In no mood to cede its market-share growth to Intel, AMD has reportedly decided to accelerate the development of its next-generation "Zen 5" microarchitecture for debut within 2023. In its mid-2022 presentations, AMD had publicly given "Zen 5" a 2024 release date. This is part of a reading-in-between the lines for a recent GIGABYTE press release announcing server platforms powered by relatively low-cost Ryzen desktop processors. The specific sentence from that release reads "The next generation of AMD Ryzen desktop processors that will come out later this year will also be supported on this AM5 platform, so customers who purchase these servers today have the opportunity to upgrade to the Ryzen 7000 series successor."

While the GIGABYTE press release speaks of a next-generation Ryzen desktop processor, it stands to reason that it is referencing an early release of "Zen 5," and since AMD shares the CPU complex dies (CCDs) between its Ryzen client and EPYC server processors, the company is looking at a two-pronged upgrade to its processor lineup, with its next-generation EPYC "Turin" processor competing with Xeon Scalable "Emerald Rapids," and Ryzen "Granite Ridge" desktop processors taking on Intel's Core "Raptor Lake Refresh" and "Meteor Lake-S" desktop processors. It is rumored that "Zen 5" is being designed for the TSMC 3 nm node, and could see an increase in CPU core count per CCD, up from the present 8. TSMC 3 nm node goes into commercial mass-production in the first half of 2023 as the TSMC N3 node, with a refined N3E node slated for the second half of the year.

A PCB drawing of a possible AMD A620 chipset Micro-ATX motherboard by MSI has surfaced. The drawing looks like that of a product designed to be priced well under the $100-mark. The Socket AM5 motherboard draws power from a 24-pin ATX and 8-pin EPS power connectors. A simple 8-phase VRM with LFPAK discrete MOSFETs condition power for the processor, which is wired to two DDR5 DIMM slots, an M.2 NVMe slot (possibly limited to Gen 4 bandwidth, if not Gen 3); and a PCI-Express x16 with Gen 3 bandwidth, if not Gen 4. The only other expansion slot is a PCI-Express 3.0 x1. There are four SATA ports on offer, Display connectivity appears to include HDMI and D-Sub. 6-channel HD audio and a 1 GbE wired network connection make for the rest of it. AMD is expected to begin rolling out cost-effective motherboard based on the A620 later this week.

Thermaltake today launched the ToughAir 710, a premium dual aluminium fin-stack CPU cooler. Measuring 148.6 mm x 146.6 mm x 165 mm (LxWxH), the TA710 is a massive, heavyweight category cooler (with its weight expected to be around the 1 kg-mark). The cooler features a U-type dual fin-stack design. Seven 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU over a base of the same material, with their ends passing through the two fin-stacks. These are ventilated by a pair of 140 mm fans in push-pull configuration, with the second fan nested between the two stacks.

Each of the two included ToughFan 14 spinners turns at speeds of up to 1,400 RPM, pushing up to 81.96 CFM of airflow at 1.81 mm H₂O static pressure, and 23.9 dBA noise output. The fans are rated for 40,000 hours of use. Thermaltake rates the ToughAir 710 as being capable of handling thermal loads of 250 W. Among the CPU socket types supported are LGA1700, LGA2066, LGA1200, LGA115x, AM5, and AM4. The company didn't reveal pricing.

Cost-effective Socket AM5 motherboards are finally on the horizon, as the first marketing pictures emerged of an ASRock-branded motherboard based on the yet-unreleased AMD A620 chipset. A successor to the A520 and A320, the A620 provides the bare-minimum feature-set for the platform, and cuts out certain premium features such as CPU overclocking. The chipset limits the x16 PEG connection from the processor to Gen 4, although motherboard vendors are free to provide just Gen 3 x16. The CPU-attached M.2 NVMe interface, too, is limited to Gen 4. This ASRock motherboard appears to be offering a Gen 3-capped M.2 NVMe slot, going by the "Hyper M.2" branding that ASRock uses for Gen 3 M.2 slots. The board offers an additional M.2 NVMe slot that's wired to the A620 chipset, and interestingly, an M.2 E-key slot for WLAN modules.

