Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology. Industry sources, as Korea Herald reports, confirmed on Tuesday that the company received internal authorization for mass production, marking completion of the advanced 10 nm-class process (called 1c DRAM) development. We recently reported that Samsung was able to achieve yield rates of 50-70% in testing for the 1c DRAM process as the company seems to be able to follow its projected timeline of approximately two years between product generations. The development holds particular significance for Samsung's high bandwidth memory (HBM) strategy since the company plans to commence HBM4 mass production during the second half of this year utilizing the newly developed sixth-generation DRAM technology. Samsung Electronics announced on May its adoption of hybrid bonding technology for future HBM4 memory stacks. The implementation aims to decrease thermal resistance while enabling ultra-wide memory interfaces, addressing the increasing bandwidth and efficiency requirements of artificial intelligence and high-performance computing applications.

SK hynix, currently dominating the HBM market pursues HBM4 development using fifth-generation DRAM technology and started to deliver HBM4 samples to major clients in March, targeting similar production timelines for the latter half of this year. However, Samsung faces critical qualification requirements ahead as the company must deliver HBM4 samples and successfully complete NVIDIA's qualification testing to secure high-volume supply contracts. Additionally, Samsung continues awaiting qualification approval for its 12-layer HBM3E product while supplying AMD and looking for supply agreements with NVIDIA.

Lexar, a leading global brand of flash memory solutions, unveiled the revolutionary Lexar ES5 Magnetic Portable SSD, designed for mobile content creators, videographers, and photographers who demand high-performance storage on the go. The ES5 Magnetic Portable SSD offers read and write speeds of up to 2000 MB/s for quick file transfers and a smooth workflow. With built-in MagSafe compatibility, it easily attaches to iPhone 15 Pro/Pro Max, iPhone 16 Pro/Max, and Samsung S25. It supports Apple ProRes recording at 4K 60/120 FPS and Samsung Pro Video at 8K 30 FPS, allowing creators to bypass internal storage limitations for uninterrupted, high-quality recording directly to the drive.

Moreover, the Lexar App, compatible with all Lexar portable SSDs and works with both iOS and Android devices, makes it easy to extend phone storage with automatic photo and video backups. With an IP65 rating, this drive is dust- and water-resistant and tested to survive drops from up to 3 meters. Its durable silicone design includes a cable organizer that doubles as a lanyard. It seamlessly attaches to your MacBook using the Magnetic Attraction Plate and is compatible with a wide range of devices—laptops, smartphones, tablets, cameras, and game consoles—making it an excellent complement to any digital setup.

Usually for newer technology rollout, prices are significantly higher compared to the last-gen. However, with DRAM, the story is the opposite. For the first time since the launch of DDR5, buyers are paying more for DDR4 memory modules than for the newer standard. A combination of tariff uncertainty and rapidly depleting DDR4 inventories is the main driver behind this. TrendForce data show that some high-demand DDR4 kits rose by as much as 40% in just one week, while DRAMeXchange reports that the average spot price for a 16 Gb (1Gx16) DDR4 module at 3,200 MT/s from Samsung and SK Hynix climbed to $12.50, with peak offers hitting $24. By contrast, dual-8 Gb DDR5 kits running between 4,800 MT/s and 5,600 MT/s remain near $6 on average, rarely exceeding $9. This unexpected surge follows Micron's announcement that it will wind down DDR4 production by year's end, accelerating the depletion of existing stocks over the next six to nine months.

Samsung also announced plans earlier this spring to retire its DDR4 lines and shift its focus to DDR5 and high-bandwidth memory, while China's CXMT confirmed it will scale back its DDR4 output despite recently reaching peak production levels. Taiwan's Nanya Technology is among the biggest beneficiaries of this topsy-turvy market. In the first quarter, the company held a DDR4 inventory valued at approximately NT$37.6 billion ($1.2 billion). Nanya even paused public price quoting to manage sales at these elevated levels. Many in the tech industry worry that renewed US-China trade tensions could spark another wave of panic buying. If additional tariffs target China's remaining DDR4 supply, module costs could climb to more than three times the price of DDR5, extending this rare pricing inversion well into the next quarter.

