AMD today announced the retail channel pricing of its upcoming Ryzen 7000X3D "Zen 4" line of high-performance Socket AM5 desktop processors. These processors introduce the 3D Vertical Cache (3DV cache) technology, which the company claims has a significant impact on gaming performance, making them perform competitively with 13th Gen Core "Raptor Lake" processors, including the fastest i9-13900K, and possibly even the i9-13900KS. AMD announced retail availability from February 28, 2023 for the Ryzen 9 7950X3D and 7900X3D. The Ryzen 7 7800X3D launches on April 6, 2023.

The Ryzen 7 7800X3D 8-core/16-thread processor is priced at USD $449. The 12-core/24-thread Ryzen 9 7900X3D is priced at $599. The flagship 16-core/32-thread Ryzen 9 7950X3D is priced at $699. The 7800X3D launches at a $50 higher price than the $399 price that the Ryzen 7 7700X launched at, before settling down at $349. The 7900X3D launches at $599, which again is a $50 premium over the launch price of the Ryzen 9 7900X—currently going for $475. The top-dog 7950X3D launches at the same $699 price that the 7950X launched at, which has its price slashed all the way down to $575.A video presentation by AMD follows.

EK, the premium liquid cooling gear manufacturer, is releasing a new AMD AM5 socket-based monoblock, the EK-Quantum Momentum² ROG Crosshair X670E Hero D-RGB - Plexi. The monoblock is engineered specifically for the ROG Crosshair X670E HERO motherboard from ASUS. It features addressable D-RGB LEDs compatible with ASUS Aura Sync RGB control and offers a full lighting customization experience for every single diode at any given time. This Quantum monoblock is EK-Matrix7 compliant and allows the use of the stock I/O shield with LED implementation.

This is a complete, all-in-one (CPU and motherboard) liquid cooling solution for AMD's Ryzen 7000-series processors compatible with the AM5 socket on the ROG Crosshair X670E Hero motherboard. The monoblock packs the latest generation Velocity² cooling engine to ensure the best possible CPU cooling without reducing flow to other components. It directly cools the AMD Ryzen 7000-series CPU and VRM section.

According to HKEPC, AMD is set to introduce two versions of the A620 chipset for its lower-end motherboards, providing a lower barrier of AM5 entry for users on a smaller budget. As the new source notes, AMD is going to use its Promontory 21 (PROM21) module for A620 motherboards, the same one used on B650 and X670 models. However, for the first time, we are hearing about Promontory 22 (PROM22), a module that will allow A620-based motherboards to start at 125 US dollars—a promise made by AMD in its marketing slides (which you can see below). Two A620 chipsets will enable users to choose basic functionality or some additional features on a reasonable budget.

With PROM21 going inside all chipset SKUs, it carries silicon functionality disabled by AMD to create different categories. However, the PROM22 is a new silicon that doesn't need bells and whistles of the high-end boards inside a feature-deprived chipset like A620. This drives down AMD's costs, making it easier for vendors to adjust pricing. We have to wait for the launch and see how much of this will be fulfilled, so stay tuned for further updates.

Akasa today introduced the AK-CC1110EP01, a low-profile CPU cooler capable of handling thermal loads of up to 65 W, and supporting AMD sockets AM5 and AM4. The cooler features a classic top-flow design, with an extruded aluminium monoblock heatsink, and a low-profile 80 mm fan. The heatsink is made entirely of copper, and comes with a pre-applied TIM. The factory-fitted 80 mm fan is just 10.8 mm thick, takes in 4-pin PWM connection, turns at speeds ranging between 600 to 3,000 RPM, pushing up to 26.53 CFM of airflow, at 1.81 mm H₂O static-pressure, and up to 27.09 dBA noise output. Measuring 80 mm x 80 mm x 41.3 mm, the cooler weighs 222 g. The company didn't reveal pricing.

Noctua today presented the latest addition to its successful NH-L9 series of low-profile CPU coolers: At a height of only 37 mm, the new NH-L9a-AM5 and NH-L9a-AM5 chromax.black are an excellent choice for quiet, ultra-compact HTPCs or Small Form Factor (SFF) systems using AMD's latest, AM5-based Ryzen processors.

