The recent semiconductor shortage has put an unprecedented amount of focus on the industry. Both commercial and government entities have come to recognize the lack of advanced node semiconductor manufacturing capabilities onshore in the United States. Intel Foundry Services (IFS) entry into the commercial foundry space is poised to change all that. As part of IFS Accelerator program, Intel recently announced their new IFS Cloud Alliance program, with Microsoft Azure as one of the inaugural members.

This is the latest chapter in a partnership between Intel and Microsoft that stretches back decades all the way back to the early days of the personal computer. In the last few years, Intel and Microsoft have collaborated on advancing semiconductor design on the cloud by working together to bring out EDA centric cloud compute such as the FX series on Azure, working with EDA vendors to enhance their software to better take advantage of the elasticity of the Azure cloud, as well as collaborating on a secure cloud-based semiconductor development platform for the US Department of Defense RAMP and RAMP-C programs.

When designing integrated circuits, engineers aim to produce an efficient design that is easier to manufacture. If they manage to keep the circuit size down, the economics of manufacturing that circuit is also going down. NVIDIA has posted on its technical blog a technique where the company uses an artificial intelligence model called PrefixRL. Using deep reinforcement learning, NVIDIA uses the PrefixRL model to outperform traditional EDA (Electronics Design Automation) tools from major vendors such as Cadence, Synopsys, or Siemens/Mentor. EDA vendors usually implement their in-house AI solution to silicon placement and routing (PnR); however, NVIDIA's PrefixRL solution seems to be doing wonders in the company's workflow.

Creating a deep reinforcement learning model that aims to keep the latency the same as the EDA PnR attempt while achieving a smaller die area is the goal of PrefixRL. According to the technical blog, the latest Hopper H100 GPU architecture uses 13,000 instances of arithmetic circuits that the PrefixRL AI model designed. NVIDIA produced a model that outputs a 25% smaller circuit than comparable EDA output. This is all while achieving similar or better latency. Below, you can compare a 64-bit adder design made by PrefixRL and the same design made by an industry-leading EDA tool.

Samsung Foundry will engage Ansys' industry-leading electromagnetic (EM) simulation tools to develop ultramodern designs, including 5G/6G, on the most advanced chips, nodes, and process technologies. Ansys' simulation solutions will deliver a comprehensive EM-aware design flow with greater capacity, speed, and integration capabilities for Samsung's most advanced semiconductor technology, accelerating on-chip design cycle times to boost high-speed connectivity while helping to reduce design error and risk.

Samsung designers will leverage Ansys' EM design tools, Ansys RaptorX, Ansys VeloceRF, and Ansys Exalto, to help reduce time to market by two to three weeks on smaller designs and up to two months for complex designs. With automation capabilities that optimize calculations and modeling, coupled with larger capacity, Ansys' software will allow the Samsung team to design at faster speeds with higher fidelity.

Samsung Electronics, the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture. Multi-Bridge-Channel FET (MBCFET), Samsung's GAA technology implemented for the first time ever, defies the performance limitations of FinFET, improving power efficiency by reducing the supply voltage level, while also enhancing performance by increasing drive current capability. Samsung is starting the first application of the nanosheet transistor with semiconductor chips for high performance, low power computing application and plans to expand to mobile processors.

"Samsung has grown rapidly as we continue to demonstrate leadership in applying next-generation technologies to manufacturing, such as foundry industry's first High-K Metal Gate, FinFET, as well as EUV. We seek to continue this leadership with the world's first 3 nm process with the MBCFET," said Dr. Siyoung Choi, President and Head of Foundry Business at Samsung Electronics. "We will continue active innovation in competitive technology development and build processes that help expedite achieving maturity of technology."

