AMD is giving final touches to its Ryzen 7000G series desktop APUs that bring the 4 nm "Phoenix" monolithic processor silicon to the Socket AM5 desktop package. The star attraction with these processors is their large iGPU based on the latest RDNA3 graphics architecture, featuring up to 12 compute units worth 768 stream processors, and full DirectX 12 Ultimate feature-set support. These processors should be able to provide 720p to 1080p gaming with entry-medium settings, where you take take advantage of FSR for even better performance. At this point we don't know whether the Ryzen AI feature-set will make its way to the desktop platform. "Phoenix" features an 8-core/16-thread CPU based on the latest "Zen 4" microarchitecture.

An interesting development here is that not only is AMD bring the "Phoenix" silicon to the desktop platform, but the processor models highlighted in this leak reference the smaller "Phoenix 2" silicon. This chip is physically smaller, features a CPU with two "Zen 4" and four "Zen 4c" cores; and an iGPU that has no more than 4 compute units worth 256 stream processors. The OPN codes of at least three processor models surfaced on the web. These include the Ryzen 5 PRO 7500G (100-000001183-00), the Ryzen 5 7500G (100-00000931-00), and the Ryzen 3 7300G (100-000001187-00). No specs about these chips are known at this point. The PRO 7500G and regular 7500G are expected to feature the full 2+4 core configuration, while the 7300G could probably feature a 2+2 core configuration. If the company does plan a 7600G and 7700G, those would likely be based on "Phoenix" with 6 or 8 regular "Zen 4" cores.

AMD is preparing to launch its first APUs on the Socket AM5 desktop platform, with the Ryzen 7000G series. While the company has standardized integrated graphics with the Ryzen 7000 series, it does not consider the regular Ryzen 7000 series "Raphael" processors as APUs. AMD considers APUs to be processors with overpowered iGPUs that are fit for entry-mainstream PC gaming. As was expected for a while now, for the Ryzen 7000G series, AMD is tapping into its 4 nm "Phoenix" monolithic silicon, the same chip that powers the Ryzen 7040 series mobile processors. Proof of "Phoenix" making its way to desktop surfaced with CPU support lists for the latest AGESA SMUs (system management units) compiled by Reous, with the AGESA ComboAM5PI 1.0.8.0 listing support for "Raphael," as well as "Phoenix." Another piece of evidence was an ASUS B650 motherboard support page that listed a UEFI firmware update encapsulating 1.0.8.0, which references an "upcoming CPU."

Unlike "Raphael" and "Dragon Range," "Phoenix" is a monolithic processor die built on the TSMC 4 nm foundry node. Its CPU is based on the latest "Zen 4" microarchitecture, and features an 8-core/16-thread configuration, with 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The star attraction here is the iGPU, which is based on the RDNA3 graphics architecture, meets the DirectX 12 Ultimate feature requirements, and is powered by 12 compute units worth 768 stream processors. Unlike "Raphael," the "Phoenix" silicon is known to feature an older PCI-Express Gen 4 root complex, with 24 lanes, so you get a PCI-Express 4.0 x16 PEG slot, one CPU-attached M.2 NVMe slot limited to Gen 4 x4, and a 4-lane chipset bus. "Phoenix" features a dual-channel (4 sub-channel) DDR5 memory controller, with native support for DDR5-5600. A big unknown with the Ryzen 7000G desktop APUs is whether they retain the Ryzen AI feature-set from the Ryzen 7040 series mobile processors.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to introduce the mid-range gaming combo with AMD AAA solution, the BIOSTAR AMD Radeon RX 7700 XT graphics card, and B650MT motherboard, the perfect solution for casual and mid-range gamers and individuals who relish a premium home entertainment experience.