"AMD's just-released 65 W Ryzen CPUs are ideal for building small yet highly powerful systems, and our new NH-L9a-AM5 is the perfect cooler to match", explains Roland Mossig (CEO). "It can easily cool the new 7900, 7700 and 7600 at ultra-quiet fan speeds and offers plenty of headroom if customers want to push them beyond 65 W - we've actually been running up to 130 W on the Ryzen 7950X and 7900X!" Since the original NH-L9a coolers for AM3 and AM4 have received more than 100 awards and recommendations from international hardware websites and magazines, the new AM5 revision builds on the same proven heatsink design to provide excellent low-profile cooling performance for AMD's latest Ryzen processors.

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

At the 2023 International CES, Cooler Master showed off a unique all-in-one liquid closed-loop CPU cooler that features user-replaceable pump-block covers, the MasterLiquid Atmos. The top cover of the pump-block comes off, so you can replace it with something with a different shape or color. Examples of these covers include a frosty-white cover made of recycled plastic resin, or a tinted acrylic diffuser. Underneath is a white silicone diffuser for an ARGB lighting element. The lighting extends to the included Cooler Master Sickleflow ARGB fans.

The MasterLiquid Atmos model shown at CES was the ML360 Atmos, featuring a 360 mm x 120 mm radiator with a trio of Sickleflow ARGB fans. These fans come pre-installed on the radiator, to minimize packaging waste. The ML360 Atmos uses a dual-chamber pump-block, which features CM's Gen 2 ARGB lighting. The company didn't go into the technical details of the fan, but mentioned its top speed to be 2,400 RPM. The MasterLiquid Atmos series comes in two variants, 240 mm and 360 mm. Among the CPU socket types supported are LGA1700, LGA1200, AM5, and AM4.

The Cooler Master Hyper 212 series over the years has become synonymous with aftermarket CPU cooling, as possibly the most popular custom CPU cooler. The company modernized it over the years with new heatsink and fan technologies, and it's has undergone a major design- and tech overhaul with the new Hyper 212 Halo. It retains the conventional aluminium fin-stack (type-U) design, with four 6 mm-thick copper heatpipes making direct contact with the CPU at the base, conveying heat to an aluminium fin-stack heatsink that's been capped off with a die-cast aluminium top-plate. The included 120 mm Halo fan features rifle-bearings rated for over 160,000 hours, and features two sets of addressable-RGB LEDs—along the bore of the fan-frame, and the impeller hub. The fan turns at speeds ranging between 650 to 2,050 RPM, pushing up to 51.88 CFM of airflow at 2.89 mm H₂O static-pressure, and 27 dBA maximum noise output. As part of its design modernization, the Hyper 212 Halo gets support for the latest Sockets LGA1700 and AM5.

At the 2023 International CES, Cooler Master showed off two of its latest premium dual fin-stack (type-D) air CPU coolers, the MasterAir MA826 Stealth, and the Hyper 662 Halo. The MA826 Stealth is, unsurprisingly, the more upmarket of the two, and measures 162.2 mm x 150.6 mm x 165.6 mm (LxWxH). A nickel-plated copper base makes contact with the processor. From here eight 6 mm-thick composite-material "superconductive" heatpipes make their way to two aluminium fin-stacks, which are then ventilated by two Mobius series fans—a 120 mm "push" fan, and a 135 mm conveyor fan located between the two fin-stacks. The two stacks are capped off by a die-cast aluminium top-plate. Both fans feature loop dynamic bearings that are rated for over 200,000 hours operation.

The Hyper 662 Halo leads the company's immensely popular Hyper series that's synonymous with aftermarket CPU cooling. This cooler comes in all-white and all-black trims, and is visibly smaller than the MA826 Stealth. It features the same nickel-plated copper base, but with six heatpipes making their way to the two fin-stacks, and a pair of 120 mm fans handling the ventilation. The fans feature two ARGB LED zones (along the bore of the frame and inside the impeller hub), which is where the Holo name derives from. Both coolers support the latest CPU socket types, including LGA1700 and AM5.

