Intel's Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group at Intel Corporation, has yesterday published a blog post talking about Intel's next-generation server platform codenamed Sapphire Rapids. The SPR platform is Intel's biggest step-up in the server processor space, and it is the exact CPU that will power the Aurora exascale supercomputer. Besides improvements to the CPU microarchitecture, the platform itself is bringing many benefits with it as well. It will use the latest industry protocols like DDR5 and PCIe 5.0. This is making a strong combination designed even for exascale supercomputers to be powered by this processor. However, the availability of this CPU was a bit of a mystery until yesterday. Below, you can see the quote from Ms. Lisa Spelman about the availability of said processors.

Lisa SpelmanDemand for Sapphire Rapids continues to grow as customers learn more about the benefits of the platform. Given the breadth of enhancements in Sapphire Rapids, we are incorporating additional validation time prior to the production release, which will streamline the deployment process for our customers and partners. Based on this, we now expect Sapphire Rapids to be in production in the first quarter of 2022, with ramp beginning in the second quarter of 2022.

Qualcomm Technologies, Inc. today announced the expansion of its 5G RAN Platforms portfolio with the addition of the Qualcomm 5G DU X100 Accelerator Card. The Qualcomm 5G DU X100 is designed to enable operators and infrastructure vendors the ability to readily reap the benefits of high performance, low latency, and power efficient 5G, while accelerating the cellular ecosystem's transition towards virtualized radio access networks.

The Qualcomm 5G DU X100 is a PCIe inline accelerator card with concurrent Sub-6 GHz and mmWave baseband support which is designed to simplify 5G deployments by offering a turnkey solution for ease of deployment with O-RAN fronthaul and 5G NR layer 1 High (L1 High) processing. The PCIe card is designed to seamlessly plug into standard Commercial-Off-The-Shelf (COTS) servers to offload CPUs from latency-sensitive and compute-intensive 5G baseband functions such as demodulation, beamforming, channel coding, and Massive MIMO computation needed for high-capacity deployments. For use in public or private networks, this accelerator card aims to give carriers the ability to increase overall network capacity and fully realize the transformative potential of 5G.

During this year's ISC 2021 event, as a part of the company's exhibition portfolio, NVIDIA has decided to launch an updated version of the A100 accelerator. A couple of months ago, in November, NVIDIA launched an 80 GB HBM2E version of the A100 accelerator, on the SXM2 proprietary form-factor. Today, we are getting the same upgraded GPU in the more standard dual-slot PCIe type of card. Featuring a GA100 GPU built on TSMC's 7 nm process, this SKU has 6192 CUDA cores present. To pair with the beefy amount of computing, the GPU needs appropriate memory. This time, there is as much as 80 GB of HBM2E memory. The memory achieves a bandwidth of 2039 GB/s, with memory dies running at an effective speed of 3186 Gbps. An important note is that the TDP of the GPU has been lowered to 250 Watts, compared to the 400 Watt SXM2 solution.

To pair with the new upgrade, NVIDIA made another announcement today and that is an enterprise version of Microsoft's DirectStorage, called NVIDIA GPUDirect Storage. It represents a way of allowing applications to access the massive memory pool built on the GPU, with 80 GB of super-fast HBM2E memory.

NVIDIA today announced it is turbocharging the NVIDIA HGX AI supercomputing platform with new technologies that fuse AI with high performance computing, making supercomputing more useful to a growing number of industries.

To accelerate the new era of industrial AI and HPC, NVIDIA has added three key technologies to its HGX platform: the NVIDIA A100 80 GB PCIe GPU, NVIDIA NDR 400G InfiniBand networking, and NVIDIA Magnum IO GPUDirect Storage software. Together, they provide the extreme performance to enable industrial HPC innovation.

SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced launched the new SiFive Performance family of processors. The SiFive Performance family debuts with two new processor cores, the P270, SiFive's first Linux capable processor with full support for the RISC-V vector extension v1.0 rc, and the SiFive Performance P550 core, SiFive's highest performance processor to date. The new SiFive Performance P550 delivers a SPECInt 2006 score of 8.65/GHz, making it the highest performance RISC-V processor available today, and comparable to existing proprietary solutions in the application processor space.

