AMD is slowly preparing the launch of the latest and greatest Ryzen processor family based on the Zen 4 CPU core design. Among various things that are getting an overhaul, the Raphael processor generation is now getting revamped temperature reading and better power management circuitry. According to an Igor's Lab report, AMD has prepared a few new improvements that will make temperature reading and power management easier for PC enthusiasts. Currently, the reported CPU temperature is called Tcontrol (Tctl), which is what the cooling solution sees. If Tctl is high, the fans spin up and cool the system. If Tctl is low, the fans slow down to reduce noise.

With Raphael, the CUR_TEMP (current temperature) output part of Tctl has been upgraded to reflect a much smoother curve, and avoid jittering with fans as they are not spiking so suddenly anymore. This is helping contribute to the noise output and has made it run at a consistent fan speed in the system. Another note about Raphael is a new power management technique. AMD has designed the AM5 platform to avoid sudden power spikes, to maintain maximum efficiency over time. It is a design decision made from the very start, and the CPU will try to constrain itself in the TDP range that it is configured for. For more details about the circuitry, please head over to the Igor's Lab article.

AMD is slowly preparing to launch its next-generation processors based on the new AM5 socket. The new lineup of processors will be based on the upgraded Zen 4 architecture that is said to bring multiple microarchitecture improvements and enhancements, equaling to a possible high-performance increase. Today, according to ExecutableFix, the person who provided us with renders of AMD's upcoming AM5 socket designed for next-generation Raphael processors. As we previously reported, AM5 is doing away from PGA and switching to LGA type instead, where pins are delivered on the socket, not the CPU like we used to see with AMD processors.

The LGA-1718 socket, pictured in the renders below, looks like a simple retention mechanism, where there is one metal arm to hold the lid down under pressure. If it turns out to be true, this implementation will be a very positive upgrade over the past PGA socket found on AM4 and before. We can look forward to seeing what AMD will deliver once the launch of Raphael processors gets closer.

We have recently seen several reputable rumors confirming that AMD's Zen 4 Raphael desktop processors will be limited to 16 cores with 2 compute units. There were previous rumors of a 24 core model with 3 compute units however that now seems unlikely. While the core counts won't increase some skews may see a TDP increase up to 170 W which should offer some performance uplift. AMD is expected to debut their 5 nm Zen 4 Raphael desktop processors in 2022 which will come with support for PCIe 5.0 and DDR5. The processors will switch to a new AM5 LGA1718 socket and will compete with Intel's Alder Lake-S successor Raptor Lake which could feature 24 cores.

Last week,we have covered the leak of AMD's upcoming Raphael processor integrated heat spreader (IHS), which featured a rather unique design. While we have made speculations as to why the design was made like that, it seems that we now have an answer to the question. It was previously believed that the unique IHS design was there to protect a double-substrate design, like Intel designed with Skylake-X. However, thanks to the updated design by ExecutableFix, we now know that AMD's design choice for Raphael is based on the simple fact that the IHS needs those cutouts for capacitors, as this seems to be the only place to have them.

As you can see below, there was no room on the LGA side, where the LGA pads are placed, and a lot of speculation suggested that capacitors were placed under the IHS or in IHS cutouts. The latter has proven to be the case according to this leak. You can check out some of the updated renderings in the images below.

AMD is preparing to switch things up a bit with its upcoming AM5 platform. The new platform is said to bring significant changes to the design of the socket and the CPU package, where we will see some new design choices and decisions. For starters, all of the processors made for the AM5 platform will come in a land grid array (LGA) configuration, very similar to that of Intel. Thanks to the rendering of ExecutableFix, we got to see exactly how will the new LGA design look like. And today, we get to see more details of the AMD's upcoming Raphael processor's integrated heat spreader (IHS) design.

The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.

Today, we have talked about AMD's upcoming Raphael lineup of processors in the article you can find here. However, it seems like the number of leaks on AMD's plans just keeps getting greater. Thanks to the "itacg" on Weibo, we have learned that AMD's Ryzen 8000 desktop series of processors are reportedly codenamed as Granite Ridge. This new codename denotes the Zen 5 based processors, manufactured on TSMC's 3 nm (N3) node. Another piece of information is that AMD's Ryzen 8000 series APUs are allegedly called Strix Point, and they also use the 3 nm technology, along with a combination of Zen 5 and Zen 4 core design IPs. We are not sure how this exactly works out, so we have to wait to find out more.

The rumor mill keeps crushing away; in this case, regarding AMD's plans for their next-generation Zen designs. Various users have shared pieces of the same AMD roadmap, which apparently places AMD in an APU-focused landscape come their Ryzen 7000 series. we are currently on AMD's Ryzen 5000-series; Ryzen 6000 is supposed to materialize via a Zen 3+ design, with improved performance per watt obtained from improvements to its current Zen 3 family. However, Ryzen 7000-series is expected to debut on AMD's next-gen platform (let's call it AM5), which is also expected to introduce DDR5 support for AMD's mainstream computing platform. And now, the leaked, alleged roadmaps paint a Zen 4 + Navi 2 APU series in the works for AMD's Zen 4 debut with Raphael - roadmapped for manufacturing at the 5 nm process.

The inclusion of an iGPU chip with AMD's mainstream processors may signal a move by AMD to produce chiplets for all of its products, and then integrating them in the final product. You just have to think about it in the sense that AMD could "easily" pair one of the eight-core chiplets from the current Ryzen 5800X, for example, with an I/O die (which would likely still be fabricated with Global Foundries) an an additional Navi 2 GPU chiplet. It makes sense for AMD to start fabricating GPUs as chiplets as well - AMD's research on MCM (Multi-Chip Module) GPUs is pretty well-known at this point, and is a given for future development. It means that AMD needed only to develop one CPU chiplet and one GPU chiplet which they can then scale on-package by adding in more of the svelte pieces of silicon - something that Intel still doesn't do, and which results in the company's monolithic dies.