Press outlets have spotted two new B650M motherboard models on ASRock's product site; the B650M Pro X3D and B650M Pro X3D WiFi (6E). The latest additions are clearly based on previous-gen AMD chipset (B650)—according to the manufacturer's descriptions, both are advertised as: "optimized for AMD Ryzen X3D processors, delivering superior stability, compatibility, and enhanced performance, making it ideal for gaming and creating." The "Pro X3D" SKUs have not launched at retail, so pricing information is not available at the time of writing. ASRock could publish a dedicated press release in the near future, but we are looking at a very quiet reveal. Curiously, the Taiwan-based motherboard and graphics card specialist has seemingly "downcycled" its fairly new B850M Pro "Race Sport" RS board design.

VideoCardz's coverage of the Pro X3D series includes a handy image comparison tool. When lined up against each other (visually), the B650M Pro X3D and B850M Pro RS designs are nigh identical. Two of the images (below) show a minor difference in printed-on model names. As expected, the ASRock website comparison tool reveals only minor disparities between respective specification sheets. The standard B850M Pro RS variant is currently on sale for $148 (normally $180). The B650M Pro X3D (non-WiFi 6E) equivalent could arrive at retail with a slightly lower price point. ASRock has signalled that its "Pro X3D" mainboard series will only be available within certain regions. According to VideoCardz, a comprehensive global rollout is not planned.

Synopsys, Inc. today announced the expansion of its industry-leading hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems using the latest AMD Versal Premium VP1902 adaptive SoC. The next generation HAPS-200 prototyping and ZeBu-200 emulation systems deliver improved runtime performance, better compile time and improved debug productivity. They are built on new Synopsys Emulation and Prototyping (EP-Ready) Hardware that optimizes customer return on investment by enabling emulation and prototyping use cases via reconfiguration and optimized software. ZeBu Server 5 is enhanced to deliver industry-leading scalability beyond 60 billion gates (BG) to address the escalating hardware and software complexity in SoC and multi-die designs. It continues to offer industry-best density to optimize data center space utilization.

"With the industry approaching 100s of billions of gates per chip and 100s of millions of lines of software code in SoC and multi-die solutions, verification of advanced designs poses never-before seen challenges," said Ravi Subramanian, chief product management officer, Synopsys. "Continuing our strong partnership with AMD, our new systems deliver the highest HAV performance while offering the ultimate flexibility between prototyping and emulation use. Industry leaders are adopting Synopsys EP-Ready Hardware platforms for silicon to system verification and validation."

Going back a year, we started hearing about an OpenAI proprietary AI chip project—this (allegedly) highly ambitious endeavor included grand plans for a dedicated fabrication network. TSMC was reportedly in the equation, but indirectly laughed at the AI research organization's ardent requests. Fast-forward to the present day; OpenAI appears to be actively pursuing a proprietary GPU design through traditional means. A Reuters exclusive report points to 2025 being an important year for the company's aforementioned "in-house" AI chip—the publication believes that OpenAI's debut silicon design has reached the finalization stage. Insiders have divulged that the project is only months away from being submitted to TSMC for "taping out." The foundry's advanced 3-nanometer process technology is reported to be on the cards. A Reuters source reckons that the unnamed chip features: "a commonly used systolic array architecture with high-bandwidth memory (HBM)...and extensive networking capabilities."

Broadcom is reportedly assisting with the development of OpenAI's in-house design—we heard about rumored negotiations taking place last summer. Jim Keller's tempting offer—of creating an AI chip for less than $1 trillion—was ignored early last year; OpenAI has instead assembled its own internal team of industry veterans. The October 2024 news cycle posited that former Google TPU engineers were drafted in as team leaders, with a targeted mass production window scheduled for 2026. The latest Reuters news article reiterates this projected timeframe, albeit dependent on the initial tape going "smoothly." OpenAI's chip department has grown to around forty individuals with recent months, according to industry moles—a small number relative to the headcounts at "Google or Amazon's AI chip program."

