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AMD Introduces Instinct MI210 Data Center Accelerator for Exascale-class HPC and AI in a PCIe Form-Factor

AMD today announced a new addition to the Instinct MI200 family of accelerators. Officially titled Instinct MI210 accelerator, AMD tries to bring exascale-class technologies to mainstream HPC and AI customers with this model. Based on CDNA2 compute architecture built for heavy HPC and AI workloads, the card features 104 compute units (CUs), totaling 6656 Streaming Processors (SPs). With a peak engine clock of 1700 MHz, the card can output 181 TeraFLOPs of FP16 half-precision peak compute, 22.6 TeraFLOPs peak FP32 single-precision, and 22.6 TFLOPs peak FP62 double-precision compute. For single-precision matrix (FP32) compute, the card can deliver a peak of 45.3 TFLOPs. The INT4/INT8 precision settings provide 181 TOPs, while MI210 can compute the bfloat16 precision format with 181 TeraFLOPs at peak.

The card uses a 4096-bit memory interface connecting 64 GBs of HMB2e to the compute silicon. The total memory bandwidth is 1638.4 GB/s, while memory modules run at a 1.6 GHz frequency. It is important to note that the ECC is supported on the entire chip. AMD provides an Instinct MI210 accelerator as a PCIe solution, based on a PCIe 4.0 standard. The card is rated for a TDP of 300 Watts and is cooled passively. There are three infinity fabric links enabled, and the maximum bandwidth of the infinity fabric link is 100 GB/s. Pricing is unknown; however, availability is March 22nd, which is the immediate launch date.

AMD places this card directly aiming at NVIDIA A100 80 GB accelerator as far as the targeted segment, with emphasis on half-precision and INT4/INT8 heavy applications.

Intel Arc GPU Found Inside Samsung Galaxy Book2 Pro is now Selling for $1350

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

ASRock Industrial Announces New Range of Industrial Motherboards with 12th Gen Intel Core Processors

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

AAEON Announces FWS-2280 Wireless AP

AAEON, experts in white box solution and network appliance manufacturing, have once again partnered with flexiWAN, a leading provider of open-source SASE and SD-WAN software. Part of this partnership has prompted the certification of the FWS-2280, allowing customers access to a wider range of deployment options.

Powered by the latest Intel Atom x6000E Processor (formerly Elkhart Lake), the FWS-2280 was designed to give the option of fast, accurate connections across SD-WAN and SASE networks, while also powering an entry-level firewall, making it an excellent companion for SMEs hoping to protect their networks. This solid base also allows the FWS-2280 to run applications such as uCPE; SD-WAN, VPN, SMB, UTM, and Firewall.

Cooler Master Outs PCI-Express 4.0 x16 300 mm Riser Cable

Cooler Master today rolled out its PCI-Express 4.0 x16 riser cable (model: MCA-U000C-KPCI40-300). To be purchased separately for use with cases that have vertical expansion slots that let you show off your graphics cards, the Cooler Master riser cable measures 300 mm in length. Its designed is characterized by one of the four strands of wiring featuring an outer insulation in the company's favorite shade of purple. The cable supports PCI-Express 4.0 x16, and all older generations or narrower lane-configurations of PCIe. The riser uses 30AWG tinned copper wires, and 96 ground-signal wires to dampen EMI; and gold-plated PCIe contact points on both the female and male sides. Cooler Master is backing this with 1-year warranty. The company didn't reveal pricing, but general availability is expected on 3rd March, 2022.

Intel Details Ponte Vecchio Accelerator: 63 Tiles, 600 Watt TDP, and Lots of Bandwidth

During the International Solid-State Circuits Conference (ISSCC) 2022, Intel gave us a more significant look at its upcoming Ponte Vecchio HPC accelerator and how it operates. So far, Intel convinced us that the company created Ponte Vecchio out of 47 tiles glued together in one package. However, the ISSCC presentation shows that the accelerator is structured rather interestingly. There are 63 tiles in total, where 16 are reserved for compute, eight are used for RAMBO cache, two are Foveros base tiles, two represent Xe-Link tiles, eight are HBM2E tiles, and EMIB connection takes up 11 tiles. This totals for about 47 tiles. However, an additional 16 thermal tiles used in Ponte Vecchio regulate the massive TDP output of this accelerator.

