMe SSDs, native NVMe-oF architectures are well-suited for applications such as artificial intelligence (AI)/machine learning (ML), high performance computing (HPC) and storage expansion. In the case of HPC, leveraging the Lustre file system, which is used to provide high bandwidth and parallel access to compute clusters, is beneficial to NVMe-oF based storage, such as EBOF systems with EM6 SSDs, that enable high availability (HA) configurations. An HPC HA configuration example consists of multiple and redundant network connections between a compute host and an EBOF with 88SN2400-connected NVMe SSDs, to deliver scalable throughput based on the number of SSDs.

AMD announced today that IBM Cloud has chosen 3rd Gen AMD EPYC processors to expand its bare metal service offerings designed to power customers' demanding workloads and solutions. The new servers, featuring 128 cores, up to 4 TB of memory and 10 NVMe drives per server, give users full access to high-end, dual-socket performance with AMD EPYC 7763 processors; a first for IBM Cloud in a dual-socket platform.

"Our customers have a high demand for computing processing power and the new 3rd Gen AMD EPYC processors provide the high levels of performance and scalability we were looking for," said Suresh Gopalakrishnan, vice president, IBM Cloud. "Our collaboration with AMD has helped us deliver our highest core counts and bandwidth ever available for IBM Cloud customers, to offer top market performance for today and tomorrow's demanding workloads."

"IBM Cloud customers regularly running compute-intensive workloads can see an immediate benefit to speed and scalability by upgrading to 3rd Gen AMD EPYC processors, while helping to deliver a secure experience for end-users," said Lynn Comp, corporate vice president, Cloud Business Group, AMD. "Our continued collaboration with IBM Cloud is further validation of the strong standing AMD holds in the market as we deliver topline solutions that promote a seamless experience for cloud partners and their customers."

OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC Docking Solutions, Network Attached Storage, and Performance Upgrade Kits, today announces the all-new OWC Accelsior 8M2. The OWC Accelsior 8M2 brings impressive speed and storage capacity to 2019 Mac Pros, Windows or Linux computers, and PCIe expansion systems.

It utilizes the total bandwidth of the latest PCIe technology and has a highly efficient heat dissipating design to provide ultra-reliable speeds up to 26,000 MB/s. Creating the fastest PCIe SSD meant combining bold engineering with the latest technology. Each OWC Accelsior 8M2's eight NVMe M.2 SSD slots can run at their full x4 lanes of data throughput. All that insanely fast speed through an entire PCIe 4.0 x16 lane architecture with up to 64 TB of storage.

Delivering on the promise of SSDs that address future enterprise infrastructure requirements, KIOXIA America, Inc. today announced production-ready availability of its 9.5 mm XD6 Series Enterprise and Datacenter Standard Form Factor (EDSFF) E1.S data center class SSDs. Introduced in late 2020, KIOXIA XD6 drives were the first EDSFF E1.S SSDs to address the specific requirements of hyperscale applications, including the performance, power and thermal requirements of the Open Compute Platform (OCP) NVMe Cloud SSD Specification. XD6 series also supports popular E1.S 15 mm and 25 mm form factor options, providing the flexibility to select the right balance of cooling through different E1.S heatsink options.

Representing the latest innovation in flash storage for servers in cloud and hyperscale data centers, KIOXIA EDSFF E1.S SSDs are designed to optimize system density, efficiency and management. As defined by the EDSFF consortium and leveraging the OCP NVMe Cloud SSD Specification, the small form factor E1.S replaces the M.2 form factor and delivers greater density, performance, reliability, and thermal management. E1.S is also designed to be hot pluggable for increased serviceability, which is another benefit over M.2.

A new era for flash used in servers and storage is here, and it's being introduced by KIOXIA America, Inc. Today, the company announced the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology - the CD7 Series. Building on the KIOXIA E3.S full-function development vehicle that received a 'Best in Show' award at last year's Flash Memory Summit, the CD7 Series E3.S increases flash storage density per drive for optimized power efficiency and rack consolidation.

Breaking free from the design limitations of the 2.5-inch form factor, the EDSFF E3 family is optimized for the needs of high-performance, highly efficient servers and storage. EDSFF enables the next generation of SSDs to address future data center architectures, while supporting a variety of new devices and applications. It provides improved airflow and thermals, signal integrity benefits, and options for larger SSD capacity points. EDSFF standardizes status LEDs on the drive, which eliminates the need for LEDs on the drive carriers. Support for higher E3.S power budgets than 2.5-inch form factor SSDs and better signal integrity allows EDSFF to deliver the performance promised by PCIe 5.0 technology and beyond.

