AMD's most affordable AM5 processor, the Ryzen 5 7400F, has emerged in Chinese retail channels priced at 849 RMB (approximately $116 with taxes). The pricing suggests the processor could retail for around $100 in other markets before local taxes. The newest silently announced CPU features 6 cores and 12 threads, joining AMD's existing Zen 4 processor lineup. Operating at a base clock of 3.7 GHz with boost capabilities up to 4.7 GHz, the chip maintains the same 32 MB L3 cache as its predecessors while running at a 65 W TDP. Unlike the previous Ryzen 5 7500F, which was limited to system builders and OEMs, the 7400F will be sold directly to consumers through regular retail channels. The processor includes a basic AMD Wraith Stealth cooler in its retail package.

The chip supports standard features found across the AM5 platform, including memory overclocking through AMD EXPO and CPU performance tuning via Precision Boost Overdrive. Like other Ryzen processors, it maintains unlocked multipliers for manual overclocking. The 7400F's appearance follows AMD's recent pattern of quiet releases, similar to the Ryzen 5 9600 that appeared during CES 2025. No official announcement preceded the processor's retail availability. Early listings show the processor available through several Chinese retailers, though availability in other regions remains unclear. The competitive price point could make AMD's AM5 platform more accessible to users building on tighter budgets, though potential buyers will still need to factor in the cost of DDR5 memory and AM5 motherboards required by the platform.

AMD is rumored to be building its next-generation CCD (core complex die) that implements the "Zen 6" microarchitecture, on the 3 nm TSMC N3E foundry node. This is part of a set of rumors from ChipHell forum, which got past rumors on AMD right. Apparently, AMD will also refresh the I/O dies for its next generation process, building them on the 4 nm foundry node, likely the TSMC N4C. The TSMC N3E node offers a 20% speed improvement, over 30% power savings, and approximately 60% logic density increase over TSMC N5, whereas the TSMC N4P node that the company uses for its current "Zen 5" chiplets only clock minor increases in logic density and power over N5. The N3E node relies on EUV double-patterning to achieve its logic density increases.

Perhaps the most interesting piece of news is the new-generation I/O dies. AMD is building these on the 4 nm node, which is a significant step up from the 6 nm node its current I/O dies are built on. On the client side of things, 4 nm will enable AMD to give the new cIOD an updated iGPU, probably based on a newer graphics architecture, such as RDNA 3.5. It will also give AMD the opportunity to integrate an NPU. The company might also update its key I/O components, such as the DDR5 memory controllers, to support higher memory speeds unlocked by CUDIMMs. We don't predict any updates on the PCIe front, since AMD is expected to carry on with Socket AM5, which determines that the cIOD puts out 28 PCIe Gen 5 lanes. At best, the USB interface put out from the processor could be updated to USB4 through an on-die host controller. Over on the server side, the new-generation sIOD will bring much needed increases to the DDR5 memory speeds enabled by clock drivers.

Alphacool presents the Apex 1, the first CPU water cooler in the Apex series. It combines maximum cooling performance, exceptional design, and a high-quality selection of materials. The Apex 1 integrates the proven cross-slot technology with the new 3D-Jetplate 2.0, ensuring optimal cooling performance for both AMD and Intel processors of the latest generation. A pre-chamber in front of the 3D-Jetplate 2.0 smooths the incoming water flow and evenly distributes it across the Jetplate and the copper base's cooling fins. Both the copper base and the brass connector part are precisely CNC-machined to guarantee top-notch manufacturing quality.

Alphacool offers two versions of the cooler. The AMD AM5 version features an offset cooler base, which does not sit centrally on the CPU. Instead, it is positioned to direct the water injection right above the CPU hotspot. The Intel version has a centrally positioned cooler base that covers the entire CPU. Both versions ensure outstanding cooling performance. The cooler's design is made to fully cover the CPU socket and mounting holes. This does not affect the installation, which remains incredibly simple. Additionally, the coolers come equipped with aRGB lighting, positioned both on the top and on the side towards the RAM, perfectly complementing the design.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing the release of low latency DDR5-6400 CL30-39-39-102 memory specification in high-capacity kit configurations, up to 96 GB (2x 48 GB) kit capacity. This high performance memory kit specification will be available under the Trident Z5 RGB and Trident Z5 Royal series, with Intel XMP 3.0 memory overclock profile support.

