A small number of AMD Ryzen 7 9800X3D CPUs have had trouble starting up on some ASRock AM5 motherboards. The issue was first noticed in February 2025, and both AMD and ASRock immediately looked into the problem. The investigation found that the older BIOS versions on specific ASRock boards had memory compatibility problems. When a Ryzen 7 9800X3D was used, the computer could not complete its normal boot process, known as POST. ASRock quickly released a beta BIOS update to fix the memory issue, and after testing, a final version of the update was made available as of now. Users who update their BIOS should now see the problem disappear. In one case, a report suggested that a Ryzen 7 9800X3D had been damaged. However, further checks showed no burn marks on the motherboard. The issue was simply due to some debris, and after careful cleaning, the motherboard started normally and passed further tests.

AMD pointed out that many reasons can cause a computer to not start up properly, and a POST failure does not always mean the CPU is broken. They advise users to update their BIOS to the newest version available for their motherboard model. If the problem continues even after updating, users should reach out to customer support for help. In a few cases, if the problem cannot be fixed on the spot, the CPU might need to be replaced. This quick fix shows that AMD and ASRock work well together to solve problems. Even though only a few systems were affected, the issue was taken seriously and fixed fast. With the latest BIOS update, users can now expect their systems to boot without trouble, ensuring that the Ryzen 7 9800X3D offers good performance for everyday tasks and gaming.

Successors to AMD's current-generation lineup of Ryzen 8000G desktop APUs are reportedly in the pipeline—according to the latest HXL/9550pro predictive declaration, finalized units could arrive at retail later this year. They propose that an "AMD AM5 New APU" family could arrive alongside an unannounced MSI Unify-X enthusiast-grade motherboard design, within the final quarter of 2025. Press interpretations of this inside track information point to possible upcoming "Ryzen 9000G" processors, utilizing Team Red's Zen 5 and RDNA 3.5 technologies. This potent combination already exists, albeit in mobile form—namely within Team Red's stable of Ryzen AI "Strix Halo, Strix Point," and "Krackan Point" APUs.

Industry experts opine that AMD will most likely deploy high-end "Strix Point" silicon to desktop, or more fancifully: "Gorgon Point." The latter codename turned up via leaks last week. Around early 2024, we witnessed Team Red's transfer of "Phoenix"—from original mobile formats—to their AM5 desktop platform. TechPowerUp's W1zzard evaluated the Ryzen 5 8500G "Phoenix 2" APU last summer; this plucky budget-friendly model sports Zen 4 and Zen 4c cores. Theoretically a flagship "Ryzen 9000G" SKU could emerge with twelve processor cores (4x "Zen 5" + 8x "Zen 5c"), a Radeon 890M iGPU, and an XDNA 2 NPU.

ASUS has readied its first all-in-one water cooler with a built-in curved AMOLED screen called ROG RYUO IV SLC 360 ARGB. The upcoming ASUS ROG RYUO AIO cooler integrates a 6.67-inch 60 Hz AMOLED display for system monitoring, significantly larger than any commercial AIO cooler with a built-in display on the pump/water block combo. The cooler operates at 39.6 dB while its 120 mm fans deliver 71.4 CFM airflow at speeds between 500-2650 RPM through PWM/DC control. A copper water block connected to a 360 mm aluminium radiator forms the thermal transfer system, joined by 200 mm FEP sleeved tubing. Socket compatibility includes current-generation Intel LGA-1851/1700 and AMD AM4/AM5 platforms, with no support for legacy sockets.

The expanded display provides real-time data visualization during intensive computational workloads without requiring additional monitoring software. ASUS plans to release the cooler before the "618" Mid-Year Shopping Festival. While the initial product features a 360 mm radiator, smaller variants may follow for space-constrained builds. No pricing details have been announced. A similar solution to this is TRYX Panorama AIO, which features a 6.5-inch L-shaped 3D screen as well, but ASUS has outdone it with a 6.7-inch screen variant now. We are curious how this cooler will look in real life, and some photos are already available below.

