GIGABYTE has a little surprise as it just listed a new B850 motherboard on its website, named B850M Force. This standard microATX form-factor AM5 motherboard marks the return of GIGABYTE's SOC Force series (i.e., GA-Z170X-SOC Force or GA-Z97X-SOC Force) that "eons ago" delighted Intel users with its striking orange aesthetics. Going from the cold, full white designs of its B850 Ice motherboards such as B850 Aorus Stealth Ice or B850M Eagle Ice series launched in January, this newly launched Force motherboard series packs a complete set of features tailored for a variety of users as well as retro enthusiasts from the Intel Z97 and Z170 times a decade ago.

The GIGABYTE B850 Force microATX motherboard is built around AMD's B850 chipset and supports the full range of AMD Ryzen processors for the AM5 socket, including the latest 9000 series CPUs. The board has an 8+2+2 phase digital VRM with heatsinks and supports up to 128 GB of DDR5 memory across two DIMM slots, with speeds up to overclocked 9600 MT/s (including AMD EXPO and XMP profiles). Storage connectivity consists of three M.2 slots supporting different PCIe configurations alongside four SATA 6 Gb/s connectors. Expansion capabilities include a PCIe x16 slot that supports PCIe 5.0 and an additional PCIe x4 slot from the chipset. Connectivity features include integrated Wi-Fi 6E with Bluetooth 5.3 (for the Wi-Fi 6E model), a 2.5 Gigabit Ethernet controller, and multiple USB ports including USB 3.2 Gen 2 and USB-C connections. Alongside its orange appearance, the motherboard has another surprise: a PS/2 port for those who are truly into the retro theme. Display outputs consist of HDMI 2.1 supporting 4K at 60 Hz and DisplayPort 1.4 capable of 4K at 144 Hz (depending on the iGPU capabilities of the installed processor).

MSI listed the MPG B850I EDGE TI WIFI, a Mini-ITX form-format AMD AM5 socket motherboard built around AMD's B850 chipset with support for the latest Ryzen CPU series. The board features an 8+2+1 phase digital VRM with 90 A SPS DrMOS power stages, powered through a single 8-pin EPS connector. It uses a 10-layer PCB with 2oz copper for enhanced conductivity and thermal performance. The motherboard supports DDR5 memory up to 8200 MT/s in a dual-slot, single DIMM per channel configuration. Storage connectivity includes a front-mounted PCIe 5.0×4 M.2 slot with active cooling fan connected directly to the CPU, plus a rear PCIe 4.0×4 M.2 slot through the chipset and two SATA III ports. A single PCIe 5.0×16 slot provides GPU connectivity via CPU lanes.

Networking capabilities include 5 GbE wired connectivity through a Realtek RTK8126 controller and Wi-Fi 7 with 320 MHz channels supporting up to 5.8 Gbps, alongside Bluetooth 5.4. Audio processing uses the Realtek ALC4080 codec. The I/O configuration provides USB-C connectivity at 20 Gbps on the rear panel and 10 Gbps via internal header, multiple USB-A ports ranging from 480 Mbps to 10 Gbps speeds, HDMI 2.1 FRL video output, S/PDIF digital audio, and dual antenna connectors for wireless connectivity. The active cooling fan on the primary M.2 slot addresses thermal management for high-performance PCIe 5.0 SSDs while maintaining the compact Mini-ITX form factor.

Coracer, a lesser-known Chinese accessories manufacturer, recently introduced a version of its GPE-01 graphene thermal pad specifically designed for AMD's AM5 processors. Until now, this pad has been compatible only with Intel's LGA 1851 and LGA 1700 sockets. The new AM5 model measures 32×32 mm, allowing it to cover the entire IHS without hanging over the edges. Thermal paste has long been the go-to option for filling the microscopic gap between CPU and cooler, but in recent years, enthusiasts have explored alternatives like liquid metal and pre-cut thermal pads. Graphene-based products have gained traction because graphene conducts heat exceptionally well. Coracer claims its GPE-01 combines graphene with silicon to achieve a thermal conductivity of 130 W/mK, which is about twice that of popular liquid metal compounds. An insulating layer around the graphene prevents any risk of shorting out the processor's circuits.

