In addition to the 37 Gbps GDDR7 memory, Samsung Electronics prepares to showcase several other memory innovations at the 2024 IEEE-SSCC as compiled by VideoCardz. To begin with, the company is showcasing a new 280-layer 3D QLC NAND flash memory in the 1 Tb density, enabling next generation of mainstream SSDs and smartphone storage. This chip offers an areal density of 28.5 Gb/mm², and a speed of 3.2 GB/s. To put this into perspective, the fastest 3D NAND flash types powering the current crop of flagship NVMe SSDs rely on 2.4 GB/s of I/O data rates.

Next up, is a new generation DDR5 memory chip offers data rates of DDR5-8000 with a density of 32 Gbit (4 GB). This chip uses a symmetric-mosaic DRAM cell architecture, and is built on a 5th generation 10 nm class foundry node Samsung optimized for DRAM products. What's impressive about this chip is that it will allow PC memory vendors to build 32 GB and 48 GB DIMMs in single-rank configuration with DDR5-8000 speeds; as well as 64 GB and 96 GB DIMMs in dual-rank configuration (impressive, provided your platform can play well with DDR5-8000 in dual-rank).

Patriot Memory brought their latest ware to the 2024 International CES that use recent advancements in tech on both the SSD and memory fronts. On the SSD front, this year sees 14 GB/s capable PCIe Gen 5 NVMe SSDs thanks to Phison's E26 Max14um controller; and a new crop of USB4 portable SSDs; while the memory front sees DDR5 speeds go far north of DDR5-6000, thanks to on-module CKDs. Patriot showed us examples of each.

First up, there's the Patriot Viper PV573 Gen 5 NVMe SSD. This thing comes in capacities of up to 4 TB, and combines a Phison E26 Max14um controller with Micron's latest B58R TLC NAND flash chips that offer 2400 MT/s per flash channel. The controller also gets some incremental thermal optimizations, which means the cooling solution for the PV573 is a 16.5 mm-tall fan-heatsink. The drive offers up to 14 GB/s sequential reads, with up to 12 GB/s sequential writes. There's also a slightly de-rated version of this drive, the Viper PV553, which has the same combination of controller and NAND flash, but with transfer speeds of up to 12.4 GB/s reads, with up to 11.8 GB/s writes.

Next week at CES 2024, KIOXIA, the inventors of NAND flash, will highlight its extensive portfolio of solid state drives (SSDs) and memory solutions. This diverse lineup - one of the broadest range of flash solutions in the industry - is well-suited to virtually any solution that uses flash and includes new products, form factors and standards designed for upcoming IT requirements.

In today's dynamic technological landscape, where evolving standards push performance boundaries higher and end user expectations continue to climb, KIOXIA stands poised for the future by making the memory to process, manage and store the world's data. "Whether it's designing ultra-thin consumer PCs, enabling the automotive in-vehicle experience or streamlining professional photography - we make flash memory that brings applications to life and enhances user experiences," said Alex Mei, vice president of corporate marketing for KIOXIA America, Inc. "Countless consumer devices and applications rely on KIOXIA technology solutions to enrich lives and make new memories. CES gives us an opportunity to explore new possibilities and showcase the depth and breadth of our solutions."

Chinese memory maker Yangtze Memory Technology Corp (YMTC) is allegedly preparing its next-generation Xtacking 4.0 3D NAND flash architecture for next-generation memory chips. According to the documentation obtained by Tom's Hardware, YMTC has developed two SKUs based on the upgraded Xtacking 4.0: X4-9060, a 128-layer three-bit-per-cell (TLC) 3D NAND, and the X4-9070, a 232-layer TLC 3D NAND. By using string stacking on both of these SKUs, YMTC plans to make the 3D NAND work by incorporating arrays with 64 and 116 active layers stacked on top of each other. This way, the export regulation rules from the US government are met, and the company can use the tools that are not under the sanction list.

