Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry's highest performance and largest capacity. Built on its in-house 5-nanometer (nm)-based controller and eighth-generation V-NAND (V8) technology, the PM9E1 will provide powerful performance and enhanced power efficiency, making it an optimal solution for on-device AI PCs. Key attributes in SSDs, including performance, storage capacity, power efficiency and security, have all been improved compared to its predecessor (PM9A1a).

"Our PM9E1 integrated with a 5 nm controller delivers industry-leading power efficiency and utmost performance validated by our key partners," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "In the rapidly growing on-device AI era, Samsung's PM9E1 will offer a robust foundation for global customers to effectively plan their AI portfolios."

TrendForce's latest reports reveal that the second quarter of 2024 saw a significant increase in demand for enterprise SSDs due to the increased deployment of NVIDIA GPU platforms and rising storage needs driven by AI applications, along with a surge in demand from server brands. The surge in demand for high-capacity SSDs for AI applications—coupled with suppliers' inability to adjust capacity in the first half of the year—resulted in a supply shortage that drove average enterprise SSD prices up by more than 25% QoQ. This price increase led to a revenue growth of over 50% for suppliers.

Looking ahead to the third quarter, demand from North American CSP customers continues to rise, and server brands show no signs of slowing down their orders, further boosting procurement volumes of enterprise SSD. With supply shortages persisting into the third quarter, TrendForce forecasts a 15% increase in contract prices compared to the previous quarter, with supplier revenues expected to grow by nearly 20%.

Samsung's foundry plans have again hit a major setback. The company notified staff at its Taylor, Texas facility that it was temporarily removing workers from the site because it is still experiencing challenges with 2 nm semiconductor yields, delaying mass production timelines from late 2024 to 2026. The Taylor site had been anticipated as the flagship facility for Samsung's sub-4 nm production, allowing access to potential customers near the facility. While Samsung has moved rapidly in terms of process development, its yields for advanced nodes have outstripped them, the company's yields for sub-3 nm processes hover around 50%, with Gate-All-Around (GAA) technology witnessing yields of only 10-20%, significantly lower than neighboring competitor TSMC's 60-70% for corresponding nodes.

The yield gaps that the company is experiencing have exacerbated the gap in market share, with TSMC capturing 62.3% of the global foundry market share in Q2 versus Samsung's 11.5%. The company is struggling to gain share despite efforts by Chairman Lee Jae-yong - including visits to component suppliers ASML, and Zeiss - and these yields put at risk as much as 9 trillion won in U.S. CHIP Act potential subsidies that are dependent upon operational milestones.

Samsung is implementing a major workforce realignment to improve operations and increase efficiency. According to a report from Reuters, Samsung has instructed its global subsidiaries to reduce marketing and sales staff by 15% and management personnel by 30% by the end of this year. Of its 267,800 employees worldwide, 147,000 are based overseas, and Samsung's global layoff plan is expected to impact all regions, including Europe, Asia, the Americas, and Africa. The exact motivation behind the layoffs is unclear; one source cites the slowdown in global demand for tech products as a factor, while another suggests Samsung is aiming to increase profits by cutting costs.

Dell is also implementing significant measures, with plans to lay off at least 12,500 employees, approximately 10% of its total workforce. Dell is striving to become "leaner" by overhauling its sales divisions and adopting paperless operations with the help of AI. Job cuts are expected to continue overseas, with U.S. staff members expecting their turn soon. Dell has declined to confirm any numbers regarding the layoffs, particularly those concerning their employees.

Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

With the industry's first mass production of QLC 9th-generation V-NAND, following the industry's first triple-level cell (TLC) 9th-generation V-NAND production in April this year, Samsung is solidifying its leadership in the high-capacity, high-performance NAND flash market.

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced the industry's first HBM4 Memory Controller IP, extending its market leadership in HBM IP with broad ecosystem support. This new solution supports the advanced feature set of HBM4 devices, and will enable designers to address the demanding memory bandwidth requirements of next-generation AI accelerators and graphics processing units (GPUs).

