We have seen a few examples of custom design/board partner Radeon RX 7600 graphics card models via leaks over the past two weeks - and AMD's alleged reference design has made an appearance this weekend, only fours days prior to the official product launch date (May 25). The leaked images once again come courtesy of VideoCardz - the set of two photos show a dual-fan setup on a mostly black shroud with the company's simple "Radeon" logo positioned near the top - this design seems to be missing an underlining strip of RGB (as seen on the big boy cards).

The picture of the card's flipside depicts a very plain looking backplate. The overall aesthetic is not too far removed from the existing high-end Radeon RX 7900 XT and 7900 XTX reference siblings, although this leaked entry-level offering is tiny in comparison - it is reported to be just under 21 centimeters in length (versus the 7900 XT at 27.6 cm and 7900 XTX at 28.7 cm). The RX 7600 MBA (made-by-AMD) card is said to be two slots wide.

Following the news that Oppo is likely to pull out of the French market, it now appears that the company has closed its chip design unit named Zeku. According to the South China Morning Post, workers at Zeku got less than a day's notice that the company was shutting down, which was on Thursday last week. Employees weren't even allowed back into the office to collect their personal belongings. As recent as two weeks ago, Zeku was still looking for new hires, which makes the abrupt closure even more peculiar, especially as Zeku is said to have employed upwards of 3,000 people.

Considering that Oppo is ranked as the fourth largest smartphone maker in terms of globally shipped units in Q1, the way the company has handled the closure of its chip design unit reeks of desperation. It should be noted that Zeku wasn't designing chips to power Oppo's phones, but presumably Zeku was behind the MariSilicon X, which was Oppo's own imaging co-processor. In all fairness, Oppo is far from the only company to have closed down business units this year, but the company is also said to be suffering in terms of shipments of smartphones, as the company saw a drop of 22 percent in shipments last year, to 103 million units. This appears to be part of the reason behind the shutdown of Zeku, but Oppo hasn't provided much in terms of details behind the closure.

Barron's Magazine has been on a technology industry kick this week and published their interview with AMD CEO Dr. Lisa Su on May 3. The interviewer asks Su about her views on Moore's Law and it becomes apparent that she remains a believer of Gordon Moore's (more than half-century old) prediction - Moore, an Intel co-founder passed away in late March. Su explains that her company's engineers will need to innovate in order to carry on with that legacy: "I would certainly say I don't think Moore's Law is dead. I think Moore's Law has slowed down. We have to do different things to continue to get that performance and that energy efficiency. We've done chiplets - that's been one big step. We've now done 3-D packaging. We think there are a number of other innovations, as well." Expertise in other areas is also key in hitting technological goals: "Software and algorithms are also quite important. I think you need all of these pieces for us to continue this performance trajectory that we've all been on."

When asked about the challenges involved in advancing CPU designs within limitations, Su responds with: "Yes. The transistor costs and the amount of improvement you're getting from density and overall energy reduction is less from each generation. But we're still moving (forward) generation to generation. We're doing plenty of work in 3 nanometer today, and we're looking beyond that to 2 nm as well. But we'll continue to use chiplets and these type of constructions to try to get around some of the Moore's Law challenges." AMD and Intel continue to hold firm with Moore's Law, even though slightly younger upstarts disagree (see NVIDIA). Dr. Lisa Su's latest thoughts stay consistent with her colleague's past statements - AMD CTO Mark Papermaster reckoned that the theory is pertinent for another six to eight years, although it could be a costly endeavor for AMD - the company believes that it cannot double transistor density every 18 to 24 months without incurring extra expenses.

According to Tom's Hardware, Microsoft is busy hiring engineers to help the company design its own Arm based SoC for Windows 12. Based on job listings, Microsoft is adding people to its "Silicon team," which is currently involved in designing products for Microsoft's Azure, Xbox Surface and HoloLens products. That said, the specific job listings mentioned by Tom's Hardware mentions "optimizing Windows 12 for Silicon-ARM architecture" suggesting we're looking at a custom Arm SoC, with others mentioning "internally developed silicon components" and "building complex, state-of-the-art SOCs using leading silicon technology nodes and will collaborate closely with internal customers and partners."

That said, Microsoft is currently working with Qualcomm and the Microsoft SQ3 found in the Surface Pro 9 is the latest result of that partnership. This brings the question if Microsoft has decided to make its own chip to compete with the Apple M-series of silicon, or if Microsoft is simply looking at working closer with Qualcomm by hiring inhouse talent that can help tweak the Qualcomm silicon to better suit its needs. With Windows 12 scheduled for a 2024 release, it looks like we'll have to wait a while longer to find out what Microsoft is cooking up, but regardless of what it is, it looks like Windows on Arm isn't going anywhere.

Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology. The TSMC N2 process, which adopts nanosheet transistor structure, represents a major advancement in semiconductor technology with significant speed and power advantages for high performance computing (HPC), mobile chips, and 3D-IC chiplets. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on N2, including the effects of self-heat on long-term reliability of wires and transistors. This latest collaboration builds on the recent certification of the Ansys platform for TSMC's N4 and N3E FinFLEX processes.

"TSMC works closely with our Open Innovation Platform (OIP) ecosystem partners to help our mutual customers achieve the best design results with the full stack of design solutions on TSMC's most advanced N2 process," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "Our latest collaboration with Ansys RedHawk-SC and Totem analysis tools allows our customers to benefit from the significant power and performance improvements of our N2 technology while ensuring predictively accurate power and thermal signoff for the long-term reliability of their designs."

Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (Nasdaq: SNPS) has strengthened its collaboration with TSMC and Ansys for multi-die system design and manufacturing. Synopsys provides the industry's most comprehensive EDA and IP solutions for multi-die systems on TSMC's advanced 7 nm, 5 nm and 3 nm process technologies with support for TSMC 3DFabric technologies and 3Dblox standard. The integration of Synopsys implementation and signoff solutions and Ansys multi-physics analysis technology on TSMC processes allows designers to tackle the biggest challenges of multi-die systems, from early exploration to architecture design with signoff power, signal and thermal integrity analysis.

"Multi-die systems provide a way forward to achieve reduced power and area and higher performance, opening the door to a new era of innovation at the system-level," said Dan Kochpatcharin, head of Design Infrastructure Management Division at TSMC. "Our long-standing collaboration with Open Innovation Platform (OIP) ecosystem partners like Synopsys and Ansys gives mutual customers a faster path to multi-die system success through a full spectrum of best-in-class EDA and IP solutions optimized for our most advanced technologies."

MSI, a world leader in high-performance and innovative computing solutions, proudly announces that the Modern MD271UL monitor has won the prestigious Red Dot Award 2023 for outstanding design and innovation. The Modern MD271UL is a 27-inch 4K monitor that offers an immersive visual experience with its wide color gamut and advanced EyesErgo eye-care technology. In addition, it is tailored for efficiency and productivity with a touch of personal style.

Elegantly Crafted with Vibrancy
Modern MD271UL monitors are inspired by Mid-century Modern Style, which has clean, low-key, and breathtaking functionality. With a sleek & minimalist design, it meshes well with stylish home or office furniture. Unlike the typical monitor, it is an elegant decor in any living room. The frameless and minimalist designs let you express your aesthetic and define your environment. The Modern MD271UL is designed not only for working but also for personal lifestyle.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

IBM today unveiled new single frame and rack mount configurations of IBM z16 and IBM LinuxONE 4, expanding their capabilities to a broader range of data center environments. Based on IBM's Telum processor, the new options are designed with sustainability in mind for highly efficient data centers, helping clients adapt to a digitized economy and ongoing global uncertainty.

Introduced in April 2022, the IBM z16 multi frame has helped transform industries with real-time AI inferencing at scale and quantum-safe cryptography. IBM LinuxONE Emperor 4, launched in September 2022, features capabilities that can reduce both energy consumption and data center floor space while delivering the scale, performance and security that clients need. The new single frame and rack mount configurations expand client infrastructure choices and help bring these benefits to data center environments where space, sustainability and standardization are paramount.

Cooler Master, the global frontrunner in PC components and peripherals, proudly reveals the triumphant entries of the Case Mod World Series 2022. This annual contest, which began in 2009, continues to captivate the imagination with trailblazing custom PC creations from artists across the globe.

This year's winner of the Best Tower Mod category is Timeplay who wowed the judges with a breathtaking Cosmos C700M mod that redefined the classic Full Tower case in an ITX form factor. In the Best Scratch Build category, Keir Graham took home the top honors with his PowerCore build—a remarkable custom liquid-cooled system that showcased both intricate detail and ingenious design.

Amid the US sanctions, Chinese technology giant Huawei has reportedly developed tools to create processors with 14 nm and above lithography. According to Chinese media Yicai, Huawei and its semiconductor partners have teamed up to create replacement tools in place of US chip toolmakers like Cadence, Synopsys, and Mentor/Siemens. These three companies control all of the world's Electronic Design Automation (EDA) tools used for every step of chip design, from architecture to placement and routing to the final physical layout. Many steps need to be taken before making a tapeout of a physical chip, and Huawei's newly developed EDA tools will help the Chinese industry with US sanctions which crippled Huawei for a long time.