Here are some of the first pictures of the ASUS ROG Crosshair X870E Extreme, the company's new flagship Socket AM5 motherboard. Until now, the company's AMD 800-series chipset motherboard lineup topped off with the ROG Crosshair X870E Hero for connectivity and the ROG Crosshair X870E Apex for overclocking chops, and the company is looking to push things up a notch, especially given that AMD's Ryzen 9000X3D series is established as the fastest processor series for gaming PC builds. This board is designed to compete with the likes of the MSI MEG X870E Godlike and the GIGABYTE X870E AORUS Xtreme. It is firmly into the E-ATX territory in terms of dimensions. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an 8-pin PCIe power. It uses the company's most powerful CPU VRM solution for the AMD platform, above even the 22-phase solution of the Hero.

The ASUS ROG Crosshair X870E Extreme comes with a large number of 4-pin PWM fan and water pump headers. Storage connectivity includes one M.2-22110 Gen 5 on the board with a chunky heat pipe-based cooler; a second Gen 5 and two Gen 4 slots on the board, and a DIMM.2 module that provides additional slots. The expansion slots provided are a PCI-Express 5.0 x16 and a second PCI-Express 4.0 x4 (physical x16). There are a boat-load of USB ports, including a couple of 40 Gbps USB4, 20 Gbps USB 3.2 Gen 2x2, and several 10 Gbps and 5 Gbps USB 3.2 ports. Networking interfaces include Wi-Fi 7, a 10 GbE, and a 5 GbE. The board features the company's most premium onboard audio solution that probably combines a Realtek ALC4082 with an ESS ES9219 DAC for the front channels, an audiophile-grade OPAMP, and premium capacitors. The board offers many of the exclusive overclocker-friendly features found in the company's ROG Maximus Extreme motherboards. A star-attraction is its 4-inch true-color display over the VRM heatsinks, which can be programmed to show anything. There is no word on availability or pricing.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, is proud to announce the global launch of the XPG LEVANTE II 360 AIO Liquid Cooler. This cutting-edge cooling solution is designed to set a new benchmark in thermal efficiency and aesthetic appeal, offering gamers and PC enthusiasts the ultimate performance upgrade.

At the heart of the LEVANTE II 360 there's an innovative high-performance dual-chamber pump that delivers exceptional thermal efficiency, handling up to 320W TDP, making it the ideal cooling solution for even the most demanding systems. Whether you're gaming, streaming, or creating, this cooler ensures your CPU stays incredibly cool and performs at its best under pressure.

Raijintek today introduced the Cyclops Lite line of all-in-one liquid CPU coolers. These come in black and white color trims, and in radiator size variants of 360 mm and 240 mm. These are characterized by a pump-block that features a propeller-like ornament that's illuminated by ARGB LEDs. You get two or three 120 mm fans depending on the variant, these come with easy daisy-chaining to minimize cable clutter around the radiator. The pump-block features a copper cold-plate, and a ceramic axis for the pump bearing, which is rated for 50,000 hours. The radiator channels are made of aluminium.

Each of the included Raijintek Ageras Xtreme 120 mm fan comes with hydraulic bearing, and takes in a 4-pin PWM connection for its main function. It turns at speeds ranging from 800 RPM to 2,200 RPM, pushing up to 67.38 CFM of airflow, at 2.57 mm H₂O static pressure, and a maximum noise output of 33 dBA. The fan bearing is rated for 40,000 hours. The proprietary daisy-chaining connection of these fans combine 4-pin PWM and 3-pin ARGB connections. Among the CPU socket types supported are AM5, AM4, LGA1851, LGA1700, and LGA1200/LGA115x. The company didn't release pricing information.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

Without making any official announcement, Colorful silently listed a new AMD B850 microATX (244 mm x 235 mm) motherboard on their Chinese website: the Battle-AX B850M-E Wi-Fi V14. The model is clearly oriented toward entry-level builds and users on a tight budget, a sharp contrast to the CVN B850I Gaming Frozen that Colorful introduced this week. Built around AMD's B850 chipset, it supports the latest AMD AM5 Ryzen 7000, 8000, and 9000 series processors. The two DDR5 dual-channel memory slots can accommodate up to 96 GB (max. 48 GB per slot), with a maximum speed of 7600 MHz (OC) and support for both XMP and EXPO. For storage and expansion, the motherboard offers 2x M.2 slots (1x PCIe 5.0 x4 and 1x PCIe 4.0 x4), one PCIe 4.0 x16 slot, and one PCIe 4.0 x4 slot. It also features a Realtek RTL8111K for 1GbE wired connectivity and Intel's AX200 Wi-Fi 6 with Bluetooth 5.2 for wireless connections.