Today, leading global fabless chipmaker MediaTek Inc., [joined by Indiana Governor Eric J. Holcomb, Deputy Secretary of Commerce Don Graves, Indiana Secretary of Commerce Bradley B. Chambers, and Purdue College of Engineering's Dr. Mung Chiang] announced their commitment to accept a state transition assistance package from the Indiana Economic Development Commission (IEDC) to support its very first Midwest semiconductor chip design center in West Lafayette, Indiana. MediaTek also shared its intention to create a new research partnership with Purdue to collaborate on engineering talent development and new research on next-generation computing and communications chip design. The news was shared with senior leaders, other international investors and policymakers assembled in National Harbor, Maryland for the 2022 SelectUSA Investment Summit.

This novel partnership in Indiana represents a new U.S. growth model for MediaTek USA; outside the traditional centers of gravity for chip design. "We believe strongly that being in Indiana means we'll have access to some of the best engineering talent in the world," said Dr. Kou-Hung Lawrence Loh, Corporate Senior Vice President of MediaTek Inc. and President of MediaTek USA, Inc. "Not just at Purdue, but West Lafayette is only four hours away from nearly a dozen of the top engineering schools in the country. In the post pandemic world, top candidates tell us they want to be closer to home, near family and they want to have a real house and great schools. Indiana offers all that and more."

Cadence Design Systems, Inc. today announced that its digital and custom/analog design flows have been certified for the TSMC N3E and N4P processes, supporting the latest Design Rule Manual (DRM). In addition, Cadence and TSMC delivered N3E and N4P process design kits (PDKs) and design flows to accelerate customer adoption and advance mobile, AI and hyperscale computing design innovation. Joint customers are actively designing with the new N3E and N4P PDKs, and several test chips have already been taped out, which demonstrates how Cadence solutions help customers improve engineering efficiency and maximize the power, performance and area (PPA) benefits offered by the latest TSMC process technologies. The Cadence digital and custom/analog advanced-node solutions support the company's Intelligent System Design strategy, enabling system-on-chip (SoC) design excellence.

Cadence worked closely with TSMC to ensure the digital full flow was optimized for TSMC's advanced N3E and N4P process technologies. The complete RTL-to-GDS flow includes the Cadence Innovus Implementation System, Quantus Extraction Solution, Quantus Field Solver, Tempus Timing Signoff Solution and ECO option, Pegasus Verification System, Liberate Characterization Solution and Voltus IC Power Integrity Solution. Additionally, the Cadence Genus Synthesis Solution and predictive iSpatial technology are enabled for the TSMC N3E and N4P process technologies.

Google Cloud and AMD today announced a technology partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, further extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud's global networking, storage, artificial intelligence, and machine learning capabilities to further improve upon its hybrid and multicloud strategy for these EDA workloads.

Scale, elasticity, and efficient utilization of resources play critical roles in chip design, particularly given that the demand for compute processing grows with each node advancement. To remain flexible and scale easily, AMD will add Google Cloud's newest compute-optimized C2D VM instance, powered by 3rd Gen AMD EPYC processors, to its suite of resources focused on EDA workloads. By leveraging Google Cloud, AMD anticipates being able to run more designs in parallel, giving the team more flexibility to manage short-term compute demands, without reducing allocation on long-term projects.

GIGABYTE Technology announced a total of four products under its gaming-focused AORUS brand, including a trio of AORUS high-end Z690 motherboards and the AORUS FO48U large-sized gaming monitor, which have been awarded the prestigious iF Design Award 2022 for their excellence in product design.

The awarded Z690 AORUS XTREME WATERFORCE, Z690 AORUS XTREME, and Z690 AORUS MASTER are the top-of-the-line motherboards engineered to perfectly support the Intel 12th-gen processors. These three motherboards impress the performance-driven enthusiasts with GIGABYTE's state-of-the-art cooling solutions and class-leading power deliveries. Combined with the exclusive DDR5 memory overclocking function, these AORUS Z690 can fully unleash the gaming prowess of the new-gen processors, putting together a powerful and durable platform for those who seek nothing but the extreme performance from their desktop PCs.