The ASRock A620M-HDV/M.2 from the pictures below, is a Micro-ATX motherboard that draws power from a 24-pin ATX and a single 8-pin EPS. It offers the simplest possible 6-phase CPU VRM, with what look like 50 A DrMOS. Besides the two M.2 NVMe slots, the only storage connectivity on offer are two SATA 6 Gbps ports. Display connectivity include DisplayPort and HDMI. We count at least four type-A USB 3.x ports on the rear I/O, besides one USB type-C, and a USB 3.x internal header. 1 GbE wired networking, and 6-channel HD audio using the most basic CODEC, make for the rest of the connectivity. An interesting touch is USB BIOS Flashback, with a button on the rear I/O, which sets even the oldest inventories of this board up for future-generation Socket AM5 Ryzen processors. Motherboards based on the A620 are expected to be priced well under the $100-mark.

Despite the fact that AMD promised that $125 AM5 are coming, there aren't many such motherboards on the market. The newest addition is the Gigabyte B650M K, which is now available at $124.99. Gigabyte's B650M K will be joining the previously available ASRock B650M-HDV/M.2 microATX motherboard, which was the first B650-based motherboard available at $125.

Same as the ASRock motherboard, the Gigabyte B650M K is also a micro-ATX motherboard with the same 8+2+1 VRM, but features four DIMM slots with support for up to 128 GB of DDR5-6400+ memory. Unfortunately, it apparently features two PCIe 4.0 M.2 slots, rather than a PCIe 5.0 x4, and comes with a single PCI-Express 4.0 x16 slot (in addition to the PCIe 3.0 x1). The rest of the specifications include Realtek's Audio, Realtek 2.5 Gb Ethernet, couple of USB 3.2 Gen 2 Type-C, Type-A, and USB 2.0/1.1 ports, as well as DisplayPort 1.4 and HDMI 2.1 outputs. Bear in mind that both of these are $139.99 motherboards, discounted down to $124.99, so hopefully, we'll see more of these $124.99 motherboards soon.

ASRock today introduced the Blazing M.2 Gen 5 Fan-Heatsink, an active cooling solution for M.2 Gen 5 SSDs, and meant to be paired with the company's Socket AM5 and LGA1700 motherboards that have Gen 5 M.2 slots. The cooler is a 5 cm-tall hunk of extruded aluminium with a 30 mm fan ventilating it at roughly 5 CFM. There are five types of these coolers, each suitable for a particular type of ASRock motherboards. These coolers have been out since December 2022 as inclusions in motherboards, however, ASRock released the types 3, 4, and 5 (from the table below) today. The cooler is said to significantly lower temperatures of SSD controllers, minimizing performance losses to thermal throttling. These coolers are expected to be priced around $30 a pop.

While Intel 600- and 700-series chipset motherboard already support non-binary memory modules and kits, such support has yet to be implemented on AMD's AM5 motherboard, but, judging from screenshots posted on ASUS ROG forums, AMD motherboard partners are working on it and it should be just around the corner.

The screenshot from ASUS Tech Marketing person, named Raja, which was posted on ASUS ROG forums, shows the ASUS ROG STRIX X670-E motherboard running 192 GB of DDR5 memory. These are four 48 GB Corsair modules running at 2600 MHz (5200 MT/s). The post includes both CPU-Z and task manager screenshots, confirming it boots into Windows. Earlier, it has been reported that AMD motherboards can't boot into Windows with non-binary memory modules and kits, although the motherboard successfully recognizes it. There have also been rumors that AMD is working on an AGESA update that will fix this issue, and now, it looks like it could be coming sooner than we expected.

AMD is working on the AGESA 1.0.0.7 BIOS update that should resolve issues and bring support for 24 GB and 48 GB DDR5 memory modules and kits on the AM5 platform. The latest report, coming from Twitter, suggest that AMD is working hard on the AGESA release, so motherboard manufacturers could push BIOS updates early next month or in May. While Intel's 600- and 700-series motherboards are happily working with 24 GB and 48 GB DDR5 memory modules and kits, allowing users to use up to 192 GB (4x48 GB) of memory in their systems, it comes as a surprise that AMD did not release an official, or even a BETA BIOS update for such modules.