The build is "very spartan," so to speak, with a black PCB, a single 8-pin EPS power connector for the CPU, no integrated I/O rear shield panel or VRM cooling—the only heatsink present is the one covering the AMD B850 chipset. Regarding power delivery, it seems that Colorful used a simple (budget-friendly) 7+2 phase approach. The rear I/O panel offers a surprise: an ancient PS/2 port (just wondering who's going to use it aside from some retro-nostalgic users). Then we have the usual array of connectors, including six USB ports (4x USB 2.0, 2x USB 3.2 Gen 1), DisplayPort 1.2, HDMI 2.0, Gigabit RJ45, two Wi-Fi antenna ports, audio jacks, and one BIOS reset/update button (placed just next to the PS/2 port).

Last Friday, AMD confirmed finalized price points for its upcoming Ryzen 9 9950X3D ($699) and 9900X3D ($599) gaming processors—both launching on March 12. Media outlets are very likely finalizing their evaluations of review silicon; official embargoes are due for lifting tomorrow (March 11). By Team Red decree, a drip feed of pre-launch information was restricted to teasers, a loose March launch window, and an unveiling of basic specifications (at CES 2025). A trickle of mid-January to early March leaks have painted an incomplete picture of performance expectations for the 3D V-Cache-equipped 16 and 12-core parts. A fresh NDA-busting disclosure has arrived online, courtesy of an alleged Ryzen 9 9950X3D sample's set of benchmark scores.

A pre-release candidate posted single and multi-thread ratings of 4739 and 69,701 (respectively), upon completion of PassMark tests. Based on this information, a comparison chart was assembled—pitching the Ryzen 9 9950X3D against its direct predecessor (7950X3D), a Zen 5 relative (9950X), and competition from Intel (Core Ultra 9 285K). AMD's brand-new 16-core flagship managed to outpace the previous-gen Ryzen 9 7950X3D by ~14% in single thread stakes, and roughly 11% in multithreaded scenarios. Test system build details and settings were not mentioned with this leak—we expect to absorb a more complete picture tomorrow, upon publication of widespread reviews. The sampled Ryzen 9 9950X3D CPU surpassed its 9950X sibling by ~5% with its multi-thread result, both processors are just about equal in terms of single-core performance. The Intel Core Ultra 9 285K CPU posted the highest single-core result within the comparison—5078 points—exceeding the 9950X3D's tally by about 7%. The latter pulls ahead by ~3% in terms of recorded multi-thread performance. Keep an eye on TechPowerUp's review section; where W1zzard will be delivering his verdict(s) imminently.

Earlier today, AMD confirmed finalized price points and a launch date for its two incoming additions to the Ryzen 9000X3D processor lineup. The current Zen 5 processor population (with 3D V-Cache onboard) has a count of one—Team Red's reigning gaming champion: the eight-core Ryzen 7 9800X3D model. AMD's Senior Vice President and General Manager of Computing and Graphics was the first staffer to make an official announcement regarding definitive talking points. Jack Huynh stated (via a social media post): the world's best processor for gaming and content creation is almost here. Available starting March 12th. Ryzen 9 9950X3D—$699. Ryzen 9 9900X3D—$599. A huge thank you to our incredible community of gamers, creators, and innovators for your continued support. Together, we're shaping the future of gaming and content creation! Let's level up together!"

The sixteen-core Ryzen 9 9950X3D and twelve-core 9900X3D SKUs were officially unveiled at CES 2025, in early January. Since then, many leaks have emerged online—certain soothsayers were bang on with their predictions. Almost a month ago, speculative $699 and $599 price points were leaked. On two separate occasions, a—now confirmed—March 12 launch day was projected. AMD is expected to lift media embargoes on March 11; reviews of finalized silicon will finally reveal whether the two new players can beat their incumbent sibling in gaming performance benchmarks. As reported this afternoon, China's JD.com retail platform has opened its order book to customers—a limited quantity of Ryzen 9 9950X3D and 9900X3D units were made available for a short period of time.