"With Large Language Models (LLMs) now exceeding a trillion parameters and continuing to grow, overcoming bottlenecks in memory bandwidth and capacity is mission-critical to meeting the real-time performance requirements of AI training and inference," said Neeraj Paliwal, SVP and general manager of Silicon IP, at Rambus. "As the leading silicon IP provider for AI 2.0, we are bringing the industry's first HBM4 Controller IP solution to the market to help our customers unlock breakthrough performance in their state-of-the-art processors and accelerators."

TrendForce reports that NAND Flash prices continued to rise in 2Q24 as server inventory adjustments neared completion and AI spurred demand for high-capacity storage products. However, high inventory levels among PC and smartphone buyers led to a 1% QoQ decline in NAND Flash bit shipments. Despite this, ASP increased by 15% and drove total revenue to US$16.796 billion, a 14.2% growth compared to the previous quarter.

All NAND Flash suppliers returned to profitability starting in the second quarter and are expanding capacity in the third quarter to meet strong demand from AI and server markets. However, weaker-than-expected PC and smartphone sales in the first half of the year are likely to constrain NAND Flash shipment growth.

Samsung Electronics today announced the Galaxy Book4 Edge (15-inch), the latest addition to Samsung's Galaxy Book lineup, now powered by Qualcomm's cutting-edge Snapdragon X Plus 8-core platform. This new Copilot+ PC seamlessly integrates advanced AI capabilities, which elevate productivity and creativity to new heights.

Enhanced connectivity with the Samsung Galaxy ecosystem allows for one easy and efficient workflow across multiple devices, and further improves access to trailblazing Galaxy AI tools. All of these innovations are housed in a slim design featuring a 15.6-inch FHD display, a long-lasting battery with Super-Fast Charging and Samsung's multi-layer Samsung Knox security. The Galaxy Book4 Edge (15-inch) is available in select markets starting October in an iconic Sapphire Blue finish.

Samsung Electronics today announced the Galaxy Book5 Pro 360, a Copilot+ PC and the first in the all-new Galaxy Book5 series. Performance upgrades made possible by the Intel Core Ultra processors (Series 2) bring next-level computing power, with up to 47 total TOPs NPU - and more than 300 AI-accelerated features across 100+ creativity, productivity, gaming and entertainment apps. Microsoft Phone Link provides access to your Galaxy phone screen on a larger, more immersive PC display, enabling use of fan-favorite Galaxy AI features like Circle to Search with Google, Chat Assist, Live Translate and more. And with the Intel ARC GPU, graphics performance is improved by 17%. When paired with stunning features like the Dynamic AMOLED 2X display with Vision Booster and 10-point multi-touchscreen, Galaxy Book5 Pro 360 allows creation anytime, anywhere.

"The Galaxy Book5 series brings even more cutting-edge AI experiences to Galaxy users around the world who want to enhance and simplify their everyday tasks - a vision made possible by our continued collaboration with longtime industry partners," said Dr. Hark-Sang Kim, EVP & Head of New Computing R&D Team, Mobile eXperience Business at Samsung Electronics. "As one of our most powerful PCs, Galaxy Book5 Pro 360 brings together top-tier performance with Galaxy's expansive mobile AI ecosystem for the ultimate AI PC experience."

Samsung Electronics America today announced the launch of its latest innovations in home entertainment, The Premiere 9 and The Premiere 7. These ultra-short throw projectors, designed to deliver an unparalleled viewing experience, transform any living space into a premium home cinema with stunning 4K resolution, immersive audio and other advanced features.

"Research finds the #1 factor buyers search for in a new projector is whether it provides a cinematic experience. That's why we've refreshed our award-winning lineup of The Premiere projectors to make it even easier for you to experience theater-like visuals, right at home" said James Fishler, Senior Vice President of Home Entertainment, Samsung Electronics America. "The Premiere 9 and 7 transform your everyday living space into an immersive viewing hub, delivering incredible picture quality, immersive sound and endless ways to enjoy your favorite content. They truly set the standard for modern home entertainment."