While YMTC has yet to fully disclose the specific advantages of the Xtacking 4.0 technology, the industry anticipates significant enhancements in data transfer speeds and storage density. These improvements are expected to stem from increased plane counts for optimized parallel processing, refined bit/word line configurations to minimize latency, and the development of modified chip variants to boost production yields. When YMTC announced Xtacking 3.0, the company offered 128-layer TLC and 232-layer four-bit-per-cell (QLC) variants and was the first company to achieve 200+ layer count in the 3D NAND space. The Xtacking 3.0 architecture incorporates string stacking and hybrid bonding techniques and uses a mature process node for the chip's CMOS underlayer. We have to wait for the final Xtacking 4.0 details when YMTC's officially launches the SKUs.

Today, IBM introduced the new IBM Storage Scale System 6000, a cloud-scale global data platform designed to meet today's data intensive and AI workload demands, and the latest offering in the IBM Storage for Data and AI portfolio.

For the seventh consecutive year and counting, IBM is a 2022 Gartner Magic Quadrant for Distributed File Systems and Object Storage Leader, recognized for its vision and execution. The new IBM Storage Scale System 6000 seeks to build on IBM's leadership position with an enhanced high performance parallel file system designed for data intensive use-cases. It provides up to 7M IOPs and up to 256 GB/s throughput for read only workloads per system in a 4U (four rack units) footprint.

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today held its annual Memory Tech Day, showcasing industry-first innovations and new memory products to accelerate technological advancements across future applications—including the cloud, edge devices and automotive vehicles.

Attended by about 600 customers, partners and industry experts, the event served as a platform for Samsung executives to expand on the company's vision for "Memory Reimagined," covering long-term plans to continue its memory technology leadership, outlook on market trends and sustainability goals. The company also presented new product innovations such as the HBM3E Shinebolt, LPDDR5X CAMM2 and Detachable AutoSSD.

TrendForce research reveals that, due to the impacts of high inflation and economic downturn, CSPs are adopting more conservative strategies when it comes to capital expenditure and consistently reducing their annual server demand forecasts. Currently, CSPs in China have reported a decline in cloud orders compared to last year, leading to a subsequent decrease in annual procurement volumes for enterprise SSDs. In North America, some clients have postponed mass production timelines for new server platforms while ramping up investments in AI servers. These factors have resulted in enterprise SSD orders falling below expectations. Consequently, global enterprise SSD revenue hit an all-time low in the second quarter, totaling just $1,500 million—a QoQ decrease of 24.9%.

Demand for AI servers remains strong in the third quarter, while orders and shipment momentum for general-purpose servers have yet to show signs of recovery. This continues to put pressure on the purchasing volume of enterprise SSDs, and annual bit volume is expected to be lower than last year. Meanwhile, vendors have once again reduced capacity utilization to slow down inventory growth. Server customers still maintain high inventory levels, and their purchasing momentum remains insufficient. This is expected to lead to an approximate 15% QoQ decline in the average price of enterprise SSDs in the third quarter, which may further result in a lackluster revenue performance for the peak season.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.

DDN, the global leader in artificial intelligence (AI) and multi-cloud data management solutions, today announced a major breakthrough for its all flash and hybrid storage solutions. DDN's parallel file system technology, combined with AI and data center specific data compression, delivers the highest performance efficiency straight into generative AI, machine learning and other enterprise high-performance applications.

Eliminating the need for complex networking and heavily bottlenecked performance found in other data storage solutions, DDN's new AI400X2 QLC and hybrid storage arrays combine DDN's parallel file system with novel client-side data compression, increasing performance by 10x, growing effective capacity by up to 15x and reducing data center footprint by 2x.

Solidigm, a leading global provider of innovative NAND flash memory solutions, is expanding its D5 Product Series with the Solidigm D5-P5430, a new QLC solid-state storage drive (SSD) optimized for mainstream and read-intensive workloads. With most of today's enterprise applications read-dominant, the D5-P5430—a 4th gen PCIe QLC SSD—offers substantial storage density and Total Cost of Ownership (TCO) opportunities while delivering read performance that is equivalent to the most widely-adopted TLC SSDs.