AMD's Ryzen 9 9950X3D and 9900X3D processors are reportedly due to launch mid-way through next week (March 12)—this "unofficial" release date was revealed by JD.com listings. Yesterday's report focused on the popular Chinese e-commerce platform's apparent leaking of Team Red's mid-March schedule. Last month, a local tipster—Golden Pig Upgrade—also alluded to a possible March 12 rollout of 16 and 12-core 3D V-Cache-equipped Zen 5 chips. In a surprise move, JD has started selling Ryzen 9 9950X3D and 9900X3D units. Earlier today, ITHome spotted updated product pages—JD disclosed that it was prepping an earlier than expected sale: "limited time and limited quantity available at 20:00 (local time) on March 7."

Officially, AMD has only teased a loose March launch window for its latest Ryzen Niners. VideoCardz has kept track of the company's recent announcements, and opines that the Ryzen 9000X3D release strategy is strange one. Embargoes for reviewer and influencers are tipped for lifting on March 11, so JD's premature sale of Ryzen 9 9950X3D and 9900X3D processors clashes with this schedule. JD's unusual 20:00 release time was highlighted by VideoCardz; they reckon that the 22:00 hour is a more appropriate kick-off time. It is possible that the limited quantity/short period sale was a mislabeled promotion for pre-orders—something could be lost in translation (see primary screenshot below), but similar events were reported in recent history.

COLORFUL has introduced a compelling new "X3D Gaming Mode" for its AM5-socketed motherboard models. The Chinese manufacturer previewed this newly supported feature via their official Weibo video channel—naturally, this mode was advertised as working in conjunction with compatible AMD Ryzen 7000X3D and 9000X3D processors. Curiously, COLORFUL did mention that non-3D V-Cache-equipped AM5 CPUs can work with their "X3D Gaming Mode." The aforementioned preview video demonstrates this new feature—accessed via the showcased B650 motherboard's BIOS interface—disabling Simultaneous Multi-Threading (SMT) on an involved processor. The population of dual-CCD Team Red 3D V-Cache models is set to grow this month, with the upcoming launch of Ryzen 9 9950X3D and 9900X3D chips.

COLORFUL's X3D Gaming Mode is touted to improve performance on dual-CCD CPUs, since it will disable the second unit. By transferring workloads to the (active) primary CCD, latency is reduced—thus boosting in-game performance. COLORFUL claimed that frame rates—in PUBG—increased by 17%, following the enabling of their snazzy X3D Gaming Mode. Wccftech opined on this scenario: "for processors like Ryzen 9 9900X3D and Ryzen 9 9950X3D, the X3D Gaming Mode is more ideal than on the single CCD non-X3D processors (e.g. Ryzen 7 9800X3D). Keep in mind that the performance of the Ryzen 9 9900X3D may be affected noticeably when one of its CCDs gets disabled. Since the processor brings only six cores on each CCD, it may not be ideal for a lot of users...Colorful's X3D Gaming Mode reminds us of Gigabyte's X3D Turbo Mode, but the latter works a bit differently and doesn't disable SMT or CCD but tweaks some CPU parameters." A "halved" Ryzen 9 9950X3D (16-core) is expected to behave in a similar manner to the current reigning champion (8-core) within gaming ecosystems.

ASRock has deployed beta BIOS version 3.20 today for its AM5 motherboard lineup to address persistent boot failures and burns affecting AMD Ryzen 7 9800X3D processors. ASRock Japan refuted claims of permanent CPU damage, characterizing circulating reports as "misinformation" and identifying memory compatibility as the underlying cause rather than processor defects. The firmware patch targets a specific interaction between memory configurations and the 9800X3D's architecture that manifests as boot failures across what ASRock describes as a "minority proportion" of affected systems. A community-aggregated database on Reddit documented 40 failure incidents, with ASRock boards accounting for 32 cases. The failure pattern appears inconsistent—some systems fail immediately while others operate normally for weeks before exhibiting symptoms. BIOS flashback procedures have successfully restored functionality in multiple instances.

"The CPUs themselves are not broken. This is specifically a memory compatibility issue affecting system initialization," ASRock Japan explained via social media. Prior to releasing version 3.20, the company had recommended affected users downgrade to BIOS 3.10 as a temporary workaround. Notably, customers who RMA'd their processors and received replacements found their systems suddenly operational—suggesting the issue stems from complex firmware-hardware interactions rather than manufacturing defects. The problem appears isolated to the 9800X3D model and does not affect other processors in AMD's Ryzen 9000 series lineup. ASRock noted that the company will provide comprehensive technical documentation explaining the underlying mechanisms. AMD has yet to issue an official statement regarding the compatibility issues affecting their premium gaming processor.