Coracer also asserts that the GPE-01 can maintain performance for up to ten years. Regular thermal paste tends to dry out and degrade over time, requiring reapplication every few years. A graphene pad like this could eliminate that chore until you swap out your CPU unless you keep the same system for over a decade. Interestingly, Coracer has almost no online footprint. Segotep, another Chinese brand, introduced a GPE-01 pad for Intel CPUs late last year, so it's unclear whether Coracer is a spin-off or if Segotep licensed the design. As of now, there's no word on pricing or availability for the AM5 version. The Intel-focused GPE-01 sells for around $15 on Taobao, which is in line with other premium pads. Without independent reviews, it's hard to know if Coracer's conductivity claim holds up in real-world testing, but graphene's reputation does offer some reason for cautious optimism. We tested a similar product, Thermal Grizzly's KryoSheet, with a conductivity of 7.5 W/m·K, so hopes are high for the GPE-01.

Yesterday, ASRock's South Korean office issued a statement regarding problematic hardware pairings; affecting current-gen motherboards and AMD Ryzen 9000 "Granite Ridge" desktop processors. Curiously, the Taiwanese manufacturer's local branch slipped in an intriguing tidbit into its message, addressed to members of the Quasar Zone forum: "ASRock has released a new BIOS version 3.25. This version is based on AMD AGESA 1.2.0.3d, and has been improved to enhance compatibility with next-generation CPUs and optimize PBO (Precision Boost Overdrive) settings to enable more stable system operation." Due to media outlets focusing on an important BIOS update, a major hint was largely ignored. Fortunately, VideoCardz's keen eye was not distracted by current affairs.

According to their evening report (dated June 4), their local contacts have confirmed that there are no misunderstandings when Westerners machine translate ASRock Korea's original statement. Naturally, guess work—about the company's teasing of next-gen processors—will land on two upcoming Team Red product families. VideoCardz quickly eliminated a successive "Zen 6" CPU series, aka "Ryzen 10000." Despite recent leaks, industry watchdogs anticipate (at best) a mid-2026 debut. Given the uptick of semi-official Ryzen 9000G "Gorgon Point" leaks throughout Q2'25, VideoCardz reckons that AMD and mainboard partners are preparing for the arrival of this Zen 5 + RDNA 3.5-based APU series. Industry insiders have proposed a fourth quarter launch window.

At Computex 2025, ASRock deliberated over the problems that have plagued certain AMD 800-series motherboard models. Fatal combinations—usually affecting popular Ryzen 7 9800X3D gaming CPUs—have been highlighted by sections of the PC hardware community, and (subsequently) press outlets. Months ago, the Taiwanese mainboard manufacturer's Japanese branch took a combative stance (in response to widespread criticism). Following continued failures of Team Red "Granite Ridge" desktop processors on "mid-to-high-end" ASRock mainboards—even in non-3D V-Cache guises—company representatives have interacted with key media conduits, including Tech YES City's Bryan Bilowol. Coinciding with the release of fresh BIOS fixes, long-form video coverage of Q&A sessions have turned up on YouTube.

Company reps have alluded to a warranty replacement scheme, but full details were not disclosed during May-time Computex proceedings. Many critics are still waiting for an official company statement; hopefully addressed to a global audience. In the meantime, one regional office has weighed in with some much-needed outreach: "ASRock Korea takes the recent AMD 800 series motherboard issues experienced by some users very seriously and will follow up with you to protect your trust. ASRock is continuously monitoring the performance and stability of the platform and will provide a firmware update as soon as possible if any issues are identified. In addition, if the system you are using is damaged due to this issue, we will take responsible measures for both the CPU and the motherboard distributed through the official domestic importer, and please submit the case through ASRock Korea's official distributor for diagnosis and processing. ASRock Korea will continue to listen to the voices of our customers and do our best to remain a trusted brand." This message was posted on Quasar Zone; a high-traffic PC hardware forum. A good number of manufacturers have responded to cases raised by members of this South Korean community.

Early indications of AMD's next-generation Ryzen processors have surfaced as AIDA64's newest beta release adds initial support for Ryzen 10000 "Zen 6" desktop, server, and mobile chips. The update was noted by X user HXL, suggesting that AMD has quietly shared basic specifications with developers of hardware monitoring software. Looking back, AIDA64 tends to announce chip support almost a year before official launches, so these new processors may not appear until Computex 2026. Leaks from March 2025 suggest that AMD's Zen 6 desktop lineup, currently codenamed Medusa Ridge, will remain compatible with the existing AM5 socket. This news should please PC enthusiasts because it means many users will not have to replace their motherboards when upgrading. Reports indicate that Medusa Ridge CPUs may include 12-core chiplet dies, marking a step forward from previous architectures.

