Monday, July 10th 2023
AMD Explored Vapor Chamber Cooling Design for Zen 4 CPUs
Gamers Nexus recently visited AMD's headquarters in Austin, Texas—a previous video documented company employees discussing the history of Zen CPUs, and the showcasing of historical prototypes including (unreleased) Ryzen 9 5950X3D and 5900X3D models. The YouTube channel promised that more AMD HQ tour footage would be shared over the next couple of weeks—their latest upload has (host) Steve Burke talking to representatives from various internal labs.
A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.Gamers Nexus: "This tour of AMD's Austin Headquarters features labs from around the sprawling campus, allowing us a never-before-seen look at the tools used by a hundred-billion dollar chip designer.
During these tours, we get to see unreleased prototypes - like vapor chamber heatspreaders (at the 29 minutes 50 second mark), first-party direct die plates, and unnamed CPUs - while also learning about the technology and tools used to test and design AMD's Ryzen (Zen) processors. The tour goes through the Bring-Up Lab, the codename "red door" lab, a thermal engineering lab, the device failure analysis lab, and an IHS etching facility."
Sources:
HardwareLuxx, Gamers Nexus YouTube Video, VideoCardz
A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.Gamers Nexus: "This tour of AMD's Austin Headquarters features labs from around the sprawling campus, allowing us a never-before-seen look at the tools used by a hundred-billion dollar chip designer.
During these tours, we get to see unreleased prototypes - like vapor chamber heatspreaders (at the 29 minutes 50 second mark), first-party direct die plates, and unnamed CPUs - while also learning about the technology and tools used to test and design AMD's Ryzen (Zen) processors. The tour goes through the Bring-Up Lab, the codename "red door" lab, a thermal engineering lab, the device failure analysis lab, and an IHS etching facility."
16 Comments on AMD Explored Vapor Chamber Cooling Design for Zen 4 CPUs
People are just being dramatic.
Anything to more effectively transfer heat out to a wider area would be a win, but I'm guessing complexity of getting an effective chamber that slim prevented it being practical. Perhaps for the next socket, whenever that is...
Mind you the root comment in question from ymdhis mentioned bulging, which wasn't the case in the above example. There are no recent widespread examples of bulging issues on AMD card's vapor chambers. Either they are pulling a very old example, are misinformed, or are making it up.
On a different note it would be interesting if MB makers could coat or dip the CPU socket pins in something type of material like nanotube graphite to kind of cool the pins themselves making contact with the CPU pads themselves. Though idk how that would work out a bit of a obscure abstract thought though which I sort of doubt has been considered.
I could see some kind of nanotube graphite coating being done in between with PCB layers of MB perhaps as well. I'm almost surprised to not having heard of that done yet thinking about it a bit instead we hear 2oz of copper that's the magical amount they all universe have agreed upon it seems.