Having no access to US-made chipmaking tools, Huawei has invested substantial time into making these EDA tools. However, with competing EDA makers supporting lithography way below 14 nm, Huawei's job still needs to be completed. Chinese semiconductor factories are currently capable of 7 nm chip production, and Huawei itself is working on making a sub-7 nm EUV scanner to aid manufacturing goals and compete with the latest from TSMC and other. If Huawei can create EUV scanners that can achieve transistor sizes smaller than 7 nm, we expect to see their EDA tools keep pace as well. It is only a matter of time before they announce adaptation for smaller nodes.

Apple CEO Tim Cook has reportedly set an ambitious end of the year launch window for the company's mixed reality headset. Operations Chief Jeff Williams has also pushed in favor of a late 2023 debut of the much delayed VR/AR hybrid product. According to anonymous insider sources who have divulged juicy details to the Financial Times, the decision to launch in 2023 has caused an internal clash with the Apple Design team at its Cupertino, California headquarters.

The Apple Park design team has called for additional development time, this would push the headset's launch back by several years. Insiders claim that the design team would prefer to have more time to refine the product's aesthetics and functionality, with emphasis on creating a sleek and more lightweight visor. Doubts about the efficacy of the headset's proposed internal technology were also expressed, the designers would prefer to delay until Augmented Reality development reaches a satisfying level of maturity.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced today that it has selected Amazon Web Services, Inc. (AWS) as its cloud provider for electronic design automation (EDA). A cloud-first approach helps Marvell to rapidly and securely scale its service on the world's leading cloud, rise to the challenges brought by increasingly complex chip design processes, and deliver continuous innovation for the expanding needs across the automotive, carrier, data center, and enterprise infrastructure markets it serves. The work extends the longstanding relationship between the two companies—Marvell is also a key semiconductor supplier for AWS, helping the company support the design and rapid delivery of cloud services that best meet customers' demanding requirements.

EDA refers to the specialized and compute-intensive processes used in chip making and is a critical piece of Marvell's R&D. Over the years, the number of transistors on an integrated chip has increased exponentially. Each advance in chip design calls for a calculated application of software modules overseeing logic design, debugging, component placement, wire routing, optimization of time and power consumption, and verification. Due to the computationally intensive nature of EDA workloads, it is no longer cost-effective or timely to run EDA on premises. By powering its EDA with AWS, Marvell leverages an unmatched portfolio of services including secure, elastic, high-performance compute capacity in the cloud to solve challenges around speed, latency, security of IP, and data transfer.

iBUYPOWER, a leading manufacturer of high-performance custom gaming PCs, today announced the new RDY Ouro Kronii system featuring the special edition Y60 Ouro Kronii PC case.

"It's been an incredible journey collaborating with Kronii and hololive Engish," said King Perez de Tagle, Marketing Executive Producer of HYTE and iBUYPOWER. "It's about time The Warden of Time gets a high-performance gaming PC and the RDY Ouro Kronii limited edition systems are ready to ship. stay tuned for even more!" The RDY Ouro Kronii will boast the latest Intel Core i9 13900K or KF CPU, NVIDIA RTX 4070 Ti GPU, Z790 motherboard, and the custom Y60 Ouro Kronii PC case. The RDY Ouro Kronii will provide users with maximum performance in virtually any application with reliable components and iBUYPOWER's expert assembly.

Even more performance for RTX 4070 Ti GPUs! With the Eisblock Aurora cooler, Alphacool presents a new, innovative solution for active water cooling of Nvidia's Geforce RTX 4070 Ti graphics cards in the reference design.

In order to dissipate the enormous waste heat of this graphics card generation, in the best possible way, numerous optimizations have been carried out on the water cooler compared to the cooler models of the 30XX card generation. The fin structure was adapted and enables an optimal water flow while simultaneously increasing the cooling surface. The modified nozzle plate with improved Inflow Engine ensures the best possible distribution of water on the cooling fins. The fully chrome-plated copper base is resistant to acids, scratches and damage. In addition, the chrome plating provides homogeneity and reflectivity that cannot be achieved by nickel plating.

Chinese processor designers need help creating a leading-edge design that satisfies their needs, with the imposed sanctions and restrictions of Western countries. However, designers are using creative ways to make a server processor to fulfill their needs. According to the latest Sina report, Chinese company Loongson has developed a 32-core processor using chiplet technology. Previously, the company announced its 16-core 3C5000 processor based on LA464 cores, which utilize LoongArch ISA. Loongson used chiplet technology to fuse two 3C5000 processors into a single-socket solution called 3D5000, which features 32 LA464 cores to create a higher-performing design. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm.