These chips are expected to be manufactured using TSMC's N3P process, which is designed to deliver improved power efficiency and higher frequencies. Additionally, a Zen 6-based X3D series is likely to feature a 3D V-Cache, targeting gamers. A model like the Ryzen 7 10800X3D could follow the success of the 9800X3D by offering strong performance at its price. On the mobile side, "Medusa Point" processors are rumored to incorporate up to 22 hybrid cores that combine performance and efficiency cores under the Zen 6 architecture. However, these mobile chips seem to be further off, with a launch window set for late 2026 or early 2027. Although AIDA64's beta edition now recognizes Ryzen 10000 series chips, AMD's usual schedule suggests we will not see them in shops until mid-2026 at the earliest. Still, compatibility with AM5 and a move to a more advanced process promise meaningful improvements when Zen 6 finally arrives.

It seems as though an official international launch for the elusive AMD Ryzen 9000G APUs might still be on the cards for later this year, after all. While an announcement was expected at Computex 2025, along with a full-scale retail launch later this year, AMD was suspiciously quiet about its CPUs at the electronics trade show. Now, it looks as though Gigabyte has seemingly started preparing its B650 motherboard line-up for the arrival of AMD's Ryzen 9000G APUs.

On Gigabyte's B650 Gaming motherboard memory compatibility page, the hardware maker seems to have replaced any mention of Ryzen 9000 series CPUs with "Ryzen 9000 G-series CPUs," altogether. It's unclear whether this change means the same memory compatibility table will apply for both AMD Ryzen 9000 and 9000G CPUs, but that seems to be the case. At any rate, this leak suggests that previous rumors claiming a Q4 launch may have been correct. Those same leaks suggested that the Ryzen 9000G APUs would feature AMD Zen 5 CPU cores paired with AMD RDNA 3.5 iGPUs, with the top-spec iGPU likely being capable of running at least some lighter-weight games and e-sports titles. As it stands, the iGPUs found in recent AMD Ryzen CPUs are merely there for basic video output and diagnostic purposes, while the G-series APUs are generally intended for use without a dedicated GPU. It seems reasonable to expect AMD to launch at least one variant in the AMD Ryzen 9000G APU series equipped with the Radeon 890M, which also powers some of the most popular Windows gaming handhelds on the market.

Earlier this month, Bryan Bilowol—of Tech YES City fame—was taken aback by the unexpected "death" of his Ryzen 9 9950X processor, at the alleged hands of an ASRock X870 Steel Legend motherboard. Throughout early 2025, widespread news reports and community tracking efforts have largely implicated ASRock boards. AMD's highly popular Ryzen 7 9800X3D gaming CPU has "fallen victim" on numerous occasions, but a smaller number of incidents have affected non-3D V-Cache equipped Ryzen 9000 "Granite Ridge" models. The Taiwanese manufacturer and Team Red have investigated these problems, and have released fixes via BIOS updates. Despite these efforts, unhappy owners have experienced CPU failures in Q2'25. Following the uploading of initial findings and theories, Bilowol promised further reports. Fortunately, a sit-down—with ASRock's motherboard team—happened late last week, at Computex 2025. At the time of writing, the company has not published an official statement regarding their latest findings or fixes. Tech YES City shared a couple of compelling details in a May 26 YouTube upload (viewable below).

Commenting on the Ryzen 9000 CPU failure situation, Bilowol relayed important ASRock material: (the motherboard team) told me it had to do with the EDC and TDC, which is the electric design current as well as the thermal design current. Essentially, they're saying it's an ampage problem that exists with the precision boost overdrive (PBO) settings. In particular, these mid-range and high-end motherboards—say for instance a B650E or an X670E Taichi or even a B850 Steel Legend—have the ability to run Ryzen 9000 series CPUs at their maximum PBO settings out of the box. What's happening here is ASRock told me they were implementing these settings to what they believe was too aggressive for what the CPUs were able to handle, at least for earlier samples. However, they do promise me that these issues have been fixed with their latest BIOS updates that they're rolling out for these mid-range and high-end motherboards. They also told me that the lower-end boards, say for instance, an A620 HDV or something like that, shouldn't be affected by this issue simply because those PBO settings have been deliberately tuned down, due to the motherboard in question not being a high-end model." Three months back, ASRock's Japanese branch accused the PC hardware community of spreading "misinformation." Hopefully, the latest batch of fixes will bring an end to all Ryzen 9000 CPU + high-end/mid-range ASRock mainboard controversies.