Wizmax by Micronics introduced a handful new CPU coolers and purpose-build heatsinks at the 2023 International CES. The CPU cooler lineup is led by the MA Frigate series. The MA4 Frigate, a thick single aluminium fin-stack tower-type cooler. Five 6 mm-thick copper heatpipes make direct contact with the CPU at the base, conveying heat through a thick aluminium fin-stack, which is ventilated by a custom-design 130 mm fan. With this fan in place, the cooler measures 132 mm x 95 mm x 156.4 mm (WxDxH), weighing 990 g. The fan turns at speeds of up to 1,500 RPM, pushing up to 71.7 CFM of airflow at 1.9 mm H₂O static-pressure. The MA4 Frigate is rated for handling thermal loads of up to 210 W.

The Wizmax MA6 Frigate is the larger sibling, with a type-D dual fin-stack design. Six 6 mm-thick nickel-plated copper heatpipes make indirect contact with the CPU through a copper base, conveying heat to two fin-stacks, which are ventilated by a pair of 140 mm fans in push-pull arrangement. One-third of the fins in the two fin-stacks are made of copper, and the rest aluminium. Each of the two 140 mm fans turns at speeds of up to 1,500 RPM, pushing up to 83 CFM of airflow at 2.2 mm H₂O. With the fans in place, the cooler measures 146 mm x 165 mm x 165 mm (WxDxH), weighing 1.6 kg. The MA6 Frigate is rated for 250 W thermal loads. Both coolers support the latest CPU socket types, including AM5 and LGA1700.

The online datasheets of some of the first AMD Ryzen 7040 series "Phoenix Point" mobile processors went live, detailing the processor's I/O feature-set. We learn that AMD has decided to give PCI-Express Gen 5 a skip with this silicon, at least in its mobile avatar. The Ryzen 7040 SoC puts out a total of 20 PCI-Express Gen 4 lanes, all of which are "usable" (i.e. don't count 4 lanes toward chipset-bus). This would mean that the silicon has a full PCI-Express 4.0 x16 interface for discrete graphics, and a PCI-Express 4.0 x4 link for a CPU-attached M.2 NVMe slot; unlike the "Raphael" desktop MCM and the "Dragon Range" mobile MCM, whose client I/O dies put out a total of 28 Gen 5 lanes (24 usable, with x16 PEG + two x4 toward CPU-attached M.2 slots).

Another interesting aspect about "Phoenix Point" is its memory controllers. The SoC features a dual-channel (four sub-channel) DDR5 memory interface, besides support for LPDDR5 and LPDDR5x. DDR5-5600 and LPDDR5-7600 are the native speeds supported. What's really interesting is the maximum amount of memory supported, which stands at 256 GB—double that of "Raphael" and "Dragon Range," which top out at 128 GB. This bodes well for the eventual Socket AM5 APUs AMD will design based on the "Phoenix Point" silicon. Older Ryzen 5000G "Cezanne" desktop APUs are known for superior memory overclocking capabilities to 5000X "Vermeer," with the monolithic nature of the silicon favoring latencies. Something similar could be expected from "Phoenix Point."

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

Here's the first look at the retail PIB package of an AMD Ryzen 9 7950X3D processor with 3D Vertical Cache technology. These chips come in box design that's distinct from the rest of the Ryzen 7000 lineup. Bright orange and silver accents make up the front face of the box, with "3D Vertical Cache technology" being mentioned prominently. With the Ryzen 7 5800X3D, the PIB package design was probably found to look too similar to the rest of the lineup and practically indistinguishable from those of the 5000G "Cezanne" desktop APUs, which is probably why AMD took this route.

It's very likely that we'll see Socket AM5 desktop APUs based on the "Phoenix Point" monolithic silicon later this year, with its 12 CU RDNA3 iGPU and 8-core/16-thread "Zen 4" CPU that has a 32 MB on-die L3 cache. These processors will have yet another distinguishable retail PIB packaging. AMD's then technical marketing director, Robert Hallock, assured us that the company will continue to invest in desktop APUs (processors with powerful iGPUs), despite Ryzen 7000 desktop processors coming with a low-power iGPU as standard.