The G.SKILL DDR5-6400 CL30 memory kit at 96 GB (2x 48 GB) combines high-capacity and low-latency to enable higher performance for memory intensive platforms and uses. The screenshot below shows this 96 GB (2x 48 GB) memory kit operating at DDR5-6400 CL30-39-39-102 with the ASUS ROG Maximus Z890 Hero motherboard and Intel Core Ultra 7 265K desktop processor.

While the Ryzen 5 7500F was the least expensive Raphael AM5 Zen 4 CPU that you could find, AMD has now silently launched the Ryzen 5 7400F, a new 6-core/12-thread SKU. Similar to the Ryzen 5 9600 (non-X) that was silently introduced during CES 2025, the Ryzen 5 7400F was not officially announced, but rather just showed up on AMD's product pages. Unlike the Ryzen 5 7500F, which was available only to OEMs and system integrators (SIs), the Ryzen 5 7400F will apparently be available in retail/e-tail as well.

As said, the Ryzen 5 7400F is a Raphael architecture CPU with Zen 4 CPU cores and fits into an AM5 socket. It is a 6-core CPU with support for AMD Simultaneous Multithreading (SMT), so it packs 12-threads and has the same 32 MB of L3 cache. The base clock is set at 3.7 GHz, with a maximum boost clock of 4.7 GHz. The TDP is still at 65 W. As with the rest of the lineup, it is an unlocked CPU, so overclocking is possible, and it supports AMD EXPO Memory Overclocking technology, as well as Precision Boost Overdrive. In the boxed version, it comes with an AMD Wraith Stealth cooler.

IceGiant at the 2025 International CES showed us their ProSiphon TITAN series CPU coolers for workstations and gaming desktops. These are closed loop liquid CPU coolers based on the ProSiphon technology IceGiant innovated. It works on the fluid siphon technology, where a thermal gradient in the loop drives coolant instead of a pump. Heat dissipates more efficiently to the coolant, and there's no crackling noise from the pump. The only downside to this are that the siphon tubes are rigid and you have to plan your build well.

There were two models on display. The TITAN-TR 360 is designed for AMD Socket SP5 or sTR5, which seats Ryzen Threadripper 7000 series workstation processors, which is a testament to the technology. Some of the processor models in the Threadripper WX7000 series come with TDP as high as 350 W. The other cooler shown is the ProSiphon TITAN 360, which is designed for mainstream desktop CPU socket types, such as AM5 and LGA1851. The cooler can tame high-power flagship chips from Intel and AMD, such as the top-spec Ryzen 9 9000X3D series with their 170 W TDP and 230 W PPT, or the Core Ultra 9 285K with its 125 W base- and 250 W maximum turbo power. IceGiant is backing the coolers with lifetime warranty, although the included fans come with 6-year warranties. The company says that the cooler will outlast the fan, unlike in the case of pump-based CLCs that give in to pump wear and structural degradation over time.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

be quiet! had plenty to show at their CES 2025 suite—TechPowerUp staffers took a look at a wide range of already announced power supplies and CPU coolers. The German hardware brand is making sure that its power supply product ranges are prepared—compatibility-wise—for the incoming NVIDIA GeForce RTX 5000 and AMD Radeon RX 9000 graphics card lineups. The Dark Power 13 PSU family was represented by the hefty 1600 W Pro model and relatively svelte non-Pro 1000 W option. be quiet! representatives re-confirmed that the whole Dark Power range (750 W - 1600 W) is ready for the new generation of GPUs.

TechPowerUp also spotted two Straight Power 12 models—the larger one being a range-topping 1500 W unit. The smaller demo model seemed to be the 1000 W variant—both are comfortably in the next-gen compatibility safe zone, but this also applies all the way down to be quiet!'s Straight Power 12 750 W model. A lone Pure Power 12 M 1000 W demonstration sample sat in between its Dark and Straight compadres. be quiet! stated that the Pure Power 12 M range is next-gen ready, going from the lowly 550 W all the way up to 1200 W.

