Intel has published a case study on the EUROCOM Panther 5SE Mobile Server as part of winning the "Form Factor Solution Innovation Award", titled "Super Computer Sheds Weight, gains mobility, Becomes "Server-on-the-Go". As an Intel Platinum Reseller, Eurocom works very closely with Intel to offer innovative and cutting edge technology to professionals who demand powerful computing solutions wherever they may be. At the 2013 Intel Solution Summit, Eurocom was awarded the Form Factor Solution Innovation Award for delivering the most innovative mobile solution based on Intel Technology to meet our customers' demands for mobility.

More specifically the EUROCOM Panther 5SE was awarded this distinction by conquering the challenge of creating a portable server for application developers, emergrency responders, on site trainers and others who need powerful server capability on the go. As Intel Explains "Eurocom corporation successfully conquered this challenge by outfitting a desktop replacement chassis with the highest quality components, including the Intel Xeon processor E5 series and Intel S3700 solid state drives - chosen for their ability to support both workstation and server-class operations."

Kingston Technology Company, Inc., the independent world leader in memory products, today announced they will be showcasing working DDR4 memory, XMP certified HyperX memory on a new Ivy Bridge-E based desktop, 2133 MHz SO-DIMMs for a Haswell based notebook and ECC memory in an Avoton based microserver at the Intel Developers Forum (IDF) 2013. IDF will be held at the Moscone center in San Francisco, California on September 10th - 12th.

During IDF 2013 Kingston will be showcasing four demo systems. The DDR4 memory demo will highlight 192 GB of working 2133 MT/s DDR4 Registered DIMMs at 1.2V operating on a future Intel reference platform. The Kingston HyperX demo will be showcasing the latest HyperX memory that has been validated through Intel's XMP certification process. The demos will be shown using an X79 motherboard and one of Intel's newest Ivybridge E processors. Our 2133 MHz SO-DIMM memory demo will be shown working on a Haswell based notebook. The Microserver demo will be demonstrating 1600 MHz 1.35V low voltage ECC SODIMM memory on an Intel Atom C2000-series "Avoton" microserver. Kingston's ECC SODIMM memory has been validated on the Intel "Edisonville" microserver system, and is posted on Intel's website.

Crucial, a leading global brand of memory and storage upgrades, today announced new Crucial Ballistix Sport SODIMMs, designed to boost performance of gaming laptops, all-in-one systems, or mini ITX motherboards. Featuring XMP profiles for easy configuration and DDR3 speeds up to 1866 MHz, Ballistix Sport SODIMMs deliver a faster and more responsive gaming experience. Optimized for the latest 4th generation Intel Core i5 and i7 mobile processors, Ballistix Sport SODIMMs offer lower latencies and increased energy efficiency compared to standard SODIMMs.

Engineered to run on 1.35V instead of the standard 1.5V found in most laptop memory modules, Ballistix Sport SODIMMs can reduce DRAM power consumption in systems by up to 10 percent, enabling longer battery life. Offered in 4 GB and 8 GB densities, Crucial Ballistix Sport SODIMMs will be available in early July.

Eurocom Corporation, a leading developer of high performance Mobile Workstations and Mobile Servers is offering the EUROCOM Scorpius, a fully scalable, high performance computing laptop platform designed specifically for professional users and digital content creators.

Using durable ABS plastics and top quality manufacturing technology, the 17.3" Scorpius weighs just 3.5 kg (7.7 lbs) and is less than 50 mm (1.9 inches) when closed, an astonishing feat of engineering considering the level of power under the hood. Its strong chassis can take unintentional abuse while on the go while being used for heavy duty computing by engineers, professionals or hardcore gamers.

The EUROCOM Uno 3.0 is designed primarily for corporate customers, the Eco-Friendly 120 Watts, 7.5kg (16.5lbs) easy to move around All in One PC allows companies to improve overall productivity and security, reduce downtime caused by power interruptions and greatly reduce energy costs.

The EUROCOM Uno 3.0 has an integrated battery pack, which provides backup power in case of electrical failure, or unstable incoming electrical current, while also allowing for easy relocation without system shutdown. When AC power suddenly shuts down, backup battery can keep you working for up to 70 minutes and/or allow users to save uncompleted documents.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced the debut of its latest motherboards series based on the Thin Mini-ITX form factor. The new GIGABYTE H77TN and B75TN motherboards enable the creation of slim and compact All-In-One (AIO) PC designs that adhere to Intel's AIO PC specification.

