Hypertec proudly announces the launch of its latest breakthrough product, the TRIDENT iG series, an immersion-born GPU server line that brings extreme density, sustainability, and performance to the AI and HPC community. Purpose-built for the most demanding AI applications, this cutting-edge server is optimized for generative AI, machine learning (ML), deep learning (DL), large language model (LLM) training, inference, and beyond. With up to six of the latest NVIDIA GPUs in a 2U form factor, a staggering 8 TB of memory with enhanced RDMA capabilities, and groundbreaking density supporting up to 200 GPUs per immersion tank, the TRIDENT iG server line is a game-changer for AI infrastructure.

Additionally, the server's innovative design features a single or dual root complex, enabling greater flexibility and efficiency for GPU usage in complex workloads.

Dell Technologies (NYSE: DELL) continues to make enterprise AI adoption easier with the Dell AI Factory, expanding the world's broadest AI solutions portfolio.Powerful new infrastructure, solutions and services accelerate, simplify and streamline AI workloads and data management.

"Getting AI up and running across a company can be a real challenge," said Arthur Lewis, president, Infrastructure Solutions Group, Dell Technologies. "We're making it easier for our customers with new AI infrastructure, solutions and services that simplify AI deployments, paving the way for smarter, faster ways to work and a more adaptable future."

CoolIT Systems (CoolIT), the world leader in liquid cooling systems for AI and high-performance computing, introduces the CHx1000, the world's highest-density liquid-to-liquid coolant distribution unit (CDU). Designed for mission-critical applications, the CHx1000 is purpose-built to cool the NVIDIA Blackwell platform and other demanding AI workloads where liquid cooling is now necessary.

"CoolIT created the CHx1000 to provide the high capacity and pressure delivery required to direct liquid cool NVIDIA Blackwell and future generations of high-performance AI accelerators," said Patrick McGinn, CoolIT's COO. "Besides exceptional performance, serviceability and reliability are central to the CHx1000's design. The single rack-sized unit is fully front and back serviceable with hot-swappable critical components. Precision coolant controls and multiple levels of redundancy provide for steady, uninterrupted operation."

Yesterday, Arm has announced significant progress in its Total Design initiative. The program, launched a year ago, aims to accelerate the development of custom silicon for data centers by fostering collaboration among industry partners. The ecosystem has now grown to include nearly 30 participating companies, with recent additions such as Alcor Micro, Egis, PUF Security, and SEMIFIVE. A notable development is a partnership between Arm, Samsung Foundry, ADTechnology, and Rebellions to create an AI CPU chiplet platform. This collaboration aims to deliver a solution for cloud, HPC, and AI/ML workloads, combining Rebellions' AI accelerator with ADTechnology's compute chiplet, implemented using Samsung Foundry's 2 nm Gate-All-Around (GAA) FET technology. The platform is expected to offer significant efficiency gains for generative AI workloads, with estimates suggesting a 2-3x improvement over the standard CPU design for LLMs like Llama3.1 with 405 billion parameters.

Arm's approach emphasizes the importance of CPU compute in supporting the complete AI stack, including data pre-processing, orchestration, and advanced techniques like Retrieval-augmented Generation (RAG). The company's Compute Subsystems (CSS) are designed to address these requirements, providing a foundation for partners to build diverse chiplet solutions. Several companies, including Alcor Micro and Alphawave, have already announced plans to develop CSS-powered chiplets for various AI and high-performance computing applications. The initiative also focuses on software readiness, ensuring that major frameworks and operating systems are compatible with Arm-based systems. Recent efforts include the introduction of Arm Kleidi technology, which optimizes CPU-based inference for open-source projects like PyTorch and Llama.cpp. Notably, as Google claims, most AI workloads are being inferenced on CPUs, so creating the most efficient and most performant CPUs for AI makes a lot of sense.

NVIDIA is reportedly considering a significant design change for its GPU products, shifting from the current on-board solution to an independent GPU socket design following the GB200 shipment in Q4, according to reports from MoneyDJ and the Economic Daily News quoted by TrendForce. This move is not new in the industry, AMD has already introduced socket design in 2023 with their MI300A series via Supermicro dedicated servers. The B300 series, expected to become NVIDIA's mainstream product in the second half of 2025, is rumored to be the main beneficiary of this design change that could improve yield rates, though it may come with some performance trade-offs.