What is interesting is that Intel gave away details of the RAMBO cache. This novel SRAM technology uses four banks of 3.75 MB groups total of 15 MB per tile. They are connected to the fabric at 1.3 TB/s connection per chip. In contrast, compute tiles are connected at 2.6 TB/s speeds to the chip fabric. With eight RAMBO cache tiles, we get an additional 120 MB SRAM present. The base tile is a 646 mm² die manufactured in Intel 7 semiconductor process and contains 17 layers. It includes a memory controller, the Fully Integrated Voltage Regulators (FIVR), power management, 16-lane PCIe 5.0 connection, and CXL interface. The entire area of Ponte Vecchio is rather impressive, as 47 active tiles take up 2,330 mm², whereas when we include thermal dies, the total area jumps to 3,100 mm². And, of course, the entire package is much larger at 4,844 mm², connected to the system with 4,468 pins.

Gigabyte Launches UD1000GM PCIE 5.0 Power Supply

Gigabyte Technology Co. Ltd, a leading manufacturer of premium gaming hardware, today announced the new UD1000GM PCIE 5.0 power supply, which supports the latest PCIe Gen 5.0 graphics cards. The UD1000GM PCIE 5.0 has a 16-pin connector and comes with a high-quality native 16-pin cable, allowing it to support the latest PCIe Gen 5.0 graphics cards. The 16-pin cable supports up to 600 watts of power to the graphics card making it ready for the future high-end graphics cards. The UD1000GM PCIE 5.0 power supply inherits the spirit of Gigabyte Ultra Durable product design, introducing a variety of high-quality materials and technologies. Not only it is the best choice for high-end gamers and overclockers, but it is also ready for the next-gen graphics card.

The UD1000GM PCIE 5.0 power supply supports the PCIe Gen 5.0 graphics cards and it is capable to deliver the increasing power that the high-end graphics card demand. Traditional power supplies need a three 8-pin to 16-pin adapters to support the latest PCIe Gen 5.0 graphics cards. The new UD1000GM PCIE 5.0 power supply needs only a single 16-pin cable to directly supply power to the PCIe Gen 5.0 graphics cards. Moreover, the PCIe Gen 5.0 16-pin cable provides up to 600 watts of power to the graphics card, but it also simplifies the number of cables, significantly reducing the cable clutter, making the graphics card installation easier and it helps with the airflow in the chassis. In addition, the UD1000GM PCIE 5.0 also provides four PCIe 8-pins for the graphics cards, so it can meet the needs of current or next-generation high-end graphics cards at the same time.

Intel "Sapphire Rapids" Xeon 4-tile MCM Annotated

Intel Xeon Scalable "Sapphire Rapids" is an upcoming enterprise processor with a CPU core count of up to 60. This core-count is achieved using four dies inter-connected using EMIB. Locuza, who leads social media with logic die annotation, posted one for "Sapphire Rapids," based on a high-resolution die-shot revealed by Intel in its ISSCC 2022 presentation.

Each of the four dies in "Sapphire Rapids" is a fully-fledged multi-core processor in its own right, complete with CPU cores, integrated northbridge, memory and PCIe interfaces, and other platform I/O. What brings four of these together is the use of five EMIB bridges per die. This allows CPU cores of a die to transparantly access the I/O and memory controlled any of the other dies transparently. Logically, "Sapphire Rapids" isn't unlike AMD "Naples," which uses IFOP (Infinity Fabric over package) to inter-connect four 8-core "Zeppelin" dies, but the effort here appears to be to minimize the latency arising from an on-package interconnect, toward a high-bandwidth, low-latency one that uses silicon bridges with high-density microscopic wiring between them (akin to an interposer).