Designing Artificial Intelligence / Machine Learning hardware accelerators takes effort from hardware engineers in conjunction with scientists working in the AI/ML area itself. A few years ago, we started seeing AI incorporated into parts of electronic design automation (EDA) software tools, helping chip designers speed up the process of creating hardware. What we were "used to" seeing AI do are just a couple of things like placement and routing. And having that automated is a huge deal. However, it looks like the power of AI for chip design is not going to stop there. Researchers at Google and UC Berkeley have made a research project that helps AI design and develop AI-tailored accelerators smaller and faster than anything humans made.

In the published paper, researchers present PRIME - a framework that created AI processors based on a database of blueprints. The PRIME framework feeds off an offline database containing accelerator designs and their corresponding performance metrics (e.g., latency, power, etc.) to design next-generation hardware accelerators. According to Google, PRIME can do so without further hardware simulation and has processors ready for use. As per the paper, PRIME improves performance upon state-of-the-art simulation-driven methods by as much as 1.2x-1.5x. It also reduces the required total simulation time by 93% and 99%, respectively. The framework is also capable of architecting accelerators for unseen applications.

Apple yesterday announced its M1 Ultra processor. It is designed to be one of the most powerful solutions ever envisioned for desktop users, and it leverages some of the already existing technologies. Essentially, the M1 Ultra chip combines two monolithic dies containing M1 Max designs. They are stitched together to create one massive chip behaving in a rather exciting way. To pair the two M1 Max dies together, Apple has designed a package called UltraFusion, which is a die-to-die interposer with more than 10,000 signals. It provides 2.5 TB/s low latency inter-processor bandwidth and enables seamless sharing of information across two dies.

What is more interesting is that this approach, called multi-chip module (MCM) design philosophy, allows the software to view these two dies as a single, unified processor. Memory is shared across a vast pool of processor cache and system memory in a single package. This approach is software agnostic and allows hardware to function efficiently with loads of bandwidth. Apple notes that no additional developer optimization is required for the new processor, and the already-existing stack of applications for M1 Max works out-of-the-box. Talking about numbers, the M1 Ultra chip has a potential main memory bandwidth of 800 GB/s, with up to 128 GB of unified system memory. We are yet to see how this design behaves as the first Mac Studio units start shipping, so we have to wait for more tests to check these claims out.

Ansys announced it is collaborating with GF to deliver innovative, unique, and feature-rich solutions to solve some of the biggest challenges facing data centers today. With data being generated at a record pace, causing a surge of power consumption in data centers globally, there is an ever-increasing need for innovative solutions to accelerate data transmission while optimizing energy efficiency. To meet such rising demands, GF is focused on developing groundbreaking semiconductor solutions that leverage the potential of photons—instead of electrons—to transfer and move data, maintaining GF's position as a leader in the rapidly growing optical networking space.

GF Fotonix is GF's next generation, widely disruptive, monolithic platform. GF Fotonix is the first in the industry to combine its differentiated 300 mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale. "Our engagement with Ansys is another example of how GF is partnering with the ecosystem leaders to deliver innovative, time to market solutions for our customers," said Mike Cadigan, senior vice president for Customer Design Enablement, GF. "By coupling GF Fotonix with Ansys' industry-leading simulation solutions, we are reaching new levels in photonic chip design. With support for Verilog-A simulation and process-enabled custom design, designers have greater modeling capabilities to meet their performance, power, and density requirements."

Ansys today announced its inaugural partnership to IFS Accelerator - EDA Alliance to provide best-in-class EDA tools and simulation solutions that will support customer innovation, including bespoke silicon for customizable three-dimensional integrated circuit (3D-IC) designs. By leveraging Ansys' market-leading multiphysics solutions, IFS Accelerator will make silicon technology available to customers to design uniquely innovative chips. Ansys' cutting-edge EDA and simulation tools will enable mutual customers to reduce design barriers, minimize design risk and cost, and accelerate time-to-market.