SilverStone brought a host of new AIO liquid CPU coolers to Computex 2025, and we begin our tour with the IceMyst Pro line of AIO CLCs for a wide range of gaming desktop CPU socket types. The company also added support for AMD Socket TR5 for Ryzen Threadripper HEDT processors. These coolers come in 240 mm, 280 mm, 360 mm, and 420 mm sizes. Next up are the IceMyst 2U and 3U lines of AIO CLCs for rackmount cases. These are highly socket specific. The IceMyst 400 2U comes with a pump-block that supports LGA1851 and AM5, with the included 80 mm server-grade fans turning at speeds of up to 8,000 RPM to push air through radiators that are either 400 mm x 80 mm (5x 80 mm), or 240 mm x 80 mm (3x 80 mm). Then there's the 3U-capable XE360PD, which comes with a pump located in the radiator, and a water block that's capable of AMD Socket TR5; and the XE360PDD, which is meant for 2P servers and workstations. There will be models specific to CPU socket types, including SP5 and LGA4266.More pictures follow.

Cougar brought a couple of its latest cooling products to Computex 2025, besides an innovative new lineup of cases, which we covered here. Starting things off are the Unity ARGB line of compound fans. A compound fan is a single fan frame with multiple impellers that are internally connected for their PWM main function and ARGB lighting. This reduces cable clutter from having individually connect each fan. Compound fans pair best with liquid cooling radiators. The company showcased its Unity ARGB 240 (2x 120 mm) and Unity ARGB 360 (3x 120 mm) compound fans, both of which come in black and white color variants, and come with the ability to forward or reverse their airflow. The frames of these fans not just discreetly wire the subunits, but also serve as ARGB diffusers. Each of the impellers comes with ARGB lighting of their own.

Next up is the Poseidon Vistek Pro line of high-end AIO liquid CPU coolers. These are characterized by large 3.9-inch true-color displays that are mostly square (and hence not from a smartphone spare parts bin). The screen can be made to display just about anything, although its included software puts out system monitoring stats pulled from ACPI. The cooler includes a Cougar Unity ARGB 360 compound fan that shares a common frame among three 120 mm impellers, and hides the associated cable clutter. The frame also has a neatly executed ARGB diffuser, besides the LEDs located in the subunits themselves. The cooler supports all modern desktop CPU socket types, including LGA1851 and AM5.

MSI's Computex booth has prepared new products for everyone, even for overclockers in microATX form factors. The company has presented a microATX MPOWER B850E motherboard, as we expected the MPOWER series comeback, with a very simple visual layout, aiming to please overclockers and even extreme LN2 users, with little add-ons to obstruct operations. Based on the B850E chipset, it accommodates AM5 processors with up to 16 cores and 32 threads in the top-end AMD Ryzen 9 9950X SKU. There are two eight-pin CPU connectors instead of the regular single eight-pin connector, for more overclocking headroom. VRM phases are covered in low-profile heatsinks so that LN2 coolers, often large and chunky, don't interfere with motherboard elements, which would usually require removal and later thermal isolation. What is particularly interesting is the usage of two memory DIMM slots, which is ideal for overclocking as it requires less CPU signaling to the memory. For easy signaling, MSI's EZ dashboard integrates power, reset, clear CMOS buttons, and a debug LED for CPU status codes.

Here is the first picture of the Antec Vortex View, a premium all-in-one closed-loop liquid CPU cooler. The Vortex View is characterized by what looks like a 4-inch 16:9 display on top of the pump-block. This display connects to your graphics card over HDMI, and can be programmed to show just about anything. An app included with the cooler reads system monitoring information from ACPI and displays onto this screen, but to the system it's just another display head, and can be programmed to show just about anything. This is the white model of the Vortex View, and comes with not just white sleeved tubing, but also a white radiator—including white fins. The whitewash continues onto the three included FDB fans. The CLC supports all modern client desktop sockets, including AM5 and LGA1851.

