GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced BIOS updates for X670, B650, and A620 Motherboards to support AMD Ryzen 9000 processors. The critical BIOS updates for GIGABYTE X670, B650, and A620 series motherboards ensure the compatibility and optimized performance with the upcoming AMD Ryzen 9000 series processors.

GIGABYTE remains committed to providing the best possible experience for users and works closely with AMD to ensure prompt updates as new AGESA versions become available. Beta BIOS will be regularly updated on the GIGABYTE website. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology.

Alphacool presents the ES 1 1U. This cooler was specially designed for the requirements of server cooling and is based on the proven technology of the Core 1. Alphacool combines the best of two worlds with the ES 1 1U. The innovative 3D jetplate in combination with the proven cross-slot technology ensures that the coolant is distributed evenly across the cooler base. Inside the cooler, an O-ring ensures a precise flow of water and thus guarantees reliable cooling.

The cooler has a particularly compact design. With side connections and a flat profile, the ES 1 1U can be easily installed in small systems with limited space, including 1U server casings. The new mounting system and use of acetal for the housing reduce both assembly effort and costs for large-scale production. The ES 1 1U is now available in the Alphacool online store.

AMD "Granite Ridge" is codename for the four new Ryzen 9000 series desktop processors the company plans to launch on July 31, 2024. The processor is built in the Socket AM5 package, and is meant to be backwards compatible with AMD 600-series chipset motherboards, besides the new 800-series chipset ones that will launch alongside. "Granite Ridge" is a chiplet-based processor, much like the Ryzen 7000 "Raphael," Ryzen 5000 "Vermeer," and Ryzen 3000 "Matisse." AMD is carrying over the 6 nm client I/O die over from "Raphael" in an effort to minimize development costs, much in the same way it carried over the 12 nm cIOD for "Vermeer" from "Matisse."

The SoC I/O features of "Granite Ridge" are contemporary, with its awesome 28-lane PCI-Express Gen 5 root complex that allows a PCI-Express 5.0 x16, two CPU-attached M.2 Gen 5 slots, and a Gen 5 x4 chipset bus. There's also a basic integrated graphics solution based on the older RDNA 2 graphics architecture; which should make these processors fit for all use-cases that don't need discrete graphics. The iGPU even has multimedia accelerators, an audio coprocessor, a display controller, and USB 3.2 interfaces from the processor.

MINISFORUM is proud to announce the MS-A1, the world's smallest and most expandable AM5 platform Mini PC. Equipped with the latest AMD AM5 platform, the MS-A1 offers a replaceable CPU, ensuring a longer motherboard lifecycle and sustainable upgrades for future generations of CPUs. Integrated with the AMD Radeon 780M graphics card, the MS-A1 includes 12 GPU cores and a GPU frequency of up to 2900 MHz, effortlessly handling both graphical and gaming demands. Additionally, it incorporates a dedicated NPU unit with up to 16 TOPS of processing power, making it the first desktop processor to include a specialized AI neural processing unit (NPU).

At its highest configuration, the MS-A1 features the AMD Ryzen 7 8700G desktop processor, built on the Zen 4 architecture. This powerhouse boasts 8 cores and 16 threads, a maximum boost clock of 5.10 GHz, and a 65 W TDP, delivering unparalleled performance. The MS-A1 supports dual-channel DDR5 5200 MHz high-speed memory, with a capacity of up to 96 GB, enabling users to achieve fast and efficient multitasking. It also features four M.2 PCIe 4.0 NVMe SSD slots, offering transfer speeds of up to 7000 MB/s. These extensive expansion slots allow for a maximum system capacity of up to 27 TB, catering to the vast storage needs of creative and multimedia professionals.

Prices of AMD's current generation flagship desktop processor, the Ryzen 9 7950X3D, dropped earlier this week, to a record low $464.99 on Amazon and Newegg. The 16-core/32-thread Socket AM5 processor features 3D V-cache technology, and roughly matches the gaming performance of Intel Core i9-14900K, in our testing. It also offers a much stronger productivity and content creation performance than the Ryzen 7 7800X3D owing to its 16-core compute muscle. The $465 new price is exactly two-thirds the processor's launch price of $700. The chip was designed to topple the Core i9-13900K "Raptor Lake." The price cuts are triggered by the impending launch of the Ryzen 9000 "Granite Ridge" processors based on the newer "Zen 5" microarchitecture.