The D5-P5430 is optimized for mainstream workloads (e.g., email/unified communications, decision support systems, object storage, and virtual desktop infrastructure) and read-intensive workloads (e.g., content delivery networks, data lakes/pipelines, video-on-demand). These workloads are typically 80% reads or higher and need to move massive amounts of data at high throughput.

Samsung Electronics today reported financial results for the first quarter ended March 31, 2023. The Company posted KRW 63.75 trillion in consolidated revenue, a 10% decline from the previous quarter, as overall consumer spending slowed amid the uncertain global macroeconomic environment. Operating profit was KRW 0.64 trillion as the DS (Device Solutions) Division faced decreased demand, while profit in the DX (Device eXperience) Division increased.

The DS Division's profit declined from the previous quarter due to weak demand in the Memory Business, a decline in utilization rates in the Foundry Business and continued weak demand and inventory adjustments from customers. Samsung Display Corporation (SDC) saw earnings in the mobile panel business decline quarter-on-quarter amid a market contraction, while the large panel business slightly narrowed its losses. The DX Division's results improved on the back of strong sales of the premium Galaxy S23 series as well as an enhanced sales mix focusing on premium TVs.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of two new PCIe Gen 4 M.2 Solid State Drives—the MP600 MINI and the MP600 CORE XT. These drives extend the CORSAIR SSD range to an ultra-compact M.2 2230 form factor, and a new highly competitive combination of price and performance, allowing a new wave of device upgrades.

The MP600 MINI brings CORSAIR M.2 SSD performance to its smallest ever size, with the M.2 2230 form factor measuring just 22 mm x 30 mm. The MP600 MINI is compatible with popular handheld gaming systems, such as the Valve Steam Deck, as well as thin and light machines where space is at a premium, such as the Microsoft Surface Pro 8 and 9. With an impressive 1 TB of capacity and PCIe Gen 4 performance of up to 4,800 MB/sec read and 4,800 MB/sec write, the MP600 MINI is an ideal performance and storage upgrade for data hungry small-form-factor devices, whether it's to store a growing game collection, or essential files.

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.

"The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership," said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. "By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions."

Although NAND suppliers have continued to roll back production, there is still an oversupply of NAND Flash as demand for products such as servers, smartphones, and notebooks is still too weak. Therefore, TrendForce predicts that the ASP of NAND Flash will continue to fall in 2Q23, though that decline may shrink to 5~10%. The key to supply and demand returning to a market equilibrium lies in whether NAND suppliers can cut back on production even more. TrendForce believes if demand remains stable, then the ASP of NAND Flash will have an opportunity to rebound in 4Q23; if demand is weaker than expected, then ASP will take longer to recover.

Client SSD: Currently, PC OEM's have managed to liquidate most of their component inventory, and are now gearing up in preparation for mid-year sales events. Suppliers are cutting prices to clear out their inventories of PCIe Gen 3 SSDs, which are gradually being phased out. Meanwhile, prices of PCIe Gen 4 SSDs continue to face downward pressure due to a slow intake of new customer orders. The continuous decline of QLC products in 1Q23 has also dragged down the prices of TLC products, and there is relatively little room for prices to keep falling in 2Q23. While it still remains unclear whether or not demand will recover, TrendForce projects that the prices of PC client SSDs will drop 5~10% in 2Q23.

No more to traditional mechanical drives as the era of high-capacity QLC has arrived. Leading memory brand Team Group today has announced the launch of two QLC SSDs to meet the various needs of users: Team Group MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD come in capacities of up to 2 TB and 4 TB, respectively. Whether for more storage for installing or storing OSs, programs, games, or documents, they are the perfect upgrade solutions for your computer.