According to the Economic Daily News, the socket design will simplify after-sales service and server board maintenance, allowing users to replace or upgrade the GPUs quickly. The report also pointed out that based on the slot design, boards will contain up to four NVIDIA GPUs and a CPU, with each GPU having its dedicated slot. This will bring benefits for Taiwanese manufacturers like Foxconn and LOTES, who will supply different components and connectors. The move seems logical since with the current on-board design, once a GPU becomes faulty, the entire motherboard needs to be replaced, leading to significant downtime and high operational and maintenance costs.

Today, Micron updated its corporate logo with new symbolism. The redesign comes as Micron celebrates over four decades of technological advancement in the semiconductor industry. The new logo features a distinctive silicon color, paying homage to the wafers at the core of Micron's products. Its curved lettering represents the company's ability to stay ahead of industry trends and adapt to rapid technological changes. The design also incorporates vibrant gradient colors inspired by light reflections on wafers, which are the core of Mircorn's memory and storage products.

This rebranding effort coincides with Micron's expanding role in AI, where memory and storage innovations are increasingly crucial. The company has positioned itself beyond a commodity memory supplier, now offering leadership in solutions for AI data centers, high-performance computing, and AI-enabled devices. The company has come far from its original 64K DRAM in 1981 to HBM3E DRAM today. Micron offers different HBM memory products, graphics memory powering consumer GPUs, CXL memory modules, and DRAM components and modules.

The 2024 International Design Excellence Awards (IDEA) has named three groundbreaking laptops—Cyborg 14 AI, Stealth 18 AI Studio, and Titan 18 HX—as "Featured Finalists" for their outstanding innovation and design. These laptops, each representing the cutting edge of gaming technology, push the boundaries of user experience with their unique aesthetics and high-performance capabilities.

The Cyborg 14 AI offers a visually striking fusion of biological and mechanical elements, The 14-inch compact and lightweight body echoes the convenience of gaming on-the-go. The Stealth 18 AI Studio, modeled after stealth combat aircraft with top-tier gaming performance, precisely carried out the task, where thin meets powerful. The Titan 18 HX, MSI's flagship gaming laptop shares a kindred spirit with hardcore gamers. The voracious gaming appetites with PC specifications and high-grade thermal efficiency by all means sets the bar extraordinarily high.

Synopsys, Inc. today announced the industry's first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world's fastest AI data centers. The UCIe interconnect, the de facto standard for die-to-die connectivity, is critical for high-bandwidth, low-latency die-to-die connectivity in multi-die packages, enabling more data to travel efficiently across heterogeneous and homogeneous dies, or chiplets, in today's AI data center systems.

Synopsys' 40G UCIe IP supports both organic substrate and high-density, advanced packaging technologies to give designers the flexibility to explore the packaging options that best fit their needs. The complete Synopsys 40G UCIe IP solution, including PHY, controller, and verification IP, is a key component of Synopsys' comprehensive and scalable multi-die solution for fast heterogeneous integration from early architecture exploration to manufacturing.

Microsoft provided a detailed view of Maia 100 at Hot Chips 2024, their initial specialized AI chip. This new system is designed to work seamlessly from start to finish, with the goal of improving performance and reducing expenses. It includes specially made server boards, unique racks, and a software system focused on increasing the effectiveness and strength of sophisticated AI services, such as Azure OpenAI. Microsoft introduced Maia at Ignite 2023, sharing that they had created their own AI accelerator chip. More information was provided earlier this year at the Build developer event. The Maia 100 is one of the biggest processors made using TSMC's 5 nm technology, designed for handling extensive AI tasks on Azure platform.

Maia 100 SoC architecture features:

• A high-speed tensor unit (16xRx16) offers rapid processing for training and inferencing while supporting a wide range of data types, including low precision data types such as the MX data format, first introduced by Microsoft through the MX Consortium in 2023.
• The vector processor is a loosely coupled superscalar engine built with custom instruction set architecture (ISA) to support a wide range of data types, including FP32 and BF16.
• A Direct Memory Access (DMA) engine supports different tensor sharding schemes.
• Hardware semaphores enable asynchronous programming on the Maia system.