Samsung Electronics today announced the unveiling of its latest gaming monitors with a particular focus on the groundbreaking Odyssey 3D, which offers glasses-free 3D viewing, at Gamescom 2024 in Cologne, Germany. Gamescom 2024, held from August 21 to 25, is the world's largest gaming exhibition and features more than 1,400 exhibitors, including hardware, software and game content producers. Samsung will showcase its high-end gaming monitors - including the new Odyssey 3D and models from the Odyssey G6, G8 and G9 series - at its booth, which spans 800 m² and is the company's largest and most immersive booth to date.

"We are thrilled to present our glasses-free 3D gaming monitor at Gamescom, the world's largest gaming exhibition," said Hoon Chung, Executive Vice President of Enterprise Business Team, Visual Display Business at Samsung Electronics. "Samsung remains committed to leading the premium gaming monitor market by continuously developing cutting-edge technologies that enhance the gaming experience."

Samsung Electronics is set to make a significant leap in semiconductor manufacturing technology with the introduction of its first High-NA 0.55 EUV lithography tool. The company plans to install the ASML Twinscan EXE:5000 system at its Hwaseong campus between Q4 2024 and Q1 2025, marking a crucial step in developing next-generation process technologies for logic and DRAM production. This move positions Samsung about a year behind Intel but ahead of rivals TSMC and SK Hynix in adopting High-NA EUV technology. The system is expected to be operational by mid-2025, primarily for research and development purposes. Samsung is not just focusing on the lithography equipment itself but is building a comprehensive ecosystem around High-NA EUV technology.

The company is collaborating with several key partners like Lasertec (developing inspection equipment for High-NA photomasks), JSR (working on advanced photoresists), Tokyo Electron (enhancing etching machines), and Synopsys (shifting to curvilinear patterns on photomasks for improved circuit precision). The High-NA EUV technology promises significant advancements in chip manufacturing. With an 8 nm resolution capability, it could make transistors about 1.7 times smaller and increase transistor density by nearly three times compared to current Low-NA EUV systems. However, the transition to High-NA EUV comes with challenges. The tools are more expensive, costing up to $380 million each, and have a smaller imaging field. Their larger size also requires chipmakers to reconsider fab layouts. Despite these hurdles, Samsung aims for commercial implementation of High-NA EUV by 2027.

Primate Labs, the developer behind the popular Geekbench benchmarking suite, has launched Geekbench AI—a comprehensive benchmark tool designed to measure the artificial intelligence capabilities of various devices. Geekbench AI, previously known as Geekbench ML during its preview phase, has now reached version 1.0. The benchmark is available on multiple operating systems, including Windows, Linux, macOS, Android, and iOS, making it accessible to many users and developers. One of Geekbench AI's key features is its multifaceted approach to scoring. The benchmark utilizes three distinct precision levels: single-precision, half-precision, and quantized data. This evaluation aims to provide a more accurate representation of AI performance across different hardware designs.

In addition to speed, Geekbench AI places a strong emphasis on accuracy. The benchmark assesses how closely each test's output matches the expected results, offering insights into the trade-offs between performance and precision. The release of Geekbench AI 1.0 brings support for new frameworks, including OpenVINO, ONNX, and Qualcomm QNN, expanding its compatibility across various platforms. Primate Labs has also implemented measures to ensure fair comparisons, such as enforcing minimum runtime durations for each workload. The company noted that Samsung and NVIDIA are already utilizing the software to measure their chip performance in-house, showing that adoption is already strong. While the benchmark provides valuable insights, real-world AI applications are still limited, and reliance on a few benchmarks may paint a partial picture. Nevertheless, Geekbench AI represents a significant step forward in standardizing AI performance measurement, potentially influencing future consumer choices in the AI-driven tech market. Results from the benchmark runs can be seen here.