In response to different storage upgrade needs of consumers, Team Group MP33Q M.2 PCIe SSD is designed with 3D QLC flash memory chips, PCIe Gen 3 x4 interface and NVMe 1.3 protocol. With up to 2,500 MB/s in read speed and 2,100 MB/s in write speed, it outperforms SATA III SSDs by five times and is available in capacities of up to 2 TB. With its carefully selected 3D QLC NAND flash and SLC Cache technology, Team Group MP33Q M.2 PCIe SSD brings a top-of-the-line solution to the storage market.

TrendForce's latest investigations reveal that the global NAND Flash market has been facing a demand headwind since 2H22. In response, the supply chain has been scrambling to clear out inventory, driving down NAND Flash contract prices by 20-25%. Enterprise SSD took the brunt of the fall with prices plummeting 23-28%. Despite manufacturers lowering prices in an attempt to drive up demand, clients are hesitant to purchase more components for fear of overstock. As a result, NAND Flash bit shipments rose by a mere 5.3% as ASP fell 22.8%. Global NAND Flash revenue was reported to be US$10.29 billion in 4Q22—down 25% QoQ.

TrendForce reports that Kioxia and Micron saw both a reduction in production and price in 4Q22. Kioxia's revenue plunged 30.5% due to weak demand from PC and smartphone clients and data centers readjusting their inventory. Micron generated a quarterly revenue of US$1.1 billion—a staggering 34.7% QoQ drop—that has led them to drastically decrease their capacity utilization rate for fabs. Luckily, Micron was able to ship their 232-layer client SSDs in 4Q22 as scheduled, and with the 176-layer QLC enterprise SSD hot on its heels, Micron's bit shipments are predicted to steadily improve in 2023 with their revenue climbing gradually quarter by quarter.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the SM2268XT, its latest high-performance PCIe Gen 4 SSD controller solution optimized for higher speed NAND transfer rates. The SM2268XT's superior performance and robust reliability allows customers to accelerate development of next-generation SSDs using current and future TLC and QLC 3D NAND flash with comprehensive data integrity and correction without compromising throughput and latency.

The SM2268XT features a dual-core ARM R8 CPU with four lanes of 16 Gb/s PCIe data flow and supports four NAND channels with up to 3,200 MT/s per channel, enabling designers to take advantage of higher throughput next-generation high-speed TLC and QLC 3D NAND flash. Its multi-core design automatically balances the compute load to deliver industry-leading sequential read and write speeds of 7,400 MB/s & 6,500 MB/s, and random read & write speed of 1,200K IOPS. In addition, its advanced architecture enables lower power consumption and rigorous data protection, providing high performance and reliability in a cost-effective DRAM-less PCIe Gen 4 NVMe SSD solution.

At the 2023 International CES, we caught a hold of Phison, makes or arguably the most popular SSD controllers, which sprung to prominence on being the first to market with PCIe Gen 4 NVMe controllers, and now hopes to repeat it with PCIe Gen 5. We'd been shown a reference-design Phison E26-powered M.2 SSD, along with some hardware specs of the controller itself. The drive itself isn't much to look at—a standard looking M.2-2280 drive with a PCI-Express 5.0 x4 host interface, and the Phison E26 controller with its shiny IHS being prominently located next to a DDR4 memory chip, and two new-generation Micron Technology 3D NAND flash memory chips.

The Phison E26 controller, bearing the long-form model number PS5026-E26, is an NVMe 2.0 spec client-segment SSD controller. It has been built on the TSMC 12 nm FinFET silicon-fabrication node. The controller features an integrated DRAM controller with support for DDR4 and LPDDR4 memory types for use as DRAM cache. Its main flash interface is 8-channel with 32 NAND chip-enable (CE) lines, support for TLC and QLC NAND flash, a dual-CPU architecture, and hardware-acceleration for AES-256, TCG-Opal, and Pyrite. The controller features Phison's 5th generation LPDC ECC and internal RAID engines. For its reference-design 2 TB TLC-based drive, Phison claims sequential transfer rates of up to 13.5 GB/s reads, with up to 12 GB/s writes. The 4K random-access performance is rated at up to 1.5 million IOPS reads, with up to 2 million IOPS writes.