PNY Technologies today announced the latest additions to their USB Type-C flash drive lineup, headlined by the extreme-performance PRO Elite V3 that delivers read speeds up to 1,000 MB/s and write speeds up to 800 MB/s, and offers storage options ranging from 256 GB - 2 TB. The expanded Type-C portfolio also includes the ultra-compact Elite-X Fit and Elite models, providing a storage solution for all Type-C and high-performance portable needs without requiring a Type-C adapter.

Extreme Storage Solution—PRO Elite V3 Type-C
The PRO Elite V3 leads PNY's latest generation of Type-C USB storage solutions, crafted for professional content creators, designers, and gamers demanding high performance while working with large files and resource-demanding applications. With extreme read speeds up to 1,000 MB/s and write speeds up to 800 MB/s, users can safely transfer their valuable content at blazing fast speeds up to 265 times faster than standard USB 2.0 flash drives. A huge storage size increase of up to 2 TB provides professional users ample space to store large project files, 4K video collections, and extensive gaming libraries on a single storage device.

Intel's Platform Engineering and Client Segments groups are actively looking into ways of reducing computer e-waste, and (in parallel) enhance product repairability. The company's newly proposed "Modular PC Design" is set to take a "sustainable approach" across three key modularity levels: factory, field and user. Team Blue's blog post goes into great detail about revised laptop and mini-PC designs—with the "right-to-repair" movement serving as a major influence. Many "consumer activists and environmental groups" have advocated for improvements in personal computer design—Intel appears to be listening, but a firm release timeline has not been set.

Intel's proposed new standards will revolve around repairability and upgradability—as explained in their blog: "the right-to-repair emphasizes the importance of being able to fix and upgrade PCs on one's own. Improving repairability requires fundamental changes starting from the design methodology." Team Blue's Modular PC program—for laptops—breaks away from the tradition of utilizing an "all-in-one motherboard." A reference diagram shows off three internal modules: a motherboard package and two "universal" left and right I/O units. These separate boards can be: "utilized across various platforms or market segments leads to cost savings by streamlining the duration of the design cycle and minimizing the engineering investment required. The I/O boards for Premium Modular designs are engineered to be common between the fan-less Thin & Light system, which operates within a 10 W power envelope, and the premium fanned designs, which function within a 20 W (single fan) and 30 W (dual fan, Wi-Fi only SKU) power envelope." Framework recently celebrated its fifth year of operation—its modular laptop designs have seemingly "inspired" a few copycats.

NVIDIA has unveiled a radical graphics card prototype that never reached production, offering insight into its design process. In a YouTube video called "Designing the Founders Edition | GeForce RTX 5090", NVIDIA showcases an unreleased design that would have occupied four PCIe slots, featuring a "three-thirds flow-through" cooling system with an unconventional three-fan stair-step configuration. NVIDIA ultimately rejected the quad-slot concept as impractical for most computer systems.
Engineers refined the cooling approach for the RTX 50-series, developing a more streamlined "two-thirds flow-through" design that maintains thermal performance while reducing the card's footprint to two PCIe slots.

Technical challenges emerged during development, particularly in connector design. The team struggled to create a ribbon cable supporting high-bandwidth UHBR20 DisplayPort 2.1b and HDMI 2.1b connections. Their solution involved infusing glass fibers into the cable, enabling support for three DisplayPort and one HDMI connector. Critical engineering focus was placed on the liquid metal thermal interface material. Extensive stress testing ensured reliability across various orientations, with particular attention to preventing oxidation. Given the electrically conductive nature of liquid metal, an air-tight seal around the GPU die became crucial to prevent potential hardware failure.

TeamSpeak, the veteran voice communication platform, has launched TeamSpeak 6 (TS6), marking its most significant update in years. The release introduces screen-sharing capabilities, a modernized interface, and simplified server hosting options as the company adapts to evolving user expectations. The new version offers screen sharing at 1440p/60 FPS without subscription fees, contrasting with Discord's premium-only approach to high-quality screen sharing. TeamSpeak's interface update maintains its core functionality while adopting a more contemporary design. Server hosting options now include direct purchasing through myTeamSpeak accounts, with rental prices starting at $3.99 monthly for five slots. Users can still self-host servers on their hardware, a feature unavailable on Discord's platform.

