According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

Intel is expanding immersion cooling collaborations with Taiwanese partners to strengthen its data center offerings for AI workloads. This includes developing an industry-first open IP complete immersion cooling solution and reference design. Partners like Kenmec and Auras Technology will be key in implementing Intel's advanced cooling roadmap. Intel is also cooperating with Taiwan's Industrial Research Institute on a new lab for certifying high-performance computing cooling technologies to international standards. With local ecosystem partners, Intel aims to accelerate next-generation cooling solutions for Taiwanese and global data centers. Advanced cooling allows packing more performance into constrained data center footprints, which is critical for AI's rapid growth. Intel touts a superfluid-based modular cooling system achieving 1500 Watts+ heat dissipation for high-density deployments.

Meanwhile, Kenmec offers a range of liquid cooling products, from Coolant Distribution Units (CDU) to customized Open Rack version 3 (ORv3) water cooling cabinets, with solutions already Intel-certified. Intel wants to solidify its infrastructure leadership as AI workloads surge by fostering an open, collaborative ecosystem around optimized cooling technologies. While progressing cutting-edge immersion and liquid cooling hardware, cultivating shared validation frameworks and best practices ensures broad adoption. With AI-focused data centers demanding ever-greater density, power efficiency, and reliability, cooling can no longer be an afterthought. Intel's substantial investments in a robust cooling ecosystem highlight it as a priority right alongside silicon advances. By lifting up Taiwanese partners as strategic cooling co-innovators, Intel aims to cement future competitiveness.

LG Electronics (LG) is set to unveil its latest lineup of UltraGear OLED gaming monitors, designed to provide superior gaming experiences. The expanded lineup includes the highly anticipated 32-inch 4K gaming monitor (model 32GS95UE), which boasts a 240 Hz refresh rate, an ultra-fast 0.03 ms Gray-to-Gray (GtG) response time, and LG's Dual-Hz feature and Pixel Sound technology. The company is also introducing stellar 39- and 34-inch models with ultra-wide curved screens: the 39GS95QE and the CES 2024 Innovation Award-winning 34GS95QE.

The groundbreaking 32GS95UE is the first UltraGear monitor equipped with the new Dual-Hz feature, allowing users to switch between 4K (3,840 x 2,160) at 240 Hz and Full-HD (1,920 x 1,080) at 480 Hz with one simple click. This time-saving innovation, easily managed via a hotkey or joystick's directional switch, lets users instantly apply the optimal combination of screen resolution and refresh rate for the genre of game they're playing. For fast-paced action titles and shooting games, users can select FHD 480 Hz, while visually rich story-driven games can be enjoyed in 4K 240 Hz.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

NZXT, a leader in PC gaming hardware and services, today announces the H6 Flow and H6 Flow RGB, a compact dual chamber mid-tower ATX case. The H6 Flow offers a harmonious blend of performance and visual appeal for PC enthusiasts. Designed for an expansive and uninterrupted view, the H6 Flow is adorned with consistent tempered glass on the front and sides, granting a panoramic peek into the insides of your build. Leveraging its dual chamber architecture, the new angel front panel directs the airflow from the three pre-included 120 mm fans (or 120 mm RGB fans for the H6 Flow RGB version) and two 140 mm fans at the base of the case allow you to cool your heat generating components. The revamped perforated panels come with a design fine-tuned for optimal airflow and superior performance. While all being easy to build with the H6 Flow facilitates generous cable-routing channels and straps, ensuring organized cable management.

A research paper released this week describes ways generative AI can assist one of the most complex engineering efforts: designing semiconductors. The work demonstrates how companies in highly specialized fields can train large language models (LLMs) on their internal data to build assistants that increase productivity.

Few pursuits are as challenging as semiconductor design. Under a microscope, a state-of-the-art chip like an NVIDIA H100 Tensor Core GPU (above) looks like a well-planned metropolis, built with tens of billions of transistors, connected on streets 10,000x thinner than a human hair. Multiple engineering teams coordinate for as long as two years to construct one of these digital mega cities. Some groups define the chip's overall architecture, some craft and place a variety of ultra-small circuits, and others test their work. Each job requires specialized methods, software programs and computer languages.