Built around the AMD B650 single-chip architecture with support for the AMD AM5 socket, the B650MT motherboard is an ideal choice to run the latest AMD Ryzen 7000 series processors with its innate ability to extract maximum performance at any instance. The B650MT motherboard is BIOSTAR's latest offering for gaming and home entertainment, meticulously crafted to meet the demands of both casual and mid-range gaming enthusiasts. This motherboard epitomizes efficiency and stability, boasting top-shelf BIOSTAR technology such as Super Hyper PWM for reliable, steady power delivery and innovative A.I Fan, with an automatic detection system designed to ensure optimum cooling performance while intelligently conserving energy.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new DDR5 memory kit specifications at DDR5-6400 CL32-39-39 in kit capacities of 32 GB (16 GB x2) and 48 GB (24 GB x2) under the Trident Z5 Neo RGB series, which also now comes in a new white version. Designed for AMD Ryzen 7000 series processors and AMD X670 chipset motherboards with AGESA 1.0.0.7c BIOS updates, and programmed with AMD EXPO overclock profile technology, these new specifications enable PC enthusiasts, overclockers, and DIY builders to build an ideal AMD system.

Overclocked Memory Speed Up to DDR5-6400
With the introduction of the AGESA 1.0.0.7c update, G.SKILL is updating the Trident Z5 Neo RGB series with DDR5-6400 memory kits, designed for use on compatible AMD platforms. Refer to the screenshot below to see the DDR5-6400 CL32-39-39 32 GB (16 GB x2) memory kit validated on the AMD Ryzen 9 7950X desktop processor and the ASUS ROG CROSSHAIR X670E HERO motherboard with the 1602 BIOS update. Memory performance and results may vary depending on the motherboard model, CPU model, and BIOS version used.

ID-Cooling introduced the IS-67-XT, a low-profile CPU cooler, which gets its name from its Z-height of just 67 mm, with its fan in place. The cooler comes in all-black, and all-white variants. Its design involves a C-type aluminium fin-stack heatsink, with a top-flow ventilation. Six 6 mm-thick nickel-plated copper heatpipes draw heat from a copper base, which is then conveyed to an aluminium fin-stack that's arranged along the plane of the motherboard. This is ventilated by a 15 mm-thick 120 mm fan. ID-Cooling claims a cooling capacity of 150 W, which means you should be able to run most mainstream desktop processors at stock speeds, taking advantage of the lower noise figures than stock cooling solutions.

The included 120 mm fan takes in 4-pin PWM input, turns at speeds ranging between 500 to 2,200 RPM, pushing up to 67.58 CFM of airflow at 1.54 mm H₂O static pressure, and a maximum noise output of 35.2 dBA. The cooler measures 120 mm x 120 mm x 67 mm, weighing 500 g (including fan). Among the CPU socket types supported by the ID-Cooling IS-67-XT are LGA1700, AM5, LGA1200, AM4, and LGA115x. Backed by a 3-year warranty, both color variants of the cooler are priced at USD $44.99 a piece.

ASUS today announced the TUF Gaming LC II 360 ARGB AIO liquid cooler, armed with a beefy 360 mm radiator and offering dazzling Gen 2 ARGB lighting and compatibility with a wide variety of chassis and CPU sockets.

The TUF Gaming LC II ARGB series delivers the performance and features users need to bring out the best in any mainstream gaming build. Coolant flows through an illuminated coldplate to reinforced sleeved tubing that arrives at a high-capacity radiator chilled by three 120 mm ARGB fans - which have grooved fins for optimal airflow and reduced noise. Meanwhile, Aura Sync ARGB elements illuminating the radiator fans and the TUF Gaming logo on the pump cover ensure unmatched style.

The TUF Gaming LC II 360 ARGB also features a new cooling design where the pump head and motor are separated for less noise and vibration, while a new place-and-twist retention mechanism makes installation a snap by eliminating the need for tools. As a nod to premium durability, each cooler comes with a class-leading six-year ASUS warranty.