ADATA tends to save the year's biggest product launches for Computex, but brought a fairly big selection of its latest case, power, and cooling products to the 2025 International CES. Let's begin with power, and the company showed us its new super-compact XPG Pymcore Platinum PSUs. These may look like SFX-L PSUs, but are actually ATX, with a very low depth, and yet full modular cabling. The 120 mm fan cooling the thing is pushed to the very edges of the fan intake. These PSUs meet ATX 3.1 and PCIe 5.1 CEM standards, in fact exceeding them with 235% excursions for 100 µs. As the name suggests, this PSU offers 80 Plus Platinum switching efficiency.

The XPG Starfighter case is one of ADATA's first cases built on the Exoskeleton design language, where the outer body of the case is what provides structural support for the case, rather than an inner chassis. The cuboidal case features a chimney design, where air is drawn at the base, and vented from the top, with all the hot components along the way, and the graphics card installed along its height. At the top is a large 160 mm fan that pulls air. The case supports a Mini-ITX motherboard, and an SFX power supply. ADATA says that the case should support the NVIDIA GeForce RTX 5090. The demo build at ADATA's booth featured a Palit RTX 4080 SUPER GamingPro, which is a fairly large card.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

AMD today expanded its Ryzen 9000X3D line of Socket AM5 desktop processors that combine the "Zen 5" microarchitecture with 3D V-Cache technology, with the introduction of two high core-count models, the Ryzen 9 9950X3D and the Ryzen 9 9900X3D. The 9950X3D is a 16-core/32-thread chip, while the 9900X3D is 12-core/24-thread. These are dual-CCD processors, and much like the Ryzen 9 7000X3D, the 3D V-Cache is only present on one of the two CCDs, while the other is a regular CCD with just the 32 MB on-die L3 cache. There is one key difference, though. Since AMD has redesigned 3D V-Cache for "Zen 5" to be below the CCD and not above, the CCD with it has the same clock speed boosting characteristics as the CCD without 3D V-Cache; and AMD has worked to refine its software-based OS scheduler optimization such that productivity applications favor either of the CCDs, while games stick to the one with 3D V-Cache.

The Ryzen 9 9950X3D comes with a base frequency of 4.30 GHz, and boosts up to 5.70 GHz, with a 170 W TDP. This is much higher than the 5.20 GHz maximum boost frequency of the Ryzen 7 9800X3D, which makes the 9950X3D the company's fastest gaming desktop processor. The Ryzen 9 9900X3D is similarly interesting—you get a base frequency of 4.40 GHz, and 5.50 GHz maximum boost frequency, which is higher than that of the 9800X3D, although the CCD with the 3D V-Cache only has 6 cores. The 9950X3D should hence end up beating the 9800X3D in gaming workloads, while the 9900X3D should be either on par or slightly slower than the 9800X3D at gaming, although faster than any chip from the non-X3D Ryzen 9000 series.

ASUS today announced the B850 and B840 series of AM5 motherboards for AMD processors, which includes models from the ROG Strix, TUF Gaming and Prime families. These motherboards give builders higher speeds, more ports and more slots for USB devices and M.2 SSDs. Many ASUS B850 motherboards also break into the next generation of wireless networking with WiFi 7 support, and also provide robust support for fast DDR5 kits. In addition, each model makes the PC building process easier than ever with tool-free M.2 SSD installation, easy troubleshooting and hassle-free installation and removal of graphics cards.