OPENEDGES Technology, Inc., the leading provider of memory subsystem intellectual property (IP), today announced the launch of the Universal Chiplet Interconnect Express (UCIe) Controller IP, named OUC. UCIe is an open industry standard for a die-to-die interconnect, and co-developed by industry giants including AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, and Samsung. UCIe is becoming a new trend in the semiconductor industry due to its advantages, such as increased semiconductor circuit integration, reduced production costs, and higher yields. OPENEDGES is contributing to UCIe consortium as a contributing member.

The OUC, deriving its name from OPENEDGES UCIe Controller, is tailored for highly customizable, package-level integration, facilitating die-to-die interconnect and protocol connections. It creates an interoperable, multi-vendor ecosystem set to revolutionize chip integration methodologies across the industry.

Intel today announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems. These milestones were achieved less than two quarters after tape-out, with both products on track to start production in 2025. The company also announced that the first external customer is expected to tape out on Intel 18A in the first half of next year.

"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers. We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025." -Kevin O'Buckley, Intel senior vice president and general manager of Foundry Services

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Altium Limited ("Altium"), a global leader in electronics design systems, today announced the successful completion of the acquisition of Altium by Renesas. The definitive agreement to acquire Altium was announced on February 15, 2024.

The combination sets the foundation for Renesas and Altium to create an innovative electronics system design and lifecycle management platform. The platform will deliver integration and standardization of various electronic design data and functions and enhanced component lifecycle management, while enabling seamless digital iteration of design processes to increase overall productivity. This brings significantly faster innovation and lowers barriers to entry for system designers by reducing development resources and inefficiencies.

It's a thrilling moment for all of us at Razer as we unveil a special tribute to one of the fighting game community and Street Fighter 6's most revered characters, the legend, Akuma. The Razer Kitsune Fighter's Edition: Akuma is set to ignite the spirit of competition with its unique design and top-tier functionality, making its debut exclusively at EVO Las Vegas 2024.

Akuma Descends on the Razer Kitsune
The Razer Kitsune Fighter's Edition: Akuma not only embodies the ferocity and mystique of Akuma but also elevates the gaming experience with its exceptional design details. This limited-edition Razer Kitsune features a fully dye-sublimated aluminium top plate showcasing Akuma in all his fearsome glory, set against a backdrop that captures the essence of his power and intensity. All this, packaged in a unique collectable box wrapped in synthetic leather. Limited to just 1000 units globally, this true collector's item is as exclusive as it is powerful, with a limited number of units making their premiere at EVO Las Vegas for sale exclusively from the Razer booth.

Cornelis Networks, a leading independent provider of intelligent, high-performance networking solutions, today announced the appointment of Lisa Spelman as its new chief executive officer (CEO), effective August 15. Spelman joins Cornelis from Intel Corporation, where she held executive leadership roles for more than two decades, including leading the company's core data center business. Spelman will succeed Philip Murphy, who will assume the role of president and chief operating officer (COO).

"Cornelis is unique in having the products, roadmap, and talent to help customers address this issue. I look forward to joining the team to bring their innovations to even more organizations around the globe."

Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted that recent Bump Pitch Transformer (BPT) designs will speed 2.5D IC advanced packaging adoption to meet the red-hot demand for AI innovation. In remarks made in the Keysight Theater at the 61st Design Automation Conference, he envisioned new BPT technology paving the way for new artificial intelligence computing opportunities.

"We believe that the Bump Pitch Transformer architecture will accelerate the growth rate of 2.5D semiconductor packages that are key to meeting the explosive demand for AI-driven computing capabilities," Dr. Zu said during his address in the Keysight Theater.

Imagination Technologies today unveils the next product in the Catapult CPU IP range, the Imagination APXM-6200 CPU: a RISC-V application processor with compelling performance density, seamless security and the artificial intelligence capabilities needed to support the compute and intuitive user experience needs for next generation consumer and industrial devices.

"The number of RISC-V based devices is skyrocketing with over 16Bn units forecast by 2030, and the consumer market is behind much of this growth" says Rich Wawrzyniak, Principal Analyst at SHD Group. "One fifth of all consumer devices will have a RISC-V based CPU by the end of this decade. Imagination is set to be a force in RISC-V with a strategy that prioritises quality and ease of adoption. Products like APXM-6200 are exactly what will help RISC-V achieve the promised success."