MSI introduced the PRO B650-A WIFI, a feature-rich entry-mainstream Socket AM5 motherboard under its PRO series. Built in the standard ATX form-factor, the board features a 6-layer PCB, and includes heatsinks for all its M.2 slots, The board draws power from a 24-pin ATX and two 8-pin EPS power connectors and uses a 14+2+1 phase VRM solution that's capable of even the top 170 W TDP Ryzen 9 chips. The CPU socket is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two M.2 NVMe Gen 4 slots. The board's third M.2 Gen 4 slot is wired to the B650 FCH.

The MSI PRO B650-A WIFI offers a fairly premium onboard audio solution driven by a Realtek ALC4080 CODEC. USB connectivity includes a 20 Gbps USB 3.2 Gen 2x2 type-C port, three 10 Gbps USB 3.2 Gen 2 type-A, four 5 Gbps USB 3.2 Gen 1, and a few USB 3.2 and USB 2.0 ports by internal headers. Display outputs include HDMI and DisplayPort. Networking connectivity includes a 2.5 GbE interface driven by a Realtek 8125B controller, and an AMD/Mediatek sourced WLAN module with Wi-Fi 6E and Bluetooth 5.3. Besides the three M.2 Gen 4 slots, you get four SATA 6 Gbps ports. The board supports USB BIOS Flashback. The company didn't reveal pricing.

AMD is about give the new "Zen 5" microarchitecture a near-simultaneous launch across both its client segments—desktop and mobile. The desktop front is held by the Ryzen 9000 "Granite Ridge" Socket AM5 processors; while Ryzen AI 300 "Strix Point" powers the company's crucial effort to capture Microsoft Copilot+ AI PC market share. We recently did a technical deep-dive on the two. HardwareLuxx.de scored two important bits of specs for both processors in its Q&A interaction with AMD—die sizes and transistor counts.

To begin with, "Strix Point" is a monolithic silicon, which is confirmed to be built on the TSMC N4P foundry node (4 nm). This is a slight upgrade over the N4 node that the company built its previous generation "Phoenix" and "Hawk Point" processors on. The "Strix Point" silicon measures 232.5 mm² in area, which is significantly larger than the 178 mm² of "Hawk Point" and "Phoenix." The added die area comes from there being 12 CPU cores instead of 8, and 16 iGPU compute units instead of 12; and a larger NPU. There are many other factors, such as the larger 24 MB CPU L3 cache; and the sizes of the "Zen 5" and "Zen 5c" cores themselves.

AMD Ryzen 8000G desktop APUs combine "Zen 4" CPU cores with a powerful iGPU based on the RDNA 3 architecture, and are the first desktop processors to pack an NPU with 16 TOPS of performance on tap. These Socket AM5 processors based on the "Hawk Point" silicon have been on a downward price trend. Last month, the top Ryzen 7 8700G asked for $299 compared to its $329 launch price; and the 6-core Ryzen 5 8600G went for $199, down from its $229 launch price. This month, the downward pricing trend continues.

According to the latest prices charted on B&H Photo, the Ryzen 7 8700G is now just $269, a $60 cut from its launch price; while the Ryzen 5 8600G faces its biggest ever cut, sending it all the way down to $152, a $77 or a 33% reduction from its launch price. At this price, the 8600G is a formidable processor, with a 6-core/12-thread CPU based on the "Zen 4" architecture (all 6 of which are full-sized "Zen 4" cores); a 16 TOPS NPU, and a Radeon 760M iGPU with 8 compute units (512 stream processors). The Ryzen 5 8500G based on the "Phoenix 2" silicon, with a combination of 2 "Zen 4" and 4 "Zen 4c" cores, is now priced at $139, a $40 cut from its original.