There were already reports that such 24 GB and 48 GB DDR5 modules are having issues on AMD's AM5 platform and while the BIOS can detect the memory, it simply will not boot into Windows. This latest report originally comes from hardware leaker chi11eddog over at Twitter, and suggests that AMD and its motherboard partners are well aware of the issue and the AGESA BIOS firmware v1.0.0.7 should bring full support for so-called "non-binary" 24 GB and 48 GB DDR5 memory modules.

Thermalright introduced the Ryzen Mounting System upgrade kit that lends support for Socket AM5 and AM4 to many of its legacy coolers, letting you orient them the correct way. There are two types of these upgrade kits, that support two different kinds of Thermalright's coolers. The TR-AM5-A kit is meant for TRUE Spirit 90 series, Archon IB-E X2 series, Silver Arrow ITX, TRUE Spirit 140 series, and TRUE Spirit 90 series. The TR-AM5-B kit, on the other hand, is meant for the Silver Arrow SB-E series, AXP-200 R, AXP-200 Macho, Archon SB-E, and Silver Arrow ITX-R. These kits aren't free, and when they go on sale later this month, they will be priced around $9.99.

Jonsbo today released the HX5230, a mid-range tower-type CPU cooler. The cooler features an all-black tower-type design, Five 6 mm-thick nickel-plated copper heatpipes make indirect contact with the processor over a mirror-finish copper base, conveying heat through the anodized aluminium fin-stack, which is ventilated by a 120 mm fan. The fin-stack is capped by a die-cast aluminium top-plate that has a premium brushed-metal appearance. The included fan features a fluid-dynamic bearing, takes in 4-pin PWM input, and turns at speeds ranging between 700 to 1,800 RPM, pushing up to 83.04 CFM of airflow, at up to 2.68 mm H₂O static pressure, and up to 37.6 dBA noise output. Jonsbo claims that the HX5230 can handle thermal loads of up to 230 W. With its fan in place, the cooler measures 128 mm x 75 mm x 158 mm (WxDxH), weighing 704 g. Among the socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

Jonsbo today unveiled the HP400S-New, a top-flow, low-profile CPU cooler with a claimed thermal capacity of 140 W, and with a height of just 40 mm. A major revision of the HP400S from February 2022, the "-New" revision uses a thicker fin-stack and a faster fan. The cooler uses a dense aluminium fin-stack heatsink with a C-type design. Four 6 mm-thick nickel-plated copper heatpipes make direct contact with the CPU at the base, conveying heat to an aluminium fin-stack arranged along the plane of the motherboard. This is then ventilated by a 15 mm-thick 90 mm fan that turns between 900—3,000 RPM, with 12.59—38.18 CFM of airflow, and 20.2—34 dBA noise output. With the fan in place, the cooler measures all of 103 mm x 92 mm x 40 mm, weighing 350 g. Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GELID Solutions unveils the new GELID Liquid 240 Ultimate AIO CPU Cooler as a product of the GELID Solutions GAMER product line. The epitome of superior liquid cooling technologies the GELID Liquid 240. Ultimate cooling performance is provided by its premium-class high-density radiator, connected with two 120 mm quiet fans (Smart ARGB PWM control) and high-class water pump with the most demanding modern needs being handled by the integrated cooling.

The low noise water pump includes a temperature display. Further the 2 ARGB PWM Fans provide 750-1800 RPM and low noise level at 29.6dBA, AIO240 is the masterpiece of top-notch liquid cooling technologies. The all-in-one cooling handles the latest requirements, even the most powerful LGA 1700 CPU from Intel( ) and AM5 from AMD, a truely multi compatible All-in-One CPU water cooler. The support of TDP over 240 W makes the GELID Liquid 240 an overkill CPU AIO cooling solution for pro gamers and overclockers.