According to a post by @g01d3nm4ng0 on Twitter/X, we now know that AMD is readying yet another AGESA update for AM5 motherboards. The new version is, based on information from our own sources, a minor update to the current version. As such, AMD will be moving from 1.0.0.7b to 1.0.0.7c. @g01d3nm4ng0 didn't reveal any details of the new AGESA apart from the screenshot below, but we asked around and managed to find out what the new AESA addresses.

The update is specifically for those with Samsung DDR5 memory in their AM5 motherboards and it addresses multiple memory related stability issues. We weren't given the full details as to what those are, but there have been some reports about there being issues specifically with Samsung DDR5 memory in some AM5 boards and hopefully this will solve all those problems. We don't have a release time frame for the updated AGESA, but with 1.0.0.7b barely out the door, it might take a few weeks before this one makes it through all the internal testing at the motherboard makers.

Thermalright has taken yet another low-key approach to announcing new products—the Taiwan hardware cooling specialist has updated its website with Heilos thermal pads. The model name looks to be a typo—should they have used "Helios" instead? A prominent sun graphic is placed on the bottom left of Thermalright's packaging for both of the Intel and AMD variants. It is unfortunate that something got lost in translation, or a spellcheck did not pick up on the small error before going to print/publication. Anyway...Thermalright is offering two sizes, with an identical 0.2 mm thickness—40x40 mm for AMD's AM4/AM5 CPU platforms, and a smaller pad (40x30 mm) for Intel LGA115X/1200/1700 CPUs. Pricing and availability is TBD.

These easy-peel away applicators provide an alternative route for users who fret about the best way to deal with traditional tubes of thermal paste. Tom's Hardware has pored over the Heilos specs—these pads offer thermal conductivity performance (8.5 W/mK) and resistance (0.04°C cm²/W), comparable (in their opinion) to "inexpensive" tubes of Arctic MX-4 and MX-5. The latter ranks at number four on the publication's "list of the best thermal pastes." Older thermal pads from other manufacturers have been criticized for falling short in terms of cooling performance, when cross-referenced against market leading thermal pastes—it is encouraging to see Thermalright addressing these concerns (specs-wise). We hope that evaluation samples have been sent out to review outlets.

Thermalright introduced the Assassin X 120 PLUS V2 tower-type CPU cooler. This is a spruced up version of the company's Assassin X series coolers, featuring a thicker fin-stack compared to the original Assassin X; four nickel-plated copper heatpipes that disperse in a unique "square" pattern through the fin-stack; a fancy die-cast aluminium top-plate for the heatsink; and two included 120 mm fans intended to be installed in a push-pull configuration (most of the Assassin X series coolers include just one).

The cooler uses a nickel-plated copper base, from which four 6 mm-thick copper heatpipes make their way through the aluminium fin-stack. The two included fans are of different types. The TL-C12B V2 fan meant for the "push" arrangement features a fluid-dynamic bearing, takes in 4-pin PWM input, turns at speeds of up to 1,500 RPM, pushing up to 66.17 CFM of airflow, at 1.53 mm H₂O static pressure, and a maximum noise output of 25.6 dBA. The TL-C12RB V2 meant for the "pull" has mostly the same specs, except 58 CFM airflow. With its fans in place, the Thermalright Assassin X 120 PLUS V2 measures 120 mm x 100 mm x 153 mm (WxDxH), weighing 815 g (545 g heatsink + 2x 135 g fans). Among the CPU socket types supported are LGA1700, AM5, AM4, LGA1200, and LGA115x. The company didn't reveal pricing.

AMD's recently added Ryzen 5 7500F for the AM5 socket was initially said to only be available in the PRC, but according to AMD, it will apparently be available globally. That said, AMD apparently only seeded review units to select Asian media, among them Quasar Zone in Korea, who put the six core, 12 thread CPU through its paces. Overall performance is very close to the Ryzen 5 7600, which isn't really all that strange, considering the two only differ by 100 MHz in both base and boost clock. In most of the benchmarks, the Ryzen 5 7500F is around two to three percent slower than the Ryzen 5 7600 on average.