AMD's Ryzen 9000 "Granite Ridge" family of Socket AM5 desktop processors based on the "Zen 5" microarchitecture arrive in July, with four processor models in the lead—the 9950X 16-core, the 9900X 12-core, the 9700X 8-core, and the 9600X 6-core. AMD is building the CCDs (CPU core dies) of these processors on the slightly newer 4 nm foundry node, compared to the 5 nm node that the Ryzen 7000 series "Raphael" processors based on "Zen 4" are built on; and generally lowered the TDP values of all but the top 16-core part. The company is reportedly reconsidering these changes, particularly in wake of company statements that the 9000X series may not beat the 7000X3D series in gaming performance, which may have sullied the launch, particularly for gamers.

From the company's Computex 2024 announcement of the Ryzen 9000 series, the 9950X has the same 170 W TDP as its predecessor, the 7950X. The 9900X 12-core part, however, comes with a lower 120 W TDP compared to the 170 W of the 7900X. Things get interesting with the 8-core and 6-core parts. Both the 9700X 8-core, and the 9600X 6-core chips come with 65 W TDP. The 9700X succeeds the 7700X, which came with a 105 W TDP, while the 9600X succeeds the 7600X that enjoys the same 105 W TDP. The TDP and package power tracing (PPT) values of an AMD processor are known to affect CPU boost frequency residence, particularly in some of the higher core-count SKUs. Wccftech reports that AMD is planning to revise the specifications of at least the Ryzen 7 9700X.

Prices of AMD Ryzen 8000G "Hawk Point" desktop APUs in the Socket AM5 package saw reductions over the week. The Ryzen 7 8700G, the fully unlocked part, is now available for $299, a $30 cut from its launch price of $329. Meanwhile, the Ryzen 5 8600G has now slipped under the $200-mark, with a $199 price-tag. The chip had originally launched at $229. Both these chips feature a 16 TOPS NPU, and are the first desktop processors that are capable of on-chip AI acceleration. Both processors are based on the 4 nm "Hawk Point" monolithic silicon, and feature "Zen 4" CPU cores. The 8700G packs an 8-core/16-thread CPU with an RDNA 3 iGPU that has 12 compute units (CU); while the 8600G is 6-core/12-thread, with an iGPU that has 8 CU.

Things get interesting with the Ryzen 5 8500G, which is now down to $159 from its launch price of $179. This new price makes the processor competitive with the 13th Gen Core i3 and the lower end of the Core i5 lineup. Unlike the other two 8000G series chips, the 8500G lacks an NPU, and is based on the 4 nm "Phoenix 2" silicon that has two "Zen 4" and four "Zen 4c" CPU cores for a 6-core/12-thread CPU configuration. Both kinds of cores share a 16 MB L3 cache. It has a heavily cut-down RDNA 3 iGPU with just 4 CU. The Ryzen 8000G desktop APU series only features PCIe Gen 4 (no Gen 5), which may not mean much for today's discrete GPUs, but limit your SSD upgrade path to Gen 4 (Gen 5 SSDs will be limited to 7 GB/s).

EVGA designed an enthusiast segment AMD X670E chipset motherboard for the Socket AM5 platform, which never made it to the mass market. It had even planned to give the board its coveted Classified brand, and sell as the X670E Classified. Prototypes of this board fetched over $1,300 in auction. The board is built in the E-ATX form-factor like most of the EVGA Classified series motherboards; and packs a powerful CPU VRM, besides several overclocker-friendly features, such as top-oriented DDR5 memory slots, side-facing I/O (including power inputs), and in general, a decluttered layout that won't get in the way of extreme cooling solutions.

There were four such prototypes with Jiacheng Liu, a hardware enthusiast, each of which went under the hammer. The only trouble with these prototypes is that they're bare—they don't include heatsinks for the CPU VRM or the chipset, let alone heatsinks for the two M.2 Gen 5 NVMe slots that don't eat into the Gen 5 x16 PEG. Another problem with these boards is that they're not supported by EVGA, and only come with their initial BIOS that supports Ryzen 7000 "Zen 4" processors, but not the upcoming Ryzen 9000 "Zen 5." We doubt if these even support the Ryzen 7000X3D series, which is probably the main reason the boards didn't fetch way more than $1,300 a piece at the auctions. Enthusiasts might still figure out a way to BIOS-mod and encapsulate the latest AGESA.