ASUS began rolling out Beta UEFI firmware updates for its Socket AM5 motherboards encapsulating AGESA 1.0.0.5 patch-C microcode. This exposes several new options to end-users through the UEFI Setup Program, which gives them greater control over the way the processor prioritizes workload among the two CCDs (CPU complex dies) on 12-core and 16-core Ryzen 7000 series processors, including the upcoming 7000X3D processors.

While AMD is working to release Chipset Software updates that include "3D V-cache Optimization driver" components that introduce OS-level awareness of the asymmetric implementation of 3D V-cache on the 7900X3D and 7950X3D where only one of the two CCDs has the additional cache; these firmware-level options give users control on prioritizing one CCD over the other for workload. The firmware-level optimization is OS-agnostic, so pretty much any OS should benefit from 3D V-cache the way it was intended (where less parallelized workloads such as games are prioritized on the CCD with the 3D V-cache.

Dynatron focuses on server/workstation cooling solutions, and developed the A49, a Socket AM5 cooler with a dual aluminium fin-stack heatsink that's designed to work with 4U rackmount cases, although it will fit inside ATX tower cases just fine, with its 130 mm height. Two dense aluminium-alloy fin-stacks are skewered by six 6 mm-thick copper heat pipes that make direct contact with the processor over a high-performance thermal pad. The heatsink is ventilated by a custom 103 mm x 103 mm x 30 mm fan that turns at speeds of up to 1800 RPM, pushing up to 35.03 CFM of airflow at 28.8 dBA noise output, and 1.16 mm H₂O static pressure. Dynatron says the cooler can handle thermal loads of up to 170 W. The cooler measures 95 mm x 95 mm x 130 mm, weighing 710 g.

EK, the leading liquid cooling gear manufacturer, is announcing the availability of two high-performance liquid cooling solutions for the AMD Ryzen processor family based on the AMD AM5 socket. These single-socket AM5 water blocks are available in both the standard and the 1U-compatible format designed specifically for server racks.

EK-Pro CPU WB AM5 Ni + Inox
Being a dedicated workstation-grade water block for AMD AM5 processors, the EK-Pro CPU WB AM5 Ni + Inox water block features two standard G1/4" threaded ports on its top. Built with performance, reliability, serviceability, and no compromises in mind, this enterprise-grade cooling solution is intended for desktops, workstations, and taller server racks. The water block's top is CNC-machined from durable black POM Acetal, and the hold-down bracket is made of laser-cut stainless steel.

Raijintek today introduced the Forkis DDC Ultra, a CPU water block with an integrated pump, with which you can connect a DIY liquid cooling loop using your own fittings. With its retention module in place, it measures 80 mm x 84 mm x 45 mm (WxDxH), and features a nickel-plated copper cold-plate. Right above it is the POM+aluminium casing, which contains a DDC Ultra pump with 150 kPa (21.7 PSI) pressure, and 3.8 m (13 ft) head, and 750 L/h discharge rate; along with a ceramic bearing that's rated for 50,000 hours. The cold-plate features a large microfin lattice throughout its inner surface, so the block is even optimized for MCMs such as the Ryzen 7000 "Raphael." The block has threads for standard G 1/4" (fittings not included). Among the CPU socket types supported are LGA1700, LGA1200, AM5, and AM4. The company didn't reveal pricing.

AMD today announced the retail channel pricing of its upcoming Ryzen 7000X3D "Zen 4" line of high-performance Socket AM5 desktop processors. These processors introduce the 3D Vertical Cache (3DV cache) technology, which the company claims has a significant impact on gaming performance, making them perform competitively with 13th Gen Core "Raptor Lake" processors, including the fastest i9-13900K, and possibly even the i9-13900KS. AMD announced retail availability from February 28, 2023 for the Ryzen 9 7950X3D and 7900X3D. The Ryzen 7 7800X3D launches on April 6, 2023.