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

EK, the renowned premium liquid cooling gear manufacturer, is proud to unveil its latest accessory that promises to streamline the assembly process for enthusiasts and professionals alike: the EK-Loop Stainless Steel Gauge Card. Crafted from durable stainless steel and designed for simplicity, this handy tool is an essential accessory for anyone involved in water cooling. Its primary function serves to drastically simplify the search for the correct assembly parts, ensuring that users can effortlessly find compatible components. Multifunctional by design yet primarily aimed at enhancing the water cooling experience, the EK-Loop Gauge Card is the accessory you didn't know you needed—until now.

Preventing Assembly Errors Before They Happen
With the Gauge Card, measuring and matching bolt and nut sizes becomes effortless. It accurately determines the bolt size and length for any component, including nut size measurements for M2.5, M3, and M4 nuts. This guarantees compatibility and ease of assembly across a wide range of components. The card also allows for the identification of different screw diameters (M4, M3.5, M3, M2.5, M2) and screw dimensions effortlessly, making it more straightforward to select the right parts for your build. Screw length identification up to 30 mm further ensures precise fitting and optimal security of components, while the tool aids in avoiding the insertion of the wrong bolts in the wrong places - thus preventing potential damage to sensitive PCBs. Moreover, the EK-Loop Gauge Card aids in the determination of Allen key sizes (2, 2.5, 6, 8, 9), simplifying the search for the right tool for the job.

Assassin's Creed Mirage was envisioned as an homage to its franchise—a celebration of how it began and what it accomplished between 2007's Assassin's Creed and 2023's Mirage. Beginning as an idea for a DLC expansion that would take Eivor to the Middle East, it grew into a standalone prequel starring Basim, the enigmatic Hidden One from Valhalla. Developed as a shorter experience by Ubisoft Bordeaux, the return-to-roots game presented a distinctive set of challenges, which are explored in the March 22 GDC talk "Between Legacy and Modernity: Creating an Homage Game to the 15-Year-Old Assassin's Creed Franchise."

During the talk, Creative Director Stéphane Boudon and Lead Producer Fabian Salomon discuss the game's beginnings, its growth into a "remoot"—that is, something between a remake and a reboot - and how a streamlined approach helped them make tough choices and focus the game on the Assassin experience. To find out more, we spoke with Boudon and Salomon about some of the early concepts behind the game, a few features that didn't make the cut, and how Mirage re-introduced and redefined stealth as a gameplay pillar.

Xbox and Fallout fans, rejoice! Today, we are thrilled to announce a striking collaboration between Xbox and new series on Prime Video "Fallout", premiering on April 11. Introducing the Xbox and Fallout Vault Box—a custom collaboration that combines the rugged essence of the Fallout universe with the unparalleled security of a Fort Knox vault. Based on one of the greatest video game series of all time, "Fallout" is the story of haves and have-nots in a world in which there's almost nothing left to have. Two-hundred years after the apocalypse, the gentle denizens of luxury fallout shelters are forced to return to the irradiated hellscape their ancestors left behind—and are shocked to discover an incredibly complex, gleefully weird, and highly violent universe waiting for them.

The series comes from Kilter Films and executive producers Jonathan Nolan and Lisa Joy. Nolan directed the first three episodes. Geneva Robertson-Dworet and Graham Wagner serve as executive producers, writers and co-showrunners. The series stars Ella Purnell (Yellowjackets), Aaron Moten (Emancipation) and Walton Goggins (The Hateful Eight). Athena Wickham of Kilter Films also executive produces along with Todd Howard for Bethesda Game Studios and James Altman for Bethesda Softworks. Amazon MGM Studios and Kilter Films produce in association with Bethesda Game Studios and Bethesda Softworks.

Altair, a global leader in computational intelligence, announced the upcoming release of Altair SimSolid for electronics, bringing game-changing fast, easy, and precise multi-physics scenario exploration for electronics, from chips, PCBs, and ICs to full system design. "As the electronics industry pushes the boundaries of complexity and miniaturization, engineers have struggled with simulations that often compromise on detail for expediency. Altair SimSolid will empower engineers to capture the intricate complexities of PCBs and ICs without simplification," said James R. Scapa, founder and chief executive officer, Altair. "Traditional simulation methods often require approximations when analyzing PCB structures due to their complexity. Altair SimSolid eliminates these approximations to run more accurate simulations for complex problems with vast dimensional disparities."