A market research of AMD Socket AM5 motherboards sold in South Korea by Danawa, provide some interesting insights on how gamers approach the platform. This research is confined to Korea, but can be extrapolated to other similar markets. The research studies the chipset model, and form-factor of Socket AM5 motherboards sold in the market. The most interesting finding of the research is that the AMD B650 is by far the most popular chipset for the platform, dwarfing even the entry-level A620 chipset by a factor of 8. A staggering 80% of the Socket AM5 motherboards being sold are based on the B650.

It's important to note here, that this figure does not include the B650E, which is separately shown making up just 2% of the volumes. The B650 (non-E) has nearly all platform features, with motherboards based on the chipset providing at least one Gen 5 M.2 NVMe slot that doesn't eat into the lanes of the x16 PEG slot; and with the current generation of GPUs not featuring the PCIe Gen 5 host interface, customers seem more than happy with the Gen 4 x16 PEG slot provided by B650 motherboards. What's more, you get CPU overclocking and memory overclocking on this mid-range chipset, so it appeals to a very wide demographic. The B650E, on the other hand, provides a Gen 5 x16 PEG slot, and motherboards based on this chipset tend to offer premium I/O features, such as a high-end onboard audio solution, premium wireless networking, among others.

Ocypus is a new PC casing and cooling brand we've met at Computex 2024. The brand has a formidable lineup of contemporary gaming PC cases, fans, and CPU coolers (both air and liquid). The Iota L36 line of AIO liquid CPU coolers come with high static pressure FDB fans, and a glossy rounded-square pump-block with a segmented display that puts out coolant temperature as measured in the pump (rather than pulled from ACPI over USB/software). The cooler comes in white and black trims, and there's just one radiator size on display—360 mm x 120 mm. The Delta L36 is a "lite" variant of the Iota L36, with a silicon RGB LED diffuser crowning the pump-block instead of the temperature display. Both coolers support the upcoming LGA1851, LGA1700, AM5, and AM4 sockets.

The CPU air cooler lineup is topped by the Iota A62, a large dual fin-stack cooler, which comes in silver and black color variants. It uses a pair of 120 mm FDB fans in push-pull configuration, with the second fan located between the two fin-stacks. The top-plates of the fin stacks have perforations, and the LED segment display peeks out from these in what is a neatly executed design. The Delta A62 is identical to this, but without the display. What's interesting is that the Iota A62 lacks fan illumination, but the Delta A62 has plenty of it.

GIGABYTE in its Computex 2027 booth showcased a huge lineup of next-generation Socket LGA1851 motherboards based on the top Intel Z890 chipset, which are ready for Intel's Core Ultra "Arrow Lake-S" desktop processors. GIGABYTE has taped out the motherboard model names, so all mentions of Z890 in this article are based on our assumption that it's the name of the next-gen Intel chipset. These chips are expected to bring generational IPC increases from their "Lion Cove" P-cores, "Skymont" E-cores, a more complete PCIe Gen 5 I/O (including for the CPU-attached NVMe slots), and other innovations. If the socket looks similar to the LGA1700, it's because it's identical in physical dimensions, and you can use your LGA1700 cooler on the LGA1851, but the processors are not inter-compatible. The company also showcased a few AMD Socket AM5 motherboards based on the new AMD X870E chipset.

The first motherboard to catch our eye is the Z890 AORUS Tachyon. This board is geared for record-seeking CPU overclocking. The processor is wired to just two DDR5 memory slots (1 DIMM per channel, the best configuration for memory OC); and the CPU-attached NVMe slots being close to the socket, with a combined heatsink. The only expansion slots are a PCI-Express 5.0 x16, and what could be a Gen 4 x8. There are plenty of overclocker-friendly controls, voltage measurement points, diagnostic LEDs, and status displays, scattered all over the board.