ASRock, a global leader in motherboards, graphics cards, mini PCs, power supplies, and gaming monitors, is excited to announce the participation in Computex Taipei 2025. Under the theme Gaming Beyond Limits, AI Beyond Imagination, ASRock will showcase the dual focus on next-level gaming and AI applications. From immersive gaming setups to AI solutions, the exhibit highlights ASRock's commitment to innovation across both fields. Visitors are invited to explore the latest products and technologies, and to experience the Phantom Gaming Zone at booth L0818.

ASRock Unveils Flagship Taichi OCF and Taichi Creator AM5 Motherboards
To expand its success on AMD AM5 motherboards, ASRock will be adding more exciting products into its product portfolio. New product such as X870E Taichi OCF, the very first OC formula motherboard based on AMD platform, Phantom Gaming X870 Nova WiFi, the new high end gaming motherboard based on X870 chipset, a functional yet elegantly designed X870 Taichi Creator and also a lot more products that are based on X870 / B850 / B840 / A620A chipset.

Unlucky owners of AMD Ryzen 7 9800X3D processors have encountered major problems that largely involve ASRock motherboards. Throughout early 2025, user feedback provided insight into numerous cases of "catastrophic CPU failures." Members of the official ASRock subreddit have kept track of these unfortunate incidents; now closing in on 200 documented "murdered" specimens. Industry watchdogs reckon that even more disagreements—involving the Zen 5-based 9000X3D series and ASRock B- and X- (AM5) boards—exist outside of this community-aggregated log. At the end of February, ASRock pushed out an important BIOS update—this fix did not resolve all problems. Over a month later, AMD weighed in with their findings—in response, ASRock released another update.

Evidently, Ryzen 7 9800X3D products continue to perish—Tech YES City's Bryan Bilowol has added Team Red's Ryzen 9 9950X model to the mix. The tech YouTuber was surprised by the death of his example; apparently caused by an ASRock X870 Steel Legend mainboard. Standard "Granite Ridge" processors—that lack 3D V-Cache—have received less attention, but observers believe that these non-X3D options are still vulnerable. Bilowol did not personally experience the moment of catastrophe—instead, a friend was borrowing an affected PC build. As demonstrated in a new Tech YES City video post-mortem, the completely dead CPU sported some worrying gray marks. Tech YES City has a fairly large audience, so ASRock leadership will likely be cursing after noticing another uptick in public scrutiny. Past reports have pointed out the manufacturer's belief that too much "misinformation" is being spread. Bilowol surmised that the company is keeping this issue: "under the radar—they seem to be hoping that the issue will just go away." Despite collaborating with ASRock for over a decade, Tech YES City will not pull any punches—await for more gory details in upcoming follow-up investigations.

Arctic presents the new Freezer 8, which is available in different socket variants. The air cooler series offers a convincing upgrade for boxed coolers and small cases at an excellent price-performance ratio. With a height of just 136 mm, the Freezer 8 fits easily into various cases and is ideal for systems with limited space and high RAM modules. Two offset direct-touch heatpipes and a pressure-optimized 100 mm PWM fan ensure quiet and powerful operation. If required, a maximum speed of 2,300 rpm can be achieved.

The compact air cooler is available in four versions for different sockets and applications:

• Freezer 8A: Supports AMD's AM5 and AM4.
• Freezer 8i: Compatible with Intel's LGA1851 and 1700 sockets.
• CO models: For continuous operation with double ball bearings.

PC hardware watchers continue to pore over official AMD repositories and adjacent databases, in the hopes of finding unannounced next-gen technologies. Olrak29 and InstLatX64 have presented their latest Team Red-related findings; apparently reaching across futuristic desktop, mobile, and workstation product families. As outlined and interpreted by VideoCardz, several of these next-gen branches are already somewhat "known" properties—namely AMD's allegedly Zen 5-based Ryzen Threadripper "Shimada Peak" 9000WX (workstation) processor series. Following almost two years of leaks, an official introduction is expected to happen during Computex 2025. The Ryzen 9000G "Gorgon Point" desktop (Zen 5 + RDNA 3.5) APU series has turned up again; now "fully" linked to the AM5 socket platform (not a big surprise). The two leakers have also uncovered another rumored AM5-bound product lineup—"Grado" chips could be based on existing "Granite Ridge" foundations, but elevated to commercial/enterprise levels. These speculated basic/entry-level "EPYC 4005" processors are floated as natural successors to currently available 4004 forebears (related to Ryzen 7000 "Raphael" architecture).