The AMD Ryzen 9 9950X3D processor will head to retail next month—a March 12 launch day is rumored—but a handful of folks seem to have early samples in their possession. Reviewers and online influencers have been tasked with evaluating pre-launch silicon, albeit under strict conditions; i.e. no leaking. Inevitably, NDA-shredding material has seeped out—yesterday, we reported on an alleged sample's ASUS Silicon Prediction rating. Following that, a Bulgarian system integrator/hardware retailer decided to upload Cinebench R23 and PCMark Time Spy results to Facebook. Evidence of this latest leak was scrubbed at the source, but VideoCardz preserved crucial details.

The publication noticed distinguishable QR and serial codes in PCbuild.bg's social media post; so tracing activities could sniff out points of origin. As expected, the leaked benchmark data points were compared to Ryzen 9 9950X and 7950X3D scores. The Ryzen 9 9950X3D sample recorded a score of 17,324 points in 3DMark Time Spy, as well as 2279 points (single-core) and 42,423 points (multi-core) in Cinebench R23. Notebookcheck observed that the pre-launch candidate came: "out ahead of the Ryzen 9 7950X3D in both counts, even if the gaming win is less than significant. Comparing the images of the benchmark results to our in-house testing and benchmark database shows the 9950X3D beating the 7950X3D by nearly 17% in Cinebench multicore." When compared to its non-3D V-Cache equivalent, the Ryzen 9 9950X3D leverages a slight performance advantage. A blurry shot of PCbuild.bg's HWiNFO session shows the leaked processor's core clock speeds; going up to 5.7 GHz (turbo) on a single CCD (non-X3D). The X3D-equipped portion seems capable of going up to 5.54 GHz.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, has observed reports on Reddit from users experiencing unexpected boot issues and error codes when using ASRock AM5 motherboards paired with minority proportion of AMD Ryzen 9000 series processors. To enhance user experience, ASRock promptly released the latest 3.20 Beta BIOS for its AM5 series motherboards, further improving AMD Ryzen 9000 series processors boot issues.

Users can download and install the BIOS from the official ASRock website or use the BIOS Flashback function on their motherboard for a quick update. ASRock also promises to continue enhancing the compatibility of its products.

MSI is pleased to announce support for the upcoming AMD Ryzen 9 9950X3D and 9900X3D processors, built on the Zen 5 architecture and featuring AMD's cutting-edge 2nd generation AMD 3D V-Cache technology. This innovative technology is designed to significantly increases the cache size, allowing faster data access and improved performance. Engineered to deliver exceptional performance, these processors meet the demands of even the most intensive gaming and content creation workloads.

At the heart of this experience is the MSI MEG X870E GODLIKE motherboard, which sets a new standard with its innovative design and robust features. The Dynamic Dashboard III, a 3.99-inch full-color LCD, offers real-time hardware monitoring, troubleshooting, BIOS update status, clock display, and personalization options, enhancing user experience and system control. MSI's EZ Link design complements this, streamlining cable management by consolidating the front panel, fan, and RGB headers into the EZ Bridge and EZ Control Hub, ensuring a cleaner build and simplified installation process.

We have noticed an uptick of AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D-related leaks in mid-to-late February; suggesting an imminent launch. Officially, a Q1 release window was set by Team Red leadership during their CES 2025 presentation, and further disclosures pointed to a loose March window. Earlier today, Golden Pig Upgrade disclosed NDA-busting information—the veteran leaker believes that AMD will be lifting global Ryzen 9 9950X3D CPU review embargoes on March 11. VideoCardz jumped on this unofficial announcement, and reached out to industry insiders. The anonymous contacts reported back; they allege that a March 12 retail release is on the cards.

It is believed that the 16-core and 12-core X3D-equipped "Granite Ridge" Ryzen 9 desktop chips will roll out on the same day (March 12). Coincidentally, Golden Pig Upgrade reckons that Intel's Core Ultra 200HX "Arrow Lake" mobile processor series will launch alongside Team Red's high-end gaming duo. The latter two are touted to attract the majority of press attention on day one. As pointed out by VideoCardz, the release of Radeon RX 9070 GPUs is—speculatively—scheduled a week in advance of AMD's expansion of its Ryzen 9000X3D lineup. Early last week, price points were leaked—courtesy of accidental Newegg listings: $699.99 for the Ryzen 9 9950X3D, and $599.99 for the 12-core Ryzen 9 9900X3D.