AMD today announced its much awaited Ryzen 9000 series desktop processors. Built in the Socket AM5 package, and drop-in compatible with all current AM5 motherboards with a BIOS update, the processors are based on the new "Zen 5" CPU microarchitecture. The operational part of the processor, the CPU complex dies (CCDs), are built on the 4 nm process, wired to a 6 nm I/O die. AMD didn't get down into the nuts and bolts of the microarchitecture, but briefly mentioned an impressive 16% IPC increase over "Zen 4." Coupled with the fact that the first wave of processors lack 3D V-cache and can sustain higher boost frequencies and TDP, processors in the series should beat the Ryzen 7 7800X3D in gaming performance, which also means that AMD has beaten the 14th Gen Core "Raptor Lake Refresh" processor series by a significant margin.

The 16% IPC increase over "Zen 4" is backed by branch prediction improvements, wider pipelines and vectors, and deeper window sizes across the core design, for more parallelism. The core also features doubling in instruction bandwidth for front-end instructions, FPU to L1, and L1 to L2 data bandwidth, and a redesigned FPU to double AI performance and AVX512 throughput. The company hasn't put out a block design for "Zen 5," and we'll learn more about it in the run-up to the market availability of these chips some time in July 2024.

An alleged company slide by motherboard maker GIGABYTE leaked a few interesting tidbits about the upcoming AMD Ryzen 9000 "Granite Ridge" Socket AM5 desktop processor powered by the "Zen 5" microarchitecture. To begin with, we're getting our first confirmation that the "Zen 5" common CCD used on "Granite Ridge" desktop processors and future EPYC "Turin" server processors, is built on the 4 nm EUV foundry node by TSMC, an upgrade from the 5 nm EUV node that the "Zen 4" CCD is built on. This could be the same version of the TSMC N4 node that AMD had been using for its "Phoenix" and "Hawk Point" mobile processors.

AMD is likely carrying over the client I/O die (cIOD) from the "Raphael" processor. This is built on the TSMC 6 nm DUV node. It packs a basic iGPU based on RDNA 2 with 2 compute units; a dual-channel DDR5 memory controller, and a 28-lane PCIe Gen 5 root complex, besides some SoC connectivity. AMD is rumored to be increasing the native DDR5 speeds for "Granite Ridge," up from the DDR5-5200 JEDEC-standard native speed, and DDR5-6000 "sweetspot" speed of "Raphael," so the cIOD isn't entirely the same.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, introduced the latest all-round B650E AORUS PRO X USB4 motherboard. Built-in with Dual USB4 ports and comprehensive leading features, B650E AORUS PRO X USB4 enables users to enjoy the most affordable next-gen AM5 platform in advance.

With blisteringly fast and reliable transfer speeds, extensive compatibility, efficient charging, and ultra-HD display connectivity, USB4 has evidently become an essential specification on the coming next-gen AM5 platform. Among the increasing number of USB4-ready devices on the market, the B650E AORUS PRO X USB4 exclusively features dual native USB4 ports, providing up to 40 Gbps on each port with support for all Ryzen processors. Uniquely, this total 40 Gbps bandwidth can be fully used for data transferring, unlike Thunderbolt 4, which shares bandwidth between data and video. Aside from the full 40 Gbps USB4, B650E AORUS PRO X USB4 also offers superb connectivity with Wi-Fi 7 using GIGABYTE's Ultra-High Gain antenna and 2.5 GbE LAN.

An AMD Ryzen 9000 "Granite Ridge" desktop processor engineering sample with a maximum boost frequency of 5.80 GHz was found to offer an astonishing 19% higher single-threaded performance increase over an AMD Ryzen 9 7950X. "Granite Ridge" is codename for the Socket AM5 desktop processor family that implements the new "Zen 5" CPU microarchitecture. The unnamed "Granite Ridge" processor comes with an OPN code of 100-0000001290. Its CPU core count is irrelevant, as the single-threaded performance is in question here. The processor boosts up to 5.80 GHz, which means the core handling the single-threaded benchmark workload is achieving this speed. This speed is 100 MHz higher than the 5.70 GHz that the Ryzen 9 7950X processor based on the "Zen 4" architecture, boosts up to.