Jabil Inc., a global leader in design, manufacturing, and supply chain solutions, today announced it will take over the manufacture and sale of Intel's current Silicon Photonics-based pluggable optical transceiver ("module") product lines and the development of future generations of such modules.

"This deal better positions Jabil to cater to the needs of our valued customers in the data center industry, including hyperscale, next-wave clouds, and AI cloud data centers. These complex environments present unique challenges, and we are committed to tackling them head-on and delivering innovative solutions to support the evolving demands of the data center ecosystem," stated Matt Crowley, Senior Vice President of Cloud and Enterprise Infrastructure at Jabil. "This deal enables Jabil to expand its presence in the data center value chain."

Socionext today announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2 nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of- network markets.

The engineering samples are targeted to be available in 1H2025. This advanced CPU chiplet proof-of-concept using Arm Neoverse CSS technology is designed for single or multiple instantiations within a single package, along with IO and application-specific custom chiplets to optimize performance for a variety of end applications.

Synopsys today announced it has expanded its collaboration with Arm to provide optimized IP and EDA solutions for the newest Arm technology, including the Arm Neoverse V2 platform and Arm Neoverse Compute Subsystem (CSS). Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai full-stack AI-driven EDA suite, and Synopsys Interface, Security, and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions. The expanded partnership builds on three decades of collaboration to enable mutual customers to quickly develop specialized silicon at lower cost, with less risk and faster time to market.

"With Arm Total Design, our aim is to enable rapid innovation on Arm Neoverse CSS and engage critical ecosystem expertise at every stage of SoC development," said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business at Arm. "Our deep technical collaboration with Synopsys to deliver pre-integrated and validated IP and EDA tools will help our mutual customers address the industry's most complex computing challenges with specialized compute."

Today, Logitech G, in collaboration with Lucasfilm Ltd., announced the release of a special edition Return of the Jedi - inspired collection in honor of the 40th anniversary of the hit movie. Designed to celebrate the Star Wars legacy, the collection includes an officially licensed G502 X PLUS Millennium Falcon Edition Gaming Mouse and G840 XL Cloth Gaming Mouse Pad in Battle of Endor and Darth Vader Editions.

The G502 X PLUS Millennium Falcon Edition Gaming Mouse features pro-grade LIGHTSPEED wireless and all-new LIGHTFORCE switch technology for achieving higher levels of speed and reliability during gameplay. Built with custom Millennium Falcon-inspired thruster animations and graphics, the gaming mouse features 8-LED full-spectrum RGB lighting.

Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced today that it selected Samsung Foundry to bring Tenstorrent's next generation of AI chiplets to market. Tenstorrent builds powerful RISC-V CPU and AI acceleration chiplets, aiming to push the boundaries of compute in multiple industries such as data center, automotive and robotics. These chiplets are designed to deliver scalable power from milliwatts to megawatts, catering to a wide range of applications from edge devices to data centers.

To ensure the highest quality and cutting-edge manufacturing capabilities for its chiplet, Tenstorrent has selected Samsung's Foundry Design Service team, known for their expertise in silicon manufacturing. The chiplets will be manufactured using Samsung's state-of-the-art SF4X process, which boasts an impressive 4 nm architecture.

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC's 3DFabric technologies. The Synopsys Multi-Die System solution includes 3DIC Compiler, a unified exploration-to-signoff platform that delivers the highest levels of design efficiency for capacity and performance. In addition, Synopsys has achieved first-pass silicon success of its Universal Chiplet Interconnect Express (UCIe) IP on TSMC's leading N3E process for seamless die-to-die connectivity.

"TSMC has been working closely with Synopsys to deliver differentiated solutions that address designers' most complex challenges from early architecture to manufacturing," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our long history of collaboration with Synopsys benefits our mutual customers with optimized solutions for performance and power efficiency to help them address multi-die system design requirements for high-performance computing, data center, and automotive applications."

Whether it's the ultimate sound system in the home or a single point of sound, Beolab 8 can be used as a system speaker to create an immersive home cinema setup using the latest high-end Bang & Olufsen speakers or even heritage speakers dating back to 1984. Stereo pair two Beolab 8 speakers to create powerful and precise stereo sound for a high-fidelity music experience. Beolab 8 is also a stand-alone speaker delivering depth with an intense bass for its size.