Featuring a low profile design that is 43% thinner than traditional Mini-ITX motherboards, GIGABYTE Thin Mini-ITX motherboards offer a full featured PC experience with performance and specification options that you'd expect from a traditional desktop PC setup. In addition, GIGABYTE's Thin Mini-ITX motherboards also offer flexible power input and IO expansion specifications that make them suitable for a broad range of commercial and industrial PC designs that also conform to Intel's Thin Mini-ITX specification.

Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, and TE Connectivity (TE), a world leader in connectivity, announced today the availability of a Single-Sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices. Aimed at providing a reduced-height memory solution for the ultrathin computing market, the new Single-Sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6 mm for a standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4 GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

The rapidly developingcloud-based services have brought prospective impact on the enterprise-level storage device, network communication equipment and high-end server.To meet the enterprises' demand for powerful computing, Apacer, the global professional manufacturer of the memory module, launchesDDR3-1333 SO-RDIMM.It's the special memory module tailored for the Mission Critical Application and the Networking System device. As the product features compactness, high-processing speed and high stability brought by registering clock driver with parity chip, it can offer enterprises the multi-advantage storage device in a cloud-based operating environment.

Eurocom, is shipping a complete line of high performance, fully upgradeable Mobile Workstations specifically designed for the modern Engineer. Supporting the most powerful mobile professional graphics solutions including the NVIDIA Quadro K5000M and K3000M, Eurocom Mobile Workstations are able to run the most demanding engineering and design software with ease, while on the go.

"We have customers running Dassault Systemes Solidworks, Siemens Solid Edge, Creo Elements Pro, CATIA and Autodesk Inventor software suites on the go with our line of Mobile Workstations. Thanks to our support of NVIDIA Quadro professional graphics solutions, our Mobile Workstations are able to handle a wide range of professional grade software suites" Mark Bialic, Eurocom President.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today announces the availability of its new Memory For Ultrabook SODIMM Modules. Compatible with 3rd generation Intel Core processors, these modules offers consumers a no hassle option to upgrade Ultrabook class laptops for increased performance and productivity.

Providing the most dynamic and powerful mobile computing platform, the Ultrabook delivers the highest levels of portability, performance, and entertainment. The Ultrabook is truly redefining the mobile computing experience. With this in mind, Patriot's Memory for Ultrabook SODIMM modules were designed to offer the perfect performance enhancement to the Ultrabook ecosystem.

Eurocom Corporation, is now launching the EUROCOM Scorpius Ultra High Performance Notebook with support for dual graphics technology from NVIDIA GeForce, Quadro and AMD Radeon, powerful Intel Core i7-3920XM Processor Extreme Edition, up to 32 GB of DDR3 1600 memory and three storage drives plus one mSATA drive.

"The EUROCOM Scorpius is an out of this world High Performance Notebook Computer. Like the mythical creature that stung and killed Orion, the EUROCOM Scorpius will take down any competition standing in its way, while allowing gamers to do the same!" exclaims Mark Bialic, Eurocom President. "We have been getting out of this world benchmark results with the EUROCOM Scorpius. Simply put, this is the most powerful system of its kind on the planet."

Eurocom Corporation, a developer of long lifespan, high performance, fully upgradable Notebooks and Mobile Workstations has launched a small form factor notebook with up to 3 terabytes storage via three 1 terabyte storage drives, 3rd Generation Intel Core i7 Ivy Bridge Processors, up to 16GB DDR3-1600 RAM and NVIDIA GeForce GT 650M graphics with Optimus technology.

EUROCOM Fox 4.0 provides high-calibre performance, powerful graphics capabilities and high performance storage with three physical storage drives RAID 0/1/5 capability. Super powerful Intel Core i7 are supported for high-end computing wherever life takes place.