EK, the premium liquid cooling manufacturer, is proud to announce the latest generation of EK-Quantum Velocity³ CPU water blocks. Offering universal compatibility for both AMD AM5 and Intel LGA 1700 / 1851 sockets, the EK-Quantum Velocity³ features a fully customizable configuration that allows you to rotate, adjust, and reposition the internal components, heat spreader, and ports - ensuring high-performance liquid cooling that's perfectly optimized for your build.

Universal Intel & AMD Platform Compatibility
The EK-Quantum Velocity³ offers a new level of compatibility with design that allows you to interchange between Intel LGA 1700 / 1851 & AMD AM5 with a few simple adjustments. When choosing your platform, simply align the jet plate alignment based on the Intel or AMD socket, reposition the cold plate and attach the LGA or AM5 mounting bracket - it's that simple. This design ensures universal compatibility, offering high performance liquid-cooling that's future proofed should you wish to change platform when upgrading your PC.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

Sapphire Technology has introduced a new NITRO+ motherboard model in China—weekend reports pointed to a listing on JD.com, where the latest addition resides alongside various previous-gen B650 options. This appears to be another region specific release—priced at 1299 RMB (~$179 USD). The NITRO+ B850M Wi-Fi model seems to share its overall aesthetic design with the preceding B650M-equipped equivalent. As surmised by VideoCardz, the Sapphire NITRO+ board's VRM patterning reminded them of the leaked premium-tier Radeon NITRO+ RX 9070 graphics card series.

The generational jump from AMD B650 to B850 chipset—as expected—yields only minor benefits (see below). The older NITRO+ B650M Wi-Fi model is a significantly cheaper prospect; coming in at 899 RMB ($124 USD). VideoCardz's weekend detective work settled on a nice improvement: "based on our research, the memory overclocking support has increased from 7600 MT/s+ to 8000 MT/s. Keep in mind that these figures may be higher for both motherboards; this is just what Sapphire guarantees when paired with a supported memory kit." Industry watchdogs believe that ASRock is likely involved in the contract manufacturing of Sapphire's motherboard offerings—the former has been long-involved in pumping out NZXT-badged products.

AMD is readying two important client segment processors powered by the next-generation "Zen 6" microarchitecture, according to a sensational new report by Moore's Law is Dead. These are the "Medusa Point" mobile processor, and the "Olympic Ridge" desktop. The former is a BGA roughly the size and Z-Height of the current "Strix Point," but the latter is being designed for the existing Socket AM5, making it the third (and probably final) microarchitecture to do so. If you recall, Socket AM4 served three generations of Zen, not counting the refreshed "Zen+." At the heart of the effort is a new CPU complex die (CCD) that AMD plans to use across its client and server lineup.

The "Zen 6" performance CCD is being designed for a 3 nm-class node, likely the TSMC N3E. This node promises a significant increase in transistor density, power, and clock speed improvements over the current TSMC N4P node being used to build the "Zen 5" CCD. Here's where it gets interesting. The CCD contains twelve full-sized "Zen 6" cores, marking the first increase in core-counts of AMD's performance cores since its very first "Zen" CCD. All 12 of these cores are part of a single CPU core complex (CCX), and share a common L3 cache. There could be a proportionate increase in cache size to 48 MB. AMD is also expected to improve the way the CCDs communicate with the I/O die and among each other.

The EU could influence the mobile phone industry to ditch bundling wall chargers with their phones, and got them to standardize the USB-C connector, with the goal of minimizing the number of wall chargers people would have to own, which could last years, spanning many phones. It even got Apple to ditch its proprietary Lightning connector in favor of USB-C. The European Commission could be turning its attention to the way products such as desktop PC processors are sold in the retail channel. In the OEM channel, things are golden—processors are sold by the 1,000 units in trays that aren't all that different from the way eggs are sold to restaurants. In the retail channel, these processors put on elaborate packaging material that includes boxes that are about 20 times the size of the processor itself, and include stock cooling solutions that can run the processors at stock settings.