"Our goal is to create powerful and immersive listening experiences for our customers. Beolab 8 provides exactly this. It is a scalable speaker that is all about flexibility, performance, and innovation", says Michael Henriksson, Vice President of Product Marketing at Bang & Olufsen and continues: "Drawing inspiration from the high-end Beolab range, our aim for Beolab 8 was to distil the acoustic essence of these impressive speakers into a compact offering that maintains the directivity and sound beam control for optimal sound reproduction in any environment. Bringing immersive experiences for every moment".

GIGABYTE, the world's leading computer hardware brand, featured its AORUS 17X laptop in two influential AI-content-focused Youtubers by Hugh Hou and MDMZ. Both Youtubers took the new AORUS 17X laptop to the AI image and AI video generation test and found the great potential of how the laptops benefit their workflow. The AORUS 17X laptop is powered by NVIDIA GeForce RTX 40 series GPUs to unlock new horizons for creativity and become the go-to choice for art and tech enthusiasts.

Hugh Hou: Unleashing the Power of AI Arts with the AORUS 17X Laptop
Hugh Hou's journey into AI arts, powered by Stable Diffusion XL, garnered viral success. The AORUS 17X laptop emerged as a game-changer with up to 16G of VRAM, enabling local AI photo and video generation without bearing hefty cloud-rendering costs. It empowers creators and outperforms competitors in AI-assisted tasks and enhances AI artistry.

IBASE Technology Inc. (TPEx: 8050), a global leader in network appliances and embedded solutions, proudly announces the release of the INA8505 enterprise 1U edge server. Powered by the Intel Xeon D-2700 processor and offering versatile connectivity options, this state-of-the-art appliance is specifically designed to excel in demanding 5G Open vRAN & MEC applications such as real-time data analytics, autonomous vehicles, and smart city deployments. It enables full control over resource allocation in the RAN and MEC, and has the potential to seamlessly integrate AI capabilities to dynamically optimize network performance in real time at the edge of the 5G network infrastructure.

The INA8505 delivers unmatched performance, scalability, and efficiency with flexible storage, offering two SATA/NVMe 2.5" HDD/SSD slots, 2x M.2 (M-key) SATA/PCI-E storage slots, and one 16 GB/32 GB/64 GB eMMC. With an FHFL PCI-E (x16) Gen 4 (supports 75 W) and an FHFL PCI-E (x8) Gen 4 (supports 75 W) configurable as PCI-E (x16) Gen 4 double FHFL (supports 120 W), the INA8505 adapts effortlessly into different network environments and meet future demands for increased scalability. It boasts a rich array of I/O connectivity options, including a VGA port from BMC (Aspeed 2600, IPMI 2.0 support), two USB2.0 Type-A ports, an RJ45 console port, and four 25 GbE SFP28 ports, ensuring enhanced adaptability to various connectivity needs.

Artificial intelligence (AI) has emerged as a transformative force in chip design, with recent examples from China and the United States showcasing its potential. Jensen Huang, CEO of Nvidia, believes that AI can empower individuals to become programmers, while Lisa Su, CEO of AMD, predicts an era where AI dominates chip design. During the 2023 World Artificial Intelligence Conference (WAIC) in Shanghai, Su emphasized the importance of interdisciplinary collaboration for the next generation of chip designers. To excel in this field, engineers must possess a holistic understanding of hardware, software, and algorithms, enabling them to create superior chip designs that meet system usage, customer deployment, and application requirements.

The integration of AI into chip design processes has gained momentum, fueled by the AI revolution catalyzed by large language models (LLMs). Both Huang and Mark Papermaster, CTO of AMD, acknowledge the benefits of AI in accelerating computation and facilitating chip design. AMD has already started leveraging AI in semiconductor design, testing, and verification, with plans to expand its use of generative AI in chip design applications. Companies are now actively exploring the fusion of AI technology with Electronic Design Automation (EDA) tools to streamline complex tasks and minimize manual intervention in chip design. Despite limited data and accuracy challenges, the "EDA+AI" approach holds great promise. For instance, Synopsys has invested significantly in AI tool research and recently launched Synopsys.ai, the industry's first end-to-end AI-driven EDA solution. This comprehensive solution empowers developers to harness AI at every stage of chip development, from system architecture and design to manufacturing, marking a significant leap forward in AI's integration into chip design workflows.