As the leading memory module maker, Apacer Technology Inc. has long been devoted to the industrial computer field, particularly the embedded systems. Apacer takes the lead by introducing today a memory module featuring high speed, high capacity and low power consumption as well as full compatibility with the 22-nm Ivy Bridge microprocessor platform released lately by Intel. Compared with the mainstream 8-GB DDR3-1333 memory module, Apacer's high-speed DDR3-1600 memory module dedicated to embedded systems requires a working voltage of only 1.35V, which can be applied into the module either to the fanless design or to the embedded system. Thanks to its 20% higher performance and 11% less power consumption, the module can save considerable power expenditure for enterprise users.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Manli, a brand owned by PC Partner, showed off its latest mini-PC, the Elite. Driven by AMD E-450 "Brazos" APU, the Elite is a barebone, that requires you to add the memory (a single DDR3-SODIMM slot is available), and storage (a 2.5-inch drive with SATA 6 Gb/s connection available). Pre-configured models with 2 GB memory and 320 GB HDD are available in select markets. Connectivity includes two USB 2.0 ports, two USB 3.0 ports, a DisplayPort and HDMI connector for display, an eSATA port, Gigabit Ethernet, a multi-format card reader, audio jacks and built in 802.11b/g/n WLAN.

PowerColor's parent company, TUL, showed off its barebones Mini-PC at CES. Its main unit measures just 165 x 165 x 55 mm (LxWxH), and is available in black and white color options. Under the hood is an AMD G-Series embedded APU, backed by Hudson M1 FCH chipset. It takes in 1 DDR3-SODIMM module, up to 4 GB in size, and runs it at speeds of up to PC3-8500 (DDR3-1066 MHz). The G-Series APU provides AMD Radeon HD 6310 graphics, with DVI and HDMI display outputs. The mini PC barebone has room for one 2.5-inch SATA 6 Gb/s drive. Its front-panel offers one USB 2.0 port (USB 3.0 can be opted for), a multi-format card reader, and eSATA 6 Gb/s. Its rear panel connectivity includes 2-channel audio outputs, gigabit Ethernet, four USB ports, and display connectivity. The unit has an internal 40W PSU.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced a line of high-performance memory upgrade kits for power laptop users.

Operating at speeds of 1600 MHz and 1866 MHz, the new Vengeance laptop memory upgrade kits are an ideal solution for notebooks equipped with a 2nd Generation Intel Core i5 or Core i7 processor. Vengeance laptop memory is designed to be plug-and-play, with no BIOS adjustments needed to instantly take advantage of the faster memory speed.

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage, and enthusiast computer products, today announces their new Mac Series XT SSDs and SODIMM lines. Optimized for the latest and popular Mac products, these premium offerings are geared for power users demanding the latest storage and memory technology to increase productivity and performance.

"Patriot Memory's Mac Series XT SSDs will provide users with a great alternative to traditional mechanical hard drives", says William Lai, Patriot Memory's Product Manager. "Offering an easy solid state and memory upgrade, Mac users will be able to maximize their computing experience almost instantly."

Stealth.com Inc. (Stealth Computer), a leading ISO 9001 manufacturer of industrial rugged computers and peripherals has released the new model LPC-125LPFM, a rugged, small footprint, fanless computer for industrial, Mobile/In-Vehicle and Embedded applications.

The LPC-125LPFM is a breakthrough in small form factor computing. The rugged, diminutive size, noise free computer operates in wide temperature ranges and drawing less than 20 Watts of operational power. This energy efficient & versatile PC measures out at only, 4.6" x 6.1" x 2.0" (117mm x 155mm x 52mm) or slightly larger than a deck of playing cards. The Stealth Mini PC weighs in at a mere 1.2lbs or 0.54kg. The PC operates from 10-26V of DC power making it ideal for DC powered applications typically found in vehicle and mobile applications.

Crucial, a leading global brand of memory and storage upgrades, today introduced Crucial 8GB DDR3-1333 MHz UDIMM (desktop) and SODIMM (laptop) memory modules to fully support the latest 2nd generation Intel Core i7 and i5 processors. Users demand more from their computers than ever before, simultaneously running and switching between multiple, complex applications such as photo editing, high-definition video editing, and gaming software. With that in mind, Crucial high-capacity 8GB desktop and laptop memory modules enable users to meet these computing challenges head on, enhancing the user experience by providing a more responsive system.