The single-threaded benchmark in question is the CPU-Z Bench. The mostly blurred out CPU-Z screenshot that reveals the OPN also mentions a processor TDP of 170 W, which means this engineering sample chip is either 12-core or 16-core. The chip posts a CPU-Z Bench single-thread score of 910 points, which matches that of the Intel Core i9-14900K with its 908 points. You've to understand that the i9-14900K boosts one of its P-cores to 6.00 GHz, to yield the 908 points that's part CPU-Z's reference scores. So straight off the bat, we see that "Zen 5" has a higher IPC than the "Raptor Cove" P-core powering the i9-14900K. Its gaming performance might end up higher than the Ryzen 7000 X3D family.Many Thanks to TumbleGeorge for the tip.

Thermalright introduced the Burst Assassin 120 EVO DARK, a performance-segment air CPU cooler. The cooler relies on a conventional D-type aluminium fin-stack heatsink that's ventilated by a pair of fans in push-pull configuration. Its design involves a nickel-plated copper base from which six 6 mm-thick copper heat pipes draw heat, conveying it to an aluminium fin-stack. This 52 mm-thick fin-stack has fins with jagged edges to increase air turbulence, and heat dissipation. The stack is covered by a metal top-plate with a brushed aluminium finish. Ventilating the heatsink is a pair of 120 mm fans.

Unlike most other companies, Thermalright includes two different kinds of 120 mm fans. The first one is a Thermalright TL-C12B V2 meant to be installed in the "push" position, and the second one is a TL-C12RB V2 intended for the "pull" position. Both fans feature fluid dynamic bearings, 4-pin PWM inputs, and top speeds of 1,500 RPM; however the push fan offers 66.17 CFM of maximum airflow, while the pull fan does 58 CFM. The static pressure ratings of both fans are 1.58 mm H₂O, and both their maximum noise outputs are rated at 25.6 dBA. With the two fans in place, the Thermalright Burst Assassin 120 EVO DARK measures 124 mm x 156 mm x 102 mm (WxHxD). The company didn't mention weight. Among the CPU socket types supported are LGA1700, AM5, AM4, and LGA1200/115x.

AMD's next-generation Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture, is rumored to launch in late-July, 2024, according to multiple sources in the ChipHell tech forums. The first four SKUs in the processor series will include one each of 16-core, 12-core, 8-core, and 6-core, spanning the Ryzen 9, Ryzen 7, and Ryzen 5 series, just like the company's Ryzen 7000 series debut. The company could unveil these processors in its 2024 Computex keynote address early next month, talking about their features and performance in broad strokes, while we get technical previews in the run-up to the late-July launch.

A late-July launch of the Ryzen 9000 series "Granite Ridge" processors should also mean that the various motherboard manufacturers will showcase their upcoming motherboards based on the AMD X870 desktop chipset at Computex. Ryzen 9000 series are built in the existing Socket AM5 package, and should be compatible with existing AMD 600-series chipset motherboards. In fact, most motherboard vendors have already released UEFI firmware updates that include Ryzen 9000 series processor compatibility. Those buying a Ryzen 9000 series processor with an AMD 600-series chipset motherboard can simply take advantage of the USB BIOS Flashback feature that's available on most motherboards, including the entry-level ones.

ID-COOLING today announced the release of its newest product, the FX360 PRO 360 mm AIO liquid cooler, priced at just $60. Building on the success of the FROSTFLOW series, the FX360 PRO features a redesigned Gen 7 pump core, boasting a higher speed of 2800 RPM and an enhanced water flow range to provide further improved cooling performance.

The FX360 PRO is designed with a sleek, all-black aesthetic, instead of ARGB lighting for a more minimalist look, highlighted only by the CD pattern pump cover. The water block chamber has also been redesigned to maximize water flow efficiency. Included in the package are three TF-12025-PRO black fans, each equipped with short daisy chain cables for streamlined cable management. These cables can be discreetly connected and extended to the back of the tray, simplifying the installation process.