Altair SimSolid has revolutionized conventional analysis in its ability to accurately predict complex structural problems with blazing-fast speed while eliminating the complexity of laborious hours of modeling. It eliminates geometry simplification and meshing, the two most time-consuming and expertise-intensive tasks done in traditional finite element analysis. As a result, it delivers results in seconds to minutes—up to 25x faster than traditional finite element solvers—and effortlessly handles complex assemblies. Having experienced fast adoption in the aerospace and automotive industries, two sectors that typically experience challenges associated with massive structures, Altair SimSolid is poised to play a significant role in the electronics market. The initial release, expected in Q2 2024, will support structural and thermal analysis for PCBs and ICs with full electromagnetics analysis coming in a future release.

Our favorite thing about Zau might surprise you. Or, it might be the first thing you noticed. In a recent Discord Q+A (viewable below), ZAU Creative Director Abubakar Salim throws the deceptively simple question to Lead Artist Ackeem Durrant and Lead Designer Zi Peters: what's your favorite thing about our main character? Since our reveal in December, we've been completely floored by how many of you took the leap to pre-order ZAU. We worked hard to give the game a fair price—and a 10% discount to everyone who buys before launch day - plus carefully crafted in-game content that feels special while not detracting from our central vision for the game. We're incredibly grateful for your support. Thank you.

Wield the dance of the shaman. Reclaim your father's spirit
A grieving boy begins to read a Bantu tale written by his late father. Adventure into the beautiful and treacherous lands of Kenzera as Zau, a young shaman who bargains with the God of death to bring his Baba back from darkness. With your cosmic powers and untried courage, you advance into unknown mythological lands. Once bursting with life, Kenzera is now rife with lost ancestral spirits. As Zau advances toward his goal, 3 mighty beings lie in wait, fearsome in their strength yet somehow strangely familiar. Will you embrace the dance of the shaman?

The HPC research projects DEEP-SEA, IO-SEA and RED-SEA are wrapping up this month after a three-year project term. The three projects worked together to develop key technologies for European Exascale supercomputers, based on the Modular Supercomputing Architecture (MSA), a blueprint architecture for highly efficient and scalable heterogeneous Exascale HPC systems. To achieve this, the three projects collaborated on system software and programming environments, data management and storage, as well as interconnects adapted to this architecture. The results of their joint work will be presented at a co-design workshop and poster session at the EuroHPC Summit (Antwerp, 18-21 March, www.eurohpcsummit.eu).

Blink, an Amazon company, today announced the next-generation Blink Mini 2. The new Blink camera packs a punch in a compact, weather-resistant design that can now be used indoors or outdoors with the purchase of the new Blink Weather Resistant Power Adapter (sold as part of a bundle or separately). Blink Mini 2 offers enhanced image quality with improved low light performance, a wider field of view, and a built-in LED spotlight for night view in color. Powered by the company's custom-built chip, Blink Mini 2 utilizes on-device computer vision (CV) to support smart notifications, including person detection, which is available with a Blink Subscription Plan (sold separately).

"It is clear customers love Blink—in fact, the Blink business has grown 5x over the last four years," said Liz Hamren, chief executive officer at Blink. "We are building on this momentum with the addition of Mini 2 to Blink's affordable and easy-to-use suite of devices. Mini 2 was rebuilt from the inside out, keeping everything customers expect from Blink while adding even more utility through features like person detection, all at an incredible price point."

Introducing the newest collection of Xbox Wireless Controllers: the Vapor series in Xbox Design Lab and the Xbox Wireless Controller—Dream Vapor Special Edition. In this collection, each top case features a dynamic pattern that is unique to every controller. If you are familiar with the Xbox Wireless Controller—Stormcloud Vapor Special Edition, you have seen how this misty pattern creates a subtle and textured look that only you can call yours.

The Vapor series with Xbox Design Lab brings some of the most unique controller designs available for your customization, offering six top case options with swirling color patterns. If green is your thing, the Electric Vapor top case merges the bold Electric Volt and the iconic Velocity Green, while the Nocturnal Vapor top case draws you in with its Dark Green and Grey swirl. Feel the heat with the Fire Vapor top case, featuring a fiery red and orange swirl, or opt for the cool and collected Stormcloud Vapor, with a sleek blue swirl design. If pink and purple are your power colors, look no further than the Cyber Vapor top case, showcasing a lively pink and purple swirl, or enter in the dreamy hues of the Dream Vapor top case with its soft pink and soft purple swirl.