When compared to the slightly more pricey Intel Core i5-13400, AMD falls behind multithreaded apps but comes out on top in most of the games tested, with the usual odd exception as would be expected. On average, the Ryzen 5 7500F is some 13 percent faster in the game benchmarks at 1080p, although this is using an NVIDIA GeForce RTX 4090 graphics card. It even beats the overall much faster Intel Core i5-13500 in gaming by around nine percent on average. However, the Ryzen 5 7500F system loses out to the two Intel systems when it comes to power efficiency, drawing around 20 Watts more on average when gaming. At US$179.99 it seems like AMD finally has a budget friendly CPU for the AM5 platform, if you're willing to lose the integrated GPU. It's unknown when the CPU will be available outside of Asia at this point in time.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, proudly unveils the A620MT motherboard, designed to run the latest AMD Ryzen 7000 Series processors. Perfectly balanced to meet the needs of various users, from office applications and system integration businesses to home entertainment systems, the A620MT motherboard offers an impressive array of advanced features and top-tier performance, setting the standard for modern-day computing.

Utilizing the AMD Socket AM5 based A620 single-chip architecture, the A620MT motherboard supports AMD Ryzen 7000 Series processors, including the brand new AMD Ryzen 5 7500F processor. The AMD Ryzen 5 7500F processor features six cores and twelve threads, operating with a 65 W TDP. While the Ryzen 5 7500F processor does not feature integrated graphics capability, BIOSTAR's Radeon RX 7600 graphics card is a great partner to it, and the combined trio of A620MT motherboard, Ryzen 5 7500F processor and BIOSTAR's RX 7600 graphics card is a recipe for success. With excellent synergy between all devices that ensures an unparalleled computing experience with higher performance, superior data integrity, and lower power consumption.

AMD's CEO Lisa Su is reported to be visiting a number of companies in Taiwan this week—one of her objectives seems to be getting next generation AM5 desktop platforms prepped with USB4 support. Hardware news site MyDrivers believes that Asmedia played host to Team Red's leader at some point—this is a significant development given that this Taiwanese company specializes in making motherboard chipsets and USB controllers, although Su has allegedly met with other competing firms. Asmedia is reported to be a market leader in terms of implementing the latest USB4 tech, with certification awarded by the USB-IF Association.

Prior leaks have implied that the two companies are already involved with each other on a separate project—their collective goal being Thunderbolt 4 support on next-gen AMD platforms. The timing of this trip to Taiwan suggests that forthcoming AM5 motherboards offering USB4 support could be lined up for launch next year, alongside the "Zen 5" Ryzen 8000 CPU series. Boards based on current gen A620, B650 and X670 chipsets could be refreshed with the latest USB connectivity standard.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, proudly announced the ultimate memory performance of DDR5 XMP 8000 is achieved with the X670E AORUS MASTER motherboard based on the latest AMD AGESA BIOS code at a SOC voltage of 1.3 V.

GIGABYTE always works closely with AMD to ensure our motherboard designs provide supreme performance and reliability, particularly on the optimum memory performance by exclusively advanced memory layout design. Meanwhile, GIGABYTE is releasing a new beta BIOS for the X670 and B650 AORUS/AERO series motherboards for the most remarkable memory performance on the AM5 platform. The new BIOS will be available at the end of July in succession. Please pay close attention to the GIGABYTE website to download the update for optimal performance.

EK, the leading manufacturer of premium liquid cooling equipment, is introducing the all-new EK-Quantum Power² Kits. These kits come equipped with full D-RGB support, feature an extensive range of award-winning Quantum Line products that share the same design language, and pack various supplementary accessories. The new Kits are aimed at enthusiasts who have powerful PC hardware and seek high-end cooling solutions without having to pick custom loop parts themselves.

With the inclusion of extra accessories, these Quantum Power² kits simplify the loop-building process, making it a hassle-free experience. Some added benefits include D-RGB lighting for customizable RGB effects, a dye pack to create a unique coolant color, two 90-degree rotary fittings, reservoir tube clamps for alternative mounting options, and much more.