Samsung Electronics today announced its latest Smart Monitor lineup, featuring the flagship Smart Monitor M9 (M90SF model) alongside the updated Smart Monitor M8 (M80F model) and M7 (M70F model). With the introduction of QD-OLED technology to the M9 and advanced AI features across the lineup, the new offerings provide a more personalized and connected screen for work and entertainment.

"The Smart Monitor series continues to evolve based on how people work, watch and play," said Hoon Chung, Executive Vice President of the Visual Display (VD) Business at Samsung Electronics. "With the introduction of QD-OLED and AI-powered enhancements, the M9 delivers a more responsive and refined screen experience - all within a single, versatile display."

Samsung's Exynos 2500 SoC has appeared on Geekbench, this time giving us a clearer indication of what to expect from the upcoming SoC that will power the next generation of Samsung flagship smartphones. There are three total runs that have appeared on Geekbench, putting forward anywhere between 2303 and 2356 points in the single-core Geekbench 6 benchmark and 8062 and 8076 points in the multicore benchmark. Meanwhile, the Qualcomm Snapdragon 8 Elite in the current-generation Samsung Galaxy S25 Ultra manages a single-core score of 2883 and a multicore score or 9518 on the same Geekbench 6 benchmark. Samsung recently made the Exynos 2500 public, with the spec sheet revealing a Samsung Xclipse 950 GPU paired with 10 Arm Cortex CPUs (1× Cortex-X5, 2× Cortex-A725 at 2.74 GHz, 5× Cortex-A725 at 2.36 GHz, and 2× Cortex A520 at 1.8 GHz).

The new SoC is reportedly the first chip to use Samsung's 3 nm GAA process, and leaks suggest that Samsung may be using the new SoC across its entire next-gen global smartphone line-up, starting with the launch of the Galaxy Z Flip 7. This would be a stark departure from previous releases, where the US versions of the Galaxy S line-up featured Qualcomm Snapdragon processors, with the international Galaxy S smartphones packing the in-house Exynos designs. In recent years, however, Samsung has pivoted to using Snapdragon SoCs across all regions.

Samsung has achieved better production results for its advanced memory technology, according to Sedaily, as cited by TrendForce. The company's sixth-generation 10 nm DRAM, called 1c DRAM, now shows yield rates of 50-70% in testing. This represents a significant improvement from last year's results, which were below 30%. Samsung takes a different path from its rivals, while SK Hynix and Micron stick with 1b DRAM technology for HBM4 products, Samsung opts to create the newer 1c DRAM. This choice comes with more risk; however, it might bring bigger rewards, as the improved production rates enable Samsung to expand its manufacturing operations. The company plans to increase 1c DRAM production at its Hwaseong and Pyeongtaek facilities with expansion activities expected to begin before the end of this year.

These developments also support Samsung's HBM4 production schedule since the company aims to begin mass production of HBM4 products later this year. Yet, experts in the field point out that the product is still in its early stages and needs ongoing monitoring. Samsung planned to begin mass-producing sixth-gen 10 nm DRAM by late 2024. Instead, the company chose to remake the chip's design. This decision caused delays of more than one year however it was made to achieve better performance and yields. The new DRAM products will be manufactured at Samsung's Pyeongtaek Line 4 facility as these chips will serve both mobile and server applications. Separately, HBM4-related production will take place at Pyeongtaek Line 3.

TrendForce's latest investigations reveal that several negative factors weighed on the enterprise SSD market in the first quarter of 2025. These include production challenges for next-gen AI systems and persistent inventory overhang in North America. As a result, major clients significantly scaled back orders, causing the ASP of enterprise SSDs to plunge nearly 20%. This led to QoQ revenue declines for the top five enterprise SSD vendors, reflecting a period of market adjustment.

However, conditions are expected to improve in the second quarter. As shipments of NVIDIA's new chips ramp up, demand for AI infrastructure in North America is rising. Meanwhile, Chinese CSPs are steadily expanding storage capacity in their data centers. Together, these trends are set to reinvigorate the enterprise SSD market, with overall revenue projected to return to positive growth.