The company claims that the typical power consumption is rated for 130 Watts at 2.0 GHz or 170 Watts at 2.2 GHz, with TDP power consumption not exceeding 300 Watts at 2.2 GHz even with peaks. The performance of the new 3D5000 processor, measured using SPEC2006, is 400 points and 800 points for single-socket and dual-socket servers, respectively. The four-socket server is expected to reach 1600 points in the same benchmark, so scaling is advertised as linear. Loongson hopes to provide samples to industry partners in the first half of 2023 with an unknown price tag.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

The Core product line takes shape with the new coolers in the usual high quality, excellent performance and functional design language. The heart of the copper cooler is an assembly of connector terminal and cooler, which is milled from one piece of copper. The fine workmanship combined with the hard and resistant chrome plating of the entire copper cooler meet the highest quality standards. The brass G1/4" threads integrated on both sides, also chrome-plated, stand out visually striking from the terminal and are one of the key points of the new design language that will be present in all products of the Core series.

The aluminium backplate matched to the design together with the terminal forms a single unit. It convinces with clear and homogeneous optics on the back of the cooler. The individually controllable lighting consists of digitally addressable RGB LEDs and enables the even and colorful illumination of the entire cooler.

We have discovered an issue with our all-in-one watercooler Lumen. Following user reports of an increase in CPU temperatures, an investigation was started to determine the potential cause. Our findings conclude that the soldering material used in the aluminium radiator, as well as impurities introduced during manufacturing, may cause a reaction with the chemical composition of the cooling fluid. Over time this may lead to sediment build-up in the circulating liquid getting caught in the fins of the CPU block, causing an increase in temperatures as a result of the blockage.

Although Lumen units that are not currently causing temperature issues are safe for continued use, the experience of our users is our main priority. We have therefore decided to halt all Lumen sales globally, until we are satisfied that the quality standards we and our users expect are fully met. In order to address the issue, our teams will be working on a new version with an updated radiator and a new liquid formula, produced following revised processes and guidelines for assembly. With our currently estimated timeline, we are hoping to have new units available as replacements for Lumen owners, as well as substitutes for stock at distributors and resellers; in about six weeks. A web form for users to request a replacement can be found on our dedicated website, which also provides ongoing updates, timeline and further information. Ticket holders will also receive updates via e-mail. We sincerely apologize for the inconvenience.

peel 3d, the developers of best-in-class professional-grade 3D scanners that offer superior value at unmatched price points, today announced the launch of peel 3 and peel 3.CAD—two new scanners that will elevate the 3D scanning experience for professional users across many different sectors without compromising affordability.

peel 3 and peel 3.CAD handle like a charm as they feature a revamped ergonomic design unlike any other on the market and an intuitive multi-function touchscreen interface. Industry-first haptic user communication through vibration simplifies generating high-quality 3D scans regardless of users' skill levels. Improved resolution and performance for more complex geometries, surfaces and colours provide additional versatility to 3D scan any type of object.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

ViewSonic Corp., a leading global provider of visual solutions, announces the new Fogra-certified professional display, ColorPro VP2786-4K. Built with 100% Adobe RGB color gamut, it delivers true-to-life color reproduction on all digital and print mediums. The monitor is tailored for the all-new ColorPro Sense software, which automatically suggests color combinations from Pantone 's color library to best match the creator's vision. It is also equipped with the intuitive ColorPro Wheel for in-depth color control and management.

"Photographers, printing professionals, and colorists require precise color reproduction to best represent their visions, which is why we offer solutions that ensure their masterpieces can be replicated in their truest form," said Oscar Lin, General Manager of the Monitor Business Unit at ViewSonic. "The ColorPro VP2786-4K takes another step forward into the realm of true color management with its combination of software and hardware. With that, we hope to give creators the freedom to command how their work looks like."

The Chinese technology giant, SMIC, has managed to advance its semiconductor manufacturing technology and shipped the first 7 nm silicon manufactured on China's soil. According to analyst firm TechInsights, who examined the 7 nm Bitcoin mining SoC made for MinerVa firm, there are doubts that SMIC 7 nm process is somewhat similar to TSMC's 7 nm process. Despite having no access to advanced semiconductor manufacturing tools, and US restrictions placed around it, SMIC has managed to produce what resembles an almost perfect 7 nm node. This could lead to a true 7 nm logic and memory bitcells sometimes in the future, as the node advances in SMIC's labs.

Having done an in-depth die analysis, the TechInsights report indicates that TSMC, Intel, and Samsung have a more advanced 7 nm node and are two nodes ahead of the Chinese SMIC. The results are not great regarding the economics and yield of this SMIC 7 nm process. While we have no specific data, the report indicates that the actual working chips made with older DUV tools are not perfect. This is not a problem for the Chinese market as it seeks independence from Western companies and technology. However, introducing a China-made 7 nm chip is more critical as it shows that the country can manufacture advanced nodes with restrictions and sanctions in place. The MinerVa SoC die and the PCB that houses those chips are pictured below.