The Ryzen 7 7800X3D 8-core/16-thread processor is priced at USD $449. The 12-core/24-thread Ryzen 9 7900X3D is priced at $599. The flagship 16-core/32-thread Ryzen 9 7950X3D is priced at $699. The 7800X3D launches at a $50 higher price than the $399 price that the Ryzen 7 7700X launched at, before settling down at $349. The 7900X3D launches at $599, which again is a $50 premium over the launch price of the Ryzen 9 7900X—currently going for $475. The top-dog 7950X3D launches at the same $699 price that the 7950X launched at, which has its price slashed all the way down to $575.A video presentation by AMD follows.

EK, the premium liquid cooling gear manufacturer, is releasing a new AMD AM5 socket-based monoblock, the EK-Quantum Momentum² ROG Crosshair X670E Hero D-RGB - Plexi. The monoblock is engineered specifically for the ROG Crosshair X670E HERO motherboard from ASUS. It features addressable D-RGB LEDs compatible with ASUS Aura Sync RGB control and offers a full lighting customization experience for every single diode at any given time. This Quantum monoblock is EK-Matrix7 compliant and allows the use of the stock I/O shield with LED implementation.

This is a complete, all-in-one (CPU and motherboard) liquid cooling solution for AMD's Ryzen 7000-series processors compatible with the AM5 socket on the ROG Crosshair X670E Hero motherboard. The monoblock packs the latest generation Velocity² cooling engine to ensure the best possible CPU cooling without reducing flow to other components. It directly cools the AMD Ryzen 7000-series CPU and VRM section.

According to HKEPC, AMD is set to introduce two versions of the A620 chipset for its lower-end motherboards, providing a lower barrier of AM5 entry for users on a smaller budget. As the new source notes, AMD is going to use its Promontory 21 (PROM21) module for A620 motherboards, the same one used on B650 and X670 models. However, for the first time, we are hearing about Promontory 22 (PROM22), a module that will allow A620-based motherboards to start at 125 US dollars—a promise made by AMD in its marketing slides (which you can see below). Two A620 chipsets will enable users to choose basic functionality or some additional features on a reasonable budget.

With PROM21 going inside all chipset SKUs, it carries silicon functionality disabled by AMD to create different categories. However, the PROM22 is a new silicon that doesn't need bells and whistles of the high-end boards inside a feature-deprived chipset like A620. This drives down AMD's costs, making it easier for vendors to adjust pricing. We have to wait for the launch and see how much of this will be fulfilled, so stay tuned for further updates.

Akasa today introduced the AK-CC1110EP01, a low-profile CPU cooler capable of handling thermal loads of up to 65 W, and supporting AMD sockets AM5 and AM4. The cooler features a classic top-flow design, with an extruded aluminium monoblock heatsink, and a low-profile 80 mm fan. The heatsink is made entirely of copper, and comes with a pre-applied TIM. The factory-fitted 80 mm fan is just 10.8 mm thick, takes in 4-pin PWM connection, turns at speeds ranging between 600 to 3,000 RPM, pushing up to 26.53 CFM of airflow, at 1.81 mm H₂O static-pressure, and up to 27.09 dBA noise output. Measuring 80 mm x 80 mm x 41.3 mm, the cooler weighs 222 g. The company didn't reveal pricing.

Noctua today presented the latest addition to its successful NH-L9 series of low-profile CPU coolers: At a height of only 37 mm, the new NH-L9a-AM5 and NH-L9a-AM5 chromax.black are an excellent choice for quiet, ultra-compact HTPCs or Small Form Factor (SFF) systems using AMD's latest, AM5-based Ryzen processors.

"AMD's just-released 65 W Ryzen CPUs are ideal for building small yet highly powerful systems, and our new NH-L9a-AM5 is the perfect cooler to match", explains Roland Mossig (CEO). "It can easily cool the new 7900, 7700 and 7600 at ultra-quiet fan speeds and offers plenty of headroom if customers want to push them beyond 65 W - we've actually been running up to 130 W on the Ryzen 7950X and 7900X!" Since the original NH-L9a coolers for AM3 and AM4 have received more than 100 awards and recommendations from international hardware websites and magazines, the new AM5 revision builds on the same proven heatsink design to provide excellent low-profile cooling performance for AMD's latest Ryzen processors.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.