Meanwhile, B840 motherboards are designed to serve the needs of builders who do not intend to overclock their CPUs or install a PCIe 5.0 M.2 SSD or graphics card. For anyone looking to build a very affordable and efficient PC—perhaps one centered around a CPU with powerful integrated graphics capabilities—ASUS B840 motherboards are a cost-effective choice. The first ASUS B840 motherboards all hail from the tried-and-true Prime family.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

Earlier today, ASUS uploaded a first sneak peek of several upcoming AMD AM5 motherboards—which we assume will feature the B850 and B840 chipsets—which according to the post on Facebook, will be launching within a couple of weeks. The boards will most likely be on display at CES, which kicks off on the 7th of January. The picture is obfuscated for obvious reasons, but what is clear is that there will be several different SKUs from all of ASUS' typical sub-brands such as TUF Gaming and ROG.

What we can also make out is that there will be at least one Mini-ITX board and one micro-ATX board, with the latter being the TUF Gaming branded board. We tried to clean up the picture a bit, but ASUS has managed to hide all details of possible models names and most of the text is kind of hard to make out. Nothing really sticks out in terms of features, although it's clear we'll end up seeing some higher-end B850 boards, judging by the fact that there are at least three ROG Strix SKUs coming. The question is if there's a market for these boards, considering the B850 chipset is pretty much the same as the B650E chipset, but with optional PCIe 5.0 support for the M.2 slots and no USB4, unlike its X870 counterpart.

Update Jan 1st: ASUS posted a picture of their upcoming mid-range Intel boards on Facebook as well, but as with the AMD boards, ASUS obfuscated the image, although not quite as badly this time around. For its Intel lineup, there's also a lower-end Prime board included, in addition to the TUF Gaming and ROG Strix boards. ASUS didn't reveal any launch window for the Intel boards.

Recent engineering samples of AMD's upcoming Ryzen 9 9950X3D reveal what appear to be the finalized specifications of the top-tier AM5 chip. The 16-core, 32-thread processor builds upon the gaming success of the Ryzen 7 9800X3D while addressing its core count limitations. The flagship processor features AMD's refined cache design, combining 96 MB of 3D V-Cache with 32 MB of standard L3 cache. Unlike its predecessor, the 7950X3D, the new Zen 5 architecture incorporates a redesigned CCD stacking method. The CCD now sits above the cache, directly interfacing with the STIM and IHS, eliminating thermal constraints that previously required frequency limitations. The processor features asymmetric cache distribution across its dual CCDs—one die combines 32 MB of base L3 cache with a 64 MB stacked V-Cache layer, while its companion die utilizes a standard 32 MB L3 cache configuration. In total, there is a 128 MB of L3 cache, with 16 MB of L2.

This architectural advancement enables the 9950X3D to achieve a 5.65 GHz boost clock across both CCDs, matching non-X3D variants. The processor maintains a 170 W TDP, suggesting improved thermal efficiency despite the additional cache. AMD's software-based OS scheduler will continue to optimize gaming workloads by directing them to the CCD with 3D V-Cache. Early leaks indicate the 9950X3D matches the base 9950X in Cinebench R23 scores, both in single and multi-threaded tests—a significant improvement over the 7950X3D, which lagged behind its non-X3D counterpart due to frequency limitations. AMD plans to expand the Zen 5 X3D lineup in Q1-2025 with both the 9950X3D and 9900X3D models. Full performance benchmarks and pricing details are expected at CES 2025, where AMD will officially unveil these processors alongside their RDNA 4 GPUs.

Here are some of the first pictures of ASRock's upcoming Live Mixer series motherboards based on mid-range chipsets from AMD and Intel. The Live Mixer brand of motherboards has a similar positioning in ASRock's product stack as Steel Legend, but with a variation in product design, and a mid-range onboard audio solution that uses audio codecs such as the ALC1200 or ALC4080. There's nothing that particularly stands out in this audio solution (no fancy amp circuits or exotic I/O). The B850 Live Mixer Wi-Fi is an ATX board based on the AMD B850 chipset. This is essentially a re-brand of the popular B650, but with out-of-the-box support for the latest Ryzen 9000 series processors, including the 9000X3D series. The board offers three M.2 NVMe slots, one of which is Gen 5, and the others Gen 4. The WLAN solution is very likely Wi-Fi 6E.