MSI announcing today a new lineup of AMD Ryzen 7000 Series processors that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen CPU will include the AMD Ryzen 9 7900, Ryzen 7 7700, and the Ryzen 5 7600 which will have a default TDP of 65 W. Even with a lower TDP, these CPUs will up to 12 cores and 24 threads as their respective CPUs and be able to hit their theoretical max boost clock of over 5 GHz. All X670 and B650 motherboards from MSI will be compatible and ready at launch with the newest BIOS version "AGESA COMBO PI-1.0.0.4" update.

MSI has 3 unique features to help users to overclock their systems which are called Performance Switch, PBO Thermal Point, and Config TDP with the new launch of AMD Ryzen 7000 Series processors. Earlier this year, MSI introduced a brand-new function called Performance Switch within the MSI BIOS. Performance Switch provides 3 levels of preset and an advanced option for users to choose from. Then combines both AMD's default PBO "Precision Boost Overdrive" and MSI's OC settings to provide a much higher CPU performance in both single-core and multi-core.

Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

AMD today announced its Ryzen 7000X3D "Zen 4" desktop processors with 3D Vertical Cache technology. With these, the company is claiming to have the world's fastest processors for gaming. The company claims to have beaten the Intel Core i9-13900K "Raptor Lake" in gaming, by a margin it feels comfortable to remain competitive with against even the upcoming Core i9-13900KS. At the heart of these processors is the new "Zen 4" 3D Vertical Cache (3DV cache) CCD, which features 64 MB of L3 cache stacked on top of the region of the "Zen 4" CCD that has the on-die 32 MB L3 cache. The 3DV cache runs at the same speed as the on-die L3 cache, and is contiguous with it. The CPU cores see 96 MB of transparent addressable L3 cache.

3DV cache is proven to have a profound impact on gaming performance with the Ryzen 7 5800X3D "Zen 3" processor that helped it beat "Alder Lake" in gaming workloads despite "Zen 3" being a generationally older microarchitecture; and AMD claims to have repeated this magic with the 7000X3D "Zen 4" series, enabling it to beat Intel "Raptor Lake." Unlike with the 5800X3D, AMD don't intend to make gaming performance a trade-off for multi-threaded creator performance, and so it is introducing even 12-core and 16-core SKUs, so you get gaming performance alongside plenty of muscle for creator workloads.

EK, the premium liquid cooling gear manufacturer, is releasing yet another unique pump-reservoir-water block combo. This time for AMD AM5 Socket, Ryzen 7000-series CPUs, and AM5 socket-based motherboards. It features the latest socket-specific EK-Quantum Velocity² cooling engine, while the CPU water block has an integrated DDC 4.2 PWM pump that is cooled by the metal part of the water block acting as a heatsink. The combo is the perfect companion for ITX (SFF) builds where space for a dedicated pump and reservoir is an issue. This product effectively combines four different products into a single small enclosure for ultimate space-saving.

The product combines a Velocity² CPU water block, a genuine DDC 4.2 PWM pump with a reservoir, and a DDC heatsink. All this is contained in an assembly significantly smaller than the sum of its parts. A total of four products in a footprint of a hefty CPU water block that fits perfectly. EK-Quantum Velocity² series CPU water blocks embed the next-generation cooling engine. They use a specific combination of mounting pressure and coldplate geometry tailored for the IHS and chiplet layout of AMD AM5 socket processors. Low hydraulic flow restriction enables these products to be used in setups with weaker water pumps or lower pump speeds for added silent operation while still being able to easily achieve top performance. The lathe-turned coldplate is made with precision to cover the IHS effectively and put pressure on the die area.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B650M-SILVER motherboard. Designed based on the AMD M5 socket, the B650M-SILVER motherboard is fully stacked to enable the latest Ryzen 7000 series processors. Leveraging the latest DDR5 memory technology, it performs exceptionally well at any given task, powered by advanced design elements like support for both AMD EXPO and Intel XMP RAM modules.

The B650M-SILVER, despite its Micro-ATX form factor, offers top-shelf features like a PCI-E Gen4 x16 slot with iron protection. The SILVER series motherboard combines 14 phase (10+2+2) power design with a 90 A power stage VRM solution to match today's power-hungry hardware, thanks to the company's signature DIGITAL PWM and 90 A Dr.MOS technologies.

