Tuesday, May 2nd 2023
Der8auer Reveals New Ryzen 7000 Direct Die Water Block
Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.
Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.
Der8auer's Mycro Direct Die cooler should be available soon, and come in RGB and non-RGB versions, priced at around €140 and €100, respectively.
Sources:
Der8auer (Youtube), via Tomshardware
Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.
26 Comments on Der8auer Reveals New Ryzen 7000 Direct Die Water Block
Remember when CPU's were purchased like this? They still come with warranty.
For modern AAA games you are gpu limited not cpu limited, and for heavy cpu tasks like data crunching you get way more performance using multi cpu setups.
For breaking overclocking records ln2 is better anyway, and i wouldn't use a dod with LM rig as a safe 24/7 base.
Even regular gpu watercooling doesn't allow you to get significant performance increase over aircooling, you need sub ambiant cooling. This would only be useful in a SLI 4090 setup, so perhaps 0,001% of pc users.
Just a boy with pricey toys. Aircooling without AIO is better suited for 99% of pc users.
Some projects are OK, and esp the self engineered things are also OK.
But the whole concept of OC'ing is pretty much dead at this point. Thus a waterblock like that won't yield you hundreds of Mhz's but just a few percent.
CPU vendors have become quite clever in getting the most out of silicon. Because of that the headroom in products gets slimmer within the year really.
So you buy a CPU, and all you remain with is undervolting or offsets, some memory OC'ing and thats about it.
In the older days a good strong OC could yield you 45% performance increase. Today it's a few percent.
Those were the days..
300A where good for 450Mhz on avg. Not 600. Now you get like procentual increase; usually at the cost of silicon life.
I'd still prefer a all core OC day and night rather then that sketchy per CCD OC'ing where you have values of one CCD being 4.2Ghz and the other one 4.3Ghz.
Great for in cinebench but who does that?
It's not like we're several years into: phones, laptops, GPUs, etc. w/ allotropic carbon thermal spreaders/TIM, or anything like that... /s
The small niche market is exactly what this direct die water block is for.
Things change. Its called “progress”. Water cooling is almost standard on 200W peak CPUs. And by no means will the CPU socket mechanisms be the same in ten years as they are today. You might be young. It would be wise to get use to change.
My new computer is fish container with chips.
IIRC, those allotropic carbon pads perform amazing, when you consider how poorly it's contacting vs. thermal paste(good) or LM-TIM(best).
Which, is why Liquid Metal consistently performed best (in the video), it makes the absolute best contact.
Personally, I'd like to see an IHS made from laminations of that Z-graphene and various thin foils (to add thermal capacity).
The challenge with either approach is the socket would likely need to be redesigned since the clamp mechanism has to swing over a thicker CPU assembly.