Intel Introduces Arctic Sound-M Data Center Graphics Card Based on DG2 Design and AV1 Encoding

At Intel's 2022 investor meeting, the company has presented a technology roadmap update to give its clients an insight into what is to come. Today, team blue announced one of the first discrete data-centric graphics cards in the lineup, codenamed Arctic Sound-M GPU. Based on the DG2 Xe-HPG variation of Intel Xe GPUs, Arctic Sound-M is the company's first design to enter the data center space. The DG2 GPU features 512 Execution Units (EUs), which get passive cooling from the single-slot design of Arctic Sound's heatsink, envisioned for data center enclosures with external airflow.

One of the most significant selling points that Intel advertises is support for hardware-based AV1 encoding standard. This feature allows the card to achieve a 30% greater bandwidth, and it is the main differentiator between consumer-oriented Arc Alchemist GPUs and itself. The card is powered by PCIe power and an 8-pin EPS power connector. Arctic Sound-M is already sampling to select customers and it will become available in the middle of 2022.

Below is Intel's teaser video.

NAND Flash Pricing Set to Spike 5-10% in Q2 Due to Material Contamination at WDC and Kioxia, Says TrendForce

WDC recently stated that certain materials were contaminated in late January at NAND Flash production lines in Yokkaichi and Kitakami, Japan which are joint ventures with Kioxia, according to TrendForce's investigations. Before this incident, TrendForce had forecast that the NAND Flash market will see a slight oversupply the entire year and average price from Q1 to Q2 will face downward pressure. However, the impact of WDC's material contamination issue is significant and Samsung's experience during the previous lockdown of Xi'an due to the pandemic has also retarded the magnitude of the NAND Flash price slump. Therefore, the Q1 price drop will diminish to 5~10%. In addition, according to TrendForce, the combined WDC/Kioxia NAND Flash market share in the 3Q21 was as high as 32.5%. The consequences of this latest incident may push the price of NAND Flash in Q2 to spike 5~10%.

The contaminated products in this incident are concentrated in 3D NAND (BICS) with an initial estimate of 6.5exabytes (approximately 6,500M GB) affected. According to TrendForce, damaged bits account for 13% of the group's output in 1Q22 and approximately 3% of the total output for the year. The normal production schedule for the entire line has yet to be confirmed. It is worth noting that the damages announced by WDC likely do not account for total losses stemming for this event and the number of damaged Kioxia parts has not been aggregated, so the total number of affected bits may increase further.

PSA: GPU-Z shows PCI-Express x16 for Radeon RX 6500 XT / Navi 24. It really is x4

AMD announced the Radeon RX 6500 XT and RX 6400 at CES just a few days ago. These new entry-level cards debut the company's first 6 nm GPU, codenamed "Navi 24"—the smallest chip from the RDNA2 family. Navi 24 is barely the size of a motherboard chipset, roughly 100 mm² in die size. The chip only features a 64-bit wide GDDR6 memory interface, needing just two memory chips to achieve 4 GB of memory size. While AMD has been fairly quiet about it, people quickly found out that the Navi 24 GPU only uses a PCI-Express 4.0 x4 host interface. While the physical connector is x16, there is only enough signal traces for x4.

Even the most updated 2.43.0 public version of GPU-Z misreports the bus interface as PCIe x16 4.0 though, which will certainly lead to confusion in the reviewer community who trust GPU-Z to report the correct specs and speeds for their articles. Maybe that's the reason why AMD has decided to not send us a sample this time—a first in 15 years.

Update Jan 20th: GPU-Z 2.44.0 has been released, which properly reports the PCIe bus configuration of RX 6500 XT.

PCI-SIG Releases PCIe 6.0 Specification: 64 GT/s Per Lane

PCI-SIG, the organization responsible for the widely adopted PCI Express (PCIe ) standard, today announced the official release of the PCIe 6.0 specification, reaching 64 GT/s. PCI Express technology has served as the de facto interconnect of choice for nearly two decades. The PCIe 6.0 specification doubles the bandwidth and power efficiency of the PCIe 5.0 specification (32 GT/s), while providing low latency and reduced bandwidth overhead.