"SiFive Performance is a significant milestone in our commitment to deliver a complete, scalable portfolio of RISC-V cores to customers in all markets who are at the vanguard of SOC design and are dissatisfied with the status quo," said Dr. Yunsup Lee, Co-Founder and CTO of SiFive. "These two new products cover new performance points and a wide range of application areas, from efficient vector processors that easily displace yesterday's SIMD architectures, to the bleeding edge that the P550 represents. SiFive is proud to set the standard for RISC-V processing and is ready to deliver these products to customers today."

The all-new AS-T10G2 is here, bringing increased efficiency and speeds to the much beloved AS-T10G. The AS-T10G2 uses the AQC-107 controller, which offers increased performance, and lower power requirements. Using the Lockerstor 16R Pro, transfer rates were found to be up to 1127 MB/s when reading and 1124 MB/s when writing. The AS-T10G2 also supports IP, TCP, UDP checksum offload to reduce CPU usage for a more efficient experience.

The AS-T10G2 is equipped with a 10 Gbps 8p8c RJ-45 Ethernet port. The AS-T10G2 supports automatic switching between all major Ethernet speeds and is compatible with four lanes of PCI Express 3.0. Pop it into an ASUSTOR NAS running ADM 4.0 or a PC to upgrade network speeds to 10-Gigabit Ethernet. The AS-T10G2 is compatible with both full-height and half-height computers, making it compatible with almost any device featuring a PCI Express slot, ensuring affordable, yet high speed networking for both homes and businesses.

Tachyum Inc. today announced that it has taken delivery of an IO motherboard for its Prodigy Universal Processor hardware emulator from manufacturing. This provides the company with a complete system prototype integrating CPU, memory, PCI Express, networking and BMC management subsystems when connected to the previously announced field-programmable gate array (FPGA) emulation system board.

The Tachyum Prodigy FPGA DDR-IO Board connects to the Prodigy FPGA CPU Board to provide memory and IO connectivity for the FPGA-based CPU tiles. The fully functional Prodigy emulation system is now ready for further build out, including Linux boot and incorporation of additional test chips. It is available to customers to perform early testing and software development prior to a full four-socket reference design motherboard, which is expected to be available Q4 2021.

QNAP Systems, Inc., a leading computing, and storage solutions innovator, today released the easy-to-use unmanaged switch QSW-2104 series, including the QSW-2104-2S (with 2-port 10 GbE SFP+ and 4-port 2.5 GbE RJ45) and the QSW-2104-2T (with 2-port 10 GbE RJ45 and 4-port 2.5 GbE RJ45). Featuring plug-and-play set up, near-silent fanless design, IEEE 802.3az compliance, and automatic loop detection and blocking, the QSW-2104 series provides the ideal choice for creating affordable high-speed network environments in homes and workplaces.

"Featuring 10 GbE and 2.5 GbE connectivity in one device, the QSW-2104 series can connect various bandwidth-demanding devices and helps users create a hybrid high-speed network in homes and workplaces. This is especially useful for accelerating file transfer, virtual machine applications, video streaming/sharing, and everyday tasks," said Frank Liao, Product Manager of QNAP, adding "for users looking to fully upgrade their network infrastructure, QNAP offers a range of 2.5 GbE/10 GbE-ready QNAP NAS and PCIe/USB adapters for desktops, servers, and laptops to take advantage of the game-changing bandwidth provided by next-generation networks."

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

Phison Electronics Corp., a global leader in NAND flash controllers and a complete line of storage solutions, and Cigent Technology, Inc., the leader in embedded cybersecurity technology, today unveiled design details behind the partnership that has delivered the industry's first and only line of self-defending storage devices with cybersecurity built into the firmware itself to protect against ransomware, data theft and malicious insider theft.

Phison's innovative and robust NAND flash solutions support a broad range of applications including embedded, consumer, enterprise and automotive. The Phison Crypto-SSD is a line of TCG enabled Self-Encrypting Drives that are designed to pass FIPS 140-3 Level 2 certification. Phison is committed to data security which helps to protect business and government users against loss or theft. Phison's collaboration with Cigent expands the E12DC Crypto-SSD security architecture to add additional compute capabilities, attack detectors and sensors directly on the drive. Together with Cigent, Phison has created a product that raises the bar of data security to a whole new level.