Olrak29 and InstLatX64 have also found multiple mysterious FP8 socket-related Ryzen AI Mobile SoCs. "Krackan2" could be a cheaper refresh of current "Krackan Point" APUs—Tom's Hardware proposes smaller designs that sport fewer cores, and not configured with NPUs. Kepler_L2 has weighed in on the matter of three listed "Gorgon Point" IPs—he reckons that the third variant ("Gorgon Point3") will be a spin-off (aka refresh) of a "Krackan2" design. As suggested by insider knowledge, Team Red's convoluted scheme points to "Gorgon Point" being the sequel to "Strix Point." An FF5-based "Soundwave" processor design has appeared alongside the aforementioned futuristic Ryzen AI Mobile chipsets—industry whispers propose that AMD will be leveraging Arm architecture within a lower product tier. InstLatX64 pulled additional compelling information from AMD's Technical Information Portal—providing further insight into Ryzen AI "Medusa Point" APUs (Zen 6 + RDNA 3.5) being dreamt up, with a matching "larger footprint" FP10 platform.

Since teasing its next-gen flagship motherboard design—at CES 2025—the ASUS Republic of Gamers (ROG) team has spent time finalizing an option that is even more extravagant than their hardcore overclocking-oriented Crosshair X870E Apex model. Naturally, the premium sub-brand did not reveal pricing during preview events—instead, premature European e-tail listings suggested a €1200 (~$1350 USD) tag. Tony Wu and colleagues at ASUS China introduced an impressive swath of brand-new products at an official in-person showcase last week, in Changsha.

During proceedings, company representatives introduced their top-flight E-ATX format board with a hefty day one price: 9999 RMB ($1360 USD). The ASUS ROG Crosshair X870E Extreme is expected to launch later this month; likely starting off with the Chinese domestic market. At the time of writing, the manufacturer's various global branches have not disclosed localized details—be it pricing or availability. Last week's presser did not produce any surprises, since plenty of specification details (and promo shots) leaked out late last month. One interesting and very over the top feature is the model's integration of an adjustable full-color 5-inch LCD screen. The primary M.2 storage solution will be cooled by an "innovative" 3D vapor chamber heatsink. Well-heeled customers will be relieved to know that ASUS has outfitted the AAA board design with their revamped Q-Release Slim mechanism.

Over a year ago, hardcore overclocking fanatics celebrated MSI's resurrection of the much missed MPOWER motherboard product line. After a seven-year hiatus, the Taiwanese manufacturer revived this series—beginning with a brand-new Z790MPOWER option. Back then, an exclusive Wccftech news report put a spotlight on the (then) brand-new model's support of Intel Core 12th, 13th, and 14th Gen processors (on LGA 1700/1800). Returning to the present day, MSI seems to be prepping a new MPOWER motherboard model—leaked shots imply a return to an old school color theme (black/yellow, rather than metallic tones). Wccftech has uploaded two close-up teaser images, from a "brief glimpse" preview session. There is evidence of AI upscaling here—despite the presence of anomalies/aberrations, we can see MSI logo and MPOWER branding on attached heatsinks.

Wccftech believes that the proposed "MSI MPOWER AMD series" will be: "a strong and cost-effective design for overclockers. The previous Z790 MPOWER motherboard brought great OC capabilities in an affordable design, offering 8000 MT/s DDR5 support and the new design will be no exception...Starting with the details, the...motherboard will feature an AM5 socket and is likely to leverage the B850E chipset. The new MPOWER motherboard also comes with a microATX form factor." Like last year's edition, MSI has readied the board with two DDR5 DIMM slots—ideal for ardent memory overclocking enthusiasts. This twin-stick setup reportedly supports up to 128 GB capacities. An extra bit of real estate is freed up; thus granting room for an additional M.2 bay. Wccftech did not disclose every tidbit of insider info, but they have hinted about the board's prowess: "it's awesome that we are finally getting an MPOWER motherboard from MSI for AM5 builders. The MPOWER series is great for overclocking and this motherboard should be just as good. We also managed to get information regarding the OC capabilities which are going to rival some of the high-end AM5 offerings as far as memory tuning is concerned."