"PCI-SIG is pleased to announce the release of the PCIe 6.0 specification less than three years after the PCIe 5.0 specification," said Al Yanes, PCI-SIG Chairperson and President. "PCIe 6.0 technology is the cost-effective and scalable interconnect solution that will continue to impact data-intensive markets like data center, artificial intelligence/machine learning, HPC, automotive, IoT, and military/aerospace, while also protecting industry investments by maintaining backwards compatibility with all previous generations of PCIe technology."

Impact of Components Shortage on Whole Device Shipments Continues, PCs and Notebooks Least Affected, Says TrendForce

Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce's investigations. Although all foundries are furiously increasing capital expenditures to expand capacity, unrealized future expansion does not ease existing supply issues. In addition, the uneven distribution of supply chain resources that has exacerbated the shortage of parts and components has yet to be definitively alleviated. Circumstances as a whole will continue affecting shipments of related whole devices. Only the PC category is expected to emerge largely unscathed in 1Q22.

Moving into 1Q22, TrendForce states, due to the limited increase in production capacity, the market's supply situation is expected to be approximately the same as in 4Q21. However, some end products have entered their traditional off-season cycle and the slowdown in demand momentum is expected to alleviate the immediate pressure on OEMs and ODMs regarding supply chain stocking.

QNAP Launches Dual-Port QM2 PCIe Cards with M.2 2280 NVMe SSD Slots and 10GbE Ports

QNAP Systems, today launched the QM2-2P410G1T and QM2-2P410G2T PCIe Gen 4 Cards; and the QM2-2P10G1TB PCIe Gen 3 Card. All three PCIe cards allow adding M.2 NVMe SSD slots and 10GbE connectivity to a QNAP NAS or PC/server/workstation, with no driver installation required. NAS users can improve overall NAS performance by enabling SSD caching, and upgrade NAS storage capacity without occupying any 3.5-inch drive bays. PC/server/workstation users can increase their storage capacity while also boosting overall IOPS performance by offloading bandwidth-demanding tasks to SSDs to minimize application loading times.

The QM2-2P410GxT series and the QM2-2P10G1TB features single/dual 10GBASE-T Multi-Gigabit (10G/5G/2.5G/1G/100M) network ports to boost bandwidth-demanding tasks. With QNAP 10GbE switches, you can easily upgrade to a high-speed network environment. M.2 SSD thermal sensors allow real-time temperature monitoring, with a quiet cooling module (heatsink and smart fan) to keep the SSDs running within optimal temperatures. A tool-less design also enables quick M.2 SSD installation and replacement.

Phanteks Previews Robotic-Looking Evolv Shift XT Case, Compact PSUs, and White Edition Products

Phanteks debuts a host of new products for the upcoming year at CES 2022 - The brand new Evolv Shift XT Mini-ITX Chassis and Revolt SFX Power Supplies, Matte White Editions for the Evolv X & Eclipse P600S Chassis, white SK PWM D-RGB Fans, white AMP Power Supply and a complete range of Gen4 PCIe Riser Cables and Gen4 Vertical GPU Bracket.

Brand new and unique Evolv Shift XT Mini-ITX Chassis and super compact Revolt SFX Power Supplies
Evolv Shift XT - Compact, Powerful, Futureproof
The Evolv Shift XT brings a unique small form factor that can extend in size to tailor to your cooling performance needs. The Evolv Shift XT has no compromise on performance with support for powerful hardware, whether in Compact, Aircooled, or Liquid Cooled Mode.

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

Axiomtek Partners with Leading AI Chipmaker Hailo to Launch Edge AI Computer for Smart City Applications

Axiomtek - a world-renowned leader relentlessly devoted in the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is pleased to announce its partnership with leading AI chipmaker Hailo to launch the RSC100, a state-of-the-art ARM-based edge AI computer (also named Plato). The ARM-based RSC100 (Plato) supports the Hailo-8 edge AI processor, the latter of which features up to 26 TOPS for running deep learning applications at full scale efficiently, intelligently, and sustainably. The partnership with Hailo offers customers a new level of AI solutions across a wide range of market segments such as smart city, smart retail, industry 4.0, and smart transportation.