Improvements include channel user previews, expanded language support, and various bug fixes targeting stability issues. The update addresses performance optimization and user interface consistency across the platform. Despite these updates, TeamSpeak faces significant market challenges. While it maintains advantages in audio latency and quality—factors valued in competitive gaming—adoption hurdles remain. Early user feedback indicates concerns about certain features, including image sharing and cross-channel communication tools. The platform's self-hosting capabilities continue to appeal to privacy-conscious users seeking alternatives to centralized services. However, competing with Discord's established social features and free core services presents ongoing challenges for TeamSpeak's market position. Nonetheless, competition is appreciated, and constant improvements of TeamSpeak software are much valued.

During our CES 2025 Alphacool booth visit, Alphacool has showcased its newest update in the Eiswolf AIO watercooling lineup, tailored specifically for NVIDIA's GeForce RTX 50 series "Blackwell" GPUs. The updated design features a GPU waterblock with an integrated pump and a radiator connected via quick-disconnect links, simplifying installation and maintenance. Alphacool continues its use of TPV hoses from the Enterprise Solution series, known for their durability and heat resistance, thanks to their EPDM/PP construction. These hoses, commonly used in servers and workstations, are free of plasticizers and paired with connectors from the same series to ensure robust performance. The GPU waterblock also includes an LED matrix display, demonstrated at the booth showing "RTX 5090," which reflects the GPU it cools. Designed with aesthetics in mind, the block incorporates an acrylic body with a top coat, illuminated by RGB lighting to suit various setups.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the Ncore 100 Air, a small form factor (SFF) PC case crafted for gamers, content creators, and SFF enthusiasts. Designed to streamline PC building and upgrading, the Ncore 100 Air features an open, tool-less design, an innovative expandable design and compatibility with the latest hardware, ensuring users can easily keep up with their performance needs while enjoying a sleek, minimalistic look.

The Ncore 100 Air builds on Cooler Master's commitment to empowering users to create high-performance PCs in small spaces. Designed with modern users in mind, this case delivers the perfect blend of power, versatility, and minimalism, supporting the latest GPUs, ITX motherboards, and SFX power supply units while maintaining an efficient thermal layout.

GameMax, an emerging brand of PC gaming components including gaming cases and power supply units, is thrilled to announce the Dragon Knight 2 full-tower gaming PC chassis. Designed for high-end gaming PC and workstation configurations, the GameMax Dragon Knight 2 features a massive interior with extensive hardware support.

The Dragon Knight 2 full-tower chassis supports up to an E-ATX motherboard, up to 8x HDDs, and has 8 PCIE slots for add-in-cards and expansions other than graphics cards. It has a built-in HDD hotswap bay on the top panel that's easily accessible. The Dragon Knight 2 comes with 5 pre-installed ARGB fans out of the box providing excellent cooling and good value for builders. The ARGB fans are fully customizable and can be synchronized with the rest of the system via the motherboard. With its cutting-edge features and sophisticated aesthetics, the Dragon Knight 2 is poised to captivate gamers and PC enthusiasts worldwide.

LG Electronics (LG) is reinforcing its reputation as a top provider of lifestyle projectors with the introduction of two brand-new models at CES 2025. Raising the bar for the lifestyle projector category, LG's "new-concept" models are designed to deliver maximum space efficiency. The CES Innovation Award-winning PF600U is a versatile device that seamlessly combines a projector with a Bluetooth speaker and LED mood lamp, while the CineBeam S (model PU615U) has the distinction of being LG's smallest-ever 4K Ultra Short Throw (UST) projector. Worthy successors to 2024's popular LG CineBeam Q, the innovative, new models boast exceptional picture quality, design and ease-of-use; making them the ideal lifestyle companions for modern consumers.

PF600U: A Versatile 3-in-1 Lifestyle Companion for Everyday Spaces
The groundbreaking PF600U, a CES Innovation Award honoree, transforms living spaces with its multifunctionality. Serving as a projector, Bluetooth speaker and LED mood lamp, it can tailor any room's ambiance to the user's preferences. Whether enjoying a private theater, soothing visuals or a mood-lit listening session, it effortlessly curates a distinctive experience that enriches the moment.