German publication, Igor's LAB, has got ahold of some information regarding AMD's upcoming Radeon RX 6600 series graphics card. Based on the Navi 23 SKU, the GPU is supposed to satisfy all the entry-level needs one would expect from a GPU. That means light 1080p gaming and multimedia streaming. For starters, let's get into details of the die. Igor's LAB notes that the die size is 235.76mm2, with a 35x35 mm package. The die will be centered in a package with a 45-degree rotation, which you can see how it looks in the images below. Additionally, the Navi 23 GPU will have SKUs ranging from 65 Watts to 95 Watts of Total Graphics Power (TGP). As far as frequency goes, the card BIOS points to the maximum clock speed of 2350 MHz, which is lower than the rumored 2684 MHz.

When it comes to memory, the upcoming Navi 23 GPUs can be equipped with up to 16 GB of GDDR6 memory, however, it is most likely that the regular gamer version will come with 8 GB of VRAM, while the Radeon Pro models will use the full 16 GB limit. As far as interface is concerned, the Radeon RX 6600 series will be limited to PCIe 4.0 x8 connection, as the low-end GPU doesn't require a full x16 slot. With the bandwidth of the PCIe 4.0, only eight lanes are enough for this GPU. These cards are expected to hit the market sometime in June, and we are waiting for the official announcement.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of AMD X570 platform with AORUS MODEL X and AMD B550 platform with mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of extreme performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the full operation, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers an ease and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a must to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with compatibility and three-year whole system warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, today presented two gaming systems of Intel Z590 platform with AORUS MODEL X and mini system AORUS MODEL S, which adopt the top-notch components and materials for extreme performance. Enhanced by the strict verification and leading technology, GIGABYTE provides the PC system of premium performance with optimized heat dissipation and acoustic control. The system maintains cool and quiet even under the overclocking, which balance the high performance and low temperature to keep the system acoustic under 40dB without throttling. Furthermore, the three-year warranty of full system offers reassuring and comprehensive service for users.

"When tackling the uplift of PC performance, multi-core, high frequency, and copious storage become a standard to the premium PC platform, as well as how to make the best components matrix to provide the optimized performance with reliability turns into more inevitable." indicated by Eddie Lin, Vice President of the GIGABYTE Channel Solutions. "The new AORUS system is well-tempered by multiple verification and tuning of GIGABYTE's R&D team, which provide a perfect match of cool, quiet, and powerful performance with optimized compatibility, Expandability, and three-year warranty of whole system.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.

In response to reports of the PCIe riser cable of its H1 case posing a fire hazard, NZXT in February 2021 instituted a recall of the case in the U.S. and Canada. The flaw in the component's design came to light in early-2020, but it was only by November that it responded to the issue. In its original design, the PCIe riser component was improperly grounded, and a short-circuit could result in a fire. NZXT's first response to this was sending out non-conductive Nylon screws for the users to replace the metal ones the part originally shipped with. This solution wasn't found to be effective, and resulted in a product recall this February. Regulators in the U.S. and Canada directed NZXT to send out free repair kits to existing owners of the H1, along with disposal instructions for the entire case, if the user wishes to discontinue use. We got our Repair Kit, and decided to go hands-on.

The NZXT Repair Kit, and replacement riser card appears to be one of the most solidly built PCIe risers in the market. Thanks to the crypto-mining boom, the market is flooded with PCIe risers of all shapes and sizes, and the NZXT riser looks to be among the better designed ones. What sets this apart from the original design is that now, the downstream (female end) of the riser comes with grounding rings around the mounting holes, similar to motherboards. These are bits of exposed copper that facilitate contact between the ground layer of the PCB, with the sheet-metal of the case. The original design lacked grounding pads on either side of the PCB, and when installed with metal screws, certain PCB traces could get shorted, causing them to heat up and start a fire. NZXT's first solution to this problem was non-conductive Nylon screws. End users with an H1 case, can request this riser cable from here.

Video streaming is looking a bit like magic. The uploader sends a video to one platform in one resolution and encoding format, while the viewer requests a video in a specific resolution and encoding format used by the device the video is streamed on. YouTube knows this best, as it represents the world's largest video platform with over 2 billion users visiting the platform each month. That takes a massive load on the server infrastructure over at Google's data centers that host the service. There is about 500 hours worth of video content uploaded to the platform every minute, and regular hardware isn't being enough anymore to handle everything.