This could change, as the EU's Packaging and Packaging Waste Regulation (PPWR) came into effect on February 11, 2025. This regulation gives manufacturers an 18-month grace period for compliance, and it affects desktop processor packaging in the retail channel. The first casualty will be special edition or flagship SKUs that come with swanky acrylic packaging, like Intel's large dodecahedron that shipped with the Core i9-9900K. Intel has already made the switch, and its current flagship, the Core Ultra 9 285K, comes in much simpler paperboard boxes. AMD's flagship processors also comply, as they come in compact paperboard boxes even for the top Ryzen 9 9950X. Then there's the issue of stock CPU coolers included in these boxes, at least for the 65 W processor models.

MSI introduced an impressive number of new AMD B850 and B840 chipset-based motherboards at January's CES trade event. According to a Wccftech report, the company's AM5—socketed lineup will expand in the near future—a leaked presentation slide provides an early preview of (allegedly) incoming budget-friendly offerings. MSI's leaked roadmap (Q1 to Q2 2025) shows new additions—mostly smaller form factor—across performance (MPG) and Pro Series product ranges. Their Arsenal Gaming (MAG) B850 range seems to be fully released, as of the first quarter of this year—consisting of models already unveiled at CES.

Five new models are seemingly lined up for release within the next couple of months—the Wccftech article listed the following SKUs: MPG B850I Edge WIFI (Mini-ITX), PRO B850M-P WIFI (M-ATX), PRO B850M-B (M-ATX), B850 Gaming PLUS WIFI PZ (ATX) and PRO B850M-A WIFI PZ (M-ATX). The publication commented on its discoveries: "as you can see, MSI will have at least one new variant within the MPG lineup which will feature a Mini-ITX design. The company has already released the full ATX-sized version of the EDGE TI WIFI, and it's nice to know that we will get a Mini-ITX variant too." The report proposes that MSI has prepped its new budget models with the latest connectivity features—most notably, Wi-Fi 7 rated at the full 320 MHz band. Support for Zen 4 and 5 Ryzen X3D CPUs is expected upon launch.

FSP, a well-known brand in the power supply and chassis has launched a new series of CPU air coolers. The lineup includes the high-efficiency MP7, powerful NP5, and NE5 models. Optimized for the latest Intel and AMD CPUs, these coolers are compatible with Intel LGA1851 and AMD AM5 sockets. Featuring high-quality designs, they offer superior cooling performance and versatile options to meet various user needs, perfectly blending extreme performance with silent operation for a cooling solution that exceeds expectations.

The MP7, NP5, and NE5 cooler series utilize antigravity heat pipe technology to enhance performance when the motherboard is mounted vertically inside the case, maximizing cooling efficiency. Additionally, the MP7 features a copper base with heat pipe welding, increasing the contact area with the CPU, significantly improving heat dissipation.

German PC hardware retailer MindFactory sold an astonishing 25,625 AMD and Intel CPUs in January 2025. However, an honor falls to AMD this time, as Team Red has managed to capture as much as 92.16% (23,615) of all units sold by this retailer. Not only did it leave Intel with 7.84% (2010) of total units sold, AMD also beat Intel in average selling price, where AMD managed to keep ASP at 320 Euros, while Intel buyers were considering some less expensive CPU SKUs at 290 Euros. This has resulted in AMD's revenue share recording 93.45% at 8,300,674 Euros, while Intel left a smaller mark at 6.55% or 581,959 Euros. The best-selling CPU was AMD's Ryzen 7 9800X3D, sold in 8,390 units in January.

A detailed analysis of socket distribution reveals AMD's AM5 platform's overwhelming dominance, securing 18,410 units or 71.84% of total sales. The mature AM4 platform maintains a significant market presence with 5,205 units (20.31%), showing strong continued demand for AMD's previous-generation socket. Intel's LGA 1700, compatible with 12/13/14th generation processors, accounted for 1,745 units (6.81%), while their older platforms showed minimal market penetration. The LGA 1851 socket, supporting Intel's latest Core Ultra 200S processors, managed just 185 units (0.72%), with legacy LGA 1200 and LGA 1151 sockets trailing at 55 (0.21%) and 25 (0.1%) units respectively. AMD's latest platform market performance suggests strong consumer confidence in AM5's upgrade path and performance capabilities. This dramatic market share capture by AMD represents one of the most significant shifts in the desktop CPU market in recent years, particularly notable given the higher average selling prices at which AMD CPUs are now sold.