Sandisk Corporation today previewed its new corporate branding and creative direction, signaling a bold debut of the company's comeback launch as a standalone Flash and memory technology innovator, planned for early 2025.

Defined by a 'Mindset of Motion', Sandisk's new creative direction represents a future forward philosophy where by creating paths and possibilities for people to go without limits, the company unites the current moment and their aspirations. This mindset brings people closer to their ambitions and creates a circle of collaboration for progress and future growth.

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced the launch of the MasterFrame Series, an innovative line of PC cases that redefines customization, performance, and artistry in PC design. This adaptable series introduces a bold reimagining of what a PC case can be—blending premium aesthetics with unparalleled functionality.

With its dynamic exo-structure and artist-inspired interchangeable panels, the MasterFrame Series offers a platform for limitless creativity. Whether building high-performance setups, creating content, or showcasing personal style, the MasterFrame empowers users to design PCs as unique as they are.

Earlier this year, it was revealed that Mozilla's entire advocacy team was caught in a round of layoffs, leading to speculation that Mozilla would be giving up its advocacy entirely, shifting to a more commercial focus. Now, with the announcement of Mozilla's new branding, aside from updating the brand's look, it seems as though the Firefox company wants to reassure users of its software that it is still dedicated to its mission to "keep the internet free, open, and accessible." The new branding strategy includes a new logo, typeface family, new icons, a T. rex mascot, and new colors.

The new branding push from Mozilla sees the brand move an appearance seemingly inspired by both its history and the text-based OS interfaces of the early years of computing. For the rebranding, Mozilla partnered with design firm JKR (Jones Knowles Ritchie), and the new branding features a cutesy DOS-style flag that doubles as a T. rex, hinting to past Mozilla logos. In the announcement of the rebranding, boldly titled "Reclaim the internet: Mozilla's rebrand for the next era of tech," Mozilla emphasizes that the new look is meant to convey the company's intention throughout its whole ecosystem of products. It seems as though Mozilla is trying to remind everyone that it's work towards a more open internet extends beyond just the advocacy team it recently laid off.

Hypertec proudly announces the launch of its latest breakthrough product, the TRIDENT iG series, an immersion-born GPU server line that brings extreme density, sustainability, and performance to the AI and HPC community. Purpose-built for the most demanding AI applications, this cutting-edge server is optimized for generative AI, machine learning (ML), deep learning (DL), large language model (LLM) training, inference, and beyond. With up to six of the latest NVIDIA GPUs in a 2U form factor, a staggering 8 TB of memory with enhanced RDMA capabilities, and groundbreaking density supporting up to 200 GPUs per immersion tank, the TRIDENT iG server line is a game-changer for AI infrastructure.

Additionally, the server's innovative design features a single or dual root complex, enabling greater flexibility and efficiency for GPU usage in complex workloads.

Dell Technologies (NYSE: DELL) continues to make enterprise AI adoption easier with the Dell AI Factory, expanding the world's broadest AI solutions portfolio.Powerful new infrastructure, solutions and services accelerate, simplify and streamline AI workloads and data management.

"Getting AI up and running across a company can be a real challenge," said Arthur Lewis, president, Infrastructure Solutions Group, Dell Technologies. "We're making it easier for our customers with new AI infrastructure, solutions and services that simplify AI deployments, paving the way for smarter, faster ways to work and a more adaptable future."

CoolIT Systems (CoolIT), the world leader in liquid cooling systems for AI and high-performance computing, introduces the CHx1000, the world's highest-density liquid-to-liquid coolant distribution unit (CDU). Designed for mission-critical applications, the CHx1000 is purpose-built to cool the NVIDIA Blackwell platform and other demanding AI workloads where liquid cooling is now necessary.

"CoolIT created the CHx1000 to provide the high capacity and pressure delivery required to direct liquid cool NVIDIA Blackwell and future generations of high-performance AI accelerators," said Patrick McGinn, CoolIT's COO. "Besides exceptional performance, serviceability and reliability are central to the CHx1000's design. The single rack-sized unit is fully front and back serviceable with hot-swappable critical components. Precision coolant controls and multiple levels of redundancy provide for steady, uninterrupted operation."