Best Buy has slashed $100 off of the AMD Ryzen 5 7600X's normal asking price—North American customers can obtain these 6-core/12-thread processors for $199.90 a piece. Amazon US price matching the consumer electronics store's offer earlier today, but their stocks were depleted at some point this afternoon. AMD's Ryzen 5 7600 (non-X) processor is still stuck at MSRP ($229), so its X-model sibling presents a better deal at its current lower price. Buyers will have to splash out extra on a CPU cooling solution, since Team Red does not include a Wraith Stealth or Prism air cooler as standard with the Ryzen 5 7600X's retail package. AMD + Bethesda's Starfield Game Bundle partnership campaign kicked off last week, and all of the AM5 desktop Ryzen 7000-series models qualify for the active promotion. This plays a part in boosting customer interest, but a nice discount also goes a long way—hence the quick run on Amazon's supplies of the Ryzen 5 7600X.

The AMD Ryzen 5 7500F CPU has been popping up via various leaks—with no official announcements made despite photos, basic specifications and benchmark results appearing online. Tom's Hardware could not extract a comment directly from Team Red, so it pivoted to inside sources instead to find out more about the mysterious Zen 4 iGPU-less processor. The news site discovered that this model is very likely going to be a Chinese market exclusive—insiders reckon that it will be released closer to the end of this month. Retailers and e-tailers in the region are getting first dibs, with the Ryzen 5 7500F also made available to SIs (system integrators), so pre-built computers featuring this AM5 CPU could be released soon after.

Tom's Hardware believes that the: "Ryzen 5 7500F is very similar to the Ryzen 5 7600 and will operate with a 65 W TDP, and thus have slightly lower boost clock speeds than the 7600." It suspects that a recently published benchmark showing that single-core performance edges past the Ryzen 5 7600X (105 W TDP) is not all that accurate—these results should be "taken with a grain of salt." According to their verified sources, the Ryzen 5 7500F should "perform slightly slower than the regular 65 W Ryzen 5 7600 (non-X)." The article presents some hope that AMD is simply market testing the CPU prior to a possible USA rollout, but insiders indicate that company plans have the Ryzen 5 7500F marked for launch in China only.

Gamers Nexus recently visited AMD's headquarters in Austin, Texas—a previous video documented company employees discussing the history of Zen CPUs, and the showcasing of historical prototypes including (unreleased) Ryzen 9 5950X3D and 5900X3D models. The YouTube channel promised that more AMD HQ tour footage would be shared over the next couple of weeks—their latest upload has (host) Steve Burke talking to representatives from various internal labs.

A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.

Scythe, the CPU cooling brand originated from Japan is proudly announcing its high-performance flagship dual tower CPU cooler Fuma 3 today. With over 20 years of professional experience accumulated, the Japanese CPU cooling brand Scythe finally launches its new flagship model, the king of dual tower - Fuma 3 Dual Tower CPU cooler. The cutting-edge Fuma 3 twin tower CPU cooler is the true successor of the legendary Fuma 2. Built on the basis of the award-winning Fuma 2 twin tower design concept, the Fuma 3 presents optimized aerodynamic engineering on a new heatsink that yields more efficient heat dissipation and is ready for the most demanding overclocked CPUs.

The sturdy dual tower Fuma 3 is a 154 mm tall high-performance CPU air cooler backed with 6x6mm high-quality nickel-plated heat pipes that work firmly with the premium aluminium heatsink. Thanks to the higher fin density array and a new asymmetrical design, the Fuma 3 obtains increased thermal conductivity which results in improved cooling performance yet better compatibility even on the Mini-ITX motherboards.