The IFS Accelerator will foster collaborative innovation with world-leading EDA, design services and IP partners to provide a comprehensive design ecosystem with premium process technologies, advanced packaging technologies, and manufacturing capabilities. "We are excited to announce the IFS Accelerator - EDA Alliance as a major step forward for Intel's foundry ambitions," said Rahul Goyal, VP and GM of Intel Product & Design Ecosystem Enablement. "Together with Ansys and other partners, this alliance will create advanced flows and methodologies, and accelerate productivity by combining our knowledge, resources, and shared passion to drive electronic design."

Phanteks announced the launch of the new Eclipse P600s and Evolv X Matte White Edition along with the Gen4 PCI-e Riser Cables. Its stunning all-new matte white look makes the Evolv X and Eclipse P600s a perfect combination for color-themed builds while maintaining a wide range of flexibility and premium materials.

Evolv X & Eclipse P600S Matte White Edition
The Evolv X and Eclipse P600s are mid-tower cases that offer dual system capabilities, massive storage, and extensive water-cooling support. The Evolv X features a 3 mm aluminium exterior with hinged clear tempered glass, improved airflow, smart spacing, and additional mesh elements. The P600s, a hybrid forged between silent and high-performance chassis. Designed with an effective soundproofing panel and Phanteks' new high-airflow fabric, the Eclipse P600s offers the full potential of two opposites, minimum noise, and maximum airflow. Whether it's a high-end water-cooling build, professional data storage system, or even a dual-system PC, both cases can accommodate your desired configuration thanks to the effective interior design that utilizes the space efficiently.

Phanteks debuts a host of new products for the upcoming year at CES 2022 - The brand new Evolv Shift XT Mini-ITX Chassis and Revolt SFX Power Supplies, Matte White Editions for the Evolv X & Eclipse P600S Chassis, white SK PWM D-RGB Fans, white AMP Power Supply and a complete range of Gen4 PCIe Riser Cables and Gen4 Vertical GPU Bracket.

Brand new and unique Evolv Shift XT Mini-ITX Chassis and super compact Revolt SFX Power Supplies
Evolv Shift XT - Compact, Powerful, Futureproof
The Evolv Shift XT brings a unique small form factor that can extend in size to tailor to your cooling performance needs. The Evolv Shift XT has no compromise on performance with support for powerful hardware, whether in Compact, Aircooled, or Liquid Cooled Mode.

The semicondustor market in 3Q21 is red hot with total revenue of the global top 10 IC design (fabless) companies reaching US$33.7 billion or 45% growth YoY, according to TrendForce's latest investigations. In addition to the Taiwanese companies MediaTek, Novatek, and Realtek already on the list, Himax comes in at number ten, bringing the total number of Taiwanese companies on the top 10 list to 4.

Qualcomm has been buoyed by continuing robust demand for 5G mobile phones form major mobile phone manufacturers with further revenue growth from its processor and radio frequency front end (RFFE) departments. Qualcomm's IoT department benefited from strong demand in the consumer electronics, edge networking, and industrial sectors, posting revenue growth of 66% YoY, highest among Qualcomm departments. In turn, this drove Qualcomm's total 3Q21 revenue to US$7.7 billion, 56% growth YoY, and ranking first in the world.

ASUS Republic of Gamers (ROG) today announced an all-new gaming peripherals lineup that channels the minimalist feel of monochrome through a striking Moonlight White color scheme. The ROG Strix Scope NX TKL 80%, tenkeyless mechanical RGB gaming keyboard, ROG Strix Impact II ambidextrous gaming mouse, ROG Strix Go Core gaming headset and ROG Cetra II Core in-ear gaming headphones are all now available in North America in this stunning colorway.