Yesterday, Arm has announced significant progress in its Total Design initiative. The program, launched a year ago, aims to accelerate the development of custom silicon for data centers by fostering collaboration among industry partners. The ecosystem has now grown to include nearly 30 participating companies, with recent additions such as Alcor Micro, Egis, PUF Security, and SEMIFIVE. A notable development is a partnership between Arm, Samsung Foundry, ADTechnology, and Rebellions to create an AI CPU chiplet platform. This collaboration aims to deliver a solution for cloud, HPC, and AI/ML workloads, combining Rebellions' AI accelerator with ADTechnology's compute chiplet, implemented using Samsung Foundry's 2 nm Gate-All-Around (GAA) FET technology. The platform is expected to offer significant efficiency gains for generative AI workloads, with estimates suggesting a 2-3x improvement over the standard CPU design for LLMs like Llama3.1 with 405 billion parameters.

Arm's approach emphasizes the importance of CPU compute in supporting the complete AI stack, including data pre-processing, orchestration, and advanced techniques like Retrieval-augmented Generation (RAG). The company's Compute Subsystems (CSS) are designed to address these requirements, providing a foundation for partners to build diverse chiplet solutions. Several companies, including Alcor Micro and Alphawave, have already announced plans to develop CSS-powered chiplets for various AI and high-performance computing applications. The initiative also focuses on software readiness, ensuring that major frameworks and operating systems are compatible with Arm-based systems. Recent efforts include the introduction of Arm Kleidi technology, which optimizes CPU-based inference for open-source projects like PyTorch and Llama.cpp. Notably, as Google claims, most AI workloads are being inferenced on CPUs, so creating the most efficient and most performant CPUs for AI makes a lot of sense.

NVIDIA is reportedly considering a significant design change for its GPU products, shifting from the current on-board solution to an independent GPU socket design following the GB200 shipment in Q4, according to reports from MoneyDJ and the Economic Daily News quoted by TrendForce. This move is not new in the industry, AMD has already introduced socket design in 2023 with their MI300A series via Supermicro dedicated servers. The B300 series, expected to become NVIDIA's mainstream product in the second half of 2025, is rumored to be the main beneficiary of this design change that could improve yield rates, though it may come with some performance trade-offs.

According to the Economic Daily News, the socket design will simplify after-sales service and server board maintenance, allowing users to replace or upgrade the GPUs quickly. The report also pointed out that based on the slot design, boards will contain up to four NVIDIA GPUs and a CPU, with each GPU having its dedicated slot. This will bring benefits for Taiwanese manufacturers like Foxconn and LOTES, who will supply different components and connectors. The move seems logical since with the current on-board design, once a GPU becomes faulty, the entire motherboard needs to be replaced, leading to significant downtime and high operational and maintenance costs.

Today, Micron updated its corporate logo with new symbolism. The redesign comes as Micron celebrates over four decades of technological advancement in the semiconductor industry. The new logo features a distinctive silicon color, paying homage to the wafers at the core of Micron's products. Its curved lettering represents the company's ability to stay ahead of industry trends and adapt to rapid technological changes. The design also incorporates vibrant gradient colors inspired by light reflections on wafers, which are the core of Mircorn's memory and storage products.

This rebranding effort coincides with Micron's expanding role in AI, where memory and storage innovations are increasingly crucial. The company has positioned itself beyond a commodity memory supplier, now offering leadership in solutions for AI data centers, high-performance computing, and AI-enabled devices. The company has come far from its original 64K DRAM in 1981 to HBM3E DRAM today. Micron offers different HBM memory products, graphics memory powering consumer GPUs, CXL memory modules, and DRAM components and modules.

The 2024 International Design Excellence Awards (IDEA) has named three groundbreaking laptops—Cyborg 14 AI, Stealth 18 AI Studio, and Titan 18 HX—as "Featured Finalists" for their outstanding innovation and design. These laptops, each representing the cutting edge of gaming technology, push the boundaries of user experience with their unique aesthetics and high-performance capabilities.