Cougar introduced the Forza 50 Essential and Forza 85 Essential tower-type CPU coolers. The Forza 50 is the lighter and slimmer of the two, with a fin-stack thickness of 50 mm, while the Forza 85 Essential has an 85 mm-thick fin-stack, hence the names. The Forza 50 Essential uses a heatpipe direct-touch (HDT) base, and relies on four 6 mm-thick copper heatpipes to pull heat from the CPU, and convey it through the fin-stack, while the Forza 85 Essential has six of these for the job, but through a nickel-plated copper base-plate.

Both models include a Cougar NHP120 fan. This 120 mm spinner takes in 4-pin PWM input, spins at speeds of up to 2,000 RPM, pushing up to 84.48 CFM of airflow at 4.24 mm H₂O static-pressure, and up to 34.5 dBA noise output. The fans feature hydraulic bearings. With the fan in place, the Forza 50 Essential measures 135 mm x 75 mm x 155 mm (WxDxH) weighing 772 g, while the Forza 85 Essential measures 135 mm x 110 mm x 155 mm, weighing 1.13 kg. Among the CPU socket types supported by both are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

Ahead of their market debut early January, we got confirmation of the specifications of the three upcoming AMD Ryzen 7000 series non-X processor SKUs. There will indeed only be three new SKUs, the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900; and no 16-core part. All three SKUs have their TDP rated at 65 W, which means that their PIB (processor in box) retail packages will include a stock cooling solution. The 7600 comes with a Wraith Stealth cooler that's capable of handling thermal loads of 65 W TDP processors at stock speeds; while the 7700 and 7900 will include a feature-packed Wraith Prism RGB cooler that's designed for 140 W TDP processors. Since Socket AM5 has cooler compatibility with AM4, AMD could simply be reusing the same coolers it packed with past-generation Ryzen processors.

The Ryzen 5 7600 comes with an MSRP of USD $229, clock speeds of up to 5.10 GHz boost, and targets the likes of the Intel Core i5-13600 or i5-12600. The $329 MSRP Ryzen 7 7700 ticks at speeds of up to 5.30 GHz boost, and is designed to compete with the Core i7-13700 or i7-12700. The Ryzen 9 7900 has an interesting price tag of $429 (MSRP), ticks at speeds of up to 5.40 GHz boost, and purportedly competes against the Core i9-13900 (non-K) and i9-12900. The three chips should be drop-in compatible with Socket AM5 motherboards being sold right now, likely with no need for a BIOS update. Although launch of these three SKUs in January is certain, the company might use the 2023 International CES keynote address by its CEO Dr Lisa Su to either tease or announce the Ryzen 7000X3D processors featuring 3D Vertical Cache memory, which is known to boost gaming performance.

Thermalright today introduced the Assassin X 90 SE, a compact tower-type CPU cooler designed to replace the stock CPU cooling solution with something that's quieter at stock frequencies. The aluminium fin tower-type cooler features a typical design for its kind—four 6 mm-thick nickel-plated copper heat pipes make direct contact with the CPU at an aluminium base; with their ends passing through an aluminium fin-stack that's capped off by a die-case top-plate. This is then ventilated by an included Thermalright TL-G9B 92 mm PWM fan.

The defining feature is the cooler's height of just 118 mm. With its fan in place, the cooler measures 94 mm x 77 mm x 118 mm, weighing 445 g. The included 92 mm fan features fluid dynamic bearing, takes in 4-pin PWM input, turns at speeds of up to 2,400 RPM, pushing up to 43 CFM of airflow at 1.51 mm H₂O pressure, and has a noise output of 27.3 dBA. Among the CPU socket types supported are LGA1700, AM5, AM4, and LGA1200. The company didn't reveal pricing.

AMD is planning to give its Ryzen 7000 "Zen 4" Socket AM5 desktop processor lineup a significant expansion in January, as rival Intel plans to do the same with its 13th Gen Core "Raptor Lake." AMD's lineup expansion will be in both directions—toward the higher end with its 7000X3D series; and toward the lower end, with its 7000 non-X series. It is now becoming clear that the 7000 non-X series will see a retail-channel launch, and won't be relegated to the OEM/SI channel. This would mean boxed versions of these processors, probably including a stock cooling solution.

