GEEKOM, a Taiwanese tech company famous for making high quality mini PCs, is heading to CES for the second consecutive year in 2025 with an exciting lineup of new products. Known as the Green Mini PC Global Leader, GEEKOM always focuses on improving the quality and reliability of its products, and it also spares no effort in cutting down carbon emissions and making the world a greener place.

Among the many mini PCs that GEEKOM plans to put on show at CES 2025, there are many industry firsts. The GEEKOM QS1, for instance, is the world's first mini PC powered by a Qualcomm chipset. The tiny computer sports an Arm-based Qualcomm Snapdragon X1E-80-100 processor with twelve 4.0 GHz Oryon CPU cores, a 3.8 TFLOPS Adreno X1-85 GPU and a 45 TOPS Hexagon NPU. It is smart and fast enough to breeze through all of your daily home and office computing chores, yet energy-efficient enough to significantly cut down your electric bill.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 "Strix Halo" APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill's latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

AMD's recently launched Strix Point lineup of high-end APUs boast truly impressive performance, even when configured with lower TDPs. As time goes on, more and more hardware brands are hitting the market with Strix Point-powered devices, and unsurprisingly, Aoostar does not wish to sit on the sidelines either.

The company has teased a yet-to-be announced mini PC, with Strix Point at its heart. Powered by the powerful Ryzen AI 9 HX 370 APU, the system will likely offer excellent performance, considering that Aoostar refuses to skimp on its cooling system. Thankfully, that does seem to be case, since Aoostar claims the upcoming mini PC will boast a vapor chamber cooling setup allowing the HX 370 to run at its maximum of 54 watts. For those out of the loop, here is a rundown of the HX 370's specifications: 12-core setup with 8 Zen 5c cores and 4 Zen 5 cores, Radeon 890M iGPU based on RDNA 3+, and a 50 TOPS XDNA 2 NPU to justify the "AI" branding.

CES 2025 is less than a month away and leaks about AMD Strix Halo APUs are starting to emerge. Today we have confirmation via a leaked Geekbench Vulcan test that AMD will launch the Ryzen AI MAX+ PRO 395 w/ Radeon 8060S "Strix Halo" APU. Information reveals that this APU is equipped with 16 Zen 5 cores with 32 threads, a 3 GHz base frequency (4.4 GHz max), and a boost up to 5.1 GHz. It sports a 32 MB L3 cache per CCD for a total of 64 MB since it uses a dual CCD chip design. The TDP should be between 55-130 W. Moreover, the "PRO" in the product naming suggests that AMD could release non-PRO models at a later date.

The integrated Radeon 8060S iGPU adopts the RDNA 3.5 architecture with 40 computing units and was tested using an AMD reference board design codenamed AMD MAPLE-STXH and 64 GB of memory scoring 67,004 points in the Geekbench Vulkan test. This initial result is lower than AMD Radeon RX 7600 RDNA 3 discrete entry-level products (despite having more cores 40CU vs 32CU), and higher than NVIDIA GeForce RTX 3050. However, since the benchmark was run on an evaluation platform without optimized drivers and more likely using an early test sample product, we can expect the actual performance of the Radeon 8060S iGPU to be higher.

GPD's 6-inch Win 4 gaming handheld has been updated with AMD's latest Strix Point offering, less than a year after the recent Hawk Point upgrade. Potential customers now have the option to splurge on a system with the Ryzen AI 9 370 HX APU paired with 32 GB of LPDDR5X-7500 memory and up to 2 TB of solid-state storage.

For those out of the AMD loop, here is a quick refresher on the Ryzen AI 9 370 HX - 12 cores (8x Zen 5c + 4x Zen 5), Radeon 890M iGPU with 16 RDNA 3.5 CUs, and a 35 W TDP as configured by GPD. According to GPD's claims, the Strix Point update allows the system to perform significantly better, even edging ahead of a 45 W RTX 2050 Mobile in synthetic benchmarks.