Next up, is the ASRock B860 Live Mixer Wi-Fi. This Socket LGA1851 motherboard is based on Intel's mid-range chipset for its "Arrow Lake" processors, the Intel B860. Much like the previous generation B760, it is expected to lack CPU overclocking support. This board visually looks a lot similar to its AMD B850-based sibling, you could almost confuse the two if you're not looking at the CPU socket. You get three M.2 NVMe slots here, too; one of which is Gen 5, and doesn't eat into the x16 PEG slot. We expect this board to offer Wi-Fi 6E, just like the B850 Live Mixer Wi-Fi. Lastly, there's the B860M Live Mixer Wi-Fi, a Micro-ATX variant of this board, with mostly the same feature-set, it's just that the third M.2 slot is without a heatsink; and the second PCIe slot is physically x8 instead of x16, which shouldn't matter since the slot is likely electrical x4 on both motherboard models. Intel and AMD are expected to debut the B850 and B860 in January.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

Minisforum is an easily recognizable brand that is well-regarded for its lineup of mini PCs. The MS-A1 is one such mid-range offering that boasts an AM5 socket, and the product is now available to configure with the 16-core Ryzen 9 9950X with a 100 W TDP, which happens to be an absolute monstrosity of a desktop CPU with hefty cooling requirements.

The system was already available with a Ryzen 7 8700G, which was most likely performant enough for most people. The MS-A1 does not feature dedicated graphics, which is why the Ryzen 7 8700G was a great choice thanks to its relatively potent iGPU. However, it is no surprise that there are many workloads that demand raw CPU power over anything else, and the MS-A1 with the Ryzen 9 9950X will be an excellent option for such demanding scenarios. That said, since the system does not feature discrete graphics, the Radeon 610M iGPU found in the 9950X will simply not be able to keep up with any GPU-intensive workloads.

JONSBO today introduced the TH line of all-in-one liquid CPU coolers. These feature conventional cylindrical pump-blocks capped with an LED 7-segment display that puts out CPU temperature, framed by an ARGB diffuser. The highlight with these coolers are their included compound fans. A compound fan is a single frame with multiple impellers (fanlets), which reduces the cable clutter that comes with having multiple individual fans. It takes in a single cable for the 4-pin PWM and 3-pin ARGB connections. The sides of the frame and the impeller hubs feature ARGB diffusers.

There are four models in the JONSBO TH-series depending on the color and radiator size—the TH-240 Black, the TH-360 Black, the TH-240 White, and the TH-360 White. Each 120 mm fanlet in the compound fan turns at speeds ranging between 700 and 2,400 RPM, pushing between 21.46 and 62.40 CFM of airflow; at between 21.3 and 37.3 dBA of noise output. The company didn't put out static pressure numbers. Among the CPU socket types supported are LGA1851, AM5, LGA1700, and AM4. The company didn't reveal pricing.

AMD has emerged as the clear winner in this year's Black Friday motherboard sales, securing an impressive 87.36% of unit sales and 86.5% of revenue share. Thanks to the nicely compiled data from TechEpiphany, we see that German retailer Mindfactory sold 3,800 AMD-socketed motherboard units compared to Intel's 550 units during the shopping event. The success story is particularly evident in AMD's newest AM5 socket platform, which accounted for 2,730 units sold, representing nearly 72% of AMD's total sales. This strong adoption rate of the AM5 platform suggests consumers are increasingly investing in AMD's latest technology despite the typically higher platform costs associated with newer generations. The older AM4 socket maintained a relevant market presence, with 1,070 units sold.

Meanwhile, Intel's sales were primarily driven by their LGA 1700 socket, which moved 490 units, with minimal movement in their newer LGA 1851 and older LGA 1200 platforms, selling just 40 and 20 units, respectively. The average selling price (ASP) comparison reveals an interesting dynamic, with Intel commanding a slightly higher ASP at $183 compared to AMD's $170. However, AMD's substantially higher sales volume resulted in a total revenue of $644,584 (about 86.5%), dwarfing Intel's revenue of $100,564 (13.5%). This sales distribution reflects AMD's successful strategy of offering competitive performance across various price points while maintaining strong platform compatibility and future support. The overwhelming preference for AMD's AM5 platform also indicates consumer confidence in the company's future upgrade path and platform longevity, which AMD also delivered with AM4.