NVIDIA RTX is spinning new cycles for designs. Trek Bicycle is using GPUs to bring design concepts to life. The Wisconsin-based company, one of the largest bicycle manufacturers in the world, aims to create bikes with the highest-quality craftsmanship. With its new partner Lidl, an international retailer chain, Trek Bicycle also owns a cycling team, now called Lidl-Trek. The team is competing in the annual Tour de France stage race on Trek Bicycle's flagship lineup, which includes the Emonda, Madone and Speed Concept. Many of the team's accessories and equipment, such as the wheels and road race helmets, were also designed at Trek.

Bicycle design involves complex physics—and a key challenge is balancing aerodynamic efficiency with comfort and ride quality. To address this, the team at Trek is using NVIDIA A100 Tensor Core GPUs to run high-fidelity computational fluid dynamics (CFD) simulations, setting new benchmarks for aerodynamics in a bicycle that's also comfortable to ride and handles smoothly. The designers and engineers are further enhancing their workflows using NVIDIA RTX technology in Dell Precision workstations, including the NVIDIA RTX A5500 GPU, as well as a Dell Precision 7920 running dual RTX A6000 GPUs.

A group of researchers in China have used a new approach to AI to create a full RISC-V processor from scratch. The team set out to answer the question of whether an AI could design an entire processor on its own without human intervention. While AI design tools do already exist and are used for complex circuit design and validation today, they are generally limited in use and scope. The key improvements shown in this approach over traditional or AI assisted logic design are the automated capabilities, as well as its speed. The traditional assistive tools for designing circuits still require many hours of manual programming and validation to design a functional circuit. Even for such a simple processor as the one created by the AI, the team claims the design would have taken 1000x as long to be done by humans. The AI was trained by observing specific inputs and outputs of existing CPU designs, with the paper summarizing the approach as such:

(...) a new AI approach, which generates large-scale Boolean function with almost 100% validation accuracy (e.g., > 99.99999999999% as Intel) from only external input-output examples rather than formal programs written by the human. This approach generates the Boolean function represented by a graph structure called Binary Speculation Diagram (BSD), with a theoretical accuracy lower bound by using the Monte Carlo based expansion, and the distance of Boolean functions is used to tackle the intractability.

Google's Android logo has been reworked in recent times—their classic green robot design was debuted in a new 3D form earlier this year at CES 2023. 9to5Google reckons that the redesign will be rolled out soon, along with a new typeface. These are allegedly set to replace the flat aesthetic from the company's 2019 branding refresh. The specialist news outlets points to Google first teasing the 3D "bugdroid" head in early January via its Keyword blog, and further examples have popped up at trade events and conferences since then.

According to 9to5Google the reworked brand identity is official, but Google was acting coy about an official launch window—details will be revealed at a later date. Industry insiders posit that Google's new design language will debut with the release of Android 14 (codenamed "Upside Down Cake"). The next-gen mobile OS is currently in Beta (version 3) and has reached platform stability.

AZZA, a company known for creating cases of interesting design, had a new lineup to show at Computex 2023. The star of the show may very well be AZZA's new Sanctum 810, a giant cube case with a cut corner that carries support for up to seven 120 mm fans, creating adequate airflow once configured. There is even room to mount a 360 mm radiator for a custom water cooling build, as shown in the pictures below.

Next, we have AZZA's oddly-shaped Mesa 811 -- a twisted cube case that supports E-ATX motherboards, has glass side panels, and even has perforated aluminium panels. It also fits three 120 mm fans in the front and only has one 120 mm in the back, but there is space to do a custom cooling loop.

It was reported earlier this morning that Leadtek was preparing a new custom design NVIDIA GeForce RTX 4070 graphics card - Tom's Hardware pointed out that South Korea's National Radio Research Agency had uploaded a registration for a "RTX 4070 AI BLOWER" VGA card on behalf of "Leadtek Research Inc." The article delves into a possible scenario, based on the model name alone, of Leadtek producing a cooling solution that reflects NVIDIA's blower-style reference design. Team Green has gained quite the reputation for being protective of that blueprint, despite its Founders Edition lineup of gaming-oriented cards shifting to a traditional cooling solution (back in the RTX 20-series days). Board partners are normally expected to devise their own/unique cooling solutions, and NVIDIA has mostly reserved the blower + vapor chamber combination for its professional GPU model lineups.