ASUS today introduced the X870 MAX Gaming WiFi7 motherboard. This Socket AM5 motherboard comes in two color-based variants—its default black, and the white X870 MAX Gaming WiFi7 W, which features a white PCB, besides white/silver heatsinks. The X870 MAX Gaming is positioned below even the TUF Gaming X870 Plus, and separate from the company's Prime series. It is designed to lure gaming PC builders away from the likes of the GIGABYTE Gaming X and MSI Gaming Plus series. The board is built in the ATX form-factor and draws power from a combination of 24-pin ATX and two 8-pin EPS connectors. It features a 12+2+1 phase CPU VRM that uses 80 A-rated power stages.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and just the one M.2 Gen 5 x4 NVMe slot. The second CPU-attached NVMe interface is wired out as M.2 Gen 4 x4. The third M.2 slot is Gen 4 x4 and wired to the X870 FCH. The board also puts out four SATA 6 Gbps ports. Besides the main Gen 5 x16 PEG slot, the board has three other physical x16 slots, two of these are Gen 4 x1, and the last one Gen 3 x1. Display connectivity includes an HDMI, and a DisplayPort that's wired to the board's two 40 Gbps USB4 type-C ports. Other USB ports include a 10 Gbps USB 3.2 Gen 2; three 5 Gbps USB 3.1 Gen 1, and four USB 2.0, there is a 20 Gbps USB-C header, besides two additional 5 Gbps ports through a standard header.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is thrilled to announce the CVN X870 ARK FROZEN motherboard for the AMD Ryzen 9000 Series processors - COLORFUL's first AMD X870 motherboard. The CVN X870 ARK FROZEN adopts the CVN's signature military-inspired aesthetics.

The CVN X870 ARK FROZEN's design is inspired by aircraft carriers. The motherboard features large frost gray heatsinks and a titanium gray-colored PCB - COLORFUL's first AM5 motherboard to feature the color. Its bright orange accents evoke power and sophistication. The M.2 heatsinks sport lines similar to the runway of the aircraft carrier.

A small number of AMD Ryzen 7 9800X3D CPUs have had trouble starting up on some ASRock AM5 motherboards. The issue was first noticed in February 2025, and both AMD and ASRock immediately looked into the problem. The investigation found that the older BIOS versions on specific ASRock boards had memory compatibility problems. When a Ryzen 7 9800X3D was used, the computer could not complete its normal boot process, known as POST. ASRock quickly released a beta BIOS update to fix the memory issue, and after testing, a final version of the update was made available as of now. Users who update their BIOS should now see the problem disappear. In one case, a report suggested that a Ryzen 7 9800X3D had been damaged. However, further checks showed no burn marks on the motherboard. The issue was simply due to some debris, and after careful cleaning, the motherboard started normally and passed further tests.

AMD pointed out that many reasons can cause a computer to not start up properly, and a POST failure does not always mean the CPU is broken. They advise users to update their BIOS to the newest version available for their motherboard model. If the problem continues even after updating, users should reach out to customer support for help. In a few cases, if the problem cannot be fixed on the spot, the CPU might need to be replaced. This quick fix shows that AMD and ASRock work well together to solve problems. Even though only a few systems were affected, the issue was taken seriously and fixed fast. With the latest BIOS update, users can now expect their systems to boot without trouble, ensuring that the Ryzen 7 9800X3D offers good performance for everyday tasks and gaming.

Successors to AMD's current-generation lineup of Ryzen 8000G desktop APUs are reportedly in the pipeline—according to the latest HXL/9550pro predictive declaration, finalized units could arrive at retail later this year. They propose that an "AMD AM5 New APU" family could arrive alongside an unannounced MSI Unify-X enthusiast-grade motherboard design, within the final quarter of 2025. Press interpretations of this inside track information point to possible upcoming "Ryzen 9000G" processors, utilizing Team Red's Zen 5 and RDNA 3.5 technologies. This potent combination already exists, albeit in mobile form—namely within Team Red's stable of Ryzen AI "Strix Halo, Strix Point," and "Krackan Point" APUs.