HighPoint has unveiled the industry's first 16x M.2 Ports NVMe RAID AIC; the SSD7749M2. Featuring an unprecedented 16 independent M.2 device channels, and armed with HighPoint's proven PCIe Gen 4 Switch Architecture and NVMe cooling technology, SSD7749M2 RAID AICs are capable of delivering 28 GB/s of transfer throughput while supporting an astounding 128 TB of client-class NVMe storage; attributes that are particularly beneficial for AI driven workflows that require high-speed storage solutions capable of rapidly processing vast quantities of data. The compact, professional-grade PCIe AIC storage solution can be easily integrated into any x86 workstation or server platform capable of supporting modern dual-width GPUs, and is equipped with a comprehensive suite of management and monitoring tools designed to optimize and streamline the platforms NVMe storage ecosystem.

Advanced Architecture Maximizes Capacity and Performance
Innovative, dual-sided, vertically aligned M.2 loading trays can directly host up to sixteen 2280 form factor M.2 SSDs using only one side of the PCB. This unique architecture results in an impressively slim hardware footprint, with a form factor similar to that of a high-end dual-width GPU. The sixteen device channels can operate independently or concurrently, and enable the SSD7749M2 to support an astonishing 128 TB of M.2 storage, with the potential to scale up to 256 TB in the near future, all from a single PCIe slot!

Samsung Electronics America, the leader in advanced memory technology, announced new 512 GB capacities for its BAR Plus and FIT Plus USB 3.2 Gen 1 Flash Drives. The newest drives introduce more storage capacity to the lineup in the same sleek designs, perfect for storing your favorite tunes, irreplaceable photos/videos, and important work or school documents. These USB flash drives help you back up your data and save time thanks to their high capacity, quick speeds, wide device compatibility, and reliability.

"We recognize that professionals across the U.S. have more data storage needs than ever. That's why we're introducing a new size option within our cutting-edge BAR Plus and FIT Plus USB Flash Drive line-up, ensuring there is a storage solution for everyone," said Jose Hernandez, Senior Director of Memory Product Marketing at Samsung. "The drives are also intentionally designed to fit your personal style - whether you prefer something sleek and modern or unassuming and traditional, you can always be plugged in."

Samsung Electronics has achieved a significant milestone in its pursuit of supplying advanced memory chips for AI systems. Their latest fifth-generation high-bandwidth memory (HBM) chips, known as HBM3E, have finally passed all NVIDIA's tests. This approval will help Samsung in catching up with competitors SK Hynix and Micron in the race to provide HBM memory chips to NVIDIA. While a supply deal hasn't been finalized yet, deliveries are expected to start in late 2024.

However, it's worth noting that Samsung passed NVIDIA's tests for the eight-layer HBM3E chips while the more advanced twelve-layer version of the HBM3E chips is still struggling pass those tests. Both Samsung and NVIDIA declined to comment on these developments. Industry expert Dylan Patel notes that while Samsung is making progress, they're still behind SK Hynix, which is already preparing to ship its own twelve-layer HBM3E chips.

Samsung Electronics, the world leader in advanced memory technology, today announced it has begun mass production for the industry's thinnest 12 nanometer (nm)-class, 12-gigabyte (GB) and 16 GB LPDDR5X DRAM packages, solidifying its leadership in the low-power DRAM market. Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical especially for high-performance applications with advanced features such as on-device AI.

"Samsung's LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package," said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. "We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market."

SK hynix is reportedly developing 400-layer NAND flash memory, with plans to begin mass production by late 2025. The company is collaborating with supply chain partners to develop the necessary process technologies and equipment for 400-layer and higher NAND chips. This information comes from a recent article by Korean media outlet etnews citing industry sources.