Leadtek has created a product page for their new custom card this afternoon, and it is immediately clear that this morning's prediction was somewhat correct. The WinFast RTX 4070 AI BLOWER 12G sports a "streamlined" yet boxy black cooling solution that appears to be closer in appearance to an NVIDIA RTX A-series professional card, although a flash of silver trim and logo on the fan provides a bit of "gamer" visual language. Leadtek's specification info states that their AI Blower cooler features an aluminium die cast housing alongside a copper finned vapor chamber. The lone mounted fan is said to have a 50,000 hour operational lifespan thanks to a special internal arrangement: "WinFast double ball bearing fan provides better reliability, higher dust resistance levels, and moreso keeps friction and noise to a minimum." Tom's Hardware posited that Leadtek's custom card would be marketed as an enterprise product (for AI processing) - the freshly uploaded product page does position it for those purposes, but the rundown also mentions its supposed gaming performance prowess.

Molex, a company known for making various electronics and connectors, has today announced that the company has developed a first-of-its-kind chip-to-chip connector. Designed mainly for the data center, the Molex 224G product portfolio includes next-generation cables, backplanes, board-to-board connectors, and near-ASIC connector-to-cable solutions. Running at 224 Gbps speeds, these products use PAM4 signaling and boast with " highest levels of electrical, mechanical, physical and signal integrity." As the company states, future high-performance computing (HPC) data centers require a lot of board-to-board, chip-to-chip, and other types of communication to improve overall efficiency and remove bottlenecks in data transfer. To tackle this problem, Molex has a range of products, including Mirror Mezz Enhanced, Inception, and CX2 Dual Speed products.

Future generative AI, 1.6T (1.6 Tb/s) Ethernet, and other data center challenges need a dedicated communication standard, which Molex is aiming to provide. Working with various data center and enterprise customers, the company claims to have set the pace for products based on this 224G PAM4 chip-to-chip technology. We suspect that Open Compute Project (OCP) will be first in the line of adoption, ad Molex has historically worked with them as they adopted Mirror Mezz and Mirror Mezz Pro board-to-board connectors. The new products can be seen below, and we expect to hear more announcements from Molex's partners. Solutions like OSFP 1600, QSFP 800, and QSFP-DD 1600 already use 224G products.

Scientific researchers need massive computational resources that can support exploration wherever it happens. Whether they're conducting groundbreaking pharmaceutical research, exploring alternative energy sources or discovering new ways to prevent financial fraud, accessible state-of-the-art AI computing resources are key to driving innovation. This new model of computing can solve the challenges of generative AI and power the next wave of innovation. Cambridge-1, a supercomputer NVIDIA launched in the U.K. during the pandemic, has powered discoveries from some of the country's top healthcare researchers. The system is now becoming part of NVIDIA DGX Cloud to accelerate the pace of scientific innovation and discovery - across almost every industry.

As a cloud-based resource, it will broaden access to AI supercomputing for researchers in climate science, autonomous machines, worker safety and other areas, delivered with the simplicity and speed of the cloud, ideally located for the U.K. and European access. DGX Cloud is a multinode AI training service that makes it possible for any enterprise to access leading-edge supercomputing resources from a browser. The original Cambridge-1 infrastructure included 80 NVIDIA DGX systems; now it will join with DGX Cloud, to allow customers access to world-class infrastructure.

Applied Materials, Inc. today announced a landmark investment to build the world's largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D). The new Equipment and Process Innovation and Commercialization (EPIC) Center is planned as the heart of a high-velocity innovation platform designed to accelerate development and commercialization of the foundational technologies needed by the global semiconductor and computing industries.

To be located at an Applied campus in Silicon Valley, the multibillion-dollar facility is designed to provide a breadth and scale of capabilities that is unique in the industry, including more than 180,000 square feet - more than three American football fields - of state-of-the-art cleanroom for collaborative innovation with chipmakers, universities and ecosystem partners. Designed from the ground up to accelerate the pace of introducing new manufacturing innovations, the new EPIC Center is expected to reduce the time it takes the industry to bring a technology from concept to commercialization by several years, while simultaneously increasing the commercial success rate of new innovations and the return on R&D investments for the entire semiconductor ecosystem.