ROG has a long history of weaving Aura Sync into a huge ecosystem of devices to let gamers shine a light on their personalities through their gear - but many players also seek a minimalist look. That's why the ROG color palette is expanding to include the Moonlight White series, providing a commanding counterpart to the signature red-and-black color scheme.

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese companies put up remarkable performances during this period, with both MediaTek and Novatek posting YoY growths of more than 95%. AMD, on the other hand, experienced a nearly 100% YoY revenue growth, the highest among the top 10.

TrendForce indicates that the ranking of the top five companies for 2Q21 remained unchanged from the previous quarter, although there were major changes in the 6th to 10th spots. More specifically, after finalizing its acquisition of Inphi, Marvell experienced a major revenue growth and leapfrogged Xilinx and Realtek in the rankings from 9th place in 1Q21 to 7th place in 2Q21.

IBM (NYSE: IBM) today announced the new IBM Power E1080 server, the first in a new family of servers based on the new IBM Power10 processor, designed specifically for hybrid cloud environments. The IBM Power10-equipped E1080 server is engineered to be one of the most secured server platforms and is designed to help clients operate a secured, frictionless hybrid cloud experience across their entire IT infrastructure.

The IBM Power E1080 server is launching at a critical time for IT. As organizations around the world continue to adapt to unpredictable changes in consumer behaviors and needs, they need a platform that can deliver their applications and insights securely where and when they need them. The IBM Institute of Business Value's 2021 CEO Study found that, of the 3,000 CEOs surveyed, 56% emphasized the need to enhance operational agility and flexibility when asked what they'll most aggressively pursue over the next two to three years.

Qualcomm Technologies International, Ltd. today continued to demonstrate its vision and leadership in the wireless audio space with the introduction of Qualcomm aptX Lossless audio technology to its already extensive audio portfolio. aptX Lossless is a new capability of the proven aptX Adaptive technology and a new feature of Snapdragon Sound Technology that is designed to deliver CD quality 16-bit 44.1kHz lossless audio quality over Bluetooth wireless technology. Qualcomm Technologies has taken a systems level approach and optimized a number of core wireless connectivity and audio technologies, including aptX Adaptive, which work together to auto detect and scale-up and are designed to deliver CD lossless audio when a user is listening to a lossless music file and the RF conditions are suitable.

"At Qualcomm Technologies we're excited about the future of sound, and we're continually looking for ways to help our customers deliver new and exciting listening experiences. Lossless audio means mathematically bit-for-bit exact, with no loss of the audio file and up to now the necessary bit rate to deliver this over Bluetooth has not been available. With many leading music streaming services now offering extensive lossless music libraries, and consumer demand for lossless audio growing, we're pleased to announce this new support for CD lossless audio streaming for Bluetooth earbuds and headsets which we plan to make available to customers later this year," said James Chapman, vice president and general manager, Qualcomm Technologies International, Ltd.

Tachyum Inc. today announced that it has successfully executed the Linux boot process on the field-programmable gate array (FPGA) prototype of its Prodigy Universal Processor, in 2 months after taking delivery of the IO motherboard from manufacturing. This achievement proves the stability of the Prodigy emulation system and allows the company to move forward with additional testing before advancing to tape out.

Tachyum engineers were able to perform the Linux boot, execute a short user-mode program and shutdown the system on the fully functional FPGA emulation system. Not only does this successful test prove that the basic processor is stable, but interrupts, exceptions, timing, and system-mode transitions are, as well. This is a key milestone, which dramatically reduces risk, as booting and running large and complex pieces of software like Linux reliably on the Tachyum FPGA processor prototype shows that verification and hardware stability are past the most difficult turning point, and it is now obvious that verification and testing should successfully complete in the coming months. Designers are now shifting their attention to debug and verification processes, running hundreds of trillions of test cycles over the next few months, and running large scale user mode applications with compatibility testing to get the processor to production quality.

MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.