"Hailo has gained a lot of experience in developing high-performance AI processors suitable for edge devices. The powerful yet affordable RSC100 (Plato) is our first fanless edge AI computing system that adopts the Hailo-8. The RSC100 (Plato) provides system developers with highly efficient implementation of innovative AI solutions at reduced time-to-market and engineering costs. With the advanced AI performance, the RSC100 (Plato) is well suited for use in smart city applications, including smart surveillance, smart factory, smart agriculture, and smart transportation," said Ken Pan, the product manager at Axiomtek.

Intel's NUC 12 Extreme Edition to Feature Non-Soldered LGA1700 Socket for Alder Lake

For a significant period, Intel's Next Unit of Computing (NUC) series has featured soldered processors on the PC's motherboard. However, according to the latest leaks from Twitter hardware leaker @9550pro, we have a potential Alder Lake-based NUC featuring desktop processor versions and a dedicated LGA1700 socket. As the leaked image shows, it looks like Intel's NUC 12 Extreme edition will feature an LGA1700 socket that features support for desktop-class of Alder Lake processors. If this leak is correct, we could see a compelling NUC solution filled with Intel-only processors, meaning an Alder Lake CPU and Arc Alchemist discrete graphics card.

There is room for PCIe expansion, which means that theoretically, you could connect any GPU to the mainboard. However, it is natural to assume that Intel could force their own GPU SKUs to launch this mini PC. We have to wait and see what Intel presents at tomorrow's CES 2022 event for more information.

NAND Flash ASP Expected to Undergo 10-15% QoQ Decline in 1Q22 as Market Shifts Towards Oversupply, Says TrendForce

Demand for NAND Flash products will undergo a noticeable and cyclical downward correction in 1Q22 as major smartphone brands wind down their procurement activities for the peak season and ODMs prepare for the New Year holidays, according to TrendForce's latest investigations. As such, the NAND Flash market will remain in an oversupply situation, with prices continuing to undergo downward corrections accordingly. However, PC OEMs have been reinstating certain orders for client SSDs since early November in response to improvements in the supply of upstream semiconductor materials. By fulfilling these orders, suppliers are able to keep their inventory level relatively low, meaning they are not under as much pressure as previously expected to reduce inventory by lowering prices. Taking these factors into account, TrendForce expects NAND Flash ASP to undergo a 10-15% QoQ decline in 1Q22, during which NAND Flash prices will experience the most noticeable declines compared to the other quarters in 2022.

Regarding the price trend of NAND Flash products across the whole 2021, TrendForce further indicates that suppliers have actively transitioned their output to higher-layer technologies, resulting in a bit supply growth that noticeably outpaces demand, though the tight supply of components such as controller ICs and PMICs has constrained the production of NAND Flash end-products. Hence, the decline in contract prices of NAND Flash products has not been as severe as previously expected. Moving ahead to 2022, however, the supply of relevant components is expected to gradually improve, so the market for various NAND Flash products will also likely shift towards a noticeable oversupply. As a result, prices of NAND Flash products will steadily decline before the arrival of the peak season in 3Q22.

Cougar Intros Polar Line of High-Wattage PSUs

Cougar today introduced the Polar line of high-wattage PSUs. These are characterized by their matte-white casing with a brushed aluminium tone that makes up the fan intake. The lineup are available in two models—1050 W and 1200 W, both with the same set of fully modular cables. Connectors include a 24-pin ATX, two 8-pin EPS, eight 6+2 pin PCIe power, nine SATA power, and three 4-pin Molex.

Under the hood, the Cougar Polar features a single +12 V rail design with 80 Plus Platinum efficiency, a 100% Japanese capacitor design, DC-to-DC switching, active PFC, and most common electrical protections. A 135 mm hydro-dynamic bearing fan keeps the unit cool with 0 dBA (fanless) operation up to 40% load (that's 480 W for the 1200 W model, and 420 W for the 1050 W model. The company didn't reveal pricing.