Synopsys, Inc. announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications. The collaboration between the companies is helping mutual customers achieve successful tape-outs of their complex designs using Synopsys' 3DIC Compiler and Samsung's advanced packaging technologies with fast turnaround time. Mutual customers can improve power, performance and area (PPA) with certified EDA flows for SF2P process, and minimize IP integration risk with the high-quality portfolio of IP on Samsung's most advanced process technologies.

"The adoption of Edge AI applications is driving the need for advancements in semiconductor technologies to enable complex computational tasks, improve efficiency, and expand AI capabilities across various industries and applications," said John Koeter, senior vice president for the Synopsys IP Group. "Together with Samsung Foundry, we're enabling the most advanced AI processors across a broad spectrum of use cases from high-performance AI inference engines for data centers to ultra-efficient Edge AI devices like cameras and drones, all optimized for development on sub-2 nm Samsung Foundry process technologies."

Cadence today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence memory and interface IP solutions in Samsung Foundry's SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging Cadence's AI-driven design solutions and Samsung's advanced SF4X, SF4U and SF2P process nodes to deliver high-performance, low-power solutions for AI data center, automotive—including advanced driver-assistance systems (ADAS)—and next-generation RF connectivity applications.

Cadence's AI-driven design solutions and comprehensive portfolio of IP and silicon solutions enhance designers' productivity and accelerate time to market (TTM) for leading-edge SoCs, chiplets and 3D-ICs on advanced Samsung Foundry processes. "We support a full portfolio of IP, subsystems and chiplets on the Samsung Foundry process nodes, and our latest multi-year IP agreement strengthens our ongoing collaboration," said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. "By combining Cadence's AI-driven design and silicon solutions with Samsung's advanced processes, we're delivering the leading-edge technologies our mutual customers need to innovate and bring their products to market faster."

TrendForce's latest research reveals that despite ongoing macroeconomic challenges, both buyers and sellers remain bullish on the OLED monitor panel market. Following a remarkable 132% YoY growth in 2024, this strong momentum is expected to carry over into 2025. As a result, TrendForce has revised its 2025 OLED monitor panel shipment forecast upward from 2.8 million to 3.4 million units—raising the annual growth rate from 40% to 69%.

While the broader panel market is feeling the strain of the U.S.'s reciprocal tariffs, the OLED monitor segment has been relatively insulated and continues to exhibit strong growth. One key driver is the high acceptance of OLED monitors among gaming enthusiasts, encouraging brands to expand their OLED gaming product lines. In parallel, Korean panel makers are increasingly shifting their focus toward OLED monitors.

Micron has informed its customers that its DDR4 memory products will reach the end of life in the coming quarters, with shipments expected to taper off over the next six to nine months. This announcement aligns Micron with the earlier plans of Samsung and SK Hynix to discontinue DDR4 production and focus on next-generation memory solutions, such as DDR5, LPDDR5, and high-bandwidth memory. In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase‑out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.

To address this imbalance, Micron will prioritize supply for long‑term partners in the automotive, industrial, and networking sectors, where product reliability and contract stability are critical. The retirement of DDR4 has been partly driven by competitive pressure from Chinese memory manufacturers, which have flooded the market with lower‑cost modules. Yet, these newcomers may face challenges in matching the quality, long-term support, and volume capabilities that established players provide. Micron is urging its customer base to transition to DDR5 and LPDDR5 products, which have reached competitive price points and offer superior bandwidth and energy efficiency.

MSI has released the latest AMD AGESA ComboPI-1.2.0.3e BIOS, supporting all AMD AM5 models, including X870, B850, B840, X670, B650, and A620 chipsets. This update not only adds support for upcoming new CPUs, but also enables all AM5 motherboards to support large-capacity 64 GB x4 DRAM chips. MSI motherboards have been optimized for overclocking large-capacity DRAM—compatible with DRAM chips from Micron, Hynix, and Samsung. Even with four 64 GB DRAM fully installed, the system can still achieve a stable overclocking speed of 6000 MT/s, and even up to 6400 MT/s.