Today, global memory leader Team Group Inc. announced today the launch of three AIO CPU liquid coolers - the T-FORCE SIREN DP360 ARGB, GA360M ARGB, and GA240M ARGB AIO CPU Liquid Coolers. With a revolutionary magnetic design on the water block, users can effortlessly attach either an LCD or ARGB module, complemented by a pre-installed fan lock on the radiator for added convenience. Compatible with the latest Intel LGA 1200/1700 sockets and AMD AM4 and AM5 platforms, the coolers empower users to harness the full potential of dual-platform processors. Combining powerful performance with striking aesthetics, these coolers redefine heat dissipation standards.

The T-FORCE SIREN DP360 ARGB utilizes Asetek's 8th module, featuring a six-wire, three-phase motor for exceptional liquid cooling performance. Its 30 mm thick aluminium radiator, combined with a pre-installed high-pressure ARGB PWM fan, significantly enhances cooling efficiency with the increased surface area. The DP360 ARGB offers fast and convenient installation, with two options available: with or without a magnetic LCD Display module on the water block. With the specially developed T-FORCE software, users can unleash their creativity, customizing high-resolution images up to 480 x 480 and displaying vibrant visuals with 16.8 million colors. Showcasing personalized GIF animations and real-time hardware monitoring to guarantee an elevated gaming experience.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in AI servers, server motherboards, and workstations, today announced its support of AMD EPYC 4004 Series processors on AM5 socket servers and server motherboards for entry-level enterprise customers. This will require a BIOS update, which will come pre-installed in the near future.

The new AMD EPYC 4004 platform, built on the AM5 socket, delivers enterprise-grade features that allow small businesses and cloud services to have dependable daily operations with minimal downtime. For reliability and manageability, the platform has been validated for compatibility with server operating systems: Ubuntu, RHEL, and Windows Server. By doing so IT administrators can better control and monitor systems, as well as protect businesses against cyberthreats.

Today, TYAN, a leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, introduced its latest offering: affordable and high-performance servers and motherboards powered by the new AMD EPYC 4004 Series CPUs. "The new AMD EPYC 4004 Series CPUs, along with our strong ecosystem of technology partners, bring enterprise solutions to a traditionally underserved market and ensure that small and medium businesses have access to highly-performant technologies that help them stay competitive," said John Morris, corporate vice president, Enterprise and HPC Business Group, AMD. "The AMD EPYC 4004 CPUs fill an important market gap, providing cost-optimized solutions with enterprise-grade dependability, scalability and security in cost-optimized system configurations that make sense for smaller businesses and dedicated hosters."

AMD EPYC 4004 Series processors complement the broad AMD EPYC processor offering, extending the established high performance, highly efficient "Zen4" core architecture into an expanded range of entry level system designs desired by small business customers as well as regional hosted IT services providers. With new low core count CPU offerings and TDP ranges as low as 65 W, attractively priced server systems featuring AMD EPYC 4004 Processors deliver the strong performance, scalability and dependability needed by growing businesses and 24x7 hosted services. With an optimized, single-socket package, 2 channels of DDR5 memory and up to 28 lanes of Gen 5 PCIe connectivity, these servers offer a compelling balance of performance and scalability in an affordable, easy-to-deploy, easy-to-manage package.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is announcing additions to the AMD based H13 generation of CPU Servers, optimized to deliver an outstanding balance of performance and efficiency and powered by the AMD EPYC 4004 Series processors. Supermicro will feature its new MicroCloud multi-node solution, which supports up to ten nodes in a 3U form factor. This very high-density option is designed for cloud-native workloads.

"Supermicro continues to offer innovative solutions for a wide range of applications, and with this new entry, based on the AMD EPYC 4004 processor, we can address the needs of on-premises or cloud service providers who need a cost-effective solution in a compact form factor," said Charles Liang, president and CEO of Supermicro. "In a single rack, 160 individual nodes can be made available for cloud-native applications, which reduces real estate need and decreases a data center TCO."