The Cyborg 14 AI offers a visually striking fusion of biological and mechanical elements, The 14-inch compact and lightweight body echoes the convenience of gaming on-the-go. The Stealth 18 AI Studio, modeled after stealth combat aircraft with top-tier gaming performance, precisely carried out the task, where thin meets powerful. The Titan 18 HX, MSI's flagship gaming laptop shares a kindred spirit with hardcore gamers. The voracious gaming appetites with PC specifications and high-grade thermal efficiency by all means sets the bar extraordinarily high.

Synopsys, Inc. today announced the industry's first complete UCIe IP solution operating at up to 40 Gbps per pin to address the increased compute performance requirements of the world's fastest AI data centers. The UCIe interconnect, the de facto standard for die-to-die connectivity, is critical for high-bandwidth, low-latency die-to-die connectivity in multi-die packages, enabling more data to travel efficiently across heterogeneous and homogeneous dies, or chiplets, in today's AI data center systems.

Synopsys' 40G UCIe IP supports both organic substrate and high-density, advanced packaging technologies to give designers the flexibility to explore the packaging options that best fit their needs. The complete Synopsys 40G UCIe IP solution, including PHY, controller, and verification IP, is a key component of Synopsys' comprehensive and scalable multi-die solution for fast heterogeneous integration from early architecture exploration to manufacturing.

Microsoft provided a detailed view of Maia 100 at Hot Chips 2024, their initial specialized AI chip. This new system is designed to work seamlessly from start to finish, with the goal of improving performance and reducing expenses. It includes specially made server boards, unique racks, and a software system focused on increasing the effectiveness and strength of sophisticated AI services, such as Azure OpenAI. Microsoft introduced Maia at Ignite 2023, sharing that they had created their own AI accelerator chip. More information was provided earlier this year at the Build developer event. The Maia 100 is one of the biggest processors made using TSMC's 5 nm technology, designed for handling extensive AI tasks on Azure platform.

Maia 100 SoC architecture features:

• A high-speed tensor unit (16xRx16) offers rapid processing for training and inferencing while supporting a wide range of data types, including low precision data types such as the MX data format, first introduced by Microsoft through the MX Consortium in 2023.
• The vector processor is a loosely coupled superscalar engine built with custom instruction set architecture (ISA) to support a wide range of data types, including FP32 and BF16.
• A Direct Memory Access (DMA) engine supports different tensor sharding schemes.
• Hardware semaphores enable asynchronous programming on the Maia system.

OPENEDGES Technology, Inc., the leading provider of memory subsystem intellectual property (IP), today announced the launch of the Universal Chiplet Interconnect Express (UCIe) Controller IP, named OUC. UCIe is an open industry standard for a die-to-die interconnect, and co-developed by industry giants including AMD, Arm, ASE Group, Google Cloud, Intel, Meta, Microsoft, Qualcomm, and Samsung. UCIe is becoming a new trend in the semiconductor industry due to its advantages, such as increased semiconductor circuit integration, reduced production costs, and higher yields. OPENEDGES is contributing to UCIe consortium as a contributing member.

The OUC, deriving its name from OPENEDGES UCIe Controller, is tailored for highly customizable, package-level integration, facilitating die-to-die interconnect and protocol connections. It creates an interoperable, multi-vendor ecosystem set to revolutionize chip integration methodologies across the industry.

Intel today announced that its lead products on Intel 18A, Panther Lake (AI PC client processor) and Clearwater Forest (server processor), are out of the fab and have powered-on and booted operating systems. These milestones were achieved less than two quarters after tape-out, with both products on track to start production in 2025. The company also announced that the first external customer is expected to tape out on Intel 18A in the first half of next year.

"We are pioneering multiple systems foundry technologies for the AI era and delivering a full stack of innovation that's essential to the next generation of products for Intel and our foundry customers. We are encouraged by our progress and are working closely with customers to bring Intel 18A to market in 2025." -Kevin O'Buckley, Intel senior vice president and general manager of Foundry Services