In addition, this update optimizes 2DPC 1R capability and includes overclocking enhancements specifically for Samsung's 4Gx8 chips. AGESA 1.2.0.3e has already been rolled out to selected AM5 800 series models, users are able to find the updated BIOS on the MSI website, and MSI will continue to update the remaining AM5 models as soon as possible. Get ready to enjoy the powerful performance brought by memory overclocking!

Samsung-branded 24 Gbit (3 GB) GDDR7 memory chips are being loosely sold in the Chinese retail market. The chips are being sold in OEM packaging meant for PCB pick-and-place machines, although the seller offers to sell these chips on a per-unit basis, priced at RMB ¥72.50, or approximately USD $10 per chip. This opens the door for graphics card memory modders to, in theory, give the GeForce RTX 5090 a 50% memory boost with $160 worth of memory chips. An RTX 5090 with 48 GB of memory would accelerate AI models with larger parameter counts than a stock card.

Given that off-brand RTX 5090 cards are being sold in China in board designs meant for commercial AI acceleration farms, this sale opens the door for off-brand RTX 5090 cards with 48 GB memory. Much of the RTX 5090 gray-market in China runs in complete disregard of U.S. export controls that prevent NVIDIA from selling the RTX 5090 in the Chinese domestic market, instead selling the RTX 5090D, a card with nearly identical gaming performance to RTX 5090, but with reduced AI acceleration and blockchain performance.

TrendForce's latest investigations find that the global foundry industry recorded 1Q25 revenue of US$36.4 billion—a 5.4% QoQ decline. The downturn was softened by last-minute rush orders from clients ahead of the U.S. reciprocal tariff exemption deadline, as well as continued momentum from China's 2024 consumer subsidy program. These factors help offset the typical seasonal slump.

Looking ahead to Q2, the effects of tariff-driven early procurement are expected to fade and lead to a general slowdown. However, continued demand from China's subsidy program, along with pre-launch inventory builds for new smartphone models and stable AI HPC demand, are expected to support capacity utilization and drive a revenue rebound for the top 10 foundries.

TrendForce's latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes. Samsung's redesign of its HBM3e products eased the HBM production squeezes. This prompted downstream players to clear inventories and extended the price declines seen since 4Q24.

Looking ahead to 2Q25, as PC OEMs and smartphone makers complete inventory corrections and ramp up system production ahead of the 90-day U.S. reciprocal tariff grace period, bit procurement momentum is expected to strengthen significantly. This will drive notable increases in supplier shipment volumes. On the pricing side, TrendForce forecasts a rebound across major application contract prices, with both conventional DRAM and combined DRAM (including HBM) contract prices expected to rise.

The Nintendo Switch 2 hybrid console is due to launch globally next Wednesday (June 4). The highly anticipated next-gen handheld is powered by a custom NVIDIA processor. To the surprise of many industry watchdogs, both parties have semi-recently disclosed a couple of technical details regarding their fruitful hardware collaboration. Historically, Nintendo has guarded many aspects of its past generation hardware. Throughout the 2020s, data miners and leakers have unearthed plenty of pre-release information—leading to theories about the Switch 2 chipset's origins. During the Switch 1 era, TSMC was the chosen manufacturing partner. NVIDIA's off-the-shelf Tegra X1 mobile SoC powered the first wave of Nintendo Switch (2017) devices, in 20 nm form. A 2019 revision resulted in Switch Lite and (refreshed) Switch models being equipped with a more efficient 16 nm solution, also present within 2023's premium OLED variant.