Designed for powerful 5G smartphones, the Dimensity 920 balances performance, power and cost to provide an incredible mobile experience. Built using the 6nm high-performance manufacturing node, it supports intelligent displays and hardware-based 4K HDR video capture, while also offering a 9% boost in gaming performance compared to its predecessor, the Dimensity 900.

ATP Electronics, a global leader in specialized storage and memory solutions, has announced that its A600Sc Series serial ATA solid state drives (SATA SSDs) have been successfully qualified for compatibility and interoperability with Adaptec Smart Storage PCIe Gen 4 Tri-Mode SmartRAID 3200, SmartHBA 2200, and HBA 1200 Smart Storage adapters.

Designed for storage platforms in next-generation data centers, the Adaptec PCIe Gen 4 SAS/SATA/NVMe HBA and RAID tri-mode adapters deliver significantly higher performance through PCIe Gen 4 x16 CPU interfaces as well as SAS and SATA storage. The new offerings simplify integration and provide flexibility to aggregate diverse storage devices with Microchip's proven security and manageability features for the most demanding server storage applications.

A recent Google study led by Mirhoseini et al. and published in Nature details how AI can be leveraged to improve upon semiconductor design practices currently employed - and which are the result of more than 60 years of engineering and physics studies. The paper describes a trained machine-learning 'agent' that can successfully place macro blocks, one by one, into a chip layout. This agent has a brain-inspired architecture known as a deep neural network, and is trained using a paradigm called reinforcement learning - where positive changes to a design are committed to memory as possible solutions, while negative changes are discarded, effectively allowing the neural network to build a decision-tree of sorts that's optimized every step of the way.

The AI isn't applied to every stage of microchip design as of yet, but that will surely change in years to come. For now, the AI is only being employed in the chip floorplanning stage of microchip production, which is actually one of the more painstaking ones. Essentially, microchip designers have to place macro blocks on their semiconductor designs - pre-made arrangements of transistors whose placement relative to one another and to the rest of the chips' components are of seminal importance for performance and efficiency targets. Remember that electric signals have to traverse different chip components to achieve a working semiconductor, and the way these are arranged in the floorplanning stage can have tremendous impact on performance characteristics of a given chip. Image A, below, showcases the tidy design a human engineer would favor - while image B showcases the apparently chaotic nature of the AI's planning.

AMD is preparing to switch things up a bit with its upcoming AM5 platform. The new platform is said to bring significant changes to the design of the socket and the CPU package, where we will see some new design choices and decisions. For starters, all of the processors made for the AM5 platform will come in a land grid array (LGA) configuration, very similar to that of Intel. Thanks to the rendering of ExecutableFix, we got to see exactly how will the new LGA design look like. And today, we get to see more details of the AMD's upcoming Raphael processor's integrated heat spreader (IHS) design.

The IHS serves the purpose of spreading the heat away from the die and dissipating it efficiently. However, IHS designs can sometimes be very interesting. According to this rendering from ExecutableFix, AMD's upcoming Raphael design, based on Zen 4 core, will feature a unique IHS design, which can be seen below.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the latest B560MX-E PRO and B560MH-E PRO motherboards. Designed to support Intel's 10th/11th Generation Intel Core Processors and professional graphics cards, the new B560 series motherboards are highly versatile. Powered by Intel's B560 chipset, these two new motherboards are efficient and robust in any use case.

PCI-e 4.0 and PCIe M.2 4.0 & M.2 Cooling, among other cutting-edge technology, adds up to a great platform, tailor-made for business or even casual use. The two new motherboards support up to 128 GB of DDR4 memory across 4 DIMM with an overclocking capability of up to 4000+(OC)MHz. Backed by BIOSTAR's proprietary Digital PWM technology, the new B560MX-E PRO, and B560MH-E PRO motherboards are safe and long-lasting, capable of supporting the best hardware with ease. Both motherboards pack all the essentials in their rear I/O panel with almost identical layouts on a Micro-ATX form factor.