AMD has published a blog post about its latest AMD Ryzen AI 300 series processors, claiming they are changing the game for portable devices. To back these claims, Team Red has compared its Ryzen AI 9 HX 370 processor to Intel's latest Core Ultra 7 258V, using the following games: Assassin's Creed Mirage, Baldur's Gate 3, Borderlands 3, Call of Duty: Black Ops 6, Cyberpunk 2077, Doom Eternal, Dying Light 2 Stay Human, F1 24, Far Cry 6, Forza Horizon 5, Ghost of Tsushima, Hitman 3, Hogwarts Legacy, Shadow of the Tomb Raider, Spider-Man Remastered, and Tiny Tina's Wonderlands. The conclusion was that AMD's Ryzen AI 9 HX 370, with its integrated Radeon 890M graphics powerhouse, outperformed the Intel "Lunar Lake" Core Ultra 7 258V with Intel Arc Graphics 140V by 75% on average.

To support this performance leap, AMD also relies on software technologies, including FidelityFX Super Resolution 3 (FSR 3) and HYPR-RX, to unlock additional power and gaming efficiency. FSR 3 alone enhances visuals in over 95 games, while HYPR-RX, with features like AMD Fluid Motion Frames 2 (AFMF 2) and Radeon Anti-Lag, provides substantial performance boosts across thousands of games. The company has also compared its FSR/HYPR-RS combination with Intel's XeSS, which is available in around 130 games. AMD claims its broader suite supports 415+ games and is optimized for smoother gameplay. The AFMF 2 claims support with thousands of titles, while Intel's GPU software stack lacks a comparison point. Of course, these marketing claims are to be taken with a grain of salt, so independent testing is always the best to compare the two.

According to CRN, AMD is looking to make some cuts to its workforce of approximately 26,000 employees. The company hasn't announced a specific number, but in a comment to the publication AMD said that "as a part of aligning our resources with our largest growth opportunities, we are taking a number of targeted steps that will unfortunately result in reducing our global workforce by approximately 4 percent". In actual headcount numbers that should be just north of a thousand people that the company will let go. It's not clear which departments or divisions at AMD will be affected the most, but the cutback appears to be a response to AMD's mixed quarterly report.

AMD's statement also doesn't make it clear on exactly what the company will be putting its focus on moving forward, but CRN seems to suggest that the embedded and gaming business is where AMD is struggling. That said, it's not likely that AMD will put an increased focus on those businesses, but instead the company is more likely to invest more into its server products, least not to try and catch up with NVIDIA in the AI server market. According to CRN, AMD has also seen a strong demand in AI PCs, such as the Ryzen AI 300-series of mobile SoCs, so it's possible AMD will put an extra effort into is mobile product range. The Ryzen 9000-series is thankfully also doing well, so it's unlikely there will be any big cutbacks here. We already know that AMD is not going after NVIDIA with a new flagship GPU to compete with NVIDIA's GeForce RTX 5000-series flagship SKU, so it's possible that the company will cut back on some people in its consumer GPU team for the time being, but this should become clear come CES in January.

AYANEO has officially revealed its latest handheld gaming console, dubbed the AYANEO 3. The company has teased the handheld multiple times in the past, while refraining from sharing any specifications regarding the same. Now, however, the company has detailed the internals for its new flagship handheld along with a few extra details.

The AYANEO 3 appears to be powered exclusively by AMD APUs, with Intel's Lunar Lake options nowhere to be found. Interested buyers will get to choose between either the Ryzen AI 9 HX 370 "Strix Point" APU, or the Ryzen 7 8840U "Hawk Point" APU. The "Strix Point" option happens to be AMD's latest and greatest, packing 4 Zen 5 and 8 Zen 5c cores, while the "Hawk Point" option sports 8 Zen 4 cores only.

AMD Ryzen AI MAX 300-series processors, codenamed "Strix Halo," have been on in the news for close to a year now. These mobile processors combine "Zen 5" CPU cores with an oversized iGPU that offers performance rivaling discrete GPUs, with the idea behind these chips being to rival the Apple M3 Pro and M3 Max processors powering MacBook Pros. The "Strix Halo" mobile processor is an MCM that combines one or two "Zen 5" CCDs (some ones featured on "Granite Ridge" desktop processors and "Turin" server processors), with a large SoC die. This die is built either on the 5 nm (TSMC N5) or 4 nm (TSMC N4P) node. It packs a large iGPU based on the RDNA 3.5 graphics architecture, with 40 compute units (CU), and a 50 TOPS-class XDNA 2 NPU carried over from "Strix Point." The memory interface is a 256-bit wide LPDDR5X-8000 for sufficient memory bandwidth for the up to 16 "Zen 5" CPU cores, the 50 TOPS NPU, and the large 40 CU iGPU.