A screenshot from Puget Systems benchmark database reveals a new upcoming desktop processor model by AMD, the Ryzen 5 7500F. The screenshot details the 7500F as a 6-core processor, and the machine features an ASUS ROG Strix X670E-F Gaming motherboard, along with an RTX 4080 graphics card. At this point it's hard to tell what the "F" brand extension means in AMD nomenclature. On Intel, it denotes a lack of integrated graphics.

There are two possible theories on what the 7500F could be. One holds that it's a down-rated "Raphael" MCM with a disabled iGPU; while the other holds that it could be based on the 4 nm Phoenix-2 monolithic silicon. Detailed in an older article, the Phoenix-2 is a 137 mm² monolithic silicon that physically features no more than 6 "Zen 4" CPU cores, and an iGPU with just 4 RDNA 3 compute units, besides I/O that's identical to that of the regular 178 mm² 8-core/12-CU Phoenix silicon. Phoenix-2 on AM5 might just end up with a lower bill of materials than a single-CCD "Raphael" MCM.

Update 06:13 UTC: A Korean retailer has posted the first picture of the Ryzen 5 7500F in the flesh. They claim a street price of around $170-180 (KRW equivalent), and availability slated for July 7.

AMD has designed a physically smaller version of its 4 nm "Phoenix" mobile processor silicon. The chip could power lower-end mobile SKUs in the Ryzen 3 and Ryzen 5 series, and it's likely that it could make it to Socket AM5, where it will power Ryzen 3 and lower-end versions of Ryzen 5 desktop processors. Built on the same 4 nm foundry process as the standard "Phoenix" silicon, the so-called "Phoenix 2" or "PHX2" die physically features a 6-core/12-thread CPU based on the "Zen 4" microarchitecture, and a physically smaller iGPU with just two WGPs (workgroup processors), or 4 CU (compute units), which work out to 256 stream processors. This iGPU is based on the same RDNA3 graphics architecture as the one powering the regular "Phoenix" silicon. At this point we don't know if the Ryzen AI component gets the axe, but given AMD's enthusiasm with consumer AI acceleration, the die might just retain it.

The PHX2 die likely retains the I/O of the regular "Phoenix," including a dual-channel (4 sub-channel) DDR5 and LPDDR5 memory interface, and a 24-lane PCI-Express Gen 4 root complex. These changes result in a die that appears to be around three-quarters the size of the regular "Phoenix," with an area of around 137 mm², compared to 178 mm² of the regular "Phoenix." The smaller die will save AMD big on costs and yields. At this time, there are at least two processor models reported to be based on this die, the Ryzen 5 7540U and Ryzen 3 7440U. Both are 15 W to 28 W class mobile processors aimed at thin-and-light notebooks.

Noctua today introduced its new NM-DD1 direct die kit. Developed in cooperation with professional overclocker and direct die cooling expert Roman "der8auer" Hartung, the NM-DD1 is a mounting spacer kit that makes it possible to use a wide range of Noctua CPU coolers on delidded AMD AM5 processors. Removing the processor's integrated heat spreader (delidding) and putting the heatsink directly onto the dies allows for much more efficient thermal transfer and can thereby lower CPU temperatures significantly, with typical gains in the range of 10-15°C.

"Delidding and direct die cooling will void your CPU's warranty and bear a certain risk of damaging it, so this certainly isn't for everyone," explains Roland Mossig (Noctua CEO). "However, the performance gains to be had are simply spectacular, typically ranging from 10 to 15°C but in some cases, we've even seen improvements of almost 20°C in combination with our offset mounting bars, so we're confident that this is an attractive option for enthusiast users. Thanks to Roman for teaming up with us in order to enable customers to implement this exciting tuning measure with our CPU coolers!"

Thermaltake today introduced the UX200 SE ARGB, an updated version of its popular tower-type CPU cooler. The cooler gets several design updates in its second generation, which improve its cooling capacity to 170 W, from 130 W on the original. This includes a heavier aluminium fin-stack with more fins and added surface area for heat-dissipation. It uses a heatpipe direct-touch base, from which four 6 mm-thick copper heat pipe convey heat to the aluminium fin-stack.