Industry experts opine that AMD will most likely deploy high-end "Strix Point" silicon to desktop, or more fancifully: "Gorgon Point." The latter codename turned up via leaks last week. Around early 2024, we witnessed Team Red's transfer of "Phoenix"—from original mobile formats—to their AM5 desktop platform. TechPowerUp's W1zzard evaluated the Ryzen 5 8500G "Phoenix 2" APU last summer; this plucky budget-friendly model sports Zen 4 and Zen 4c cores. Theoretically a flagship "Ryzen 9000G" SKU could emerge with twelve processor cores (4x "Zen 5" + 8x "Zen 5c"), a Radeon 890M iGPU, and an XDNA 2 NPU.

ASUS has readied its first all-in-one water cooler with a built-in curved AMOLED screen called ROG RYUO IV SLC 360 ARGB. The upcoming ASUS ROG RYUO AIO cooler integrates a 6.67-inch 60 Hz AMOLED display for system monitoring, significantly larger than any commercial AIO cooler with a built-in display on the pump/water block combo. The cooler operates at 39.6 dB while its 120 mm fans deliver 71.4 CFM airflow at speeds between 500-2650 RPM through PWM/DC control. A copper water block connected to a 360 mm aluminium radiator forms the thermal transfer system, joined by 200 mm FEP sleeved tubing. Socket compatibility includes current-generation Intel LGA-1851/1700 and AMD AM4/AM5 platforms, with no support for legacy sockets.

The expanded display provides real-time data visualization during intensive computational workloads without requiring additional monitoring software. ASUS plans to release the cooler before the "618" Mid-Year Shopping Festival. While the initial product features a 360 mm radiator, smaller variants may follow for space-constrained builds. No pricing details have been announced. A similar solution to this is TRYX Panorama AIO, which features a 6.5-inch L-shaped 3D screen as well, but ASUS has outdone it with a 6.7-inch screen variant now. We are curious how this cooler will look in real life, and some photos are already available below.

Here are some of the first pictures of the ASUS ROG Crosshair X870E Extreme, the company's new flagship Socket AM5 motherboard. Until now, the company's AMD 800-series chipset motherboard lineup topped off with the ROG Crosshair X870E Hero for connectivity and the ROG Crosshair X870E Apex for overclocking chops, and the company is looking to push things up a notch, especially given that AMD's Ryzen 9000X3D series is established as the fastest processor series for gaming PC builds. This board is designed to compete with the likes of the MSI MEG X870E Godlike and the GIGABYTE X870E AORUS Xtreme. It is firmly into the E-ATX territory in terms of dimensions. The board draws power from a combination of 24-pin ATX, two 8-pin EPS, and an 8-pin PCIe power. It uses the company's most powerful CPU VRM solution for the AMD platform, above even the 22-phase solution of the Hero.

The ASUS ROG Crosshair X870E Extreme comes with a large number of 4-pin PWM fan and water pump headers. Storage connectivity includes one M.2-22110 Gen 5 on the board with a chunky heat pipe-based cooler; a second Gen 5 and two Gen 4 slots on the board, and a DIMM.2 module that provides additional slots. The expansion slots provided are a PCI-Express 5.0 x16 and a second PCI-Express 4.0 x4 (physical x16). There are a boat-load of USB ports, including a couple of 40 Gbps USB4, 20 Gbps USB 3.2 Gen 2x2, and several 10 Gbps and 5 Gbps USB 3.2 ports. Networking interfaces include Wi-Fi 7, a 10 GbE, and a 5 GbE. The board features the company's most premium onboard audio solution that probably combines a Realtek ALC4082 with an ESS ES9219 DAC for the front channels, an audiophile-grade OPAMP, and premium capacitors. The board offers many of the exclusive overclocker-friendly features found in the company's ROG Maximus Extreme motherboards. A star-attraction is its 4-inch true-color display over the VRM heatsinks, which can be programmed to show anything. There is no word on availability or pricing.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, is proud to announce the global launch of the XPG LEVANTE II 360 AIO Liquid Cooler. This cutting-edge cooling solution is designed to set a new benchmark in thermal efficiency and aesthetic appeal, offering gamers and PC enthusiasts the ultimate performance upgrade.

At the heart of the LEVANTE II 360 there's an innovative high-performance dual-chamber pump that delivers exceptional thermal efficiency, handling up to 320W TDP, making it the ideal cooling solution for even the most demanding systems. Whether you're gaming, streaming, or creating, this cooler ensures your CPU stays incredibly cool and performs at its best under pressure.