Golden Pig Upgrade leaked what looks like a company slide from a notebook OEM, which reveals the iGPU model names for the various Ryzen AI MAX 300-series SKUs. Leading the pack is the Ryzen AI MAX+ 395. This is a maxed out SKU with a 16-core/32-thread "Zen 5" CPU that uses two CCDs. All 16 cores are full-sized "Zen 5." The CPU has 64 MB of L3 cache (32 MB per CCD), each of the 16 cores has 1 MB of dedicated L2 cache. The iGPU is branded Radeon 8060S, it comes with all 40 CU (2,560 stream processors) enabled, besides 80 AI accelerators, and 40 Ray accelerators. The Ryzen AI MAX 390 is the next processor SKU, it comes with a 12-core/24-thread "Zen 5" CPU. Like the 395, the 390 is a dual-CCD processor, all 12 cores are full-sized "Zen 5." There's 64 MB of L3 cache, and 1 MB of L2 cache per core. The Radeon 8060S graphics solution is the same as the one on the Ryzen AI MAX+ 395, it comes with all 40 CU enabled.

A new ultraportable notebook model powered by the AMD Ryzen AI 300 series "Strix Point" processor coming this December, will feature LPDDR5X-8000 memory, a memory speed above the LPDDR5-7500 that was standard for the processor. Hoang Anh Phu did some digging, and found that AMD has quietly updated the product pages of these processors on its website, now showing support for LPDDR5X-8000. Older versions of these pages accessed by The Wayback Machine showed them to mention 7500 MT/s as the top speed for LPDDR5X.

While regular DDR5 SO-DIMM speeds remain unchanged at dual-channel DDR5-5600, it's pertinent to note that mainstream and enthusiast-segment gaming notebooks tend to use faster DDR5 SO-DIMMs than spec using OEM-level memory overclocking, however, LPDDR5X speeds do not tend to be higher than what the processor is capable of. An OEM would only use LPDDR5X-8000 chips if the processor officially supports it, which it now does with this stealthy specs update. The notebook in question is an HP EliteBook X G1a, a 14-inch premium ultraportable that not just uses LPDDR5X-8000 with "Strix Point" processors, but also seems to have overclocked its NPU. By AMD's specs, the XDNA 2 NPU should be capable of 50 TOPS, but HP has stepped its performance up by 10%.

Even as AMD is giving final touches the 2nd generation Ryzen Z2 Extreme processor for gaming handhelds with a wacky 3+5 CPU core-configuration, some manufacturers like OneXPlayer couldn't wait, and went ahead to implement the Ryzen AI 9 HX 370 mobile processor with a cTDP of 15 W. On the upside, the HX 370 is better kitted out than the Z2 Extreme, having all 12 cores enabled (4+8), but on the downside, it lacks much of the power optimization AMD put into the Ryzen Z2 Extreme. The OneXFly F1 Pro implements the Ryzen AI HX 370, and packs a 7-inch Full HD 144 Hz touchscreen. It was recently benchmarked by One-Netbook, where it yielded some surprising results, including a 58 FPS average frame-rate in "Black Myth Wukong" with low settings.

AMD today announced revenue for the third quarter of 2024 of $6.8 billion, gross margin of 50%, operating income of $724 million, net income of $771 million and diluted earnings per share of $0.47. On a non-GAAP basis, gross margin was 54%, operating income was $1.7 billion, net income was $1.5 billion and diluted earnings per share was $0.92.

"We delivered strong third quarter financial results with record revenue led by higher sales of EPYC and Instinct data center products and robust demand for our Ryzen PC processors," said AMD Chair and CEO Dr. Lisa Su. "Looking forward, we see significant growth opportunities across our data center, client and embedded businesses driven by the insatiable demand for more compute."

Minisforum is thrilled to announce the launch of the EliteMini AI370, a powerful mini PC that combines groundbreaking CPU performance with a sleek, compact design. This innovative device is designed to meet the demands of gamers, creators, and tech enthusiasts who need high performance in a small footprint.