The Ryzen 7000 non-X series in the retail channel is expected to include the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900. The defining feature of these SKUs is their significantly lower TDP of just 65 W, which would put their PPT (package power tracking) value around 90 W. Their maximum boost frequencies are still north of the 5 GHz-mark, with the 7600 boosting up to 5.10 GHz, the 7700 going up to 5.30 GHz and the 7900 up to 5.40 GHz, however their base frequencies are significantly lower, with the 7600 around 3.80 GHz, the 7700 and 7900 between 3.60-3.80 GHz. The three are expected to feature aggressive power-management to meet their lower power limits, which should also lower their cooling requirements. Wccftech predicts that AMD could announce these processors in its January 4 International CES Keynote address, followed by availability on January 10. In related news, the 7000X3D could see an announcement in the same January 4 keynote, but with a slightly later product availability date.

AMD is firing full cylinders to release a new line of Ryzen 7000-series "Zen 4" Socket AM5 desktop processors featuring 3D Vertical Cache, at the earliest. Faced with a significant drop in demand due to the slump in the PC industry, and renewed competition from Intel in the form of its 13th Gen Core "Raptor Lake" processors, the company is looking to launch the Ryzen 7000X3D desktop processors within January 2023, with product unveiling expected at AMD's 2023 International CES event. The 3D Vertical Cache technology had a profound impact on the gaming performance of the older "Zen 3" architecture, bringing it up to levels competitive with those of the 12th Gen Core "Alder Lake" processors, and while gaming performance of the Ryzen 7000 "Zen 4" processors launched till take match or beat "Alder Lake," they fall behind those of the 13th Gen "Raptor Lake," which is exactly what AMD hopes to remedy with the Ryzen 7000X3D series.

In a report, Korean tech publication Quasar Zone states that AMD is planning to release 16-core/32-thread, 12-core/24-thread, and 8-core/16-thread SKUs in the Ryzen 7000X3D series. These would use one or two "Zen 4" chiplets with stacked 3D Vertical Cache memory. A large amount of cache memory operating at the same speed as the on-die L3 cache, is made contiguous with it and stacked on top of the region of the CCD (chiplet) that has the L3 cache, while the region with the CPU cores has structural silicon that conveys heat to the surface. On "Zen 3," the 32 MB on-die cache is appended with 64 MB of stacked cache memory operating at the same speed, giving the processor 96 MB of L3 cache that's uniformly accessible by all CPU cores on the CCD. This large cache memory positively impacts gaming performance on the Ryzen 7 5800X3D in comparison to the 5800X; and a similar uplift is expected for the 7000X3D series over their regular 7000-series counterparts.

MONTECH, an innovative PC components and peripherals brand, announces the Metal DT24 BASE and DT24 PREMIUM, dual tower CPU coolers equipped with 2x METAL 120 PWM fans. Featuring a 104-fin stack paired with 6 heat pipes of 6 mm diameter each, the METAL DT24 is compatible with the newest INTEL LGA 1700 and AMD AM5 socket with a rated TDP of 270 W. The DT24 PREMIUM includes an additional aluminium ARGB top cover. The included METAL 120PWM fans offer speeds of up to 1950 RPM and deliver up to 69CFM of airflow and 2.82 mm H2O of static pressure at a 26 dBA noise level. The METAL DT24 BASE is available at MSRP US$57.00, the METAL DT24 PREMIUM is available at MSRP USD $69, and the METAL 120 PWM is available at MSRP $9.90.

The dual-tower, dual-fan METAL DT24 CPU coolers are built from the ground up for high-performance cooling. The heatsink includes a total of 6x 6 mm thick heat pipes for quick and efficient heat transfer from the CPU. The dual-tower cooler has a massive 104-fin stack, which gives the METAL DT24 a surface area of 8553.23 cm² allowing the cooler to handle up to 270 W TDP. The METAL DT24 supports the latest Intel LGA1700 and AMD AM5 processors.