SK hynix intends to use hybrid bonding technology to achieve this, which is expected to bring new packaging materials and components suppliers into the supply chain. The development process involves exploring new bonding materials and various technologies for connecting different wafers, including polishing, etching, deposition, and wiring. SK hynix aims to have the technology and infrastructure ready by the end of next year.

Samsung Electronics, the world leader in advanced memory technology, today announced the release of its 1-terabyte (TB) high-capacity microSD cards PRO Plus and EVO Plus. By adopting Samsung's eighth-generation V-NAND (V8) technology, the PRO Plus and EVO Plus boast enhanced performance and high capacity, ideal for content creators and tech enthusiasts needing quick file transfers and storage for everyday use across their devices in everyday use.

"Creators and tech enthusiasts are increasingly using portable devices such as smartphones and handheld gaming devices to store data that demand high-performance and high-capacity," said Hangu Sohn, Vice President of Memory Brand Product Biz Team at Samsung Electronics. "The new high-capacity microSD cards, PRO Plus and EVO Plus, are response to the demand for storing large amounts of high-quality data in a reliable and secure way."

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

Samsung Electronics' latest high bandwidth memory (HBM) chips have reportedly passed NVIDIA's suitability tests, according to Reuters. This development comes two months after initial reports suggested the chips had failed due to heat and power consumption issues. Despite this approval, NVIDIA plans to use Samsung's memory chips only in its H20 GPUs, a less advanced version of the H100 processors designed for the Chinese market to comply with US export restrictions.

The future of Samsung's HBM3 chips in NVIDIA's other GPU models remains uncertain, with potential additional testing required. Reuters also reported that Samsung's upcoming fifth-generation HBM3E chips are still undergoing NVIDIA's evaluation process. When approached for comment, neither company responded to Reuters. It's worth noting that Samsung previously denied the initial claims of chip failure.

Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications. These substrates are made in SEMCO's key the technology hub in Busan and the newly built state of the art factory in Vietnam. Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW in 2028. SEMCO's substantial investment of 1.9 trillion KRW in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and the future technology needs.

SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.

Samsung Electronics Co. is putting a lot of effort into securing its involvement in next-generation memory technology, CXL (Compute Express Link). In a media briefing on Thursday, Jangseok Choi, vice president of Samsung's new business planning team, announced plans to mass-produce 256 GB DRAM supporting CXL 2.0 by the end of this year. CXL technology promises to significantly enhance the efficiency of high-performance server systems by providing a unified interface for accelerators, DRAM, and storage devices used with CPUs and GPUs.

The company projects that CXL technology will increase memory capacity per server by eight to ten times, marking a significant leap in computing power. Samsung's long investment in CXL development is now in the final stages with the company currently testing products with partners for performance verification, Samsung recently established the industry's first CXL infrastructure certified by Red Hat. "We expect the CXL market to start blooming in the second half and explosively grow from 2028," Choi stated, highlighting the technology's potential to expand memory capacity and bandwidth far beyond current limitations.

TrendForce's latest industry report on AI servers reveals that high demand for advanced AI servers from major CSPs and brand clients is expected to continue in 2024. Meanwhile, TSMC, SK hynix, Samsung, and Micron's gradual production expansion has significantly eased shortages in 2Q24. Consequently, the lead time for NVIDIA's flagship H100 solution has decreased from the previous 40-50 weeks to less than 16 weeks.

TrendForce estimates that AI server shipments in the second quarter will increase by nearly 20% QoQ, and has revised the annual shipment forecast up to 1.67 million units—marking a 41.5% YoY growth.

Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully completed verification of the industry's fastest 10.7 gigabit-per-second (Gbps) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on MediaTek's next-generation Dimensity platform.

The 10.7 Gbps operation speed verification was carried out using Samsung's LPDDR5X 16-gigabyte (GB) package on MediaTek's upcoming flagship Dimensity 9400 System on Chip (SoC), scheduled to be released in the second half of this year. The two companies have closely collaborated to complete the verification within just three months.