The Next-Level Performance
At the core of the EliteMini AI370 is the new AMD Ryzen AI 9 HX 370 processor. Featuring 12 cores and 24 threads, this advanced chip delivers effortless power for gaming and creative applications. It expertly balances high performance and energy efficiency, with integrated AI enhancements that optimize workflows and daily tasks like never before.

Today, AMD (NASDAQ: AMD) announced its third generation commercial AI mobile processors, designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute, with up to three times the AI performance than the previous generation, and offer uncompromising performance for everyday workloads. Enabled with AMD PRO Technologies, the Ryzen AI PRO 300 Series processors offer world-class security and manageability features designed to streamline IT operations and ensure exceptional ROI for businesses.

Ryzen AI PRO 300 Series processors feature new AMD "Zen 5" architecture, delivering outstanding CPU performance, and are the world's best line up of commercial processors for Copilot+ enterprise PCs. Laptops equipped with Ryzen AI PRO 300 Series processors are designed to tackle business' toughest workloads, with the top-of-stack Ryzen AI 9 HX PRO 375 offering up to 40% higher performance and up to 14% faster productivity performance compared to Intel's Core Ultra 7 165U. With the addition of XDNA 2 architecture powering the integrated NPU, AMD Ryzen AI PRO 300 Series processors offer a cutting-edge 50+ NPU TOPS (Trillions of Operations Per Second) of AI processing power, exceeding Microsoft's Copilot+ AI PC requirements and delivering exceptional AI compute and productivity capabilities for the modern business. Built on a 4 nm process and with innovative power management, the new processors deliver extended battery life ideal for sustained performance and productivity on the go.

The upcoming Strix Point Halo processors from AMD now have a new name - Ryzen AI Max - and come with big promises of impressive power. This rumor, first reported by VideoCardz and originating from Weibo leaker Golden Pig Upgrade, reveals key details about the first three processors in this lineup, along with their specifications.

The leaker claims AMD might roll out a new naming system for these processors branding them as part of the Ryzen AI Max series. These chips will run on the anticipated Strix Halo APU. This series includes three models, with the top-end version boasting up to 16 Zen 5 cores and 40 Compute Units (CUs) for graphics. This setup is expected for the best model contrary to earlier rumors that AMD would drop such a variant. In fact, word has it that at least two of the models in this lineup will come with 40 RDNA 3.5 Compute Units. The leaker also hints that Strix Halo will handle up to 96 GB of video memory suggesting AMD aims to make this processor work with its ROCm (Open Compute Platform) system.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Lenovo, a global leader in technology innovation, announced its latest advancements at Lenovo Innovation World 2024, unveiling a series of AI PC devices, including ThinkPad, ThinkBook, Yoga, and IdeaPad laptops, designed to transform both enterprise and consumer user experiences.

AI PC Era
AI PCs are set to revolutionize computing as their relevance grows, with 60% of PCs shipped by 2027 anticipated to be AI-capable. Lenovo's AI PCs are at the forefront of this transformation, leveraging natural interactions, personalized large language models, and advanced computing architectures. These innovations make computing more personal by tailoring experiences to individual users, more productive by enhancing workflow efficiency, and more protected by integrating robust security features into AI-driven systems.

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable.

Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.

Acer today announced its entry into the handheld gaming space with the launch of the new Acer Nitro Blaze 7 (GN771). The device combines cutting-edge technology and a compact design to always bring next-level gaming and entertainment within reach. Acer's first-generation handheld AI gaming PC features an AMD Ryzen 7 8840HS processor, with Ryzen AI that optimizes performance and responsiveness across a wide range of games and applications.

The design allows users to easily slip the device into their bags or pockets for instant playing time on the go. It features a 7-inch Full HD (FHD) IPS display with a touch interface, plus AMD FreeSync Premium technology, and a blazing-fast 144 Hz refresh rate. This allows players to experience enhanced visuals and responsive controls while playing their favorite AAA titles. The system runs on Windows 11 and features the new Acer Game Space application which supports the addition of games from multiple platforms.