Akasa Intros AK-PCCE25-02 2.5GbE Adapter Capable of 25W PoE

Akasa has been into client networking products lately, with its recent low-profile 2.5 GbE adapter. The company's latest product in the category is the AK-PCCE25-02. This card provides 2.5 Gbps wired Ethernet connectivity, along with 25.5 Watts of Power-over-Ethernet (PoE), which should power equipment such as repeaters or cameras. It features all power switching components on board, and relies on a SATA power input for this purpose, and doesn't load the PCIe slot for PoE. Without the SATA power input, the PoE function is disabled, and it works like any other 2.5 GbE adapter. The card remains half-height, and a low-profile bracket is included. The company didn't reveal pricing.

Sapphire GPRO X080 and X060 Mining GPUs Based on AMD RDNA2 Navi Architecture Surface

Sapphire, along with various other AIB partners from AMD, has been making graphics cards exclusively for cryptocurrency mining. With the arrival of AMD's RDNA2 generation, this has continued as well. However, the company has been doing it more quietly to avoid backslash from its customers already furious about the poor availability of graphics cards in general. Fortunately, El Chapuzas Informatico managed to get ahold of two datasheets from Sapphire that highlight features and use cases of its GPRO X080 and GPRO X060 mining graphics cards, primarily targeting Ethereum coin mining.

According to the source, the company has readied two models based on RDNA2 chipsets. That is GPRO X080 SKU based on Navi 22 with 2304 Streaming Processors, running at 2132 MHz frequency. Paired with Navi 22 GPU, 10 GB of GDDR6 memory runs at 16 Gbps speed on a 160-bit bus. This model has no display outputs, and the only connector is a PCIe 4.0 x16 slot that connects the GPU to the motherboard. Running at the default 165 Watt TGP, the card produces a 38.0 MH/s hash rate, while the optimized form of 41.6 MH/s reduces TGP to just 93 Watts.

ADATA Industrial Unveils New Upgraded IM2P33E8 PLP PCIe Gen3x4 M.2 2280 Solid State Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the new upgraded ADATA IM2P33E8 PLP PCIe Gen3x4 M.2 2280 solid state drive (SSD) with Power Loss Protection (PLP) technology. Since its launch in 2019, the IM2P33E8 has been recognized by industry insiders and customers involved in 5G, IoT, cloud, AI and other industrial applications for its excellent performance, high capacities, and comprehensive data security mechanism.

In order to meet the requirements of industrial applications in the era of 5G, IoT, Cloud, AI, and big data analytics, ADATA is offering an SSD that is able to operate for longer after power outages and reduce the misidentification of bad blocks. This was achieved by the inclusion of tantalum polymer capacitors to the IM2P33E8 PLP. Tantalum polymer capacitors have the ability to reduce the detriment caused by power outages, most notably data loss.

Intel's Sapphire Rapids Xeons to Feature up to 64 GB of HBM2e Memory

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

GIGABYTE Prepares AORUS Z690 First Look Event to Showcase the Launch of the new Intel Alder Lake Platform

The launch of Intel's Alder Lake processsors has opened an exciting chapter for team blue and motherboard makers who are finally transitioning to new technologies like DDR5 and PCIe Gen5 standards. Today, GIGABYTE AORUS has prepared a complete lineup of motherboards designed to satisfy all kinds of workloads powered by Alder Lake processors as these AORUS Z690 motherboards are about to hit the market. These new boards include an upgraded feature set like 16+ phases power delivery on all boards, upgraded heatsinks to keep VRM temperatures under control, and built-in DDR5 overclocking features.

The event will be live-streamed on YouTube, so tune in to the First Look Event as the AORUS team gives an in-depth overview and cover the performance increase you can experience with Intel 12th gen CPU and DDR5 memory on the AORUS Z690 platform. They will be going over the new platform's entire lineup and feature set, so make sure you get to the event on time. It will start at 18:00 UTC zone, and you can tune in to watch here: AORUS Z690 First Look Event.
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