Chinese OEM brand Erying presented its first AMD-based motherboard, the Alkiad B650 ITX D5. The overall design of the Erying Alkiad B650 ITX D5 sports a white PCB with black components and is equipped with an EPS 8-pin power connector alongside a 24-pin ATX connector. 5 V ARGB connectors are included for those who cannot live without a colorful build. The VRM is based on an 8+2+1 phase power delivery design and covered by a decent heatsink, more than enough for a budget AM5 65 W platform in a standard ITX 170 x 170 mm format.

The Alkiad B650 ITX D5 motherboard has 2 DDR5 DIMM memory slots, supports 6400+ (OC) MT/s, and Intel XMP 3.0 / AMD EXPO profiles. The Erying motherboard offers 1x PCIe 4.0 ×16 and 1x PCIe 4.0 ×4 M.2 slots, and 4x SATA III ports while the Realtek RTL8125BG provides 1x 2.5GbE RJ45 connectivity. The rear I/O panel offers 4x USB 2.0, 3x USB-A 5 Gbps and 1x USB-C 10 Gbps ports, 1x DP and 1x HDMI connectors and the usual audio combo (one S/PDIF and a pair of 3.5 mm). The motherboard comes before AMD's expected expansion of its Ryzen 9000 series "Granite Ridge" desktop processor family in Q1 2025 with new 65 W CPU models and the introduction of the AMD B850 chipset. There is no exact information yet regarding pricing and availability.

The desktop version of AMD's next-generation "Zen 6" microarchitecture will retain Socket AM5, Kepler_L2, a reliable source with hardware leaks, revealed. What's more interesting is the rumor that the current "Zen 5" will remain AMD's mainstay for the entirety of 2025, and possibly even most of 2026, at least for the desktop platform. AMD will be banking heavily on the recently announced Ryzen 7 9800X3D, and its high core-count siblings, the Ryzen 9 9950X3D and possible 9900X3D, to see the company through for 2025 against Intel. The 9800X3D posted significantly higher gaming performance than Intel, and the 9950X3D is expected to be at least faster than the 7950X3D at gaming, which means its gaming performance, coupled with multithreaded application performance from its 16-core/32-thread count should be the face of AMD's desktop processor lineup for at least the next year.

It wouldn't be off-character for AMD to launch "Zen 6" on AM5, and not refresh the platform. The company had launched three microarchitectures (Zen thru Zen 3) on Socket AM4. With "Zen 6," AMD has the opportunity to not just increase IPC, but also core-counts per CCD, cache sizes, a new foundry node such as 3 nm, and probably even introduce features such as hybrid architecture and an NPU to the desktop platform, which means it could at least update the current 6 nm client I/O die (cIOD) while retaining AM5. A new cIOD could give AMD the much-needed opportunity to update the DDR5 memory controllers to support higher memory frequencies. The Kepler_L2 leak predicts a "late-2026 or early-2027" launch for desktop "Zen 6" processors. In the meantime, Intel is expected to ramp "Arrow Lake-S" on Socket LGA1851, and debut the "Panther Lake" microarchitecture on LGA1851 in 2025-26.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, announced today that its AM5 series motherboards are fully compatible with the AMD Ryzen 7 9800X3D processor, maximizing its impressive gaming performance. This allows PC enthusiasts worldwide to be among the first to experience the exceptional capabilities brought by the AMD Ryzen 7 9800X3D processor. The AMD Ryzen 7 9800X3D is the first model released in the 9000X3D processor series. ASRock AM5 motherboards will continue to receive updates to ensure seamless compatibility with upcoming Ryzen 9000 Series X3D processors, delivering outstanding performance for gaming enthusiasts.

Users can download and install the latest AGESA 1.2.0.2a BIOS from the ASRock website or use the BIOS Flashback and Instant Flash features for an easy upgrade. ASRock recommends updating to the latest BIOS version promptly to ensure optimal system compatibility and performance.

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.