The new modules also allow for high-capacity memory in smaller form factors such as laptops, All-in-One PCs, and home theater PCs. Traditionally, most laptops have been limited to one or two DIMM slots for system memory needs. As form factors continue to shrink, providing even less space on the motherboard to populate memory, an 8GB Crucial laptop module is ideal for newer, more portable form factors that only have one DIMM slot available. Additionally, these new 8GB DDR3-1333MHz SODIMM modules are 1.35V, compared to their standard 1.5V counterparts. For laptops that support the lower voltage, the modules help reduce power consumption and operating temperature while increasing battery life.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced worldwide retail availability of 4GB DDR3 memory for Apple Mac desktop and laptop PCs.

Corsair's Mac memory kits are tested at Apple Developer Compatibility Labs and are guaranteed to work with any Mac desktop or notebook PC that supports 4GB DDR3 SODIMMs, including iMac, Mac mini, Mac Pro, MacBook, and MacBook Pro models. This includes virtually all models offered by Apple since 2010.

Stealth.com Inc., a leader in the industrial computer and peripherals market has released a new ultra small PC designed specifically for in-vehicle/mobile/embedded applications. Stealth's model LPC-125LPM is a rugged small form PC that operates in extreme temperatures and is energy efficient, drawing less than 20 Watts in operational power.

Housed in a rugged aluminum enclosure this energy efficient & versatile PC measures out at only 4.0" x 6.1" x 1.45" (102mm x 155mm x 37mm) or about the size of a deck of playing cards. The Stealth Mini PC weighs in at a mere 1.2lbs or 0.54kg. The PC operates from 10-26V of DC power making it ideal for DC powered applications typically found in vehicles and mobile applications.

TEAM Group, of the TEAM Xtreem fame, showed us its latest generation of ultra-high end DDR3 memory modules for overclocking. The theme for this year is LV (low-voltage) modules, which can do their rated DRAM speeds at 1.35V voltage. We begin with TEAM Xtreem DDR3-2400 MHz and TEAM Xtreem DDR3-2000 MHz, which come in 2 GB and 4 GB module capacities, and in triple-channel and dual-channel kits. These kits are the top of the line that TEAM has, to offer.

Moving on, there's a second line of memory kits for the performance segment, also LV (low-voltage, 1.35V), called TEAM Xtreem Dark series, which offer speeds of DDR3-1600 MHz, and use slightly smaller heatsinks. These modules come in 2, 4 GB capacities, and in dual and triple channel kits. Next up is the TEAM Green series, that are bare modules without heatsinks, that do JEDEC standard DDR3-1333 MHz and DDR3-1600 MHz at 1.35V, with loose timings. Lastly, there's a performance line of SODIMM modules for Apple Macs, the TEAM Mac SODIMM, which runs at DDR3-1333 and DDR3-1066 MHz speeds, offering 2 GB and 4 GB module capacities.

MSI, the global leading brand in motherboards, announced the upgraded version of IM-QM67 which is powered by the 2nd generation Intel Core processor family, Intel Sandy Bridge processor, and Intel QM67 Express chipset. IM-QM67 supports multiple display outputs in a mini-ITX form factor board and utilizes Intel's 32nm process technology products to give the competitive advantage through the performance enhancements and scalability.

MSI debuts the IM-QM67 based on the Intel Core i7, Core i5 and Core i3 processors to offer lower power consumption and enhanced graphic and media performance. The IM-QM67 is equipped with dual-channel DDR3 1067/1333/1600 MHz memory up to a maximum of 16 GB in dual SO-DIMM slots and is ideally suited to applications requiring multi-tasking capabilities, high computing power. This combination of CPU, chipset and memory provides the MSI IM-QM67 with improved power efficiency and high-speed data transfer for performance-driven industrial applications, such as industrial control, automation, digital signage, kiosk, POS, gaming, ATM and medical electronic.

Hynix Semiconductor Inc. ('Hynix') today announced that it has developed 2Gb(Gigabit) DDR4 DRAM and DDR4 DRAM based 2GB(Gigabyte) ECC-SODIMM(Error Check & Correction Small Outline Dual In-line Memory Module) applying its leading 30nm class process technology. The DDR4 DRAM product meets the JEDEC standard and the module product is designed for the micro server.

DDR4 DRAM is a next generation memory product which consumes less electronic power while it transfers data as twice as faster than the existing DDR3 DRAM. The device works at the industry's fastest speed of 2400Mbps(Megabits per second), which is also 80% faster than DDR3 1333Mbps product. The Module product operates at such a low voltage of 1.2V and processes up to 19.2 GB (Gigabytes) of data per second with a 64-bit I/O.