Since then, Switch 2's alleged NVIDIA Tegra T239 SoC was linked to a Samsung 8 nm node process. Earlier this month, extremely brave Chinese leakers produced "full die shot" evidence of South Korean foundry origins. Bloomberg insider news articles have implied that Samsung Semi's mature 8 nm FinFET node is better suited—rather than an equivalent TSMC product—for the Switch 2's custom NVIDIA chipset. Unnamed sources have mentioned critical factors; namely stable production and process compatibility. Industry moles reckon that Samsung leadership is actively and aggressively pushing for a longer Switch 2 chipset production deal. Renewed terms could include a future die shrink; pre-launch analysis indicates a sizeable 207 mm² footprint. Beyond foundry biz negotiations, additional murmurs suggest company executives dangling an OLED panel supply agreement. Industry experts have viewed Samsung's key entry—into the gaming console chip market—as a seismic development. A DigiTimes article dives into a so-called "tripartite cooperation"—involving Nintendo, NVIDIA, and the South Korean semiconductor giant. The Samsung Foundry has floundered and struggled in recent times, but is keen to catch up with its arch rival. Fresh rumors have AMD and Sony considering Samsung's chip making channels; possibly with futuristic PlayStation hardware in mind.

Samsung Display is participating in COMPUTEX TAIPEI 2025, Asia's largest IT trade show, for the first time, showcasing its cutting-edge OLED display technologies. The company announced today that it will exhibit at COMPUTEX TAIPEI 2025, taking place May 20 to 23 at the Taipei Nangang Exhibition Center Hall 2, it will host a private exhibition for clients, unveiling its latest IT OLED portfolio for applications like laptops, tablets, monitors and other IT devices.

Samsung Display is set to unveil UT One for the first time alongside a range of low-power solutions optimized for IT devices such as laptops and tablets. The company will also showcase QD-OLED prototypes along with an ultra-high resolution and ultra-high refresh rate that will change the premium monitor market. In addition, wheeled dual-arm robots Rainbow Robotics, a company that specializes in robotic platforms, will perform a welcome show to demonstrate the slimness and light weight characteristics of Samsung OLED, set to leave a lasting impression on clients visiting our booth.

Samsung Electronics today announced that its 2025 OLED TV lineup will feature NVIDIA G-SYNC compatibility, delivering ultra-smooth gameplay, low latency, and enhanced responsiveness to meet the needs of gaming enthusiasts worldwide. With NVIDIA G-SYNC compatibility, Samsung's 2025 OLED TVs synchronize the TV's refresh rate with the GPU's frame rate, reducing screen tearing and stuttering for a seamless and immersive gaming experience. Paired with Samsung's Motion Xcelerator technology, which supports refresh rates up to 165 Hz, gamers can enjoy exceptionally fluid visuals and sharp clarity during fast-paced action scenes.

"With the addition of NVIDIA G-SYNC compatibility and our most advanced gaming features yet, Samsung's 2025 OLED TVs deliver elite-level performance for even the most competitive players," said Kevin Lee, Executive Vice President of the Visual Display Customer Experience Team at Samsung Electronics. "By building on our leadership in display innovation and integrating real-time AI enhancements, we're redefining what gamers can expect from a TV - on and off the battlefield."

Around mid-February, South Korean sources alleged that NVIDIA was in the process of developing an innovative new memory form factor. The System on Chip Advanced Memory Module (SOCAMM) design is reportedly a collaborative effort. Team Green's usual set of memory partners—SK Hynix, Samsung, and Micron—were mentioned in early 2025 news articles. Just over a month later, official press material revealed a key forthcoming deployment—Micron stated: "(our) SOCAMM (product), a modular LPDDR5X memory solution, was developed in collaboration with NVIDIA to support the NVIDIA GB300 Grace Blackwell Ultra Superchip. In a (rumored) blow to all involved parties, ZDNet Korea posits that Team Green has postponed the commercialization of their "next-generation low-power DRAM module" IP. According to industry moles, the SOCAMM standard will not debut with this generation of enterprise-focused "Grace-Blackwell" chips. Instead, fresher theories indicate a postponement into next-gen territories—possibly rescheduled to arrive alongside the firm's "Rubin" GPU architecture.