That is why YouTube has developed custom chips, ASICs, that are called VCUs or Video (trans)Coding Units. In Google data centers, there is a large problem with transcoding. Each video needs to adapt to the streaming platform and desired specifications, and doing that on regular hardware is a problem. By using ASIC devices, such as VCUs, Google can keep up with the demand and deliver the best possible quality. Codenamed Argos, the chip can deliver 20-33x improvement in efficiency compared to the regular server platform. In data centers, the VCU is implemented as a regular PCIe card, with two chips under the heatsinks.

AMD seems to be preparing a chipset refresh, and this time, it is coming straight from the top-end market. When the company launched its high-end X570 chipset, it brought the PCIe 4.0 support, which many praised due to its capability to handle much faster NVMe drives. However, it seems like the company is not satisfied with that and it needs to release an updated chipset version called X570S. According to a popular hardware leaker, TUM_APISAK, we have discovered that GIGABYTE is preparing X570S Aorus Pro AX motherboard that will use the refreshed chipset. GIGABYTE already listed several Eurasian Economic Commission (EEC) listings, so the new chipset is sure to hit the market, just at an unknown time.

The S denotes the word silent, meaning that these updated chipsets are capable of working with passive cooling and possibly having a lower TDP compared to 11 and 15 Watts of the X570 chipsets for consumer and enterprise motherboards, respectively. The test was conducted using AMD's newly announced Ryzen 7 5700G processor. The 5000-series of APUs are so far limited to OEMs, so one would guess that GIGABYTE itself made the leak by using a public entry of CPU-Z validation.

ASUS today announced Mini PC PB62, a durable computer that delivers powerful performance to provide flexibility, expandability and performance to suit a range of business applications, including digital signage, point-of-sales (POS) system, kiosks and intelligent vending machines. Mini PC PB62 is powered by the latest desktop-grade up to 11th Generation Intel Core processor and fast DDR4 3200 MHz memory.

Engineered for performance: 11th Gen Intel Core, DDR4 3200 MHz memory and Intel Optane
With the latest up to 11th Gen Intel Core i7 processors, Mini PC PB62 is caters for with support for either a 35- or 65-watt CPU - so it's ready to be specified for supreme efficiency or maximum performance. PB62 also has built-in support for Intel Optane H20 memory, the technology that greatly improves storage speeds, enables frequently-used documents, pictures, videos and applications to be accessed more quickly while improving overall system performance to maximize productivity and efficiency.

Gigabyte Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest BIOS of B560 AORUS motherboards. Enhanced by the 12+1 phases DrMOS power stage with 60 Amps for each and full coverage VRM thermal design, B560 AORUS motherboards can support Intel Core i9 11900K (F) series processors overclocking to all cores 5.1 GHz. The exclusive anti-interference design of memory circuit enables DDR4 speed raising up to XMP 4800 MHz, and overclocking performance boost to DDR4 5300 MHz. which demonstrates GIGABYTE's strong R&D strength and persistence in quality. Users can enjoy the performance boost of time-limited overclocking by simply updating to the latest BIOS to meet their special needs.1

Intel B series chipset motherboards have been always excluded from overclocking due to the product positioning. Although the memory XMP overclocking is unlocked on 500 series, the processor frequency can only reach up to 4.8 GHz by Turbo Boost. Thanks to the efforts of Gigabyte's R&D team, the processor can be overclocked to 5.1 GHz and maintain low temperature under the Prime95 no AVX burn-in test. This powerful performance benefits from the top-quality materials of GIGABYTE AORUS motherboards and product design capabilities, which include 12+1 phases/ 60Apms DrMOS power stage, 6 layers 2Oz ultra-cool PCB, full-covered VRM thermal design, and the latest Smart Fan 6 technology for temperature control. These features allow processors to have a stable and pure power supply under ultra-high frequency operation, providing the most solid backing for the CPU limited-time overclocking.