Greenliant is sampling high capacity NVMe U.2 Industrial Enterprise PX Series solid state drives (SSDs), designed with high quality 3-bit-per-cell (TLC) 3D NAND and on-board DRAM to provide consistent low latency and high IOPS over the entire industrial temperature range (-40°C to +85°C). The G7200 NVMe U.2 PX Series offers customers a rugged industrial SSD with enterprise grade sustained performance. See NVMe U.2 Industrial Enterprise SSD information here.

NVMe U.2 Industrial Enterprise PX Series SSDs reach up to 2,500/1,900 MB/s sequential read/write performance and provide endurance of 2 drive writes per day (DWPD) for 5 years. Combining the best of enterprise and industrial SSD features, the G7200 PX Series is ideal for high reliability automation, datacenter, video, networking, transportation and aerospace applications.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces XPG, a fast-growing provider of systems, components, and Peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces a new series of solid state drives (SSD), the XPG ATOM series, geared toward creators of different needs and budgets. They include the XPG ATOM 30, 40, and 50.

The ATOM 30 and 40 utilize PCIe Gen3x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the ATOM 50 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5, 000/4,500 MB per second.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces a new series of solid state drives (SSD), the ADATA LEGEND series, geared toward creators of different needs and budgets. They include the ADATA LEGEND 740, 750, and 840.

The LEGEND 740 and 750 utilize PCIe Gen3 x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the LEGEND 840 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5,000/4,500 MB per second.

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced TrendForce has named it as the number one supplier of SSDs in the channel for all of 2020. According to TrendForce, Kingston accounted for a whopping 27 percent of the 111.5 million units shipped in 2020.

With the emergence of COVID-19 in 2020, TrendForce reported a 15% YoY decrease in annual SSD shipments to the channel and severe delays in manufacturing and logistics resulting in a sudden decline in order volumes. Yet, findings show through Kingston's global strategy for sourcing components, the company was well ahead of its competitors considering a global pandemic and looming chip shortage. The results reinforced Kingston as the clear leader in SSD production, as the second-place supplier accounted for only 8 percent of the total channel market. As a category, third-party suppliers (non-semiconductor) SSD makers accounted for 35% of the total shipments in 2020.

Seagate Technology Holdings plc today introduced the new family of Star Wars Beskar Ingot Drives, the first release in a collaboration to bring designs inspired by the Star Wars franchise to its line of PC gaming storage devices, taking gamers' battle stations to the next level. The first release in the collaboration celebrates the legends of the Star Wars Mandalorian galaxy. These drives bring the iconic Star Wars "precious metal" aesthetic to the FireCuda line-up. The special edition designs will be available in M.2 NVMe, 2.5-inch SATA, and external HDD formats. Each drive resembles an ingot of Beskar, including its Imperial stamp featured prominently in the series, making these drives the ultimate collectible for Star Wars fans.

"We are thrilled to bring unique, iconic designs from one of the world's most popular franchises to the forefront of every gamer's battle station," said Jeff Fochtman, Senior Vice President of Business and Marketing at Seagate Technology. "This collaboration appeals to global audiences including gamers, PC builders, and Star Wars enthusiasts alike."

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced KC3000, its next generation PCIe 4.0 NVMe M.2 SSD for desktop and laptop PCs. KC3000 SSD offers next-level performance using the latest Gen 4x4 NVMe controller and 3D TLC NAND ideal for power users who require the fastest speeds on the market.

By leveraging Gen4 technology, KC3000 delivers speeds up to 7,0000/7,000 MB/s read/write of blazing-fast performance and full capacities up to 4096GB2 for optimal storage. Users can keep up with demanding workloads and experience better performance with software applications such as 3D rendering and 4K+ content creation by upgrading the systems storage. KC3000 is built with high-density 3D TLC NAND housed in the industry standard M.2 2280 form factor to store even more and enable users to take advantage of PCIe 4.0 speeds. With the combination of performance and endurance, KC3000 is reinforced with a low profile, graphene aluminium heatspreader to effectively disperse heat and keep your drive cool during intensive workloads.