MSI, a leading brand in gaming, content creation, and business & productivity laptops, proudly launched several next-gen AI+ gaming and business productivity laptops featuring the new Intel Core Ultra processor (Series 2) and AMD Ryzen AI 300 Series at IFA 2024. These laptops offer more AI computing power, making it the most robust platform for AI PC development, with more AI models, frameworks, and runtimes enable. Additionally, MSI officially launched the new Claw 8 AI+ Windows 11 gaming handheld device, powered by Intel Core Ultra processors (Series 2) and an 8-inch screen, providing a smoother and broader mobile gaming experience. MSI also announced the whole new Venture series laptops, redefining the combination of thin, light and powerful. Equipped with Intel Core Ultra processors (Series 2) and varieties of different size, from 14, 15.6, 16, to 17 inches.

"MSI not only brings the industry's most comprehensive AI+ PC lineup but also introduces multiple new laptops and handheld devices designed for gamers worldwide," said Eric Kuo, MSI's Executive Vice President and General Manager of NB Business Unit. "We welcome global guests to visit the MSI booth to experience next-gen AI computing and exciting gaming products."

ASUS announced availability for the company's new lineup of AMD Ryzen AI laptops featuring advanced AI capability with 50 TOPS NPU AI engines.

ASUS ProArt P16 / ProArt PX13
The new ASUS ProArt laptop lineup is designed to empower every creator — whether they are everyday users, outdoor content creators, or professionals — to transform their precious life moments into enduring stories. The lightweight, durable, and powerful laptops allow users to create anywhere, create faster, and create smarter.

Since its reveal last week, we got a slightly more technical deep-dive from AMD on its two upcoming processors—the "Strix Point" silicon powering its Ryzen AI 300 series mobile processors; and the "Granite Ridge" chiplet MCM powering its Ryzen 9000 desktop processors. We present a closer look into the "Strix Point" SoC in this article. It turns out that "Strix Point" takes a significantly different approach to heterogeneous multicore than "Phoenix 2." AMD gave us a close look at how this works. AMD built the "Strix Point" monolithic silicon on the TSMC N4P foundry node, with a die-area of around 232 mm².

The "Strix Point" silicon sees the company's Infinity Fabric interconnect as its omnipresent ether. This is a point-to-point interconnect, unlike the ringbus on some Intel processors. The main compute machinery on the "Strix Point" SoC are its two CPU compute complexes (CCX), each with a 32b (read)/16b (write) per cycle data-path to the fabric. The concept of CCX makes a comeback with "Strix Point" after nearly two generations of "Zen." The first CCX contains the chip's four full-sized "Zen 5" CPU cores, which share a 16 MB L3 cache among themselves. The second CCX contains the chip's eight "Zen 5c" cores that share a smaller 8 MB L3 cache. Each of the 12 cores has a 1 MB dedicated L2 cache.

AMD presented a closer look at the Radeon 890M iGPU powering the Ryzen AI 300 series "Strix Point" mobile processor. The iGPU introduces the new RDNA 3.5 graphics architecture, with several architecture-level improvements built around the existing RDNA 3 SIMD, to yield performance/Watt improvements that AMD could trade in to increase the SIMD muscle for its processors, and proportionately increase performance. The iGPU features one Shader Engine with 8 workgroup processors (WGPs), which amount to 16 CU (compute units), for a total of 1,024 stream processors, 32 AI accelerators, and 16 Ray accelerators. The iGPU also has 4 render backends+, for 16 ROPs. It is specced with a maximum engine clock of 2.90 GHz, which yields over 11 TFLOP/s of FP32 throughput, which is around 30% higher than the iGPU of "Phoenix" (12 CU, RDNA 3), at comparable power.

AMD goes into the finer points of how it yielded the performance/Watt gains. The company worked on the texture subsystem to double the texture sampler rate, and introduced point-sampling acceleration. The shader sub-system features interpolation and comparison rate doubling. The raster sub-system introduces sub-batching of batch raster operations, with a programmable bin order, for the hardware to be more efficient. Lastly, AMD worked on the iGPU's memory-management, to be more aware of LPDDR5 (which has a different physical layer or way of writing/fetching than GDDR6). The company worked on improving the memory compression technologies, to improve performance, and reduce the iGPU's memory footprint.