QNAP Systems, Inc., today launched the QM2-2P2G2T PCIe card which adds M.2 SSD slots and 2.5 GbE connectivity to a QNAP NAS or PC/server/workstation. NAS users can benefit from 2.5 GbE connectivity, improve overall NAS performance by enabling SSD caching, and upgrade NAS storage capacity without occupying any 3.5-inch drive bays. PC/server/workstation users can increase their storage capacity while also boosting overall IOPS performance by offloading bandwidth-demanding tasks to SSDs to minimize application loading times.

The QM2-2P2G2T features dual 2.5GBASE-T Multi-Gigabit (2.5G/1G/100M/10M) network ports to boost bandwidth-demanding tasks. M.2 SSD thermal sensors allow real-time temperature monitoring, with a quiet cooling module (heatsink and smart fan) to keep the SSDs running within optimal temperatures.

Hewlett Packard Enterprise, the company focused on making enterprise hardware and software, has today mistakenly listed some of Intel's upcoming 3rd generation Xeon Scalable processors. Called Ice Lake-SP, the latest server processor generation is expected to launch sometime in the coming days, with a possible launch date being the March 23rd "Intel Unleashed" webcast. The next generation of processors will finally bring a new vector of technologies Intel needs in server space. That means the support for PCIe 4.0 protocol for higher speed I/O and octa-channel DDR4 memory controller for much greater bandwidth. The CPU lineup will for the first time use Intel's advanced 10 nm node called 10 nm SuperFin.

Today, in the leaked HPE listing, we get to see some of the Xeon models Intel plans to launch. Starting from 32-core models, all the way to 40-core models, all SKUs above 28 cores are supposed to use dual die configuration to achieve high core counts. The limit of a single die is 28 cores. HPE listed a few models, with the highest-end one being the Intel Xeon Platinum XCC 8380 processor. It features 40 cores with 80 threads and a running frequency of 2.3 GHz. If you are wondering about TDP, it looks like the 10 nm SuperFin process is giving good results, as the CPU is rated only for 270 Watts of power.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 7003 Series Processor-based server platforms featuring efficiency and performance enhancements in hardware, security, and memory density for the modern data center.

"Big data has become capital today. Large amounts of data and faster answers drive better decisions. TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "Moving the bar once more for workload performance, EPYC 7003 Series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "Time is the new metric for efficiency and EPYC 7003 Series processors are the perfect choice for the most diverse workloads, helping provide more and better data to drive better business outcomes."

AMD has four weeks ago acknowledged that there was a problem with 500 series motherboard chipsets. The problem has occurred with a few chipset functions like USB connectivity, USB 2.0 audio crackling (e.g. DAC/AMP combos), and USB/PCIe Gen 4 exclusion. To fix these problems, consumers were forced to either put up with problems or lower the PCIe standard from Gen 4 to Gen 3 and switch USB protocol revision from 3.0 to 2.0. This of course wasn't the ideal solution, especially for bandwidth-heavy applications. Users have submitted many reports to AMD, and the company appears to have found a root cause of these issues. AMD has published a Reddit thread, that reports that the company found a solution to the problem and that we are going to see a fix for it in a form in AGESA BIOS update.

AMD RedditAMD has prepared AGESA 1.2.0.2 to deploy this update, and we plan to distribute 1.2.0.2 to our motherboard partners for integration in about a week. Customers can expect downloadable BIOSes containing AGESA 1.2.0.2 to begin with beta updates in early April. The exact update schedule for your system will depend on the test and implementation schedule for your vendor and specific motherboard model. If you continue to experience intermittent USB connectivity issues after updating your system to AGESA 1.2.0.2, we encourage you to download the standalone AMD Bug Report Tool and open a ticket with AMD Customer Support.

Demand for notebook computers is expected to remain strong throughout 2Q21 due to the persisting stay-at-home economy that arose in the wake of the pandemic, according to TrendForce's latest investigations. In response to the high demand for notebooks, PC OEMs are actively raising a consistent inventory of components, including client SSDs. Nonetheless, client SSDs are now in increasingly tight supply because the preexisting shortage of NAND Flash controllers is now exacerbated by the power outage at Samsung's Austin-based semiconductor plant. SSD manufacturers are therefore preparing to raise the prices of SSDs. Accordingly, TrendForce has also revised up its forecast of client SSD prices for 2Q21 from "mostly flat" to a 3-8% increase QoQ instead.