TrendForce reports that the recent easing of tight supply for components has led to rising shipments for enterprise servers. Furthermore, ODMs for the most part have been able to sustain the momentum of data center build-out with the demand from ByteDance and the tenders issued by Chinese telecom companies. Nevertheless, the performance of the enterprise SSD market on the whole has been impacted by falling NAND Flash prices. For 3Q22, the NAND Flash industry's enterprise SSD revenue dropped by 28.7% QoQ to US$5.22 billion. Furthermore, all enterprise SSD suppliers recorded a negative performance for the period as well.

Regarding individual enterprise SSD suppliers' revenue figures for 3Q22, Samsung posted around US$2.12 billion. Its market share also shrank to 40.6% from 44.5% in 2Q22. Samsung's performance was mainly dragged down by the decline in its NAND Flash ASP. In the aspect of product development, SSDs featuring 128L NAND Flash and PCIe 4.0 will remain Samsung's main offerings for enterprise storage during 2023.

Solidigm—the company that Intel sold its SSD business to—held a tech day last week where the company shared some details about its future roadmaps. The company appears to be focusing on 3D QLC NAND and its 192-layer product promises both larger drives, but also enhanced endurance for QLC NAND. For example, Solidigm's 30.72 TB SSD is promising a PBW of around 32 PB (Petabyte) endurance. This is using what the company calls QLC Essential Endurance NAND.

However, its QLC Value Endurance NAND is what will enable the 61.44 TB drive, which is said to offer around 65 PB write endurance, but it should be noted that this is at 16 KB aligned data or during other types of light data writes. Neither type of NAND is destined for consumer applications as of now, as Solidigm is only targeting E1, E3 and U.2 form factors. Regardless, this appears to be a huge step forward for 3D QLC NAND and Solidigm is hoping that its upcoming drives will be able to replace mechanical drives in the enterprise market space. On top of this, Solidigm also claims to offer better throughput and latency compared to its competitors, but we're still looking at SATA type level SSD performance for the IOPS. The first drives with the new 192-layer 3D QLC NAND are expected to be available sometime early next year.

Kingston released the NV2 line of entry-level M.2 NVMe SSDs succeeding the NV1 series from early-2021, which was infamous for its hardware-specs lottery. The biggest change with the NV2 series is the move to PCI-Express Gen 4 (from Gen 3 for the NV1 series), even though it doesn't appear like they can take advantage of all that bandwidth.

The Kingston NV2 comes in capacities of 250 GB, 500 GB, 1 TB, and 2 TB; and offer sequential transfer speeds of up to 3000 MB/s reads, with up to 1300 MB/s writes; with endurance ratings of up to 80 TBW for 250 GB, 160 TBW for 500 GB, 320 TBW for 1 TB, and 640 TBW for 2 TB. The company won't mention the controller + NAND flash combo in use (so it could use whatever combination it wants to in the future, as long as the advertised speeds and endurance are achieved); but in all likelihood, this is Phison E19T DRAMless controller that features PCI-Express 4.0 x4, paired with 3D QLC NAND flash. Kingston is backing these with 3-year warranties.

According to TrendForce research, material supply improvement and spiking demand for enterprise SSDs from North American hyperscale data center and enterprise clients in 2Q22 coupled with the Kioxia contamination incident in 1Q22 prompted customers to ramp up procurement to avoid future supply shortages. Manufacturers also give priority to meeting the needs of server customers due to the high pricing of enterprise SSD. In the second quarter, overall revenue of the enterprise SSD market increased by 31.3% to US$7.32 billion.

