Monday, May 31st 2021
AMD Ryzen 7000 Series "Raphael" Zen 4 Processor IHS Design Gets Leaked
AMD is preparing to switch things up a bit with its upcoming AM5 platform. The new platform is said to bring significant changes to the design of the socket and the CPU package, where we will see some new design choices and decisions. For starters, all of the processors made for the AM5 platform will come in a land grid array (LGA) configuration, very similar to that of Intel. Thanks to the rendering of ExecutableFix, we got to see exactly how will the new LGA design look like. And today, we get to see more details of the AMD's upcoming Raphael processor's integrated heat spreader (IHS) design.
The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.
As you can see, the IHS is very similar to that found on Intel's now discontinued Skylake-X HEDT design, pictured below. Underneath Skylake-X lies a double substrate setup, which is protected by the spider-like IHS. Could that be the same reason that AMD decided to use this IHS design, or is there something else at play here? We just have to wait for more information to find out.
Source:
ExecutableFix (Twitter)
The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.
24 Comments on AMD Ryzen 7000 Series "Raphael" Zen 4 Processor IHS Design Gets Leaked
Maybe AMD got inspired and decided to optimize manufacturing by making the same BGA assembly for everything, and only adding a second layer and tweaking PL/boost for desktop versions?
5800X is the demonstration on how difficult is to cool a MCM chip, and I think the 5nm node will makes things even worst.
Future IHS'es will have an integrated cold plate "vapour chamber" in my honest opinion. It is such a small, but effective fix. That and liquid metal: small coolers will suffer while big towers take the spotlight.
MCM has +1GHz potential - we have seen it even as far back from Intel Clarkdale - AMD is in no hesitancy to let it sit idle. They will have that much more nails to hammer home.
I'm curious - does it actually have holes in it or is it just cutouts and the IHS is fully sealed?
Added Heat Sink instead of Integrated.