NVIDIA has reportedly sent out notices to major memory partners—(alleged) May 14 updates were received by Samsung Electronics and SK Hynix (in South Korea) and Micron (USA). As a result, SOCAMM supply timelines are (apparently) adjusted. A newer "Cordelia" board design—acting as a substrate for GB300 chips, and compatible with SOCAMM—was in the picture. The latest whispers suggest a return to an existing "Bianca" board configuration, that supports current-gen LPDDR memory modules. ZDNet believes that company engineers have run into several obstacles: "Blackwell chips have been continuously experiencing difficulties in securing design and packaging yields. In fact, the 'Cordelia' board is known to have reliability issues, such as data loss, and SOCAMM has reliability issues, such as heat dissipation characteristics." NVIDIA briefly previewed its futuristic "Rubin Ultra" AI GPU design during GTC 2025—on-stage, a "second half of 2027" release window was teased.

South Korean semiconductor insiders and analysts believe that Samsung's Foundry business is catching up with a main rival. Earlier this month, TSMC leadership openly discussed an unprecedented demand for 2 nm wafer products. Industry moles believe that the Taiwan's top chipmaker is still ahead of contenders in nearby nations. As a result of an alleged leading and comfortable position, TSMC is reportedly upgrading its state-of-the-art facilities with brand-new equipment—indicating a push into 1.4 nm fields. According to a fresh Chosun Biz news article, Samsung engineers are in the process of narrowing the gap between their 2 nm Gate-All-Around (GAA)—also known as SF2—manufacturing node process and TSMC's equivalent technology.

Last month, leaks suggested SF2 trial yields passing the ~40% mark—in comparison, a ~60% figure was uttered by TSMC insiders. Chosun Biz's sources claim that the South Korean foundry team is close to getting their "2 nm process performance evaluation" into a crucial final stage. Yesterday's report posits that NVIDIA and Qualcomm are in the equation; these VIP clients are purportedly considering SF2 as a "second channel" option. Chosun Biz reckons that Team Green is sizing up Samsung Foundry flagship tech for next-gen commercial and enterprise GPUs. Meanwhile, the San Diego-based smartphone processor specialist could be eyeing up SF2 (for a future AP). The latest inside track info points to 2 nm GAA trial production runs breaking beyond aforementioned (approximate) 40% yield rates. TSMC 2 nm wafer charges are reportedly greater than expected, so big industry players are allegedly investigating "cheaper" non-Taiwanese production avenues.

At the recent AI Semiconductor Forum in Seoul, Samsung Electronics revealed that it will adopt hybrid bonding in its upcoming HBM4 memory stacks. This decision is intended to reduce thermal resistance and enable an ultra‑wide memory interface, qualities that become ever more critical as artificial intelligence and high‑performance computing applications demand greater bandwidth and efficiency. Unlike current stacking methods that join DRAM dies with tiny solder microbumps and underfill materials, hybrid bonding bonds copper‑to‑copper and oxide‑to‑oxide surfaces directly, resulting in thinner, more thermally efficient 3D assemblies. High‑bandwidth memory works by stacking multiple DRAM dies on top of a base logic die, with through‑silicon vias carrying signals vertically through each layer. Traditionally, microbumps routed horizontal connections between dies, but as data rates increase and stack heights grow, these bumps introduce significant electrical and thermal limitations.

Hybrid bonding addresses those issues by allowing interconnect pitches below 10 micrometers, which lowers both resistance and capacitance and improves overall signal integrity. SK hynix has taken a different path. The company is enhancing its molded reflow underfill (MR‑MUF) process to produce 16‑Hi HBM4 stacks that comply with JEDEC's maximum height requirement of 775 micrometers. The company believes that if its advanced MR‑MUF technique can achieve performance on par with hybrid bonding, they will avoid the substantial capital investment needed for the specialized equipment that true 3D copper bonding requires. The cost and space demands of hybrid bonding equipment are significant. Specialized lithography and alignment tools occupy more clean‑room real estate, increasing capital expenditures. Samsung may mitigate some of these costs through Semes, its in‑house equipment subsidiary, but it remains uncertain whether Semes can deliver production‑ready hybrid bonding systems in time for mass production. If Samsung successfully qualifies its HBM4 stacks using hybrid bonding, which it plans to begin manufacturing in 2026, the company could gain a competitive edge over Micron and SK hynix.