As the market leader, Samsung has grown its enterprise SSD revenue to US$3.26 billion with the recovery of enterprise SSD procurement. Especially in the second quarter, when orders for other consumer products continued to decline, enterprise SSD became the company's outlet for reducing production capacity. At present, Samsung has been continuously investing in the development of next-generation transmission specification products such as the CXL 2.0 product released at the Flash Summit in early August, in order to maintain a leading position in the market.

Solidigm has announced the Solidigm P41 Plus, the company's first branded solid-state storage drive (SSD) since becoming a company in December 2021. The P41 Plus is an innovative PCIe 4.0 product that delivers the industry's best combination of performance and value to PC users for everyday productivity and gaming. Capable of delivering up to 4,125 MB/s sequential read speed, the Solidigm P41 Plus represents a breakthrough in cost efficiency, delivering great PCIe 4.0 performance at a price that won't break the budget for everyday PC users. The Solidigm P41 Plus features 144-layer 3D NAND and is widely available in an M.2 2280 form factor in capacities of 512 GB, 1 TB, and 2 TB. For increased design flexibility, the Solidigm P41 Plus is also available to OEMs in 2230 and 2242 sizes.

In a move that reinforces Solidigm's commitment to being a new paradigm in solid-state storage, the company has invested significantly in storage software to unlock the best possible user experience. The result is Solidigm Synergy software, an optional but highly recommended suite that includes both a storage driver and a Windows application with robust drive health monitoring tools. The Solidigm Storage Driver supports host-managed caching by monitoring usage patterns to identify high-priority data, keeping the most important items in the cache, and enabling faster reads as the drive fills up.

According to TrendForce, market oversupply intensified in 2Q22 due to lagging demand and continued NAND Flash output and process advancement. The market consensus is a disappointing 2H22 peak season for consumer electronics including notebooks, TVs, and smartphones. Material inventory levels continue to rise and has become a risk to the supply chain. Due to slow destocking among distributors and a conservative stocking approach among clients, inventory problems have bubbled over upstream onto the supply side and sellers are under increased pressure to sell. TrendForce estimates, due to the rapid deterioration of the balance between supply and demand, the drop in NAND Flash pricing will expand to 8~13% in 3Q22, and this decline may continue into 4Q22.

In terms of Client SSD, due to weak consumer demand, various PC brands have significantly reduced their purchase order volume in 3Q22 in order to digest 1H22 SSD inventory. As suppliers shift focus to 176-layer client SSD, 176-layer QLC SSDs have begun to ship, and YMTC looks to expand shipment of notebook client SSDs in 2H22, price competition has become increasingly fierce, forcing manufacturers to increase price concessions to incentivize clients to up order volume. Thus, the decline in client SSD pricing is expected to expand to 8~13% in 3Q22.

Micron Technology, Inc., today announced new client solid-state drives (SSDs) that bring NVMe performance to client computing applications, freeing laptops, workstations and other portables from legacy architectures that can rob devices of battery power, performance and productivity. The Micron 2300 SSD combines the power and density needed to drive compute-heavy applications in a compact form factor with the reduced power consumption modern mobile users demand. For the first time, Micron brings together NVMe performance and low-cost quad-level-cell (QLC) NAND in the Micron 2210 QLC SSD. It combines fast NVMe throughput and Micron's leadership in QLC technology to offer flash capabilities at hard disk drive-like price points while reducing power consumption by 15 times when compared to hard drives.

"Ninety percent of client platforms will ship NVMe SSDs within the next year, and the market is fast bifurcating into mainstream and value market segments," said Roger Peene, vice president of marketing, Storage Business Unit, Micron. "Our two new client SSDs, the 2300 and 2210, are optimized for each segment. The 2300 offers outstanding power performance, while the 2210 delivers compelling price performance by using Micron's industry-leading QLC NAND." Both SSDs introduced today are built on Micron's innovative 96-layer 3D NAND technology to deliver power savings, right-sized capacity and compact form factors that enable flexible designs. They also deliver enhanced client security features and capabilities for protecting data, with TCG Opal 2.0 and TCG Pyrite 2.0 support.