The included 120 mm fan features 30,000 hours rated hydraulic bearing, takes in 4-pin PWM input for its main function, turns at speeds ranging between 800 to 1,800 RPM, pushing up to 62.72 CFM of airflow, at up to 25 dBA of noise output. The lighting setup uses a 3-pin addressable RGB input, and has LEDs studded in the impeller hub. With its fan installed, the UX200 SE ARGB measures 122 mm x 61 mm x 156.2 mm (WxDxH), weighing 771 g. There are two color based variants, black (model: CL-P105-AL12SW-A), and white (CL-P116-AL12SW-A). Among the CPU socket types supported are LGA1700, AM5, LGA1200, and AM4. Available now, the UX200 SE ARGB is priced around USD $35.

Gigabyte has added three additional AMD A620 based motherboards to its lineup after the initial two that were announced on the launch day. The three new models are the A620M DS3H, A620M S2H and A620M H, all three models being mATX motherboards. The A620M DS3H is the board with most features and it's the only model to include a VRM heatsink as well as four memory slots. Common features among the three boards include a single PCIe 4.0 x16 slot, a PCIe 3.0 x1 slot, a single PCIe 4.0 M.2 NVMe slot—that supports the slightly wider 2580 form factor—four SATA ports and somewhat surprisingly for this range of boards, a DP 1.4 port and an HDMI 2.1 port.

All three boards also sport Gigabit Ethernet and a Realtek based audio solution, as well as a 90 degree angled USB 3.2 5 Gbps header. The A620M DS3H is the only model that gets a USB Type-C port around the back, but it's limited to 5 Gbps data speeds. All three models also support Gigabyte's QFlash Plus UEFI recovery/flashing solution, making it possible to update the UEFI/BIOS without having a CPU in the board. All three boards support the full range of AM5 CPUs up to 170 W, courtesy of a 5+2+2 PWM design. These might not be the most exciting boards, but they seem like a solid budget range.

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

ZALMAN, of the cooling noise prevention system (CNPS) legacy, introduced a slew of PC cooling products at the 2023 Computex. The lineup was led by the innovative Reserator5 Z-series AIO CPU coolers, which use two sets of impellers in the pump-block. One of these is dedicated for the coolant intake, after the coolant passes through the block's micro-fin lattice, it's picked up by a second impeller, which pushes it to the radiator. The dual-impeller design also provides a degree of redundancy in case one of them fails. This ZALMAN's original design, which it has patented. This cooler comes in two models, the Reserator5 Z24 (240 mm x 120 mm radiator), and the Reserator 5 Z36 (360 mm x 120 mm radiator). The impellers turn at synchronized speeds ranging between 1,000 to 2,100 RPM, while each of the included fans do 800 to 2,000 RPM, pushing up to 77.37 CFM of airflow, at 37 dBA noise output.

The next major AIO series showcased by ZALMAN is the Alpha series, which comes in three variants—Alpha 24 (240 mm x 120 mm radiator), Alpha 28 (280 mm x 140 mm), and Alpha 36 (360 mm x 120 mm). This cooler uses a more traditional single-impeller design, although the pump-block has an interesting design that resembles a heatsink. It's topped with 7-segment LED display that puts out coolant temperature in real-time. The pump runs at speeds of up to 3,200 RPM, while each of the included fans do 500 to 1,800 RPM, pushing up to 71.1 CFM at 38 dBA. Both of ZALMAN's new AIO series support the latest CPU socket types, including LGA1700, AM5, LGA1200, and AM4. Among the air-based CPU coolers shown were the new CNPS13X (single fin-stack with push-pull fans), and the CNPS13X Plus (dual fin-stack). The CNPS13X uses a single large aluminium fin-stack, and two 120 mm fans in push-pull mode. The CNPS13X Plus is a D-type dual-fin-stack cooler, with two included fans. Both coolers come with CPU surface temperature displays.