Samsung Display announced on May 13 that it will take part in Display Week 2025, held from May 13 to 15 at the McEnery Convention Center in San Jose, California. The event, hosted by the Society for Information Display (SID), brings together display companies and experts from around the world to share cutting-edge technologies and R&D achievements.

Samsung Display is set to unveil a range of next-generation display technologies, including the industry's first non-cadmium 400-nit EL-QD and a 5,000 pixels-per-inch (PPI) RGB OLED on Silicon (OLEDoS) at Display Week 2025, reinforcing its leadership in cutting-edge panel technology. The company will also highlight its leadership in OLED innovation through a range of future-oriented technologies, including organic photodiodes (OPD), advanced sensors capable of measuring biometric data such as heart rate and blood pressure directly from light generated by a panel touched by a patient, and a high-resolution microdisplay that delivers 5,000 PPI in a compact 1.4-inch form factor.

Samsung Electronics today announced the global launch of the Odyssey OLED G6, the world's first 500 Hz OLED gaming monitor. The Odyssey OLED G6 will first be available in Singapore, Thailand, Vietnam and Malaysia, followed by a phased rollout to additional global markets later this year. Building on its six-year leadership in the global gaming monitor market and two-year leadership in OLED gaming displays, Samsung is once again expanding the boundaries of gaming performance with the Odyssey OLED G6.

"Samsung continues to lead the gaming monitor industry with breakthrough innovations that redefine how games are experienced," said Hoon Chung, Executive Vice President of Visual Display (VD) Business at Samsung Electronics. "With the Odyssey OLED G6, the world's first 500 Hz OLED gaming monitor, we are pushing gaming performance, visual quality and immersion to entirely new heights—delivering the next evolution of display technology for gamers around the world."

TrendForce's latest investigation reveals that global OLED monitor shipments remain in rapid growth mode. With brands actively launching new models, shipments hit a record high of approximately 507,000 units in 1Q25, marking a 175% YoY increase. Thanks to strong demand—particularly for 27-inch UHD models—shipments in 2Q25 are expected to climb to 650,000 units. For the full year, shipments are projected to reach 2.58 million units, up 81% YoY, raising OLED's penetration rate in the overall monitor market to 2%.

Samsung retained its top position in 1Q25 with over 22% market share, driven by its flagship 49-inch models, which accounted for 40% of its OLED monitor shipments. As the 27-inch UHD model gains traction in 2Q25, it is expected to become Samsung's best-selling OLED monitor size.

AMD has reportedly decided to move its 4 nm chip orders from Samsung to TSMC's facilities in Arizona, United States. This is a significant loss for Samsung, as AMD had been working closely with Samsung on the SF4X process for EPYC server processors, Ryzen APUs, and Radeon graphics cards. It's worth noting that in May 2023, AMD announced the exact opposite—moving from TSMC to Samsung for some of its 4 nm CPUs. This partnership was an important part of AMD's strategy to use multiple manufacturers; however now appears to be failing. Reports indicate that AMD's decision comes from concerns about the stability and consistency of Samsung's manufacturing process, leading AMD to cancel plans for mass production of graphics chips using Samsung's 4 nm technology.

These changes in manufacturing strengthen TSMC's leading position in the chip manufacturing industry, even though relying on a single manufacturer creates geopolitical risks. AMD continues to deepen its relationship with TSMC, committing to use TSMC's advanced 2 nm technology for its upcoming "Venice" processors, which have completed testing at TSMC's Arizona facility and remain on schedule for release in 2026. Meanwhile, Samsung Electronics has reportedly achieved better-than-expected results in testing its SF2 (2 nm) process, with initial yields above 30%. The company plans to stabilize this process in the second half of 2025 to begin mass production of the Exynos 2600 mobile chip. Building on this progress, Samsung is reportedly close to securing an agreement to manufacture Qualcomm's Snapdragon 8 Elite 2 using its new 2 nm process.